MATERIAL DECLARATION SHEET CD214A-B SERIES Material Number Product Line Semiconductor Products Compliance Date RoHS Compliant 2004/8/2 Yea MSL No. Construction Element(subpart) Homogeneous Material Material weight [mg] 1 Dice Silica compound 1.9 2 Solder Paste High-melting point solder 2.56 3 Lead frame &clip Copper Alloy 26.6 4 Epoxy material Green molding compound 32.3 Sn plating cover 0.64 5 Plating cover Total weight This Document was updated on: Headquarters Riverside CA 1 Homogeneous Material\ Substances CASRN if applicable Materials Mass % Material Mass % of total unit wt. Silicon Nickel Lead* Tin Silver Copper Zinc Iron Phosphorus Silica fused 7440-21-3 7440-02-0 7439-92-1 7440-31-5 7440-22-4 7440-50-8 7440-66-6 7439-89-6 7723-14-0 7631-86-9 98% 2% 92.5% 5.0% 2.5% 99.950% 0.004% 0.010% 0.034% 68.7% 2.91% 0.06% 3.700% 0.200% 0.100% 41.542% 0.002% 0.004% 0.014% 34.672% Silica quartz 14808-60-7 25.0% 12.617% Phenolic resin Carbon black 9003-35-4 1333-86-4 6.0% 0.3% 3.028% 0.151% Tin 7440-31-5 100% 1.00% Subpart mass of total wt. (%) 2.97 4.00 41.56 50.47 1.00 64.0 2015-4-27 www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 2 MATERIAL DECLARATION SHEET Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. 2. * 7(a)-Lead in high melting temperature type solders (i.e. lead- based alloys containing 85% by weight or more lead) Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2