PHILIPS TDA8003TS

INTEGRATED CIRCUITS
DATA SHEET
TDA8003TS
I2C-bus SIM card interface
Product specification
Supersedes data of 2000 Feb 29
File under Integrated Circuits, IC02
2000 Apr 20
Philips Semiconductors
Product specification
I2C-bus SIM card interface
TDA8003TS
FEATURES
• Subscriber Identification Module (SIM) card interface in
accordance with GSM11.11, GSM11.12 (Global System
for Mobile communication) and ISO 7816 requirements
• VCC regulation (3 or 5 V ±8%) with controlled rise and
fall times
APPLICATIONS
• Card take-off protection
• One protected and buffered pseudo-bidirectional I/O line
(I/O referenced to VCC and SIMI/O referenced to VDDI)
• GSM mobile phones
• Clock generation (up to 10 MHz) with synchronous start
and frequency doubling
• Portable card readers, etc.
• SAM interfaces in banking terminals
• Clock stop LOW, clock stop HIGH or 1.25 MHz (from
internal oscillator) for cards Power-down mode
GENERAL DESCRIPTION
The TDA8003TS is a low cost one chip SIM interface, in
accordance with GSM11.11, GSM11.12 and EMV96
(Europay, Mastercard, Visa) with card current limitation.
Controlled by I2C-bus, it is optimized in terms of board
space, external components count and connection count
(see Chapter “Application information”).
• Automatic activation and deactivation sequences of an
independent sequencer
• Automatic processing of pin RST with count of the CLK
cycles for start of the Answer To Reset (ATR)
• Warm reset command
• Supply voltage supervisor for Power-on reset, spike
killing and emergency deactivation in case of supply
drop-out
The integrated DC-to-DC converter ensures full
cross-compatibility between 3 or 5 V cards and 3 or 5 V
environments. The very low-power consumption in
Power-down mode and Off mode saves battery power.
• DC-to-DC converter (doubler, tripler or follower)
allowing operation in a 3 or 5 V environment
(2.5 ≤ VDD ≤ 6 V)
• Enhanced Electrostatic Discharge (ESD) protections on
card side (6 kV minimum)
• Power-down mode with several active features and
current reduction
• Off mode with 2 µA current
• Control from a microcontroller via a 400 kHz slave
I2C-bus (4 possible addresses: 48H, 4AH, 4CH
and 4EH)
• Four parallel devices possible due to 2 sub-address
wires
• Interface signals supplied by an independent voltage
(1.5 ≤ VDDI ≤ 6 V).
ORDERING INFORMATION
PACKAGE
TYPE
NUMBER
NAME
TDA8003TS/C1
SSOP24
plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
TDA8003TS/C2
SSOP24
plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
2000 Apr 20
DESCRIPTION
2
VERSION
Philips Semiconductors
Product specification
I2C-bus SIM card interface
TDA8003TS
QUICK REFERENCE DATA
SYMBOL
PARAMETER
VDD
supply voltage on pins VDDS
and VDDP
IDD
supply current on pins VDDS
and VDDP
VDDI
interface signal supply voltage
VCC
card supply voltage
CONDITIONS
MIN.
TYP.
MAX.
UNIT
2.5
−
6
V
Off mode; VDD = 3 V
−
−
2
µA
Power-down mode; VDD = 3 V;
VCC = 5 V; ICC = 100 µA; SIMCLK
connected to PGND or VDDI;
CLK is stopped
−
−
500
µA
active mode; VDD = 3 V; VCC = 3 V;
ICC = 6 mA; fCLK = 3.25 MHz
−
−
18
mA
active mode; VDD = 3 V; VCC = 5 V;
ICC = 10 mA; fCLK = 3.25 MHz
−
−
50
mA
active mode; VDD = 5 V; VCC = 3 V;
ICC = 6 mA; fCLK = 3.25 MHz
−
−
10
mA
active mode; VDD = 5 V; VCC = 5 V;
ICC = 10 mA; fCLK = 3.25 MHz
−
−
30
mA
1.5
−
6
V
5 V card; active mode;
0 < ICC < 15 mA; 40 nAs dynamic
load on 200 nF capacitor
4.6
5
5.4
V
3 V card; active mode;
0 < ICC < 10 mA; 24 nAs dynamic
load on 200 nF capacitor
2.75
3
3.25
V
−
5.4
V
5 V card; bit PDOWN = 1; ICC < 5 mA 4.6
3 V card; bit PDOWN = 1; ICC < 5 mA 2.75
−
3.25
V
CL(max) = 200 nF
0.05
−
0.25
V/µs
deactivation time
−
−
120
µs
tact
activation time
−
−
150
µs
fi(SIMCLK)
clock input frequency
0
−
20
MHz
Tamb
operating ambient temperature
−40
−
+85
°C
SR
slew rate on VCC (rise and fall)
tde
2000 Apr 20
3
Philips Semiconductors
Product specification
I2C-bus SIM card interface
TDA8003TS
BLOCK DIAGRAM
VDDP
handbook, full pagewidth
100 nF
VDDS
2.2 µF
100 nF
S3
S4
S1
S2
4
6
2
7
100 nF
5
14
VUP 8
21
100 nF
DC-TO-DC
CONVERTER
PGND 3
VOLTAGE
SUPERVISOR
15
SIMERR
DEL
10 nF
TDA8003TS
SEQUENCER
18
VDDI
12
VCC
200 nF
23
RST
I/O
CLK
PRES
13
9
ANALOG
DRIVERS
AND
PROTECTIONS
I2C-BUS
INTERFACE
AND
REGISTERS
INTERNAL
OSCILLATOR
22
19
20
1
17
SDA
SCL
PWROFF
SIMI/O
11
CLOCK
COUNTER
16
CLOCK
CIRCUITRY
24
10
MGR434
SGND
Fig.1 Block diagram.
