TDA8023 Low power IC card interface Rev. 01 — 16 July 2007 Product data sheet 1. General description The TDA8023 is a complete cost-efficient, low-power analog interface for synchronous or asynchronous smart cards. It can be placed between the card and the microcontroller with very few external components to perform all supply, protection and control functions. 2. Features n n n n n n n n n n n n n n n n n n n I2C-bus controlled IC card interface in TSSOP28 Supply voltage from 2.7 V to 6.5 V Independant supply voltage VDD(INTF) for interface signals with the microcontroller Shutdown input for very low power consumption when the part is not used Power reduction modes when the card is active DC-to-DC converter for VCC generation (capacitive doubler, tripler, or inductive, or follower automatically selected according to supply voltage and card voltage) 1 specific protected half duplex bidirectional buffered I/O line, with current limitation at ±15 mA, maximum frequency 1 MHz 2 auxiliary card I/O lines controlled by I2C-bus (C4 and C8) VCC regulation: 5 V, 3 V or 1.8 V ± 8 %, ICC < 55 mA, current spikes of 40 nAs up to 20 MHz, with controlled rise and fall times, filtered overload detection approximately 80 mA, current limitation about 120 mA Thermal and short-circuit protections on all card contacts Automatic activation and deactivation sequences: initiated by software or by hardware in the event of a short-circuit, card take-off, overheating, VDD or VDD(DCDC) drop-out Enhanced ElectroStatic Discharge (ESD) protection on card side (> 6 kV) 20 MHz clock input Clock generation for the card up to 10 MHz (CLKIN divided by 1, 2, 4 or 5) with synchronous frequency changes; stop HIGH or LOW or free running 1 MHz in cards Low-power mode; current limitation on pin CLK (C3) RST signal (C2) with current limitation at 20 mA, controlled by an embedded programmable CLK pulse counter on asynchronous cards or by a register on synchronous cards ISO 7816-3, GSM 11.11 and EMV 2000 (payment systems) compatibility Supply voltage supervisor for spike killing during power-on and emergency deactivation at power-off: threshold internally fixed or set via an external resistor bridge; pulse width internally fixed or set via an external capacitor Card presence input with 10 ms built-in debouncing system One interrupt signal INT TDA8023 NXP Semiconductors Low power IC card interface 3. Applications n n n n Banking terminals Internet terminals Set-top boxes Portable IC card readers 4. Quick reference data Table 1. Quick reference data VDD = 3.3 V; VDD(INTF) = 1.5 V; fCLKIN = 10 MHz; GND = 0 V; Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VDD supply voltage on pin VDD 2.7 - 6.5 V VDD(DCDC) DC-to-DC converter supply voltage on pin VDDP 2.7 - 6.5 V VDD(INTF) interface supply voltage on pin VDDI Supply IDD supply current 1.5 - 6.5 V Shutdown mode [1] - - 10 µA Inactive mode; CLKIN LOW or HIGH [1] - - 200 µA Active mode; VCC = 5 V; fCLK = 5 MHz [1] - - 15 mA capacitive; ICC = 5 mA capacitive; ICC = 55 mA - - 200 mA inductive; ICC = 5 mA - - 15 mA - - 150 mA - - 2 mA 5 V card; ICC < 60 mA; VCC = 5 V 4.75 5 5.25 V 3 V card; ICC < 55 mA; VCC = 3 V 2.80 3 3.15 V 1.65 1.8 1.95 V 5 V card; current pulses of 40 nAs 4.65 - 5.35 V 3 V card; current pulses of 24 nAs 2.76 - 3.24 V 1.8 V card; current pulses of 15 nAs 1.62 - 1.98 V - - 350 mV 5 V card; VCC = 0 V to 5 V - - −55 mA 3 V card; VCC = 0 V to 3 V - - −55 mA 1.8 V card; VCC = 0 V to 1.8 V - - −35 mA inductive; ICC = 55 mA Power-down mode; VCC = 5 V; ICC = 100 µA; CLK stopped; CLKIN HIGH or LOW; capacitive or inductive [1] Supply voltage for the card: pin VCC[2] VCC supply voltage Active mode; 2.7 V < VDD < 6.5 V [3] 1.8 V card; ICC < 30 mA; VCC = 1.8 V Active mode; AC current pulses with I < 200 mA, t < 400 ns and f < 20 MHz Vripple(p-p) peak-to-peak ripple voltage on VCC; 20 kHz to 200 MHz ICC supply current VDD > 2.7 V TDA8023_1 Product data sheet [3] © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 2 of 32 TDA8023 NXP Semiconductors Low power IC card interface Table 1. Quick reference data …continued VDD = 3.3 V; VDD(INTF) = 1.5 V; fCLKIN = 10 MHz; GND = 0 V; Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit tdeact deactivation time total sequence 60 80 100 µs Ptot total power dissipation Tamb = −25 °C to +85 °C Tamb ambient temperature General - - 500 mW −40 - +85 °C [1] Sum of currents on pins VDD and VDDI. [2] Two ceramic multilayer capacitors of minimum 100 nF with low Equivalent Series Resistance (ESR) should be used in order to meet these specifications. [3] Output voltage towards the card, including ripple. 5. Ordering information Table 2. Ordering information Type number Package Name Description Version TDA8023TT TSSOP28 plastic thin shrink small outline package; 28 leads; body width 4.4 mm SOT361-1 6. Block diagram optional external resistor bridge 1 µF 100 nF VDD 22 R2 100 nF VDDP SBP 26 27 100 nF SBM 25 SAM 23 SAP 28 PORADJ 20 24 GNDP R1 CDEL 21 CCDEL SUPPLY SUPERVISOR DC-TO-DC CONVERTER 1 VUP GND 10 100 nF TDA8023 VDDI SDWN SDA SCL CLKIN I/OUC INT SPRES SAD0 17 4 VCC 100 nF 3 5 18 6 9 11 RST 16 I2C-BUS INTERFACE 2 SEQUENCER CLOCK COUNTER 8 7 CARD DRIVERS CLK 14 13 12 19 15 I/O C4 C8 PRES GNDC 001aag336 Fig 1. Block diagram with capacitive DC-to-DC converter TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 3 of 32 TDA8023 NXP Semiconductors Low power IC card interface optional external resistor bridge LX 100 nF 6.8 µH 10 µF VDD 22 R2 VDDP SBP 27 26 SBM 25 SAM 23 SAP 28 PORADJ 20 24 GNDP CDEL 21 R1 CCDEL SUPPLY SUPERVISOR DC-TO-DC CONVERTER 1 VUP GND 10 100 nF 4.7 µF TDA8023 VDDI SDWN SDA SCL CLKIN I/OUC INT SPRES SAD0 17 4 VCC 100 nF 3 5 18 6 9 11 RST 16 I2C-BUS INTERFACE 2 SEQUENCER CLOCK COUNTER CARD DRIVERS CLK 14 13 12 8 19 7 15 I/O C4 C8 PRES GNDC 001aag337 Fig 2. Block diagram with inductive DC-to-DC converter 7. Pinning information 7.1 Pinning VUP 