MN101C88D, MN101C88F, MN101C88G MN101C88D Type 64K RAM (byte) 2K Minimum Instruction Execution Time MN101C88G MN101CF88G Mask ROM Internal ROM type ROM (byte) Package (Lead-free) MN101C88F 96K FLASH 128K 4K 10K QFP100-P-1818B QFP100-P-1818B QFP100-P-1818B (Under planning) 0.1 µs (at 4.5 V to 5.5 V, 20 MHz) 0.24 µs (at 2.7 V to 5.5 V, 8.4 MHz) 0.48 µs (at 2.3 V to 5.5 V, 4.19 MHz)* 1.0 µs (at 2.0 V to 5.5 V, 2.0 MHz)* 62.5 µs (at 2.0 V to 5.5 V, 32 kHz)* * The lower limit for operation guarantee for flash memory built-in type is 2.5 V Interrupts RESET, Watchdog, External 0 to 4, Timer 0 to 3, Timer 6, Timer 7 (2 systems), Time base, Serial 0 (2 systems), Serial 1 (2 systems), Serial 2, A/D conversion finish, Automatic transfer finish, FL display key scan, FL display dimmer Timer Counter Timer counter 0 : 8-bit × 1 (square-wave/8-bit PWM output, event count, generation of remote control carrier, simple pulse width measurement) Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ........... coincidence with compare register 0 Timer counter 1 : 8-bit × 1 (square-wave output, event count, serial transfer clock) Clock source................ 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ........... coincidence with compare register 1 Timer counter 0, 1 can be cascade-connected. Timer counter 2 : 8-bit × 1 (square-wave output, PWM output, serial transfer clock, event count, simple pulse width measurement) Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ........... coincidence with compare register 2 Timer counter 3 : 8-bit × 1 (square-wave output, event count, generation of remote control carrier, serial transfer clock) Clock source................ 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ........... coincidence with compare register 3 Timer counter 2, 3 can be cascade-connected. Timer counter 6 : 8-bit freerun timer Clock source................ 1/1 of system clock frequency; 1/1, 1/128, 1/8192 of OSC oscillation clock frequency; 1/1, 1/128, 1/8192 of XI oscillation clock frequency Interrupt source ........... coincidence with compare register 6 Timer counter 7 : 16-bit × 1 (square-wave output, 16-bit PWM output (cycle / duty continuous variable), event count, pulse width measurement, input capture) Clock source................ 1/1, 1/2, 1/4, 1/16 of system clock frequency; 1/1, 1/2, 1/4, 1/16 of OSC oscillation clock frequency; 1/1, 1/2, 1/4, 1/16 of external clock input frequency Interrupt source ........... coincidence with compare register 7 (2 lines) Time base timer (one-minute count setting) Clock source................ 1/1 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency Interrupt source ........... 1/128, 1/256, 1/512, 1/1024, 1/8192, 1/32768, of clock source frequency MAD00051DEM MN101C88D, MN101C88F, MN101C88G Watchdog timer Interrupt source ........... 1/65536, 1/262144, 1/1048576 of system clock frequency Serial interface Serial 0 : synchronous type/UART (full-duplex) × 1 Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 1 or 2; 1/2, 1/4, 1/16, 1/64 of OSC oscillation clock frequency, external clock Serial 1 : synchronous type/UART (full-duplex) × 1 Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 1 or 2; 1/2, 1/4, 1/16, 1/64 of OSC oscillation clock frequency, external clock Serial 2 : synchronous type/single-master I²C × 1 Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 2 or 3; 1/2, 1/4, 1/16, 1/32 of OSC oscillation clock frequency, external clock DMA controller Max. Transfer cycles : 255 Starting factor : external request, various types of interrupt, software Transfer mode : 1-byte transfer, word transfer, burst transfer I/O Pins I/O 35 High Voltage 53 Common use, Specified pull-up resistor available , Input/output selectable (bit unit) Output : 29, I/O : 24, P-ch. open drain (breakdown voltage –40 V) : FL drive : 53 Specified pull-down resistor mask option : 35 A/D converter 10-bit × 8-ch. (with S/H) Display control function FL (35 to 43) segments × (18 to 10) digits Special Ports Buzzer output, high-current drive port ROM Correction Correcting address designation : up to 3 addresses possible Development tools In-circuit Emulator PX-ICE101C/D+PX-PRB101C88-QFP100-P-1818B-M MAD00051DEM 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 PB6, SEG28 PB7, SEG27 PC0, SEG26 PC1, SEG25 PC2, SEG24 P90, SEG23 P91, SEG22 P92, SEG21 P93, SEG20 P94, SEG19 P95, SEG18 P96, SEG17 P97, SEG16 P80, SEG15 P81, SEG14 P82, SEG13 P83, SEG12 P84, SEG11 P85, SEG10 P86, SEG9 P87, SEG8 P70, SEG7, DGT0 P71, SEG6, DGT1 P72, SEG5, DGT2 P73, SEG4, DGT3 Pin Assignment MN101C88D MN101C88F MN101C88G 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 DGT4, SEG3, P74 DGT5, SEG2, P75 DGT6, SEG1, P76 DGT7, SEG0, P77 DGT8, P40 DGT9, P41 DGT10, P60 DGT11, P61 DGT12, P62 DGT13, P63 DGT14, P64 DGT15, P65 DGT16, P66 DGT17, P67 VDD3 VDD2 P34 P33 SCL, SBT2, P32 SBI2, P31 SDA, SBO2, P30 IRQ4, P24 IRQ3, P23 IRQ2, P22 ACZ, IRQ1, P21 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 TXD0A, SBO0A, P00 RXD0A, SBI0A, P01 SBT0A, P02 TXD1, SBO1, P03 RXD1, SBI1, P04 SBT1, P05 BUZZER, P06 RST, P27 VDD1 OSC2 OSC1 VSS XI XO MMOD AN0, PA0 AN1, PA1 AN2, PA2 AN3, PA3 AN4, PA4 AN5, PA5 AN6, PA6 AN7, PA7 VREF+ IRQ0, P20 PB5, SEG29 PB4, SEG30 PB3, SEG31 PB2, SEG32 PB1, SEG33 PB0, SEG34 PD7, SEG35 PD6, SEG36 PD5, SEG37 PD4, SEG38 PD3, SEG39 PD2, SEG40 PD1, SEG41 PD0, SEG42 VPP P50, LED0, SBO0B, TXD0B P51, LED1, SBI0B, RXD0B P52, LED2, SBT0B P10, TM0IO, RMOUT P11, TM1IO P12, TM2IO P13, TM3IO P14 P15, TM7IO P16 QFP100-P-1818B MAD00051DEM Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. Industrial Co., Ltd.