2000 Apr 20
SAD1
SAD0
4
SIMCLK
Philips Semiconductors
Product specification
I2C-bus SIM card interface
TDA8003TS
PINNING
SYMBOL
PIN
DESCRIPTION
PWROFF
1
control input for entering the Off mode (active LOW)
S1
2
capacitor connection for the DC-to-DC converter (between S1 and S2)
PGND
3
power ground
S3
4
capacitor connection for the DC-to-DC converter (between S3 and S4)
VDDP
5
power supply voltage
S4
6
capacitor connection for the DC-to-DC converter (between S3 and S4)
S2
7
capacitor connection for the DC-to-DC converter (between S1 and S2)
VUP
8
DC-to-DC converter output (must be decoupled with 100 nF to ground)
I/O
9
input/output to and from the card reader (C7I); see Fig.7
SGND
10
signal ground
CLK
11
clock output to the card reader (C3I)
VCC
12
supply voltage to the card reader (C1I)
RST
13
reset output to the card reader (C2I)
VDDS
14
signal supply voltage
DEL
15
external capacitor connection for the delay on voltage supervisor
PRES
16
card presence indication input (active LOW); note 1
SIMI/O
17
input/output to and from the microcontroller (internal 20 kΩ pull-up resistor connected to VDDI)
VDDI
18
supply voltage for the interface signals with the system
SDA
19
I2C-bus serial data input/output
SCL
20
I2C-bus serial clock input
SIMERR
21
interrupt output (active LOW; internal 100 kΩ pull-up resistor connected to VDDI)
SAD0
22
I2C-bus slave address selection input
SAD1
23
I2C-bus slave address selection input
SIMCLK
24
external clock input
Note
1. Card presence input with negative current source. To be used with the card reader switch connected to VDDS
or VDDP. The switch is normally closed when the card is not present. If the switch connection is open-circuit or pin 16
is not connected, then the interface will always detect a present card (see Fig.7).
2000 Apr 20
5
Philips Semiconductors
Product specification
I2C-bus SIM card interface
TDA8003TS
handbook, halfpage
PWROFF 1
24 SIMCLK
S1 2
23 SAD1
PGND 3
22 SAD0
S3 4
21 SIMERR
VDDP 5
20 SCL
19 SDA
S4 6
TDA8003TS
18 VDDI
S2 7
VUP 8
17 SIMI/O
I/O 9
16 PRES
SGND 10
15 DEL
CLK 11
14 VDDS
VCC 12
13 RST
MGR435
Fig.2 Pin configuration.
The structure of the I2C-bus data frames is as follows:
FUNCTIONAL DESCRIPTION
• Commands to the TDA8003TS:
Figure 1 shows the block diagram of the TDA8003TS.
The functional blocks are described in the following
sections. It is assumed that the reader of this specification
is aware of GSM11.11 and ISO 7816 terminology.
I2C-bus
– START/ADDRESS/WRITE
– COMMAND BYTE
– STOP.
The fixed address is 01001XY. X and Y are defined by
the logic levels on pins SAD1 and SAD0 as shown in
Table 1 (connect to ground for logic 0; connect to VDDI
for logic 1). The command bits are described in Table 2.
The commands are executed on the rising edge of the
9th SCL pulse.
control
The I2C-bus interface is used:
• To configure the clock to the card in active mode
(1⁄2fSIMCLK and 1⁄4fSIMCLK)
• To configure the clock to the card in power reduction
mode (stop LOW, stop HIGH or ±1.25 MHz derived
from the internal oscillator)
• Status from the TDA8003TS (see Table 4). The fixed
address is 01001XY. X and Y are defined by the logic
levels on pins SAD1 and SAD0 as shown in Table 1.
• To select operation with a 3 or 5 V card
• To start or stop sessions (cold reset)
Table 1
• To initiate a warm reset
• To enter or leave the Power-down mode
• To request the status (card present or not, hardware
problem occurred, unresponsive card after activation,
supply drop-out detected by the voltage supervisor, card
powered or not)
• To configure SIMI/O and I/O in high-impedance (for use
of several TDA8003TS in parallel).
