Plastic Packages for Integrated Circuits Package Outline Drawing M38.173C 38 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE (HTSSOP) Rev 0, 4/10 PIN 1 ID B 4.6±0.10 0.09-0.20 D 3 2 1 12 3 C L 6.4 3.20±0.10 4.4±0.10 4 38 0.17-0.27 A 0.20 C A-B D 2X N/2 TIPS 0.08 M C A-B D 5 SEE DETAIL "A" EXPOSED PAD VIEW END VIEW TOP VIEW (14°) TYP (1.00) 1.10 MAX 0.05 C 0.90±0.05 0.25 C PARTING LINE 0.10 C 0.50 0.05/0.15 9.70±0.10 4 SEATING PLANE SIDE VIEW H 3 (0-8°) 0.6±0.10 DETAIL "A" SCALE: 30/1 (VIEW ROTATED 90°C.W.) (4.60) NOTES: 1. Die thickness allowable is 0.279±0.0127 (0.0110±0.0005 inches). 2. Dimensioning & tolerances per ASME. Y14.5m-1994. (1.30) (5.80) (3.20) 3. Datum plane H located at mold parting line and coincident with lead where lead exits plastic body at bottom of parting line. 4. At reference datum and does not include mold flash or protrusions, and is measured at the bottom parting line. Mold flash or protrusions shall not exceed 0.15mm on the package ends and 0.25mm between the leads. 5. The lead width dimension does not include dambar protrusion. Allowable dambar protrusion shall be 0.07mm total in excess of the lead width dimension at maximum material condition. Dambar cannot be located on the lower radius or the foot. Minimum space between protrusions and an adjacent lead should be 0.08mm. (36X 0.50) (38X 0.28) TYPICAL RECOMMENDED LAND PATTERN 1 6. This part is compliant with JEDEC specification MO-153 variation BDT-1