1 28 SAP INT 2 27 SBP SDWN 3 26 VDDP VDDI 4 25 SBM SDA 5 24 GNDP SCL 6 23 SAM SAD0 7 SPRES 8 CLKIN 9 TDA8023TT 22 VDD 21 CDEL 20 PORADJ GND 10 19 PRES I/OUC 11 18 RST C8 12 17 VCC C4 13 16 CLK I/O 14 15 GNDC 001aag338 Fig 3. Pin configuration TDA8023TT TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 4 of 32 TDA8023 NXP Semiconductors Low power IC card interface 7.2 Pin description Table 3. Pin description Symbol Pin Type[1] Description VUP 1 O output of the DC-to-DC converter INT 2 O Negative-channel Metal Oxide Semiconductor (NMOS) interrupt to the host (active LOW and open-drain) (see fault detection in Section 8.7 “Protection”) SDWN 3 I shutdown and reset input VDDI 4 S interface positive supply voltage SDA 5 I/O serial data line to/from the I2C-bus master (open-drain) SCL 6 I serial clock line from the I2C-bus master SAD0 7 I I2C-bus address selection SPRES 8 I select PRES mode[2] CLKIN 9 I external clock input GND 10 S ground connection 11 I/O[3] data in/out from/to microcontroller 12 I/O[4] auxiliary input/output to/from the card (contact C8) C4 13 I/O[4] auxiliary input/output to/from the card (contact C4) I/O 14 I/O[4] data input/output to/from (contact C7 of) the card GNDC 15 S ground connection for the card (contact C5) CLK 16 O clock output to (contact C3 of) the card I/OUC C8 VCC 17 S supply voltage for the card (contact C1) RST 18 O reset output to (contact C2 of) the card PRES 19 I card presence input with a 10 ms built-in debouncing system[2] PORADJ 20 I input for changing the power-on reset threshold with an external resistor bridge. In case no external resistor bridge is used, it is mandatory to connect this pin to GND to avoid possible perturbations. CDEL 21 C delay capacitor connection for the voltage supervisor (1 ms per 2 nF) VDD 22 S power supply SAM 23 C connection for the DC-to-DC converter GNDP 24 S ground connection for the DC-to-DC converter SBM 25 C connection for the DC-to-DC converter VDDP 26 S positive supply for the DC-to-DC converter SBP 27 C connection for the DC-to-DC converter SAP 28 C connection for the DC-to-DC converter [1] I = input, O = output, S = supply, C = configuration. [2] PRES is active-HIGH when SPRES = LOW and PRES is active-LOW when SPRES = HIGH. [3] With integrated pull-up to VDD(INTF). [4] With integrated pull-up to VCC. TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 5 of 32 TDA8023 NXP Semiconductors Low power IC card interface 8. Functional description Remark: Throughout this document, it is assumed that the reader is familiar with ISO 7816 and EMV 2000 terminology. 8.1 Power supplies The supply pins for the TDA8023 are VDD and GND. VDD should be in the range from 2.7 V to 6.5 V. The supply voltages VDD, VDD(INTF) and VDD(DCDC) may be applied to the TDA8023 in any time sequence. All interface signals with the system controller are referenced to a separate supply voltage VDD(INTF) on pin VDDI, that may be lower or higher than VDD. For generating a supply voltage VCC of 5 V ± 5 % or 3 V ± 5 % used by the card, an integrated DC-to-DC converter is incorporated. This DC-to-DC converter should be separately supplied by VDD(DCDC) on pin VDDP and GNDP (from 2.7 V to 6.5 V). The I2C-bus signals SDA and SCL may be externally referenced to a voltage higher than VDD. 8.2 Voltage supervisor 8.2.1 Without external divider on pin PORADJ The voltage supervisor surveys the VDD supply voltage. It is used as Power-On Reset (POR) and as supply dropout detection during a card session. Supply dropout detection ensures that a proper deactivation sequence is followed before the voltage is too low. A reset pulse of duration tW (see Figure 4) is used internally for maintaining the TDA8023 in the Inactive mode during powering up or powering down of VDD. As long as VDD is less than Vth(POR)H the TDA8023 will remain inactive whatever the levels on the command lines are. This also lasts for the duration of tW after VDD has reached a level higher than Vth(POR)H. When VDD falls below Vth(POR)L an automatic deactivation sequence of the contacts is performed. In this case (no external resistor bridge) it is mandatory to connect pin PORADJ to GND. power on shutdown mode power off Vth(POR)H Vth(POR)L VDD status read status read Vhys(POR) INT tW tW SDWN bus unresponsive bus unresponsive bus unresponsive 001aag339 Fig 4. Voltage supervisor and Shutdown mode TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 6 of 32 TDA8023 NXP Semiconductors Low power IC card interface 8.2.2 With external divider on pin PORADJ If an external resistor bridge is connected to pin PORADJ (R1 to GND and R2 to VDD as shown in Figure 1 and Figure 2), then the internal threshold voltages and the internal hysteresis voltage are overridden by externally determined ones. The voltage on pin PORADJ is: R1 V PORADJ = -------------------- × V DD = k × V DD R1 + R2 where R1 k = -------------------R1 + R2 The thresholds that are applied by the TDA8023 to this voltage VPORADJ are: V hys V th ( H ) ( PORADJ ) = V bg ( int ) + ---------- (rising) 2 V hys V th ( L ) ( PORADJ ) = V bg ( int ) – ---------- (falling) 2 where Vbg(int) = 1.25 V (typ) Vhys = 60 mV (typ) The thresholds and hysteresis on VDD can then be calculated from: V th ( POR )H V V + hys- V th ( H ) ( PORADJ ) bg ( int ) ---------2 = -------------------------------------- = ----------------------------------------- (rising) k k V th ( POR )L V V – hys- V th ( L ) ( PORADJ ) bg ( int ) ---------2 = ------------------------------------- = ----------------------------------------- (falling) k k V hys V hys ( POR ) = ---------k The minimum threshold voltage Vth(POR)L should be chosen higher than 2 V. Input PORADJ is biased internally with a pull-down current source of 4 µA which is cut when the voltage on this pin exceeds 1 V. This ensures that after detection of the external bridge during power-on, the input current on this pin does not cause inaccuracy of the bridge voltage. 