2000 Apr 20
6
Address selections
ADDRESS
SAD1
SAD0
48H
0
0
4AH
0
1
4CH
1
0
4EH
1
1
Philips Semiconductors
Product specification
I2C-bus SIM card interface
Table 2
TDA8003TS
Description of the command bits; (all bits are cleared at reset)
SYMBOL
BIT
DESCRIPTION
START/STOP
0
Logic 1 initiates an activation sequence and a cold reset procedure. Logic 0 initiates a
deactivation sequence.
WARM
1
Logic 1 initiates a warm reset procedure. TDA8003TS/C1: warm reset performed only
when the 2 times 45000 CLK pulses have expired without answer from the card.
TDA8003TS/C2: warm reset performed whatever the card has answered or not at the
cold reset procedure but the count is 2 times 44745 CLK pulses.
3 V/5 VN
2
Logic 1 sets the card supply voltage VCC to 3 V. Logic 0 sets VCC to 5 V.
PDOWN
3
Logic 1 applies on CLK the frequency defined by bits CLKPD1 and CLKPD2, and
enters a reduced consumption mode. Logic 0 sets the circuit back to normal mode.
CLKPD1
4
Bits 4 and 5 determine the clock to the card at power-down as shown in Table 3.
CLKPD2
5
DT/DFN
6
Logic 1 sets fCLK to 1⁄2fSIMCLK (in active mode). Logic 0 sets fCLK to 1⁄4fSIMCLK.
I/OEN
7
Logic 1 will transfer I/O to SIMI/O. Logic 0 sets I/O and SIMI/O to high-impedance.
Table 3
Clock to the card at power-down
BIT 4
BIT 5
0
0
clock stop LOW
0
1
clock stop HIGH
1
0
clock is 1⁄2fosc
1
1
no change
Table 4
FUNCTION
Description of the status bits; note 1
SYMBOL
BIT
DESCRIPTION
PRES
0
Logic 1 when the card is present. Logic 0 when the card is not present.
PRESL
1
Logic 1 when the card has been extracted or inserted. Logic 0 when the status is
read-out.
−
2
Bit 2 is not used and is fixed to logic 0.
SUPL
3
Logic 1 when the voltage supervisor has signalled a fault. Logic 0 when the status is
read-out.
PROT
4
Logic 1 when an overload has occurred during a session. Logic 0 when the status is
read-out.
MUTE
5
TDA8003TS/C1: Logic 1 when a card has not answered after 2 times 45000 CLK
pulses. Logic 0 when the status is read-out.
TDA8003TS/C2: Same as for C1, but the count is 2 times 44745 CLK pulses.
EARLY
6
Logic 1 when a card has answered between 200 and 352 CLK cycles. Logic 0 when
the status is read-out.
ACTIVE
7
Logic 1 when the card is power-on. Logic 0 when the card is power-off.
Note
1. In case of card extraction, supply drop-out or overload detection within a session, the card will be automatically
deactivated, SIMERR pulled LOW, bit START = 0 and the corresponding status bit = 1. The status bit will be logic 0
and SIMERR will be released when the microcontroller reads out the status register, on the 7th SCL pulse. After a
supply drop-out, SIMERR will be released at the end of the alarm pulse and bit SUPL = 1.
2000 Apr 20
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Philips Semiconductors
Product specification
I2C-bus SIM card interface
TDA8003TS
The voltage supervisor (see Fig.3) senses VDDS. It
generates an alarm pulse, whose length tW is defined by
an external capacitor connected to pin DEL, when VDD is
too low to ensure proper operation (1 ms per 1 nF typical).
Power supply
The circuit operates within a supply voltage range of
2.5 to 6 V. The supply pins are VDDS and SGND. Pins
VDDP and PGND only supply the DC-to-DC converter for
the analog drivers to the card and must be decoupled
externally because of the large current spikes that the card
and the DC-to-DC converter can create. An integrated
spike killer ensures the card contacts to remain inactive
during power-up or power-down. An internal voltage
reference is generated for the DC-to-DC converter, the
voltage supervisor and the VCC generator.
During this alarm pulse, SIMERR is LOW and the I2C-bus
is unresponsive. SIMERR goes back to HIGH, and the
I2C-bus becomes operational at the end of this alarm
pulse. Bit SUPL is set as long as the status has not been
read.
It is also used to either block any spurious signals on card
contacts during microcontroller reset, or to force an
automatic deactivation of the contacts in the event of
supply drop-out.
All interface signals with the microcontroller (PWROFF,
SIMCLK, SAD1, SAD0, SIMERR, SCL, SDA and SIMI/O)
are referenced to a separate supply pin VDDI, which may
be different from VDD (1.5 ≤ VDDI ≤ 6 V).
Outside a card session, SIMERR is LOW as long as the
voltage supervisor is active. If a supply drop-out occurs
during a session, SIMERR falls to LOW, bit START is
cleared and an automatic deactivation is initiated.
