P6SMB480A~550A, P6SMB130CA~550CA

MATERIAL DECLARATION SHEET
Material Number
P6SMB480A~550A, P6SMB130CA~550CA
Product Line
Semiconductors
Compliance Date
RoHS Compliant
2015/04/08
Yes
MSL
Material
Construction
Homogeneous
weight
Element(subpart) Material
[mg]
No.
1
Dice
Silicon
4.479
2
High-melting point
Solder paste
solder paste
3.02
3
Lead frame /
Leads / Disc
Copper alloy
33.50
4
Molding
Compound
Epoxy material
51.00
5
Plating
Matte-Tin
1.011
Total Weight
93.01
This Document was updated on:
1
Homogeneous
CASRN if
Material\
applicable
Substances
Silicon
7440-21-3
Phosphorous
7723-14-0
Boron
7440-42-8
Nickel
7440-02-0
Lead Glass
7439-92-1
Silicon dioxide
7631-86-9
Aluminum oxide
1344-28-1
Tin
7440-31-5
Lead
7439-92-1
Silver
7440-22-4
Copper
7440-50-8
Iron
7439-89-6
Phosphorus
7723-14-0
Silica
14808-60-7
Epoxy resin
25928-94-3
Phenolic resin-A,-B
9003-35-4
Aluminum hydroxide
21645-51-2
Carbon black
1333-86-4
Tin
7440-31-5
Material Mass
Materials
Subpart mass
% of total unit
Mass %
of total wt. (%)
wt.
60.1800%
2.898%
0.0100%
0.0005%
0.0100%
0.0005%
4.815%
14.8000%
0.713%
12.5000%
0.602%
10.0000%
0.482%
2.5000%
0.1204%
5.000%
0.162%
3.247%
92.500%
3.003%
2.500%
0.081%
99.800%
35.946%
36.018%
0.150%
0.054%
0.050%
0.018%
76.000%
41.673%
9.000%
4.935%
54.833%
8.000%
4.387%
6.000%
3.290%
1.000%
0.548%
100.000%
1.087%
1.087%
2015/04/08
(EU) RoHS Directive 2011/65/EU ANNEX - Application of lead which are exempted from the requirements: 7(a) Lead in high melting temperature type solders (i.e. lead- based alloys
containing 85 % by weight or more lead) , and 7(c)-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g.
piezoelectronic devices, or in a glass or ceramic matrix compound.
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