8.2.3 External capacitor on pin CDEL The width of the POR pulse (tW) is externally set by the value of the CDEL capacitor: the typical value is 1 ms per 2 nF. Usually CCDEL = 22 nF, therefore tW = 10 ms (typ). TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 7 of 32 TDA8023 NXP Semiconductors Low power IC card interface 8.2.4 Shutdown mode When pin SDWN = HIGH, the TDA8023 is in Shutdown mode; the consumption in this mode is less than 10 µA. The I2C-bus is unresponsive. If the card is extracted or inserted when the TDA8023 is in Power-down mode, pin INT becomes LOW and stays LOW as long as pin SDWN = HIGH. When pin SDWN is pulled LOW, the TDA8023 leaves Shutdown mode and executes a complete power-on reset sequence. 8.3 I2C-bus A 400 kHz I2C-bus slave interface is used for configuring the TDA8023 and reading the status. 8.3.1 I2C-bus protocol The I2C-bus is for 2-way 2-line communication between ICs or modules. The serial bus consists of two bidirectional lines: one for data signals (SDA) and one for clock signals (SCL). Both the SDA and SCL lines must be connected to a positive supply voltage via a pull-up resistor. The following protocol has been defined: • Data transfer may be initiated only when the bus is not busy • During data transfer, the data line must remain stable whenever the clock line is HIGH; changes in the data line while the clock line is HIGH will be interpreted as control signals 8.3.2 Bus conditions The following bus conditions have been defined. Bus not busy — Both data and clock lines remain HIGH. Start data transfer — A change in the state of the data line from HIGH to LOW, while the clock is HIGH, defines the START condition. Stop data transfer — A change in the state of the data line from LOW to HIGH, while the clock is HIGH, defines the STOP condition. Data valid — The state of the data line represents valid data when, after a START condition, the data line is stable for the duration of the HIGH period of the clock signal. There is one clock pulse per bit of data. 8.3.3 Data transfer Each data transfer is initiated with a START condition and terminated with a STOP condition (see Figure 7). See Table 15 for timing information. Data transfer is unlimited in the Read mode. The information is transmitted in bytes and each receiver acknowledges with a 9th bit. TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 8 of 32 TDA8023 NXP Semiconductors Low power IC card interface Within the I2C-bus specifications, a Standard mode (100 kHz clock rate) and a Fast-speed mode (400 kHz clock rate) are defined. The TDA8023 operates in both Fast-speed and Standard modes. By definition, a device that sends a signal is called a transmitter and a device that receives the signal is called a receiver. The device that controls the signal is called the master. The devices that are controlled by the master are called slaves. Each byte is followed by one acknowledge bit. This acknowledge bit is a HIGH level, put on the bus by the transmitter. The master generates an extra acknowledge-related clock pulse. The slave receiver that is addressed is obliged to generate an acknowledge after the reception of each byte. The master receiver must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse in such a way that the SDA line is stable LOW during the HIGH period of the acknowledge-related clock pulse. Set-up and hold times must be taken into account. A master receiver must signal an end of data to the slave transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event, the transmitter must leave the data line HIGH to enable the master generation of the STOP condition. 8.3.4 Device addressing Each TDA8023 has 2 different addresses, one for each of its two registers. Two TDA8023s may be used in parallel due to the address selection pin SAD0. Pin SAD0 is externally hardwired to pin VDD or pin GND. The voltage on pin SAD0 sets address bit b2: HIGH sets bit b2 to logic 1, LOW resets b2 to logic 0. Address bit b1 selects Register 0 or Register 1. Address bit b0 defines Read or Write operation: 1 means Read, 0 means Write. The addresses for the TDA8023 are shown in Table 4 and Table 5. Table 4. Device addressing b7 b6 b5 b4 b3 b2 b1 b0 0 1 0 0 0 SAD0 0/1 R/W Table 5. I2C-bus addresses for write mode Pin SAD0 Register 0 Register 1 L 40h 42h H 44h 46h TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 9 of 32 TDA8023 NXP Semiconductors Low power IC card interface 8.3.5 Registers Table 6. Bit Table of registers Register 0 Register 1 Read mode Write mode Read/Write mode Status Command REG1 = 0 REG1 = 1 REG0 = 0 REG0 = 1 REG0 = 0 REG0 = 1 7 ACTIVE VCC1V8 TEST D7 C15 C7 6 EARLY I/OEN RSTIN D6 C14 C6 5 MUTE REG1 C8 D5 C13 C5 4 PROT REG0 C4 D4 C12 C4 3 SUPL PDWN CLKPD2 D3 C11 C3 2 CLKSW 5V/3VN CLKPD1 D2 C10 C2 1 PRESL WARM CLKDIV2 D1 C9 C1 0 PRES START CLKDIV1 D0 C8 C0 Table 7. Status - Register 0 in Read mode bit description Bit Symbol Description 7 ACTIVE set if the card is active; reset if the card is inactive 6 EARLY set during Answer To Reset (ATR) when the selected card has answered too early 5 MUTE set during ATR when the card has not answered during the ISO 7816 time slots 4 PROT set when an overload or an overheating has occurred during a session; reset when the status has been read 3 SUPL set when the voltage supervisor has signalled a fault; reset when the status has been read 2 CLKSW set when the TDA8023 is in Power-down mode and the clock has changed 1 PRESL set when the card has been inserted or extracted; reset when the status has been read 0 PRES set when the card is present; reset when the card is not present When at least one of the bits PRESL, PROT, MUTE and EARLY is set, pin INT goes LOW until the status byte has been read. After power-on, bit SUPL is set until the status byte has been read, and pin INT = LOW until the voltage supervisor becomes