The pull-up resistors on bus lines SDA and SCL may be
referenced to a voltage higher than VDDI. This allows the
use of peripherals which do not operate at VDDI.
handbook, full pagewidth
VDDS
DEL
tW
tW
SIMERR
status read
after event
I2C-bus unresponsive
I2C-bus OK
I2C-bus
unresponsive
I2C-bus OK
I2C-bus
unresponsive
MGR436
Fig.3 Voltage supervisor.
2000 Apr 20
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Philips Semiconductors
Product specification
I2C-bus SIM card interface
TDA8003TS
DC-to-DC converter
Off mode
The whole circuit is powered by VDDS, except for the
VCC generator, the other card contact buffers and the
interface signals.
The Off mode is entered when the PWROFF signal is
LOW. In this mode, no function is valid. This mode avoids
switching off the power supply of the device, and gives a
current consumption less than 2 µA. Before entering the
Off mode, the card must be deactivated.
The DC-to-DC converter acts as a doubler or a tripler,
depending on the supply voltage VDD and the card supply
voltage VCC. There are basically four possible situations:
The Off mode is resumed when the PWROFF signal
returns to HIGH. This re-initializes the voltage supervisor,
and has the same effect as a reset of the device. As long
as the device is not ready to operate, the SIMERR signal
will remain LOW.
• VDD = 3 V and VCC = 3 V. The DC-to-DC converter acts
as a doubler with a regulation of VVUP at approximately
4.5 V
• VDD = 3 V and VCC = 5 V. The DC-to-DC converter acts
as a tripler with a regulation of VVUP at approximately
6.5 V
Sequencer and clock counter
The sequencer handles the ensuring activation and
deactivation sequences in accordance with GSM11.11
and ISO 7816, even in case of emergency (card take-off,
short circuit and supply drop-out). The sequencer is
clocked with the internal oscillator frequency fosc.
• VDD = 5 V and VCC = 3 V. The DC-to-DC converter is
disabled and VDD is applied to pin VUP
• VDD = 5 V and VCC = 5 V. The DC-to-DC converter acts
as a doubler with a regulation of VVUP at approximately
6.5 V.
The activation is initiated with the START command (only
if the card is present, and if the voltage supervisor does not
detect a fault on the supply). During activation, VCC goes
HIGH and subsequently I/O is enabled and CLK is started
with RST = LOW. The clock counter counts the CLK
pulses till a start bit is detected on I/O.
The supply voltage is recognized by the TDA8003TS at
approximately 3.75 V for the C1 and 3.3 V for the C2.
When a card session is requested by the microcontroller,
the sequencer will first start the DC-to-DC converter, which
is a switched capacitor type, clocked by an internal
oscillator at a frequency fosc of approximately 2.5 MHz.
The output voltage VVUP is regulated at approximately
4.5 or 6.5 V and subsequently fed to the VCC generator.
VCC and PGND are used as a reference for all other card
contacts.
After 45000 CLK pulses for the C1 (44745 for the C2), if no
start bit on I/O has been detected, the sequencer toggles
RST to HIGH, and counts again 45000 CLK pulses
(44745 for the C2). If, again, no start bit has been
detected, SIMERR will be pulled LOW and the information
of bit MUTE is set in the status register.
Power-down mode
If a start bit has been detected during the two 45000 CLK
pulse slots (44745 for the C2), the clock counter is
stopped, RST is kept at the same level and the session
can go on between the card and the system.
The Power-down mode is used for current consumption
reduction when the card is in Sleep mode.
To enter Power-down mode, the microcontroller must first
select CLK in this mode (stop LOW, stop HIGH or
1.25 MHz from the internal oscillator) with bits CLKPD1
and CLKPD2. Subsequently, the microcontroller sends the
command PDOWN, CLK is switched to the value
predefined by bits CLKPD1 and CLKPD2, and SIMCLK
may be stopped (HIGH or LOW).
The clock counter does not take care of any start bit during
the 200 first CLK pulses of both slots; if a start bit is
detected between 200 and 352 CLK pulses of both slots,
then SIMERR will be pulled LOW and the information of
bit EARLY is set in the status register.
If the selected CLK is stopped, the biasing currents in the
buffers to the card will be reduced. The voltage supervisor
and all control functions also remain active. The maximum
current taken by the card in this mode when CLK is
stopped is assumed to be less than 5 mA.
The deactivation is initiated either by the microcontroller
(STOP command), or automatically by the TDA8003TS in
case of card take-off, short circuit or supply voltage
drop-out detected by the voltage supervisor. During
deactivation, RST will go LOW, CLK is stopped, I/O is
disabled and VCC goes LOW.
Before leaving the Power-down mode, the clock signal
must first be applied to SIMCLK, and then bit PDOWN
must be set to logic 0.
2000 Apr 20
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Philips Semiconductors
Product specification
I2C-bus SIM card interface
TDA8003TS
If a start bit is detected on I/O and the clock counter is
stopped with RST = HIGH, the card session may continue.
If not, bit MUTE is set in the status register and SIMERR is
pulled LOW. The microcontroller may initiate a
deactivation sequence by setting bit START to logic 0.
