PL IA N T Features S CO M ■ *R oH ■ ■ ■ ■ RoHS compliant* Glass passivated chip Low reverse leakage current Low forward voltage drop High current capability CD214B-F250~F2600 Surface Mount Fast Response Rectifiers General Information The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components. Bourns offers Surface Mount Fast Response Rectifiers for rectification applications, in compact chip DO-214AA (SMB) size format, which offer PCB real estate savings and are considerably smaller than most competitive parts. The Fast Response Rectifier Diodes offer a forward current of 2.0 A with a choice of repetitive peak reverse voltages of 50 V up to 600 V. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration minimizes roll away. Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Symbol Maximum Repetitive Peak Reverse Voltage Maximum RMS Voltage CD214B- Unit F250 F2100 F2150 F2200 F2400 F2600 VRRM 50 100 150 200 400 600 V VRMS 35 70 105 140 280 420 V Maximum DC Blocking Voltage VDC 50 100 150 200 400 600 V Max. Average Forward Rectified Current1 I(AV) 2.0 A DC Reverse Current @ Rated DC Blocking Voltage (@ TJ = 25 °C) IR 5.0 µA DC Reverse Current @ Rated DC Blocking Voltage (@ TJ = 125 °C) IR 350 µA Typical Junction Capacitance2 CJ 200 pF Maximum Instantaneous Forward Voltage @ 1 A VF 0.92 1.25 1.30 V Typical Thermal Resistance3 RθJL 15 °C/W Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 50 A Notes: 1 See Figure 1. 2 Measured @ 1.0 MHz and applied reverse voltage of 4.0 VDC. 3 Thermal resistance from junction to ambient and from junction to lead P.C.B. mounted on 0.2 ˝ x 0.2 ˝ (5.0 mm x 5.0 mm) copper pad areas. Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Operating Temperature Range Storage Temperature Range Symbol CD214B-F250~F2600 Unit TJ -55 to +125 °C TSTG -55 to +150 °C *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. CD214B-F250~F2600 Surface Mount Fast Response Rectifiers Product Dimensions Recommended Pad Layout A This is an RoHS compliant product. It is a molded plastic package. A cathode band indicates the polarity. The package weighs approximately 0.064 g. The package and dimensions are shown below. A B B C DIMENSIONS: MM (INCHES) C Dimension SMA (DO-214AC) A 2.90 (0.114) B 3.00 (0.118) C 2.30 (0.091) How To Order CD 214B - F 2 50 D H G E F Dimensions A 4.06 - 4.57 (0.167 - 0.187) B 3.30 - 3.94 (0.130 - 0.150) C 1.96 - 2.21 (0.075 - 0.087) D 2.01 - 2.62 (0.079 - 0.096) E 0.76 - 1.52 (0.039 - 0.055) F 5.21 - 5.59 (0.197 - 0.236) G 0.05 - 0.20 (0.00196 - 0.00787) H 0.15 - 0.31 (0.006 - 0.016) DIMENSIONS: Common Code Chip Diode Package • 214B = SMB/DO-214AA Model F = Fast Response Rectifiers Forward Current I(AV) 2=2A Reverse Voltage 50 = 50 V 100 = 100 V 150 = 150 V 200 = 200 V 400 = 400 V 600 = 600 V MM (INCHES) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. CD214B-F250~F2600 Surface Mount Fast Response Rectifiers Rating and Characteristic Curves Forward Current Derating Curve Non-Repetitive Surge Current Peak Forward Surge Current (Amps) Average Forward Current (Amps) 2.00 1.50 1.25 1.00 0.75 0.50 Single Phase Half Wave 60 Hz Resistive or Inductive Load 0.25 0 25 50 75 100 125 150 100 80 60 40 Pulse Width 8.3 ms Single Half Sine-Wave (JEDEC Method) 20 0 175 1 10 Lead Temperature (°C) Forward Characteristics Reverse Characteristics 100 Instantaneous Reverse Leakage Current (mA) 10 Instantaneous Forward Current (Amps) 100 Number of Cycles at 60 Hz 1.0 0.1 Pulsewidth: 300 µs 1% Duty Cycle TJ = 150 °C 10 TJ = 125 °C 1.0 TJ = 25 °C 0.1 .01 0.4 0.6 0.8 1.0 1.2 1.4 Instantaneous Forward Voltage (Volts) 1.6 0 20 40 60 80 100 Percent of Rated Peak Reverse Voltage (%) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 110 CD214B-F250~F2600 Surface Mount Fast Response Rectifiers Packaging Information The surface mount product is packaged in an 8 mm x 4 mm tape and reel format per EIA-481 standard. P 0 P 1 d T E Index Hole 120 ° F D2 W B D1 D P A Trailer C Device Leader ....... ....... ....... ....... ....... ....... ....... ....... End W1 Start DIMENSIONS: 10 pitches (min.) 10 pitches (min.) MM (INCHES) Direction of Feed Item Symbol Carrier Width A Carrier Length B Carrier Depth C Sprocket Hole d Reel Outside Diameter D Reel Inner Diameter D1 Feed Hole Diameter D2 Sprocket Hole Position E Punch Hole Position F Punch Hole Pitch P Sprocket Hole Pitch P0 Embossment Center P1 Overall Tape Thickness T Tape Width W Reel Width W1 Quantity per Reel — DO-214AA (SMB) 1.90 ± 0.10 (0.075 ± 0.004) 4.30 ± 0.10 (0.169 ± 0.004) 1.80 ± 0.10 (0.071 ± 0.004) 1.55 ± 0.05 (0.061 ± 0.002) 178 (7.008) 80.0 MIN. (3.150) 13.0 ± 0.20 (0.512 ± 0.008) 1.75 ± 0.10 (0.069 ± 0.004) 3.50 ± 0.05 (0.138 ± 0.002) 4.00 ± 0.10 (0.157 ± 0.004) 4.00 ± 0.10 (0.157 ± 0.004) 2.00 ± 0.05 (0.079 ± 0.002) 0.20 ± 0.10 (0.008 ± 0.004) 8.00 ± 0.20 (0.315 ± 0.008) 13.5 MIN. (0.531) REV. 09/15 3,000 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.