inactive. Table 8. Command - Register 0 in Write mode bit description Bit Symbol Description 7 VCC1V8 1: VCC = 1.8 V 0: VCC is defined by bit 5V/3VN this bit can not change if bit START is logic 1 6 I/OEN 5 and 4 REG[1:0] 1: signal on pin I/OUC is transferred to pin I/O 0: pin I/OUC and pin I/O are high-impedance selection of subaddress in Register 1 (see Table 9, 10, 11 and 12) TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 10 of 32 TDA8023 NXP Semiconductors Low power IC card interface Table 8. Command - Register 0 in Write mode bit description …continued Bit Symbol Description 3 PDWN 1: applies on pin CLK the frequency that is defined by bits CLKPD[2:1] and reduces power consumption (in Synchronous mode); this bit can not change if bit START is logic 1 2 5V/3VN 1: VCC = 5 V 0: VCC = 3 V this bit can not change if bit START is logic 1 1 WARM 1: initiates a warm reset procedure this bit will be automatically reset by hardware when bit MUTE is set to logic 1 0 START 1: initiates an activation sequence and a cold reset procedure (only if bit SUPL = 0 and the bit PRES = 1) 0: initiates a deactivation sequence Table 9. R1_00 - Register 1 subaddress 00 in Read/Write mode bit description Bit Symbol Description 7 TEST 1: the circuit is in Test mode 6 RSTIN[1] 0: the circuit is in Operational mode defines the voltage on pin RST: 1: VCC 0: 0 V 5 C8 defines the voltage on pin C8: 1: VCC 0: 0 V 4 C4 defines the voltage on pin C4: 1: VCC 0: 0 V 3 and 2 CLKPD[2:1] clock pulse definition: 00: CLK stop LOW 01: CLK stop HIGH 10: frequency on pin CLK: fCLK = fosc(int) / 2 11: no change in Synchronous mode bit CLKPD2 is always logic 0 by hardware and bit CLKPD1 controls the voltage on pin CLK: 1: VCC 0: 0 V 1 and 0 CLKDIV[2:1] clock divider: 00: fCLK = fCLKIN 01: fCLK = fCLKIN / 2 10: fCLK = fCLKIN / 4 11: fCLK = fCLKIN / 5 in Synchronous mode, bits CLKDIV[2:1] are always 00 by hardware [1] Synchronous or asynchronous cards management are defined when bit START is set: the TDA8023 will be in asynchronous cards management when bit RSTIN = 1 when bit START is set to logic 1. TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 11 of 32 TDA8023 NXP Semiconductors Low power IC card interface Table 10. R1_01 - Register 1 subaddress 01 in Read/Write mode bit description Bit Symbol 7 to 0 D[7:0] Description 8-bit programmable CLK period count register; range: 0 to 255; initial value: 170 Table 11. R1_10 - Register 1 subaddress 10 in Read/Write mode bit description Bit Symbol Description 7 to 0 C[15:8] 8-bit programmable CLK period count register; range in combination with C[7:0]: 0 to 65535; initial value: 164 Table 12. R1_11 - Register 1 subaddress 11 in Read/Write mode bit description Bit Symbol Description 7 to 0 C[7:0] 8-bit programmable CLK period count register; range in combination with C[15:8]: 0 to 65535; initial value: 116 If bit RSTIN = 0 when bit START is set to logic 1, then pin RST is controlled by bit RSTIN. Else, pin RST = LOW during a number of CLK periods, defined by the 16-bit CLK count register C[15:0], and goes HIGH afterwards. There are two synchronous card management types: • If bit PDWN = 0 when bit START is set to logic 1, then the output CLK is controlled by input CLKIN (without division) • If bit PDWN = 1 when bit START is set to logic 1, then the output CLK is controlled by bit CLKPD1 8.4 DC-to-DC converter For generating a supply voltage VCC of 5 V ± 5 % or 3 V ± 5 % to the card, an integrated voltage converter is incorporated. This DC-to-DC converter should be separately supplied by VDD(DCDC) on pin VDDP and GNDP (from 2.7 V to 6.5 V). The DC-to-DC conversion is either capacitive or inductive, according to the external components (automatic detection). 8.4.1 Capacitive configuration The external components are three 100 nF capacitors (low-ESR), see Figure 1. The DC-to-DC converter is either tripler, doubler or follower according to the respective values of VCC and VDD(DCDC). An hysteresis of 100 mV is present on both thresholds: • Follower: – If VCC = 5 V and VDD(DCDC) > 5.8 V – If VCC = 3 V and VDD(DCDC) > 4 V – If VCC = 1.8 V TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 12 of 32 TDA8023 NXP Semiconductors Low power IC card interface • Doubler: – If VCC = 5 V and VDD(DCDC) = 4 V to 5.8 V – If VCC = 3 V and VDD(DCDC) < 4 V • Tripler: – If VCC = 5 V and VDD(DCDC) < 4 V 8.4.2 Inductive configuration The external components are a diode, a coil of 6.8 µH and a capacitor of 4.7 µF (see Figure 2). In this configuration the DC-to-DC converter acts as follows. • If VCC = 5 V then VVUP is regulated at 5.5 V • If VCC = 3 V then VVUP is regulated at 4 V • If VCC = 1.8 V then the DC-to-DC converter acts as a follower 8.5 VCC buffer In all modes (follower, doubler, tripler), the DC-to-DC converter is able to deliver 60 mA over the whole VDD range (2.7 V to 6.5 V) or 90 mA if VDD > 3 V. The current on the VCC buffer has an internal limitation of around 90 mA. When this limit is reached, an automatic deactivation sequence is performed. The VCC voltage should be decoupled with a low-ESR capacitor between 100 nF and 168 nF. If the card socket is not very close to the TDA8023, one capacitor should be placed near the TDA8023, and a second one near the card contacts. 