Clock circuit
The clock to the card is either derived from pin SIMCLK
(2 to 20 MHz) or from the internal oscillator.
During a card session, fCLK may be chosen to be
1⁄ f
1
2 SIMCLK or ⁄4fSIMCLK depending on bit DT/DFN.
If a start bit is detected during the 200 first CLK pulses of
each count slot, then it will not be taken into account. If a
start bit is detected during 200 and 352 CLK pulses of
each slot, then bit EARLY is set in the status register and
SIMERR is pulled LOW. The microcontroller may initiate a
deactivation sequence by setting bit START to logic 0.
For the card Sleep mode, CLK may be chosen stop LOW,
stop HIGH or 1⁄2fosc (1.25 MHz) with bits CLKPD1 and
CLKPD2. This predefined value will be applied to CLK
when bit PDOWN is set to logic 1.
The first CLK pulse has the correct width, and all frequency
changes are synchronous, ensuring that no pulse is
smaller than 45% of the shortest period.
The sequencer is clocked by 1⁄64fosc which leads to a time
interval T of 25 µs typically. Thus t1 = 0 to 1⁄64T;
t2 = t1 + 3⁄2T; t3 = t1 + 7⁄2T; t4 = t1 + 4T and t5 depends on
the SIMCLK frequency.
The duty cycle is within 45 and 55% in stable state, the rise
and fall times are less than 8% of the period and
precaution has been taken so that there is no overshoot or
undershoot.
Deactivation sequence
Figure 5 shows the deactivation sequence. When the
session is completed, the microcontroller sets bit START
to logic 0. The circuit will execute an automatic
deactivation sequence:
Activation sequence
Figure 4 shows the activation sequence. When the card is
inactive, VCC, CLK, RST and I/O are LOW, with
low-impedance with respect to ground. The DC-to-DC
converter is stopped. SIMI/O is pulled HIGH at VDDI via the
20 kΩ pull-up resistor. When all conditions are met (supply
voltage, card present, no hardware problems), the
microcontroller may initiate an activation sequence by
setting bit START to logic 1 (t0) via the I2C-bus:
1. Card reset, RST falls to LOW (t10).
2. CLK is stopped (t11).
3. I/O falls to LOW (t12).
4. VCC falls to 0 V with typically 0.17 V/µs slew rate (t13).
The deactivation is completed when VCC reaches
0.4 V (tde).
1. The DC-to-DC converter is started (t1).
5. The DC-to-DC converter is stopped and CLK, RST,
VCC and I/O become low-impedance with respect to
PGND (t14).
2. VCC starts rising from 0 to 3 or to 5 V according to
3 V/5 VN control bit with a controlled rise time of
0.17 V/µs typically (t2).
Where t10 < 1⁄64T; t11 = t10 + 1⁄2T; t12 = t10 + T;
t13 = t12 + 5 µs and t14 = t10 + 4T.
3. I/O buffer is enabled in reception mode (t3).
4. CLK is sent to the card reader with RST = LOW, and
the count of 45000 (44745 for C2) CLK pulses is
started (t4 = tact).
5. If a start bit is detected on I/O, the clock counter is
stopped with RST = LOW. If not, RST = HIGH, and a
new count of 45000 (44745 for C2) CLK pulses is
started (t5).
2000 Apr 20
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Philips Semiconductors
Product specification
I2C-bus SIM card interface
TDA8003TS
handbook, full pagewidth
START
VCC
,
I/O
CLK
,
RST
SIMI/O
MGR437
t0, t1 t2
t3 t4 (= tact)
t5
Answer To Reset (ATR) begin
the 200 first CLK pulses are masked
Fig.4 Activation sequence.
handbook, full pagewidth
START
RST
CLK
I/O
VCC
MGR438
t10
t13
t11
tde
t14
t12
Fig.5 Deactivation sequence.
2000 Apr 20
11
Philips Semiconductors
Product specification
I2C-bus SIM card interface
TDA8003TS
When configuration bit I/OEN is logic 0, then I/O and
SIMI/O are independent, which allows parallelization of
several TDA8003TS with only one I/O line on the
microcontroller side (up to 4 different I2C-bus addresses).
Protections
The following main hardware fault conditions are
monitored by the circuit:
• Short circuits between VCC and other contacts
When bit I/OEN is logic 1, then the data transmission
between I/O and SIMI/O is enabled.
• Card take-off during transaction
• Supply drop-out.
The first side on which a falling edge occurs becomes the
master. An anti-latch circuit disables the detection of falling
edges on the other side, which becomes a slave.
When one of these problems is detected during a card
session, the security logic block pulls SIMERR to LOW, to
warn the microcontroller and initiates an automatic
deactivation of the contacts (see Fig.6).
After a delay time td (<500 ns) on the falling edge, the
N transistor on the slave side is turned on, thus
transmitting the logic 0 present on the master side.
I/O circuit
When the master goes back to logic 1, the P transistor on
the slave side is turned on during td, and then both sides
return to their Idle states.
