MATERIAL DECLARATION SHEET CD214B-B SERIES Material Number Product Line Semiconductor Products Compliance Date RoHS Compliant 2004/8/2 Yea MSL No. Construction Element(subpart) Homogeneous Material Material weight [mg] 1 Dice Silica compound 4.60 2 Solder Paste High-melting point solder 2.33 3 Lead frame &clip Copper Alloy 40.48 4 Epoxy material Green molding compound 44.66 Sn plating cover 0.93 5 Plating cover Total weight This Document was updated on: Headquarters Riverside CA 1 Homogeneous Material\ Substances CASRN if applicable Materials Mass % Material Mass % of total unit wt. Silicon Nickel Lead Tin Silver Copper Zinc Iron Phosphorus Silica fused 7440-21-3 7440-02-0 7439-92-1 7440-31-5 7440-22-4 7440-50-8 7440-66-6 7439-89-6 7723-14-0 7631-86-9 98% 2% 92.5% 5.0% 2.5% 99.950% 0.004% 0.010% 0.034% 68.7% 4.85% 0.1% 2.317% 0.12% 0.063% 43.505% 0.002% 0.004% 0.015% 33.375% Silica quartz 14808-60-7 25.0% 11.045% Phenolic resin Carbon black 9003-35-4 1333-86-4 6.0% 0.3% 3.362% 0.240% Tin 7440-31-5 100% 1.00% Subpart mass of total wt. (%) 4.95% 2.50% 43.53% 48.02% 1.00% 93.0 2015-4-27 www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 2 MATERIAL DECLARATION SHEET Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. 2. * 7(a)-Lead in high melting temperature type solders (i.e. lead- based alloys containing 85% by weight or more lead) Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2