8.6 Sequencer and clock counter The sequencer takes care of ensuring activation and deactivation sequences according to ISO 7816 and EMV 2000, even in case of emergency (card removal during transaction, supply dropout or hardware problem). The sequencer is clocked with an internal oscillator. The activation of a card is initiated by setting bit START in the Command register, which is only possible if the card is present and if the voltage supervisor is not active. The activation sequence is described in Section 8.6.1. The deactivation is initiated either by the system controller or automatically in case of a hardware problem or a supply dropout. The deactivation sequence is described in Section 8.6.2. Outside a session, card contacts are forced low-impedance with respect to pin GNDC. 8.6.1 Activation sequence When the card is inactive, pins VCC, CLK, RST and I/O are LOW, which is low-impedance with respect to pin GNDC. The DC-to-DC converter is stopped. TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 13 of 32 TDA8023 NXP Semiconductors Low power IC card interface When everything is satisfactorily present (voltage supply, card present, no hardware problems) the system controller may initiate an activation sequence of a present card: 1. The internal oscillator changes to its high frequency (t0, see Figure 5). 2. The DC-to-DC converter is started (t1). 3. VCC starts rising from 0 V to 5 V, 3 V or 1.8 V with a controlled rise time (t2). 4. The voltage on pin I/O rises to VCC, due to integrated 14 kΩ pull-ups to VCC (t3). 5. CLK is sent to the card and pin RST is enabled (t4 = tact). During the activation sequence, the answer from the card (ATR) is monitored and the steps are the following: 1. If a start bit is detected on pin I/O during the first 200 CLK pulses, then it is simply ignored, and the CLK count goes on. 2. If a start bit is detected whilst pin RST = LOW (between 200 and 42100 CLK pulses or the value written in C[15:0]), then the bits EARLY and MUTE are set in the Status register. Pin RST will remain LOW. It is up to the software to decide whether to accept the card or not. 3. If no start bit has been detected within 42100 CLK pulses, then pin RST is toggled to HIGH (t5). 4. If, again, a start bit is detected within 370 CLK pulses (200 + 170 or the value defined in D[7:0]), bit EARLY in the Status register is set. 5. If the card does not answer within 42100 new CLK pulses, then bit MUTE in the Status register is set. 6. If the card answers within the correct time window, then the CLK count is stopped and the system controller can send commands to the card. f osc ( int ) The sequencer is clocked by ------------------- which leads to a time interval T = 25 µs (typical). 64 T 7T 3T Thus t 1 = 0 s to ------ , t 2 = t 1 + ------- , t 3 = t 1 + ------- and t 4 = t 1 + 4T . 64 2 2 START VUP VCC I/O CLK RST t0 t1 t2 tact t3 t4 t5 ATR 001aag340 Fig 5. Activation sequence TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 14 of 32 TDA8023 NXP Semiconductors Low power IC card interface 8.6.2 Deactivation sequence When the session is completed, the microcontroller resets bit START to logic 0 (t10, see Figure 6). The circuit then executes an automatic deactivation sequence: 1. Card reset: pin RST falls to LOW (t11). 2. CLK is stopped (t12). 3. Pin I/O falls to 0 V (t13). 4. Pin VCC falls to 0 V with a controlled slew rate (t14). 5. The DC-to-DC converter is stopped and pins CLK, RST, VCC and I/O become low-impedance with relation to GNDC (t15). 6. The internal oscillator changes to its low frequency (t15). T T 3T 7T t 11 = t 10 + ------ , t 12 = t 11 + --- , t 13 = t 11 + T , t 14 = t 11 + ------- and t 15 = t 11 + ------- . 2 64 2 2 The deactivation time tdeact is the time that VCC needs for going down to less than 0.4 V, counted from the moment bit START is reset. START RST CLK I/O VCC VUP t10 t11 t12 t13 t14 t15 001aag619 tdeact Fig 6. Deactivation sequence 8.7 Protection All card contacts are protected against any short with any other card contact. The currents on various pins are limited: • • • • on pin CLK: limited to ±70 mA on pin I/O: limited to ±10 mA (typical value) on pin RST: limited (only when this pin is LOW) to ±20 mA on pin VCC: limited to 90 mA If any of these currents exceeds its limit, an emergency deactivation sequence is performed: pin INT is pulled LOW and bit PROT in the Status register is set. TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 15 of 32 TDA8023 NXP Semiconductors Low power IC card interface In case of overcurrent on pin VCC, removal of the card during a session, overheating, supply dropout, DC-to-DC out of limits, or overcurrent on pin RST, the TDA8023 performs an automatic emergency deactivation sequence on the card, resets bit START and pulls pin INT LOW. 9. Limiting values Table 13. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDD supply voltage on pin VDD −0.5 +6.5 V VDD(DCDC) DC-to-DC converter supply voltage on pin VDDP −0.5 +6.5 V VDD(INTF) interface supply voltage on pin VDDI −0.5 +6.5 V VIH HIGH-level input voltage on pins SAP, SAM, SBP, SBM, VUP −0.5 +7.5 V −0.5 +6.5 V on pins SDA, SCL Ptot total power dissipation Tstg storage temperature Tj junction temperature Vesd electrostatic discharge voltage on all other pins −0.5 VDD + 0.5 V Tamb = −25 °C to +85 °C - 500 mW −55 +150 °C - 150 °C on card pins I/O, VCC, CLK, GNDC, PRES, RST −6 +6 kV on all other pins −2 +2 kV −200 +200 V [1] Human Body Model (HBM) Machine Model (MM) all pins, excluding card pins [1] Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining. Method 3015 (HBM; 1500 Ω; 100 pF) defines 3 pulses positive and 3 pulses negative on each pin referenced to ground. 10. Thermal characteristics Table 14. