MATERIAL DECLARATION SHEET Material Number Product Line Compliance Date SMAJ5.0A ~ 350A, SMAJ5.0CA ~ 130CA Semiconductors 2011/01/01 RoHS Compliant YES Construction No. Element(subpart) MSL Homogeneous Material 1 Material weight [mg] 1 Dice Silicon 1.330 2 High-melting point Solder paste Solder paste 2.003 3 Lead frame Copper 27.5 4 Molding compound Epoxy material 31.035 5 Plating Matte-100% tin Total weight 0.663 62.531 This Document was updated on: Homogeneous Material\ Substances CASRN if applicable Silicon Phosphorus Boron Nickel 7440-21-3 7723-14-0 7440-42-8 7440-02-0 Lead-containing glass 7439-92-1 Silicon dioxide 7631-86-9 Aluminum oxide 1344-28-1 Tin 7440-31-5 Lead 7439-92-1 Silver 7440-22-4 Copper (Cu) 7440-50-8 Iron 7439-89-6 Phosphorus 7723-14-0 Silica 14808-60-7 Epoxy resin 25928-94-3 Phenolic resin-A,B 9003-35-4 Aluminum hydroxide 21645-51-2 Carbon black 1333-86-4 Tin 7440-31-5 Materials Mass % 60.18 0.01 0.01 14.8 12.5 10.0 2.5 5 92.5 2.5 99.8 0.15 0.05 76 9 8 6 1 100 Material Mass Subpart % of total unit mass of total wt. wt. (%) 1.2800 0.0002 0.0002 0.3148 0.2659 0.2127 0.0532 0.16 2.963 0.08 43.89 0.066 0.022 37.72 4.467 3.971 2.978 0.496 1.06 2.127 3.203 43.978 49.632 1.06 2015/02/09 (EU) RoHS Directive 2011/65/EU Application of lead which are exempted from the requirements: 7(a) Lead in high melting temperature type solders (i.e. lead- based alloys containing 85 % by weight or more lead) 7(c)-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1