P4SMA480A~550A, P4SMA160CA~550CA

MATERIAL DECLARATION SHEET
Material Number
Product Line
Compliance Date
P4SMA480A~550A P4SMA160CA~550CA
Semiconductors
2015/04/08
RoHS Compliant
YES
No.
MSL
Construction
Homogeneous Material
Element(subpart)
Material
weight [mg]
1
Dice
Silicon
2.560
2
High-melting point
Solder paste
Solder paste
2.777
3
Lead frame
Copper alloy
27.50
1
Homogeneous
Material\
Substances
Silicon
Phosphorous
Boron
Nickel
Lead glass
Silicon dioxide
Aluminum oxide
Tin
Lead
Silver
CASRN
if applicable
Materials
Mass %
Iron
Phosphorus
Silica
Epoxy resin
Phenolic resin-A,B
7440-21-3
7723-14-0
7440-42-8
7440-02-0
7439-92-1
7631-86-9
1344-28-1
7440-31-5
7439-92-1
7440-22-4
7440-50-8
7439-89-6
7723-14-0
14808-60-7
25928-94-3
9003-35-4
60.18
0.01
0.01
14.80
12.50
10.00
2.50
5.00
92.50
2.50
99.80
0.15
0.05
76.00
9.00
8.00
Aluminum hydroxide
21645-51-2
6.00
Carbon black
Tin
1333-86-4
7440-315
1.00
100
Copper
4
Molding compound Epoxy material
5
Plating
30.25
Matte-100% tin
0.663
Total weight
63.75
Material Mass
Subpart mass
% of total unit
of total wt. (%)
wt.
2.4166
0.0004
0.0004
0.5943
4.0156
0.502
0.4015
0.1004
0.2178
4.0294
4.3561
0.1089
43.051
43.1373
0.0647
0.0216
36.0627
4.2706
3.7961
47.451
2.8471
0.4745
1.04
1.04
This Document was updated on: 2015/04/08
(EU) RoHS Directive 2011/65/EU ANNEX Application of lead which are exempted from the requirements:
7(a) Lead in high melting temperature type solders (i.e. lead- based alloys containing 85 % by weight or more lead), and;
7(c)-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix
compound.
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