MATERIAL DECLARATION SHEET Material Number Product Line Compliance Date P4SMA480A~550A P4SMA160CA~550CA Semiconductors 2015/04/08 RoHS Compliant YES No. MSL Construction Homogeneous Material Element(subpart) Material weight [mg] 1 Dice Silicon 2.560 2 High-melting point Solder paste Solder paste 2.777 3 Lead frame Copper alloy 27.50 1 Homogeneous Material\ Substances Silicon Phosphorous Boron Nickel Lead glass Silicon dioxide Aluminum oxide Tin Lead Silver CASRN if applicable Materials Mass % Iron Phosphorus Silica Epoxy resin Phenolic resin-A,B 7440-21-3 7723-14-0 7440-42-8 7440-02-0 7439-92-1 7631-86-9 1344-28-1 7440-31-5 7439-92-1 7440-22-4 7440-50-8 7439-89-6 7723-14-0 14808-60-7 25928-94-3 9003-35-4 60.18 0.01 0.01 14.80 12.50 10.00 2.50 5.00 92.50 2.50 99.80 0.15 0.05 76.00 9.00 8.00 Aluminum hydroxide 21645-51-2 6.00 Carbon black Tin 1333-86-4 7440-315 1.00 100 Copper 4 Molding compound Epoxy material 5 Plating 30.25 Matte-100% tin 0.663 Total weight 63.75 Material Mass Subpart mass % of total unit of total wt. (%) wt. 2.4166 0.0004 0.0004 0.5943 4.0156 0.502 0.4015 0.1004 0.2178 4.0294 4.3561 0.1089 43.051 43.1373 0.0647 0.0216 36.0627 4.2706 3.7961 47.451 2.8471 0.4745 1.04 1.04 This Document was updated on: 2015/04/08 (EU) RoHS Directive 2011/65/EU ANNEX Application of lead which are exempted from the requirements: 7(a) Lead in high melting temperature type solders (i.e. lead- based alloys containing 85 % by weight or more lead), and; 7(c)-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1