The Idle state is realized by both I/O and SIMI/O being
pulled HIGH (via a 10 kΩ pull-up resistor from I/O to VCC
and via a 20 kΩ pull-up resistor from SIMI/O to VDDI).
The maximum frequency on these lines is 1 MHz.
I/O is referenced to VCC and SIMI/O to VDDI, thus allowing
operation with VCC ≠ VDD ≠ VDDI.
handbook, full pagewidth
START
status readout
SIMERR
RST
CLK
I/O
VCC
MGR439
Fig.6 Emergency deactivation.
2000 Apr 20
12
Philips Semiconductors
Product specification
I2C-bus SIM card interface
TDA8003TS
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VDDP
power supply voltage
−0.5
+6.5
V
VDDS
signal supply voltage
−0.5
+6.5
V
VDDI
interface signal supply voltage
−0.5
+6.5
V
Vi(n)
input voltage
on pins 1, 17, 21 and 24
−0.5
+6.5
V
on pins 15, 16, 22 and 23
−0.5
VDDS + 0.5 V
on pins 19 and 20
−0.5
+6.5
V
on pins 9, 11 and 13
−0.5
VCC + 0.5
V
on pin 12
−0.5
+6.5
V
on pin 8
−0.5
+7.5
V
on pins 2, 4, 6 and 7
−0.5
VVUP + 0.5 V
on pins 1, 17, 19, 20, 21, 22, 23 and 24
−5
+5
mA
on pin 15
−5
+10
mA
Ii(n)
Ii/o(n)
DC input current
DC input/output current
on pins 2, 4, 6, 7 and 8
−40
+40
mA
on pin 16
−5
+5
mA
−40
+40
mA
Ii/o(17)
transient input/output current on pin 17
duration 1 ms
Ptot
continuous total power dissipation
Tamb = −40 to +85 °C
−
230
mW
Tj
operating junction temperature
−
125
°C
Tstg
IC storage temperature
−55
+150
°C
Vesd(n)
electrostatic discharge voltage
on pins 9, 11, 12, 13 and 16
−6
+6
kV
on any other pin
−2
+2
kV
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handle Metal Oxide Semiconductor (MOS) devices.
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
2000 Apr 20
PARAMETER
CONDITIONS
thermal resistance from junction to ambient in free air
13
VALUE
UNIT
102
K/W
Philips Semiconductors
Product specification
I2C-bus SIM card interface
TDA8003TS
CHARACTERISTICS
VDD = 3 V; VDDI = 1.5 V; fSIMCLK = 13 MHz; fCLK = 3.25 MHz; Tamb = 25 °C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
VDD
supply voltage on pins VDDS
and VDDP
IDD
supply current on pins VDDS
and VDDP
2.5
−
6.0
V
Off mode
−
−
2
µA
inactive mode
−
−
50
µA
Power-down mode; VCC = 5 V;
ICC = 100 µA; SIMCLK connected
to SGND or VDDI; CLK is stopped
−
−
500
µA
active mode; VCC = 3 V; ICC = 6 mA −
−
18
mA
active mode; VCC = 5 V;
ICC = 10 mA
−
−
50
mA
active mode; VDD = 5 V; VCC = 3 V;
ICC = 6 mA
−
−
10
mA
active mode; VDD = 5 V; VCC = 5 V;
ICC = 10 mA
−
−
30
mA
1.5
−
6
V
−
−
2
µA
VDDI
interface signal supply voltage
IDDI
interface signals supply
current
SIMCLK connected to
PGND or VDDI
fSIMCLK = 13 MHz; VDDI = 1.5 V
−
−
120
µA
Vth(VDD)
threshold voltage on VDD
falling edge
2
−
2.3
V
Vhys
hysteresis voltage on Vth(VDD)
40
−
200
mV
Vth(DEL)
threshold voltage on pin DEL
−
1.38
−
V
VDEL
voltage on pin DEL
−
−
VDD
V
Ich(DEL)
charge current on pin DEL
−0.5
−1
−2.5
µA
Idch(DEL)
discharge current on pin DEL
VDEL = VDD
0.5
−
−
mA
tW
alarm pulse width
CDEL = 10 nF
15
−
25
ms
Pin SIMCLK
fi(SIMCLK)
clock input frequency
0
−
20
MHz
tf
fall time
−
−
1
µs
tr
rise time
−
−
1
µs
VIL
LOW-level input voltage
0
−
0.3VDDI
V
VIH
HIGH-level input voltage
0.7VDDI
−
VDDI + 0.3 V
IL
leakage current
−
−
±3
µA
1
−
1.6
MHz
5 V card
−
6.0
−
V
3 V card
−
4.5
−
V
DC-to-DC converter
1⁄
2fosc
VVUP
2000 Apr 20
oscillator frequency
voltage on pin VUP
14
Philips Semiconductors
Product specification
I2C-bus SIM card interface
SYMBOL
TDA8003TS
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Pin SDA (open-drain)
VIL
LOW-level input voltage
