SMLJ5.0A~170A, 5.0CA~43CA

MATERIAL DECLARATION SHEET
Material Number
SMLJ5.0A~170A , 5.0CA~43CA
Product Line
Semiconductors
Compliance Date
2011/01/01
RoHS Compliant
No.
Yes
Construction
Element(subpart)
MSL
1
Homogeneous
Material
Material
weight [mg]
1
Dice
Silicon
4.829
2
Die attach (Solder)
Solder paste
9.170
3
Lead frame / Leads /
Disc
N/A
110.667
4
Molding Compound
(Plastic Package
Only)
Epoxy material
112.150
5
Plating
Matte-Tin
Total weight
1.275
238.091
This Document was updated on:
Homogeneous
Material\
Substances
Silicon
Phosphorus
Boron
Nickel
CASRN
if applicable
7440-21-3
7723-14-0
7440-42-8
7440-02-0
Lead-containing glass 7439-92-1
Silicon dioxide
7631-86-9
Aluminum oxide
1344-28-1
Tin
7440-31-5
Lead
7439-92-1
Silver
7440-22-4
Copper
7440-50-8
Iron
7439-89-6
Phosphorus
7723-14-0
Silica
14808-60-7
Epoxy resin
25928-94-3
Phenolic resin-A,-B 9003-35-4
Hydroxide metal
21645-51-2
Carbon black
1333-86-4
Tin
7440-31-5
Materials
Mass %
60.18
0.01
0.01
14.80
12.50
10.00
2.50
5.00
92.50
2.50
99.80
0.15
0.05
76.00
9.00
8.00
6.00
1.00
100.00
Material
Mass % of
total unit wt
1.2205
0.0002
0.0002
0.3001
0.2535
0.2028
0.0507
0.192
3.563
0.096
46.388
0.070
0.023
35.800
4.239
3.768
2.826
0.471
0.536
Subpart
mass of total
wt. (%)
2.028
3.851
46.481
47.104
0.536
2015/02/09
(EU) RoHS Directive 2011/65/EU Application of lead which are exempted from the requirements:
7(a) Lead in high melting temperature type solders (i.e. lead- based alloys containing 85 % by weight or more lead);
7(c)-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix
compound.
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