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient in free air 100 K/W TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 16 of 32 TDA8023 NXP Semiconductors Low power IC card interface 11. Characteristics Table 15. Supply VDD = 3.3 V; VDD(INTF) = 1.5 V; fCLKIN = 10 MHz; GND = 0 V; Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VDD supply voltage on pin VDD 2.7 - 6.5 V VDD(DCDC) DC-to-DC converter supply voltage on pin VDDP 2.7 - 6.5 V VDD(INTF) interface supply voltage on pin VDDI supply current IDD 1.5 - 6.5 V Shutdown mode [1] - - 10 µA Inactive mode; CLKIN LOW or HIGH [1] - - 200 µA Active mode; VCC = 5 V; fCLK = 5 MHz [1] capacitive; ICC = 5 mA - - 15 mA capacitive; ICC = 55 mA - - 200 mA inductive; ICC = 5 mA - - 15 mA inductive; ICC = 55 mA - - 150 mA - - 2 mA - - 120 µA Power-down mode; VCC = 5 V; ICC = 100 µA; CLK stopped; CLKIN HIGH or LOW; capacitive or inductive [1] IDD(INTF) interface supply current Vth(POR)L LOW-level power-on reset decreasing voltage on pin VDD; see Figure 4 threshold voltage 2.30 - 2.60 V Vhys(POR) power-on reset hysteresis on pin VDD; see Figure 4 voltage 50 - 150 mV [1] on pin VDDI Sum of currents on pins VDD and VDDI. Table 16. Supply supervisor VDD = 3.3 V; VDD(INTF) = 1.5 V; fCLKIN = 10 MHz; GND = 0 V; Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Vth(H)(PORADJ) HIGH-level threshold voltage on pin PORADJ rising voltage; see Section 8.2.2 1.25 1.28 1.31 V Vth(L)(PORADJ) LOW-level threshold voltage on pin PORADJ falling voltage; see Section 8.2.2 1.19 1.22 1.25 V Vhys hysteresis voltage Vth(H)(PORADJ) − Vth(L)(PORADJ); see Section 8.2.2 30 60 90 mV ∆Vth/∆T threshold voltage variation with temperature on Vth(H)(PORADJ) and Vth(L)(PORADJ) - - 0.25 mV/°C IL leakage current VPORADJ < 0.6 V 0 4 10 µA VPORADJ > 0.8 V −1 - +1 µA - - VDD + 0.3 V Pin PORADJ Pin CDEL VCDEL voltage on pin CDEL ICDEL current on pin CDEL tW pulse width pin grounded (charge) - −2 0 µA VCDEL = VDD (discharge) - −5 - mA internal alarm pulse; CCDEL = 22 nF - 10 - ms TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 17 of 32 TDA8023 NXP Semiconductors Low power IC card interface Table 17. DC-to-DC converter VDD = 3.3 V; VDD(INTF) = 1.5 V; fCLKIN = 10 MHz; GND = 0 V; Tamb = 25 °C; unless otherwise specified. Symbol Parameter fosc(int) internal oscillator frequency VVUP voltage on pin VUP Vdet detection voltage Conditions Min Typ Max Unit 2 2.5 3 MHz 5 V card 5.3 5.5 5.8 V 3 V card 3.5 4 4.2 V 1.8 V card - VDD(DCDC) - V 5 V card; Follower mode 5.5 5.8 6 V 3 V card; Follower mode 3.8 4 4.2 V 5 V card; Tripler mode - 3.5 - V on pin VDDP Table 18. Card drivers VDD = 3.3 V; VDD(INTF) = 1.5 V; fCLKIN = 10 MHz; GND = 0 V; Tamb = 25 °C; unless otherwise specified. Symbol Parameter Supply voltage for the card: pin VCC Vo(inact) Conditions Min Typ Max Unit [1] inactive mode output voltage no load 0 - 0.1 V Io(inact) = 1 mA 0 - 0.3 V Io(inact) inactive mode output current at grounded pin VCC - - −1 mA VCC supply voltage Active mode; 2.7 V < VDD < 6.5 V 5 V card; ICC < 60 mA; VCC = 5 V 4.75 5 5.25 V 3 V card; ICC < 55 mA; VCC = 3 V 2.80 3 3.15 V 1.65 1.8 1.95 V 5 V card; current pulses of 40 nAs 4.65 - 5.35 V 3 V card; current pulses of 24 nAs 2.76 - 3.24 V [2] 1.8 V card; ICC < 30 mA; VCC = 1.8 V Active mode; AC current pulses with I < 200 mA, t < 400 ns and f < 20 MHz 1.8 V card; current pulses of 15 nAs [2] 1.62 - 1.98 V - - 350 mV 5 V card; VCC = 0 V to 5 V - - −55 mA 3 V card; VCC = 0 V to 3 V - - −55 mA 1.8 V card; VCC = 0 V to 1.8 V - - −35 mA 5 V card or 3 V card - −90 −120 mA 1.8 V card - −70 −90 mA 5 V card 0.080 0.140 0.200 V/µs 3 V card 0.050 0.080 0.110 V/µs 1.8 V card 0.025 0.045 0.080 V/µs Vripple(p-p) peak-to-peak ripple voltage on VCC; 20 kHz < f < 200 MHz ICC supply current VDD > 2.7 V VCC shorted to GND SR slew rate rise or fall; maximum load capacitor CL = 300 nF TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 18 of 32 TDA8023 NXP Semiconductors Low power IC card interface Table 18. Card drivers …continued VDD = 3.3 V; VDD(INTF) = 1.5 V; fCLKIN = 10 MHz; GND = 0 V; Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 0.1 V Reset output to the card: pin RST Vo(inact) inactive mode output voltage no load 0 - Io(inact) = 1 mA 0 - 0.3 V Io(inact) inactive mode output current at grounded pin RST 0 - −1 mA VOL LOW-level output voltage IOL = 200 µA 0 - 0.3 V VOH HIGH-level output voltage IOH < −200 µA VCC − 0.5 - VCC V tr rise time CL = 30 pF - - 0.1 µs tf fall time CL = 30 pF - - 0.1 µs inactive mode output voltage no load 0 - 0.1 V Io(inact) = 1 mA 0 - 0.3 V Io(inact) inactive mode output current at grounded pin CLK 0 - −1 mA VOL LOW-level output voltage IOL = 200 µA 0 - 0.3 V VOH HIGH-level output voltage IOH < −200 µA VCC − 0.5 - VCC V tr rise time CL = 30 pF - - 8 ns tf fall time CL = 30 pF - - 8 ns Clock output to the card: pin CLK Vo(inact) fCLK frequency on pin CLK operational 0 - 10 MHz δ clock duty cycle CL = 30 pF 45 - 55 % SR slew rate rise and fall; CL = 30 pF 0.2 - - V/ns no load 0 - 0.1 V Io(inact) = 1 mA - - 0.3 V - - −1 mA V Data lines: pins I/O, C4 and C8 Vo(inact) inactive mode output voltage [3] Io(inact) inactive mode output current at grounded pin I/O VOL LOW-level output voltage IOL = 1 mA 0 - 0.3 VOH HIGH-level output voltage no DC load 0.9VCC - VCC + 0.1 V IOH < −20 µA 0.8VCC - VCC + 0.1 V IOH < −40 µA 0.75VCC - VCC + 0.1 V −0.3 - +0.8 V 1.5 - VCC V VCC = 5 V - - 600 µA VCC = 3 V - - 500 µA - - 10 µA VIL LOW-level input voltage VIH HIGH-level input voltage IIL ILIH LOW-level input current HIGH-level input leakage current at pin I/O; VIL = 0 V at pin I/O; VIH = VCC TDA8023_1 Product data sheet [3] [3] © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 19 of 32 TDA8023 NXP Semiconductors Low power IC card interface Table 18. Card drivers …continued VDD = 3.3 V; VDD(INTF) = 1.5 V; fCLKIN = 10 MHz; GND = 0 V; Tamb = 25 °C; unless otherwise specified. Symbol Ipu Parameter pull-up current Conditions [3] at pin I/O; VOH = 0.9VCC; CL = 30 pF [3][4] Min Typ Max Unit −1 - - mA - 500 650 ns td delay time between edges on pin I/O and pin I/OUC; corresponds to width of active pull-up pulse tr rise time inputs; from VIL(max) to VIH(min) - - 1.5 µs tTLH clock rise time output transition time; from 10 % of VCC to 90 % of VCC; CL < 30 pF; no DC load - - 0.1 µs Ci input capacitance on pin I/O [3] - - 10 pF 10 13.5 17 kΩ - - 500 kHz Rpu(int) internal pull-up resistance between pin I/O and VCC [3] fmax maximum input clock frequency on pin I/O [3] Card presence input: pin PRES, active-HIGH when pin SPRES = LOW or active-LOW when pin SPRES = HIGH VIL LOW-level input voltage - - 0.3VDD V VIH HIGH-level input voltage 0.7VDD - - V ILIL LOW-level input leakage VI = 