Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
M48.240
48 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 1, 11/10
0.50
B
0.09-0.20
48
8.1
C
L
6.1±0.10
4
0.20 C A B
2X N/2 TIPS
123
PIN 1 ID
0.17-0.27
SEE
DETAIL "A"
0.08 M C A B 5
BOTTOM VIEW
TOP VIEW
A
1.10 MAX
0.90±0.05
0.05
(1.45)
C
12.50±0.10
(7.35)
0.05/0.15
4
0.10 C
SEATING
PLANE
SIDE VIEW
(12°) TYP
(1.00)
(46X 0.50)
(48X 0.28)
0.25
PARTING
LINE
TYPICAL RECOMMENDED LAND PATTERN
H 3
(0-8°)
0.6±0.15
DETAIL "A"
SCALE: (NONE)
(VIEW ROTATED 90° C.W.)
NOTES:
1. All dimensions are in millimeters (angles in degrees).
2. Dimensioning & tolerances per ASME. Y14.5m-1994.
3. Datum plane H located at mold parting line and coincident
with lead where lead exits plastic body at bottom of parting line.
4. At reference datum and does not include mold flash or protrusions,
and is measured at the bottom parting line. Mold flash or protrusions
shall not exceed 0.15mm on the package ends and 0.25mm between
the leads.
5. The lead width dimension does not include dambar protrusion.
Allowable dambar protrusion shall be 0.08mm total in excess of
the lead width dimension at maximum material condition. Dambar
cannot be located on the lower radius or the foot. Minimum space
between protrusions and an adjacent lead should be 0.07mm.
6. This part is compliant with JEDEC specification MO-153 variation
ED except it is 0.1mm thinner.
7. Dimensions in ( ) are for reference only.
1