MATERIAL DECLARATION SHEET Material Number CD214A-F Serial Product Line Semiconductor Products Compliance Date RoHS Compliant No. Construction Element(subpart) 2005/03/04 Yes MSL Homogeneous Material 1 Material weight [mg] 1 Solder wafer Metal 1.72 2 Dice Metal 2.37 3 Molding compound Plastic 38.83 4 Lead Wire Metal 20.98 5 Plating Metal 0.1 Total weight 64.0 This Document was updated on: Headquarters Riverside CA Homogeneous Material\ Substances Lead *3 Tin Silver Silicon Nickel Aluminum Lead*4 Phosphorus Boron Other trace metals Silica Epoxy Resin Phenol Resin Antimony trioxide Copper Misc not to declare Tin Misc not to declare CASRN if applicable Materials Mass % 7439-92-1 7440-31-5 7440-22-4 7440-21-3 7440-02-0 7429-90-5 7439-92-1 7723-14-0 7440-42-8 14808-60-7 29690-82-2 9003-35-4 1309-64-4 7440-50-8 7440-31-5 - 92.5 5 2.5 73.54 1.99 0.56 14.80 0.249 0.874 7.987 70 20 8 2 >99.0 <1.0 >99.0 <1.0 Material Mass % of total unit wt. 2.49 0.13 0.07 2.720 0.074 0.021 0.548 0.009 0.032 0.296 42.47 12.13 4.85 1.21 32.45 0.33 0.16 0.002 Subpart mass of total wt. (%) 2.69 3.7 60.67 32.78 0.16 2015/11/03 www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 2 MATERIAL DECLARATION SHEET Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. 2. *：Excepted for RoHS 7(a)-Lead in high melting temperature type solders (i.e. lead- based alloys containing 85% by weight or more lead)； 3. *：Excepted for RoHS 7(c) I-Electrical and electronic components containing lead in a glass or ceramic other then dielectric ceramic in capacitors,e.g.piezoelectronic devices, or in a glass or ceramic matrix compound； Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2