0.3VDD; pin SPRES = HIGH current VI = 0.3VDD; pin SPRES = LOW 0 - 5 µA 10 - 40 µA VI = 0.7VDD; pin SPRES = HIGH −40 - −10 µA VI = 0.7VDD; pin SPRES = LOW −5 - 0 µA HIGH-level input leakage current ILIH [1] Two ceramic multilayer capacitors of minimum 100 nF with low Equivalent Series Resistance (ESR) should be used in order to meet these specifications. [2] Output voltage towards the card, including ripple. [3] Pin I/O has an internal 15 kΩ pull-up resistor to VCC. [4] Pin I/OUC has an internal 11 kΩ pull-up resistor to VDD(INTF). Table 19. Sequencer and clock counter VDD = 3.3 V; VDD(INTF) = 1.5 V; fCLKIN = 10 MHz; GND = 0 V; Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit tact activation time total sequence - - 135 µs tdeact deactivation time total sequence 60 80 100 µs Table 20. Interface signals to host controller VDD = 3.3 V; VDD(INTF) = 1.5 V; fCLKIN = 10 MHz; GND = 0 V; Tamb = 25 °C; unless otherwise specified. Symbol Parameter Data line: pin Conditions Min Typ Max Unit I/OUC[1] VOL LOW-level output voltage IOL = 1 mA 0 - 0.3 V VOH HIGH-level output voltage no DC load 0.9VDD(INTF) - VDD(INTF) + 0.2 V IOH < −10 µA 0.75VDD(INTF) - VDD(INTF) + 0.2 V −0.3 - 0.25VDD(INTF) V VIL LOW-level input voltage VIH HIGH-level input voltage 0.7VDD(INTF) - VDD(INTF) + 0.3 V IIL LOW-level input current VIL = 0 V - - 600 µA ILIH HIGH-level input leakage current VIH = VDD(INTF) - - 10 µA TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 20 of 32 TDA8023 NXP Semiconductors Low power IC card interface Table 20. Interface signals to host controller …continued VDD = 3.3 V; VDD(INTF) = 1.5 V; fCLKIN = 10 MHz; GND = 0 V; Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit tr rise time input; from VIL(max) to VIH(min) - - 1 µs tTLH clock rise time output transition time; from 10 % to 90 % of VDD(INTF); CL < 30 pF - - 0.1 µs Rpu(int) internal pull-up resistance between pin I/OUC and pin VDDI 11 15 19 kΩ 0 - 25 MHz VDD(INTF) > 2 V 0 - 0.3VDD(INTF) V 1.5 V < VDD(INTF) < 2 V 0 - 0.15VDD(INTF) V VDD(INTF) > 2 V 0.7VDD(INTF) - VDD(INTF) + 0.3 V 1.5 V < VDD(INTF) < 2 V 0.85VDD(INTF) - VDD(INTF) + 0.3 ns [1] Clock input: pin CLKIN fCLKIN frequency on pin CLKIN VIL LOW-level input voltage VIH HIGH-level input voltage tr rise time - - 0.1 / fCLKIN ns tf fall time - - 0.1 / fCLKIN ns Logic inputs: pins SAD0, SPRES and SDWN VIL LOW-level input voltage −0.3 - 0.3VDD(INTF) V VIH HIGH-level input voltage 0.7VDD - VDD(INTF) + 0.3 V ILIL LOW-level input leakage current - - ±1 µA ILIH HIGH-level input leakage current - - ±1 µA Ci input capacitance - - 10 pF - - 0.3 V - - 10 µA Interrupt line: pin INT; open-drain active-LOW output VOL LOW-level output voltage ILH HIGH-level leakage current Io = 2 mA Serial data input/output: pin SDA; open-drain VIL LOW-level input voltage −0.3 - 0.3VDD V VIH HIGH-level input voltage 0.7VDD - 6.5 V VOL1 LOW-level output voltage IOL = 3 mA - - 0.3 V ILH HIGH-level leakage current input or output - - 1 µA ILL LOW-level leakage current depends on the pull-up resistance; input or output - - 1 µA V Serial clock input: pin SCL VIL LOW-level input voltage −0.3 - 0.3VDD VIH HIGH-level input voltage 0.7VDD - 6.5 V ILIH HIGH-level input leakage current - - 1 µA IIL LOW-level input current - - 1 µA depends on the pull-up resistance TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 21 of 32 TDA8023 NXP Semiconductors Low power IC card interface Table 20. Interface signals to host controller …continued VDD = 3.3 V; VDD(INTF) = 1.5 V; fCLKIN = 10 MHz; GND = 0 V; Tamb = 25 °C; unless otherwise specified. Symbol I2C-bus Parameter Conditions Min Typ Max Unit timing; see Figure 7 fSCL SCL clock frequency 0 - 400 kHz tBUF bus free time between a STOP and START condition 1.3 - - µs tHD;STA hold time (repeated) START condition 0.6 - - µs tLOW LOW period of the SCL clock 1.3 - - µs tHIGH HIGH period of the SCL clock 0.6 - - µs tSU;STA set-up time for a repeated START condition 0.6 - - µs tHD;DAT data hold time 0 - - ns tSU;DAT data set-up time 100 - - ns tr rise time of both SDA and SCL signals - - 300 ns tf fall time of both SDA and SCL signals - - 300 ns tSU;STO set-up time for STOP condition 0.6 - - µs hold time after which first clock pulse is generated [2] [1] Pin I/OUC has an internal 11 kΩ pull-up resistor to VDD(INTF). [2] The hold time required (not greater than 300 ns) to bridge the undefined region of the falling edge of SCL must be internally provided by a transmitter. Table 21. Protection and limitations VDD = 3.3 V; VDD(INTF) = 1.5 V; fCLKIN = 10 MHz; GND = 0 V; Tamb = 25 °C; unless otherwise specified. Symbol Parameter Tamb ambient temperature Tsd shutdown temperature input current limit IIlim IOlim [1] output current limit Conditions Min Typ Max Unit −40 - +85 °C - 150 - °C on pin I/O [1] −15 - +15 mA on pin I/O [1] −15 - +15 mA at die on pin CLK −70 - +70 mA shutdown current; on pin RST −20 - +20 mA shutdown current; on pin VCC - −90 - mA Pin I/O has an internal 15 kΩ pull-up resistor to VCC. TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 22 of 32 TDA8023 NXP Semiconductors Low power IC card interface SDA tBUF SCL P tLOW tf tHD;STA S tHD;STA tr tHD;DAT tHIGH tSU;DAT S P tSU;STA tSU;STO mba705 P = STOP condition; S = START condition. Fig 7. Timing requirements for the I2C-bus TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 23 of 32 TDA8023 NXP Semiconductors Low power IC card interface 12. Application information VDD R3 10 kΩ C16(1) IC1 VDD IC2 C20 100 nF HOST CONTROLLER VDD INT GND SDA 4.7 kΩ INT SDWN VDDI SDA SCL SCL CLKout I/OAUX VUP 4.7 kΩ SAD0 SPRES VDD CLKIN GND I/OUC C8 C4 I/O 100 nF 1 28 2 27 3 26 4 25 5 24 6 23 7 22 8 TDA8023TT 21 9 20 10 19 11 18 12 17 13 16 14 15 SAP SBP VDD VDDP C19(1) SBM C15 100 nF GNDP 100 nF C17(1) SAM 100 nF VDD CDEL 22 nF CDEL VDD PORADJ PRES P1 10 kΩ C29 100 nF RST VCC CLK GNDC C13(2) 68 nF C18(1) 100 nF CARD READER normally closed C5I C6I C7I C8I