MATERIAL DECLARATION SHEET Material Number CD2320 Serial Product Line Semiconductor Products Compliance Date RoHS Compliant No. 1 Construction Element(subpart) FRP 2006/06/26 Yes MSL Homogeneous Material 1 Material weight [mg] Others 42.5 2 Epoxy Plastic 20.3 3 Solder Cream Metal 1.523 4 Dice Others 4.277 5 Terminal Plating Metal 1.4 Total weight 70.0 This Document was updated on: Homogeneous Material\ Substances Continuous filament glass fibers Copper foil Non-Hazardous cured resin Silicon Dioxides F-P-R resin Lead *2 Tin Silver Silicon Nickel Lead*3 Gold Tin CASRN if applicable Materials Mass % Material Mass % of total unit wt. 65997-17-3 43 26.107 7440-50-8 14 8.5 Proprietary 43 26.107 7631-86-9 9003-36-5 7439-92-1 7440-31-5 7440-22-4 7440-21-3 7440-02-0 7439-92-1 7440-57-5 55 45 88 10 2 35.77 0.7 63.51 0.02 15.95 13.05 1.91488 0.2176 0.04352 2.186 0.043 3.88 0.001 7440-31-5 100 2 Subpart mass of total wt. (%) 60.71 29 2.18 6.11 2 2015/05/05 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 2 MATERIAL DECLARATION SHEET 2. Excepted for RoHS 7(a)-Lead in high melting temperature type solders (i.e. lead- based alloys containing 85% by weight or more lead)； 3. Excepted for RoHS 7(c) I-Electrical and electronic components containing lead in a glass or ceramic other then dielectric ceramic in capacitors,e.g.piezoelectronic devices, or in a glass or ceramic matrix compound； Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2