−0.3
−
+0.3VDDI
V
VIH
HIGH-level input voltage
0.7VDDI
−
6
V
ILH
HIGH-level leakage current
−
−
1
µA
IIL
LOW-level input current
depends on the pull-up resistor
−
−
−
µA
VOL
LOW-level output voltage
IOL = 3 mA
−
−
0.3
V
Pin SCL (open-drain)
VIL
LOW-level input voltage
−0.3
−
+0.3VDDI
V
VIH
HIGH-level input voltage
0.7VDDI
−
6
V
ILI
input leakage current
−
−
1
µA
Pin SIMERR (100 kΩ pull-up resistor to VDDI)
VOL
LOW-level output voltage
IOL < 1 mA
−
−
0.3VDDI
V
VOH
HIGH-level output voltage
IOH < −1 µA
0.7VDDI
−
−
V
0
−
0.3VDDI
V
Pins SAD0, SAD1 and PWROFF
VIL
LOW-level input voltage
VIH
HIGH-level input voltage
0.7VDDI
−
VDDI + 0.3 V
ILI
input leakage current
−
−
±1
µA
−0.3
Pin RST
VO
output voltage
inactive mode; IO = 1 mA
−
+0.4
V
IO
output current
inactive mode; pin RST short circuit −
to ground
−
−1
mA
VOL
LOW-level output voltage
IOL = 200 µA
−0.2
−
+0.3
V
VOH
HIGH-level output voltage
IOH < −200 µA
VCC − 0.5
−
VCC + 0.2 V
tf
fall time
CL = 30 pF
−
−
0.5
µs
tr
rise time
CL = 30 pF
−
−
0.5
µs
VO
output voltage
inactive mode; IO = 1 mA
−0.3
−
+0.4
V
IO
output current
inactive mode; pin CLK short circuit −
to ground
−
−1
mA
V
Pin CLK
VOL
LOW-level output voltage
IOL = 200 µA
−0.2
−
+0.3
VOH
HIGH-level output voltage
IOH = −200 µA
VCC − 0.5
−
VCC + 0.2 V
tf
fall time
CL = 30 pF
−
−
8
tr
rise time
CL = 30 pF
−
−
8
ns
fclk
clock frequency
1 MHz power-down configuration
1
−
1.5
MHz
regular activity
0
−
10
MHz
CL = 30 pF
45
−
55
%
δ
2000 Apr 20
duty factor
15
ns
Philips Semiconductors
Product specification
I2C-bus SIM card interface
SYMBOL
PARAMETER
TDA8003TS
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Pin VCC
VO
output voltage
inactive mode; IO = 1 mA
−
−
0.4
V
active mode; 5 V card; no load
4.85
5.10
5.40
V
active mode; 3 V card; no load
2.8
3.05
3.22
V
5 V card; 40 nAs pulses
4.60
−
5.40
V
3 V card; 24 nAs pulses
2.75
−
3.22
V
inactive mode; pin VCC short circuit
to ground
−
−
−1
mA
VCC = 5 or 3 V; VDD = 2.5 V
−
−
15
mA
VCC = 5 or 3 V; VDD = 5.5 V
−
−
40
mA
VCC short circuit to ground
active mode; with 200 nF capacitor;
including static load (up to 20 mA)
and dynamic current pulses;
Imax = 200 mA, fmax = 5 MHz;
duration <400 ns
IO
output current
ICC
output current
−
−
120
mA
SR
slew rate on VCC (rise and fall) CL(max) = 300 nF
0.05
0.17
0.25
V/µs
Pin I/O
VO
output voltage
inactive mode; IO = 1 mA
−
−
0.4
V
IO
output current
inactive mode; pin I/O short circuit
to ground
−
−
−1
mA
VOL
LOW-level output voltage
IOL = 1 mA
−0.2
−
+0.4
V
+25 < IOH < −25 µA
VOH
HIGH-level output voltage
0.8VCC
−
VCC + 0.2 V
VIL
LOW-level input voltage
−0.3
−
+0.8
VIH
HIGH-level input voltage
1.5
−
VCC + 0.3 V
ILIH
HIGH-level input leakage
current
−
−
10
µA
IIL
LOW-level input current
−
−
−600
µA
tt(DI)
data input transition time
CL = 30 pF
−
−
1
µs
tt(DO)
data output transition time
CL = 30 pF
td
delay time on falling edge
Rpu(int)
internal pull-up resistance
between pins I/O and VCC
VOL
V
−
−
0.5
µs
−
−
500
ns
C1 version
8
−
13
kΩ
C2 version
13
−
18
kΩ
LOW-level output voltage
IOL = 1 mA
−0.2
−
+0.3
V
VOH
HIGH-level output voltage
with internal 20 kΩ pull-up resistor
to VDDI; IO = 10 µA
VDDI − 0.3 −
VDDI + 0.2 V
VIL
LOW-level input voltage
−0.3
−
+0.3VDDI
VIH
HIGH-level input voltage
0.7VDDI
−
VDDI + 0.3 V
ILIH
HIGH-level input leakage
current
−
−
10
Pin SIMI/O
2000 Apr 20
16
V
µA
Philips Semiconductors
Product specification
I2C-bus SIM card interface
SYMBOL
PARAMETER
TDA8003TS
CONDITIONS
MIN.
