MATERIAL DECLARATION SHEET Material Number CD1408 Serial Product Line Semiconductor Products Compliance Date RoHS Compliant No. 1 Construction Element(subpart) FRP 2006/9/12 Yes MSL Homogeneous Material 1 Material weight [mg] Others 6 2 Epoxy Plastic 3.54 3 Solder Cream Metal 0.17 4 Dice Others 2.05 5 Terminal Plating Metal 0.24 Total weight This Document was updated on: Homogeneous Material\ Substances Continuous filament glass fibers Copper foil Non-Hazardous cured resin Silicon Dioxides P-F-R Resin Lead *2 Tin Silver Silicon Nickel *3 Lead Gold Tin CASRN if applicable Materials Mass % Material Mass % of total unit wt. 65997-17-3 43 21.5 7440-50-8 14 7 Proprietary 43 21.5 7631-86-9 9003-36-5 7439-92-1 7440-31-5 7440-22-4 7440-21-3 7440-02-0 7439-92-1 7440-57-5 55 45 88 10 2 35.77 0.7 63.51 0.02 16.225 13.275 1.247 0.142 0.028 6.11 0.12 10.85 0.003 7440-31-5 >99.9 2 Subpart mass of total wt. (%) 50.0 29.5 1.4 17.1 2.0 12 2015/05/05 Important remarks: Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 2 MATERIAL DECLARATION SHEET 1. It is the responsibility of the user to verify they are accessing the latest version. 2. *：Excepted for RoHS 7(a)-Lead in high melting temperature type solders (i.e. lead- based alloys containing 85% by weight or more lead)； 3. Excepted for RoHS 7(c) I-Electrical and electronic components containing lead in a glass or ceramic other then dielectric ceramic in capacitors,e.g.piezoelectronic devices, or in a glass or ceramic matrix compound； Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2