MN101CF95F, MN101CF95G MN101CF95F Type MN101CF95G FLASH Internal ROM type ROM (byte) 96K 128K RAM (byte) 4K 6K Package (Lead-free) TQFP080-P-1212D (Under planning) Minimum Instruction Execution Time TQFP080-P-1212D (Under development) [Standard] 0.2 µs (at 2.7 V to 3.6 V, 10 MHz) 0.5 µs (at 2.7 V to 3.6 V, 4 MHz) 62.5 µs (at 2.7 V to 3.6 V, 32 kHz) [Double speed] 0.1 µs (at 2.7 V to 3.6 V, 10 MHz) Interrupts RESET, Watchdog, External 0 to 5, Timer 0 to 8, Time base, Serial 0 reception, Serial 0 transmission, Serial 1 reception, Serial 1 transmission, Serial 2, Serial 3, Serial 4 reception, Serial 4 transmission, Automatic transfer finish, A/D conversion finish, Key interrupts (12 lines) Timer Counter Timer counter 0 : 8-bit × 1 (square-wave/8-bit PWM output, event count, pulse width measurement, serial clock output, real-time output control, generation of remote control carrier) Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ........... coincidence with compare register 0 Timer counter 1 : 8-bit × 1 (square-wave output, event count, synchronous output event, serial clock output) Clock source................ 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ........... coincidence with compare register 1 Timer counter 0, 1 can be cascade-connected. Timer counter 2 : 8-bit × 1 (square-wave output, PWM output, event count, pulse width measurement, synchronous timer, serial clock output) Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ........... coincidence with compare register 2 Timer counter 0, 1, 2 can be cascade-connected. Timer counter 3 : 8-bit × 1 (square-wave output, event count, serial clock output) Clock source................ 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ........... coincidence with compare register 3 Timer counter 2, 3 can be cascade-connected. Timer counter 0, 1, 2, 3 can be cascade-connected. Timer counter 4 : 8-bit × 1 (square-wave/8-bit PWM output, event count, pulse width measurement, real-time output control, serial clock output) Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; 1/1 of external clock input frequency Interrupt source ........... coincidence with compare register 4 Timer counter 5 : 8-bit × 1 (square-wave/8-bit PWM output, event count, pulse width measurement, serial clock output) Clock source................ 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ........... coincidence with compare register 5 Timer counter 4, 5 can be cascade-connected. MAD00053CEM MN101CF95F, MN101CF95G Timer counter 6 : 8-bit freerun timer Clock source................ 1/1 of system clock frequency; 1/1, 1/128, 1/8192 of OSC oscillation clock frequency; 1/1, 1/128, 1/8192 of XI oscillation clock frequency Interrupt source ........... coincidence with compare register 6 Timer counter 7 : 16-bit × 1 (square-wave/16-bit PWM output, cycle / duty continuous variable, event count, synchronous output evevt, pulse width measurement, input capture, real-time output control) Clock source................ 1/1, 1/2, 1/4, 1/16 of system clock frequency; 1/1, 1/2, 1/4, 1/16 of OSC oscillation clock frequency; 1/1, 1/2, 1/4, 1/16 of external clock input frequency Interrupt source ........... coincidence with compare register 7 (2 lines) Timer counter 8 : 16-bit × 1 (square-wave output, PWM output (duty continuous variable), event count, pulse width measurement, input capture) Clock source................ 1/1, 1/2, 1/4, 1/16 of system clock frequency; 1/1, 1/2, 1/4, 1/16 of OSC oscillation clock frequency; 1/1, 1/2, 1/4, 1/16 of external clock input frequency Interrupt source ........... coincidence with compare register 8 (2 lines) Time base timer (one-minute count setting) Clock source................ 1/1 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency Interrupt source ........... 1/128, 1/256, 1/512, 1/1024, 1/8192, 1/32768 of clock source frequency Watchdog timer Interrupt source ........... 1/65536, 1/262144, 1/1048576 of system clock frequency Serial interface Serial 0 : synchronous type / UART (full-duplex) × 1 Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 1, 2; 1/2, 1/4, 1/16, 1/64 of OSC oscillation clock frequency Serial 1 : synchronous type / UART (full-duplex) × 1 Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 2, 3; 1/2, 1/4, 1/16, 1/64 of OSC oscillation clock frequency Serial 2 : synchronous type / multi-master I²C × 1 Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 3, 4; 1/2, 1/4, 1/16, 1/32 of OSC oscillation clock frequency Serial 3 : synchronous type / single-master I²C × 1 Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 4, 5; 1/2, 1/4, 1/16, 1/32 of OSC oscillation clock frequency Serial 4 : synchronous type / UART (full-duplex) × 1 Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 0, 5; 1/2, 1/4, 1/16, 1/64 of OSC oscillation clock frequency DMA controller Max. Transfer cycles : 255 Starting factor : various types of interrupt, software Transfer mode : 1-byte transfer, word transfer, burst transfer I/O Pins I/O 67 Common use , Specified pull-up resistor available, Input/output selectable (bit unit) A/D converter 10-bit × 11-ch. (with S/H) Special Ports Buzzer output, remote control carrier signal output, high-current drive port Development tools In-circuit Emulator PX-ICE101C/D+PX-PRB101C95-TQFP080-P-1212D MAD00053CEM P75, SDO5, TM8IO P74, SDO4, TM7OB P73, SDO3 P72, SDO2, SBT1B P71, SDO1, SBI1B, RXD1B P70, SDO0, SBO1B, TXD1B P43, KEY11 P42, KEY10 P41, KEY9 P40, KEY8 P67, KEY7 P66, KEY6 P65, KEY5 P64, KEY4 P63, KEY3 P62, KEY2 P61, KEY1 P60, KEY0 P54, TM1IO, TM0OB, RMOUTB P53, TM0IOA, RMOUTA 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 Pin Assignment TM4IO, SDO6, P76 61 40 P25, IRQ5, TM7IOA TM5IO, SDO7, P77 62 P24, IRQ4 LED7, P87 39 63 P23, IRQ3 LED6, P86 38 64 P22, IRQ2 SBT0A, LED5, P85 37 65 P21, IRQ1 RXD0A, SBI0A, LED4, P84 36 66 P20, IRQ0 TXD0A, SBO0A, LED3, P83 35 67 P36 LED2, P82 34 68 P35, SBT4 LED1, P81 33 69 P34, SBI4, RXD4 LED0, P80 32 70 P33, SBO4, TXD4 KEY12, P44 31 71 P32, TM3IO KEY13, P45 30 72 P31, TM2OB KEY14, P46 29 73 P30, TM2IOA KEY15, P47 28 74 P15, SBT2, SCL2, SBT0B VREF- 27 75 P14, SBI2, SBI0B, RXD0B AN0, PA0 26 76 P13, SBO2, SDA2, SBO0B, TXD0B AN1, PA1 25 77 P12, SBT1A AN2, PA2 24 78 P11, SBI1A, RXD1A AN3, PA3 23 79 P10, SBO1A, TXD1A AN4, PA4 22 80 21 P02, SBT3, SCL3, BUZZER 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 AN5, PA5 AN6, PA6 AN7, PB0 AN8, PB1 AN9, PB2 AN10, PB3 DMOD VREF+ VPP VDD33 VDD18 OSC2 OSC1 VSS XI XO MMOD P27, NRST SDA3, SBO3, P00 SBI3, P01 MN101CF95F MN101CF95G TQFP080-P-1212D MAD00053CEM Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. Industrial Co., Ltd.