TYP.
MAX.
UNIT
IIL
LOW-level input current
with internal 20 kΩ pull-up resistor
to VDDI; VI = 0 V
−
−
−100
µA
tt(DI)
data input transition time
CL = 30 pF
−
−
1
µs
tt(DO)
data output transition time
CL = 30 pF
−
−
0.5
µs
td
delay time on falling edge
−
−
500
ns
Rpu(int)
internal pull-up resistance
between pins SIMI/O
and VDDI
16
−
26
kΩ
VIL
LOW-level input voltage
−0.3
−
+0.3VDD
V
Pin PRES
VIH
HIGH-level input voltage
0.7VDD
−
VDD + 0.3 V
IIL
LOW-level input current
−
−
5
µA
IIH
HIGH-level input current
−
−
−5
µA
tact
activation time
−
−
150
µs
tde
deactivation time
−
−
120
µs
Timing
2000 Apr 20
17
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S1
CARD READER
PGND
C4
C8
C3
C7
C2
C6
C1
C5
C5I
C1I
C6I
C2I
S2
C7I
C3I
100 nF VUP
100 nF
S3
VDDP
100 nF
C4I
100
nF S4
18
I/O
SGND
CLK
K1
(1)
K2
VCC
1
24
2
23
3
22
4
21
5
20
6
19
TDA8003TS
7
18
8
17
9
16
10
15
11
12
14
13
SIMCLK
+1.5 V
SAD1
VCC
SAD0
P0-0
SIMERR
P0-1
SCL
P0-2
SDA
P0-3
+1.5 V
VDDI
P0-4
P0-5
SIMI/O
100 nF
P0-6
P0-7
PRES
EA
DEL
ALE
VDDS
10
nF
RST
PSEN
P2-7
P2-6
P2-5
P2-4
100 nF
P2-3
3V
100 nF
P2-2
100 nF
P2-1
P2-0
0Ω
3V
40
1
39
2
38
3
37
4
36
5
35
6
7
34
33
32
31
30
29
28
MICROCONTROLLER
PWROFF
8
9
10
11
12
13
27
14
26
15
25
16
24
17
23
18
22
19
21
20
P1-0
P1-1
P1-2
P1-3
P1-4
P1-5
+1.5 V
P1-6
10 µF
P1-7
RST
P3-0
P3-1
P3-2
P3-3
P3-4
P3-5
P3-6
P3-7
XTAL2
XTAL1
VSS
14.74 MHz
Fig.7 Application diagram.
Product specification
MGR440
33
pF
TDA8003TS
33 pF
(1) The switch is normally closed when the card is not present.
Philips Semiconductors
2.2
µF
C8I
1.5 to 6 kΩ
1.5 V
I2C-bus SIM card interface
1.5 to 6 kΩ
3V
APPLICATION INFORMATION
andbook, full pagewidth
2000 Apr 20
+1.5 to +6 V
Philips Semiconductors
Product specification
I2C-bus SIM card interface
TDA8003TS
PACKAGE OUTLINE
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
D
SOT340-1
E
A
X
c
HE
y
v M A
Z
24
13
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
12
bp
e
detail X
w M
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2.0
0.21
0.05
1.80
1.65
0.25
0.38
0.25
0.20
0.09
8.4
8.0
5.4
5.2
0.65
7.9
7.6
1.25
1.03
0.63
0.9
0.7
0.2
0.13
0.1
0.8
0.4
8
0o
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
OUTLINE
VERSION
SOT340-1
2000 Apr 20
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-02-04
99-12-27
MO-150
19
o
Philips Semiconductors
Product specification
I2C-bus SIM card interface
TDA8003TS
SOLDERING
If wave soldering is used the following conditions must be
observed for optimal results:
Introduction to soldering surface mount packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Wave soldering
Manual soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
2000 Apr 20
20
Philips Semiconductors
Product specification
I2C-bus SIM card interface
TDA8003TS
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable(2)
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
not
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
REFLOW(1)
suitable
suitable
suitable
not
recommended(3)(4)
suitable
not
recommended(5)
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2000 Apr 20
21
Philips Semiconductors
Product specification
I2C-bus SIM card interface
TDA8003TS
DATA SHEET STATUS
DATA SHEET STATUS
PRODUCT
STATUS
DEFINITIONS (1)
Objective specification
Development
This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
Preliminary specification
Qualification
This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DEFINITIONS
DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
2000 Apr 20
22
Philips Semiconductors
Product specification
I2C-bus SIM card interface
TDA8003TS
NOTES
2000 Apr 20
23
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Tel. +61 2 9704 8141, Fax. +61 2 9704 8139
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Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
SCA 69
© Philips Electronics N.V. 2000
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753504/03/pp24
Date of release: 2000
Apr 20
Document order number:
9397 750 07034