Plastic Packages for Integrated Circuits HTSSOP (Heat-Sink TSSOP) Family MDP0048 0.25 M C A B D HTSSOP (HEAT-SINK TSSOP) FAMILY A (N/2)+1 N MILLIMETERS SYMBOL 14 LD 20 LD 24 LD 28 LD 38 LD TOLERANCE PIN #1 I.D. E E1 1 0.20 C B A 2X N/2 LEAD TIPS (N/2) TOP VIEW B D1 EXPOSED THERMAL PAD E2 1.20 1.20 1.20 1.20 Max 0.075 0.075 0.075 0.075 ±0.075 A2 0.90 0.90 0.90 0.90 0.90 +0.15/-0.10 b 0.25 0.25 0.25 0.25 0.22 +0.05/-0.06 c 0.15 0.15 0.15 0.15 0.15 +0.05/-0.06 D 5.00 6.50 7.80 9.70 9.70 ±0.10 D1 3.2 4.2 4.3 5.0 7.25 Reference E 6.40 6.40 6.40 6.40 6.40 Basic E1 4.40 4.40 4.40 4.40 4.40 ±0.10 E2 3.0 3.0 3.0 3.0 3.0 Reference e 0.65 0.65 0.65 0.65 0.50 Basic L 0.60 0.60 0.60 0.60 0.60 ±0.15 L1 1.00 1.00 1.00 1.00 1.00 Reference N 14 20 24 28 38 Reference NOTES: 0.05 e 1.20 0.075 Rev. 3 2/07 BOTTOM VIEW C A A1 H 1. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm per side. 2. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm per side. SEATING PLANE 0.10 C N LEADS 3. Dimensions “D” and “E1” are measured at Datum Plane H. 0.10 M C A B b 4. Dimensioning and tolerancing per ASME Y14.5M-1994. SIDE VIEW SEE DETAIL “X” c END VIEW L1 A A2 GAUGE PLANE 0.25 L A1 0° - 8° DETAIL X 1