C1I C2I C3I C4I K1 K2 Rp 10 kΩ VDD 001aag341 (1) Low-ESR capacitor, placed near the IC. (2) Low-ESR capacitor, placed near the C1 contact. Fig 8. Application diagram: typical TDA8023TT application with capacitive DC-to-DC converter TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 24 of 32 TDA8023 NXP Semiconductors Low power IC card interface VDD R3 10 kΩ C16(1) IC1 VDD IC2 C20 100 nF HOST CONTROLLER VDD INT GND SDA 4.7 kΩ INT SDWN VDDI SDA SCL SCL CLKout I/OAUX VUP 4.7 kΩ SAD0 SPRES VDD CLKIN GND I/OUC C8 C4 I/O 1 28 2 27 3 26 4 25 5 24 6 23 7 22 8 TDA8023TT 21 9 20 10 19 11 18 12 17 13 16 14 15 SAP SBP D1 C8 BAT54 4.7 µF 16 V 100 nF VDD VDDP L1 SBM 6.8 µH C15 100 nF GNDP SAM VDD CDEL 22 nF CDEL VDD PORADJ PRES P1 10 kΩ C29 100 nF RST VCC CLK GNDC C13(2) 68 nF C18(1) 100 nF CARD READER normally open C5I C6I C7I C8I C1I C2I C3I C4I K1 K2 VDD 001aag342 (1) Low-ESR capacitor, placed near the IC. (2) Low-ESR capacitor, placed near the C1 contact. Fig 9. Application diagram: typical TDA8023TT application with inductive DC-to-DC converter TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 25 of 32 TDA8023 NXP Semiconductors Low power IC card interface 13. Package outline TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm D SOT361-1 E A X c HE y v M A Z 15 28 Q A2 (A 3) A1 pin 1 index A θ Lp 1 L 14 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.1 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 9.8 9.6 4.5 4.3 0.65 6.6 6.2 1 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.8 0.5 8 o 0 o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT361-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-153 Fig 10. Package outline SOT361-1 (TSSOP28) TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 26 of 32 TDA8023 NXP Semiconductors Low power IC card interface 14. Soldering This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 14.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 14.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus PbSn soldering 14.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 27 of 32 TDA8023 NXP Semiconductors Low power IC card interface 14.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 11) than a PbSn process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 22 and 23 Table 22. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 ≥ 350 < 2.5 235 220 ≥ 2.5 220 220 Table 23. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 11. TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 28 of 32 TDA8023 NXP Semiconductors Low power IC card interface temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 11. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 29 of 32 TDA8023 NXP Semiconductors Low power IC card interface 15. Revision history Table 24. Revision history Document ID Release date Data sheet status Change notice Supersedes TDA8023_1 20070716 Product data sheet - - TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 30 of 32 TDA8023 NXP Semiconductors Low power IC card interface 16. Legal information 16.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 16.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I2C-bus — logo is a trademark of NXP B.V. 17. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: [email protected] TDA8023_1 Product data sheet © NXP B.V. 2007. All rights reserved. Rev. 01 — 16 July 2007 31 of 32 TDA8023 NXP Semiconductors Low power IC card interface 18. Contents 1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.2.1 8.2.2 8.2.3 8.2.4 8.3 8.3.1 8.3.2 8.3.3 8.3.4 8.3.5 8.4 8.4.1 8.4.2 8.5 8.6 8.6.1 8.6.2 8.7 9 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 16.1 16.2 16.3 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 6 Power supplies . . . . . . . . . . . . . . . . . . . . . . . . . 6 Voltage supervisor . . . . . . . . . . . . . . . . . . . . . . 6 Without external divider on pin PORADJ . . . . . 6 With external divider on pin PORADJ. . . . . . . . 7 External capacitor on pin CDEL . . . . . . . . . . . . 7 Shutdown mode . . . . . . . . . . . . . . . . . . . . . . . . 8 I2C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 I2C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . . 8 Bus conditions . . . . . . . . . . . . . . . . . . . . . . . . . 8 Data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Device addressing . . . . . . . . . . . . . . . . . . . . . . 9 Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 DC-to-DC converter . . . . . . . . . . . . . . . . . . . . 12 Capacitive configuration . . . . . . . . . . . . . . . . . 12 Inductive configuration . . . . . . . . . . . . . . . . . . 13 VCC buffer . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Sequencer and clock counter . . . . . . . . . . . . . 13 Activation sequence . . . . . . . . . . . . . . . . . . . . 13 Deactivation sequence . . . . . . . . . . . . . . . . . . 15 Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 16 Thermal characteristics. . . . . . . . . . . . . . . . . . 16 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 17 Application information. . . . . . . . . . . . . . . . . . 24 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 26 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Introduction to soldering . . . . . . . . . . . . . . . . . 27 Wave and reflow soldering . . . . . . . . . . . . . . . 27 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 27 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 28 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 30 Legal information. . . . . . . . . . . . . . . . . . . . . . . 31 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 31 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 16.4 17 18 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Contact information . . . . . . . . . . . . . . . . . . . . 31 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 16 July 2007 Document identifier: TDA8023_1