MATERIAL DECLARATION SHEET Material Number CDDFN2-T5.0C Product Line Diode Products Compliance Date 16 Jun 2009 RoHS Compliant Yes No. Construction Element(subpart) MSL Homogeneous Material Material weight [g] 1 FR-4 Board Substrate/ Terminal 2 Wafer Diode 0.000029 3 Al wire Conductor 0.000001 4 Silver paste Welding 0.000005 5 Molding Compound Outer 0.000511 Total weight Headquarters Riverside CA 0.000223 1 Homogeneous Material\ Substances if applicable Materials Mass % Copper Nickel Gold Epoxy Resin Silicon Aluminum Titanium Gold Arsenic Aluminum 7440-50-8 7440-02-0 7440-57-5 -------------7440-21-3 7429-90-5 7440-32-6 7440-57-5 7440-38-2 7429-90-5 43.01% 3.677% 0.099% 53.22% 90.70% 1.90% 0.001% 6.40% 0.07% >99% Material Mass % of total unit wt. 43.01% 3.677% 0.099% 53.22% 90.70% 1.90% 0.001% 6.40% 0.07% >99% Silicon Additives Silver Epoxy resins Silica Fused Epoxy Resin Phenol Resin Carbon Black Catalyst 7440-21-3 ---------7440-22-4 ---------60676-86-0 --------------------------1333-86-4 -------------- <1% 1~7% 76~85% 5~25% 70~90% 5~15% 5~15% 0.1~0.5% <1% <1% 1~7% 76~85% 5~25% 70~90% 5~15% 5~15% 0.1~0.5% <1% CASRN Subpart mass of total wt. (%) 29.00 3.77 0.13 0.65 66.45 0.000769 www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 2 MATERIAL DECLARATION SHEET This Document was updated on: 21 Aug 2009 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2