Plastic Packages for Integrated Circuits Package Outline Drawing M8.173 8 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP) Rev 2, 01/10 A 2 4 3.0 ±0.5 SEE DETAIL "X" 5 8 6.40 CL 4.40 ±0.10 3 4 PIN 1 ID MARK 0.20 C BA 1 4 0.09-0.20 B 0.65 TOP VIEW END VIEW 1.00 REF 0.05 H C 0.90 +0.15/-0.10 1.20 MAX SEATING PLANE 0.25 +0.05/-0.06 0.10 C 0.10 GAUGE PLANE 0.25 6 CBA 0°-8° 0.05 MIN 0.15 MAX 0.60 ±0.15 DETAIL "X" SIDE VIEW (1.45) NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. (5.65) PACKAGE BODY OUTLINE 2. Dimension does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 per side. 3. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.15 per side. 4. Dimensions are measured at datum plane H. 5. Dimensioning and tolerancing per ASME Y14.5M-1994. (0.35 TYP) (0.65 TYP) TYPICAL RECOMMENDED LAND PATTERN 1 6. Dimension on lead width does not include dambar protrusion. Allowable protrusion shall be 0.08 mm total in excess of dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm. 7. Conforms to JEDEC MO-153, variation AC. Issue E