MATERIAL DECLARATION SHEET Material Number Product Line Compliance Date RoHS Compliant No. CD214A-T150CA~170CA Semiconductor Products 2011/01/01 YES MSL Homogeneous Material Construction Material weight [mg] Element(subpart) 1 Dice Silicon 2.560 2 High-melting point Solder paste Solder paste 2.777 3 Lead frame Copper 27.50 4 Plating Homogeneous Material\ Substances Silicon Phosphorus Boron Nickel Lead Silicon dioxide Aluminum oxide Tin Lead Silver Copper 30.25 Iron Phosphorus Silica Epoxy resin Phenolic resin-A,B Matte-100% tin 0.663 Carbon Tin Total weight 63.75 Molding compound Epoxy material 5 1 CASRN if applicable Materials Mass % 7440-21-3 7723-14-0 7440-42-8 7440-02-0 7439-92-1 7631-86-9 1344-28-1 7440-31-5 7439-92-1 7440-22-4 7440-50-8 7439-89-6 7723-14-0 14808-60-7 25928-94-3 9003-35-4 60.18 0.01 0.01 14.80 12.50 10.00 2.50 5.00 92.50 2.50 99.80 0.15 0.05 76.00 9.00 8.00 N/A 6.00 1333-86-4 7440-315 1.00 100 Hydroxide metal Material Mass Subpart mass % of total unit of total wt. (%) wt. 2.417 0.0004 0.0004 0.5943 4.01 0.502 0.4016 0.1004 0.218 4.03 4.36 0.109 43.051 43.14 0.065 0.022 36.063 4.271 3.796 47.45 2.847 0.475 1.04 1.04 This Document was updated on: 2015/02/09 (EU) RoHS Directive 2011/65/EU ANNEX Application of lead which are exempted from the requirements 7(a) Lead in high melting temperature type solders (i.e. lead- based alloys containing 85 % by weight or more lead) 7(c)-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1