HS-1254RH PRELIMINARY Radiation Hardened, High Speed, Low Power Dual Operational Amplifier with Disable April 1998 Features Description • QML Qualified Per MIL-PRF-38535 Requirements The HS-1254RH is a ±5V, Rad Hard, monolithic, dual, current feedback amplifier that provides highly reliable performance in harsh radiation environments. Dielectric isolation and bonded wafer processing make this device immune to latch-up (SEL). • Radiation Environment - Total Dose . . . . . . . . . . . . . . . . . . . . . 3 x 105 RAD(Si) - SEL Immune . . . . . . . . . . . Bonded Wafer DI Process • Low Quiescent Current (per amp) . . . . . . 6.1mA (Max) Excellent dynamic characteristics, coupled with the disable function, make this amplifier well-suited for a variety of satellite system applications. The outputs have individual disable control pins that make it easy to multiplex wideband signals, putting the outputs in a high impedance mode and reducing the supply current per op amp down to 3mA (typical). • Disabled Supply Current (per amp) . . . . . 4.0mA (Max) • Low Offset Voltage. . . . . . . . . . . . . . . . . . . 5.0mV (Max) • Output Enable/Disable Time . . . . . . . 160ns/20ns (Typ) • High Slew Rate . . . . . . . . . . . . . . . . . . . 1050V/µs (Typ) Post radiation limits are fully specified and guaranteed to 300kRAD(Si) total dose to ensure predictable performance in any space application. • Wide -3dB Bandwidth (AV = +2) . . . . . . . 530MHz (Typ) Applications Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). SMD numbers must be used when ordering. • High Speed A/D Drivers • Cable Drivers Detailed Electrical Specifications for the HS-1254RH are contained in SMD 5962-98581, which is easily downloadable from our website, via a DSCC “hot-link”. http://www.semi.intersil.com/data/sm/index.htm • Wideband Signal Switching and Routing • Redundant Circuit Multiplexing • Pulse Amplifiers Ordering Information SMD PART NUMBER INTERSIL PART NUMBER 5962R9858101VXC HS9-1254RH-Q N/A HS9-1254RH/Sample TEMP. RANGE (oC) PACKAGE CASE OUTLINE -55 to 125 14 Ld Flatpack CDFP3-F14 25 14 Ld Flatpack CDFP3-F14 Pinout HS-1254RH (FLATPACK) TOP VIEW -IN1 1 14 OUT1 +IN1 2 13 NC DISABLE 1 3 12 GND V- 4 11 V+ DISABLE 2 5 10 NC +IN2 6 9 NC -IN2 7 8 OUT2 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999 1 File Number 4507 HS-1254RH Die Characteristics DIE DIMENSIONS SUBSTRATE Size: 1750µm x 2330µm (69 mils x 92 mils) Thickness: 483µm (19 mils) DI, Bonded Wafer BACKSIDE FINISH GLASSIVATION Silicon Type: Nitride Thickness: 4kÅ ± 0.5kÅ SUBSTRATE POTENTIAL Floating (Recommend connection to V-) METALLIZATION TRANSISTOR COUNT: Metal 1 180 Type: AlCu(2%)/TiW Thickness: 8kÅ ± 0.4kÅ Metal 2 Type: AlCu(2%) Thickness: 16kÅ ± 0.8kÅ Metallization Mask Layout HS-1254RH -IN1 OUT1 GND (SEE NOTE 1) V+ +IN1 NC DISABLE1 V- DISABLE2 NC +IN2 OUT2 -IN2 V- NOTE: 1. This is an optional GND pad. Users may set a GND reference, via this pad, to ensure the TTL compatibility of the DISABLE inputs when using asymmetrical supplies (e.g., V+ = 10V, V- = 0V). 2 HS-1254RH All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com Sales Office Headquarters NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (407) 724-7000 FAX: (407) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 3 ASIA Intersil (Taiwan) Ltd. Taiwan Limited 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029