PQFN 5X6 RoHS Compliance Document Contents: 1. Composition 2. Solder Reflow 3. Tin Whisker Report The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. October 2014 PQFN 5X6 BOM 1 Copper Clip Component Material Name Material Mass (g) Chip Silicon 0.00131 Encapsulant Epoxy Resin 0.03822 Lead Frame Copper 0.03816 Die Attach Silver Epoxy 0.00083 Copper Clip Wire Bond Lead Finish Copper Copper Matte Tin* 0.00995 0.00031 0.00146 Element Name Composition Si SiO2 Epoxy Cu Fe Pb Sn Ag Cu Cu Sn Total Weight (g) CAS # Substance Mass (g) 7440-21-3 7631-86-9 90598-46-2 7440-50-8 7439-89-6 7439-92-1 7440-31-5 7440-22-4 7440-50-8 7440-50-8 7440-31-5 0.00131 0.03409 0.00413 0.03727 0.00089 0.00077 0.00004 0.00002 0.00995 0.00031 0.00146 Material Analysis Weight (%) 100% 89% 11% 98% 2% 92.5% 5% 2.5% 100% 100% 100% % of Total Weight 1.5% 37.8% 4.6% 41.3% 1.0% 0.9% 0.0% 0.0% 11.0% 0.3% 1.6% 0.09024 *Tin whisker mitigation strategy is 150 °C, 1 hour anneal within 24 hours of tin plating. This part is compliant with EU Directive 2011/65/EU (RoHS Directive) and does not contain lead, mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%, except as permitted by Annex III. Further part complies with 3 reflow cycles per JEDEC J-STD-020 The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 1 October 2014 PQFN 5X6 BOM 2 Copper Clip Component Material Name Material Mass (g) Chip Silicon 0.00131 Encapsulant Epoxy Resin 0.03822 Lead Frame Copper 0.03816 Die Attach Sold Solder 0.00083 Copper Clip Wire Bond Lead Finish Copper Gold Matte Tin* 0.00995 0.00031 0.00146 Element Name Composition Si SiO2 Epoxy Cu Fe Pb Sn Ag Cu Au Sn Total Weight (g) CAS # Substance Mass (g) 7440-21-3 7631-86-9 90598-46-2 7440-50-8 7439-89-6 7439-92-1 7440-31-5 7440-22-4 7440-57-5 7440-50-8 7440-31-5 0.00131 0.03409 0.00413 0.03727 0.00089 0.00077 0.00004 0.00002 0.00995 0.00031 0.00146 Material Analysis Weight (%) 100% 89% 11% 98% 2% 92.5% 5% 2.5% 100% 100% 100% % of Total Weight 1.5% 37.8% 4.6% 41.3% 1.0% 0.9% 0.0% 0.0% 11.0% 0.3% 1.6% 0.09024 *Tin whisker mitigation strategy is 150 °C, 1 hour anneal within 24 hours of tin plating. This part is compliant with EU Directive 2011/65/EU (RoHS Directive) and does not contain lead, mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%, except as permitted by Annex III. Further part complies with 3 reflow cycles per JEDEC J-STD-020 The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 2 October 2014 PQFN 5X6 BOM 3 Copper Clip Component Material Name Material Mass (g) Chip Silicon 0.00131 Encapsulant Epoxy Resin 0.03822 Lead Frame Copper 0.03816 Die Attach Soft Solder 0.00083 Copper Clip Wire Bond Copper Gold 0.00995 0.00031 Lead Finish Ni/Pd/Au 0.00146 Element Name Composition Si SiO2 Epoxy Cu Fe Pb Sn Cu Au Ni Pd Au Total Weight (g) CAS # Substance Mass (g) 7440-21-3 7631-86-9 90598-46-2 7440-50-8 7439-89-6 7439-92-1 7440-31-5 7440-50-8 7440-57-5 7440-02-0 7440-05-3 7440-57-5 0.00131 0.03409 0.00413 0.03727 0.00089 0.00079 0.00004 0.00995 0.00031 0.00135 0.00009 0.00002 Material Analysis Weight (%) 100% 89% 11% 98% 2% 95% 5% 100% 100% 92.4% 6.3% 1.3% % of Total Weight 1.5% 37.8% 4.6% 41.3% 1.0% 0.9% 0.0% 11.0% 0.3% 1.7% 0.1% 0.0% 0.09024 *Tin whisker mitigation strategy is 150 °C, 1 hour anneal within 24 hours of tin plating. This part is compliant with EU Directive 2011/65/EU (RoHS Directive) and does not contain lead, mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%, except as permitted by Annex III. Further part complies with 3 reflow cycles per JEDEC J-STD-020 The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 3 October 2014 PQFN 5X6 BOM 4 Copper Clip Component Material Name Material Mass (g) Chip Silicon 0.00131 Encapsulant Epoxy Resin 0.03822 Lead Frame Copper 0.03816 Die Attach Soft Solder 0.00083 Copper Clip Wire Bond Lead Finish Copper Copper Matte Tin* 0.00995 0.00031 0.00146 Element Name Composition Si SiO2 Epoxy Cu Fe Pb Sn Cu Cu Sn Total Weight (g) CAS # Substance Mass (g) 7440-21-3 7631-86-9 90598-46-2 7440-50-8 7439-89-6 7439-92-1 7440-31-5 7440-50-8 7440-50-8 7440-31-5 0.00131 0.03409 0.00413 0.03727 0.00089 0.00079 0.00004 0.00995 0.00031 0.00146 Material Analysis Weight (%) 100% 89% 11% 98% 2% 95% 5% 100% 100% 100% % of Total Weight 1.5% 37.8% 4.6% 41.3% 1.0% 0.9% 0.0% 11.0% 0.3% 1.6% 0.09024 *Tin whisker mitigation strategy is 150 °C, 1 hour anneal within 24 hours of tin plating. This part is compliant with EU Directive 2011/65/EU (RoHS Directive) and does not contain lead, mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%, except as permitted by Annex III. Further part complies with 3 reflow cycles per JEDEC J-STD-020 The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 4 October 2014 PQFN 5X6 BOM 5 Ribbon Component Material Name Material Mass (g) Element Name Composition CAS # Substance Mass (g) Si SiO2 Epoxy Cu Fe Pb Sn Ag 7440-21-3 7631-86-9 90598-46-2 7440-50-8 7439-89-6 7439-92-1 7440-31-5 7440-22-4 0.00131 0.03409 0.00413 0.03727 0.00089 0.00077 0.00004 0.00002 Material Analysis Weight (%) 100% 89% 11% 98% 2% 92.5% 5% 2.5% % of Total Weight Chip Silicon 0.00131 1.6% 42.0% 5.1% 45.9% 1.1% 0.9% 0.0% 0.0% Encapsulant Epoxy Resin 0.03822 Lead Frame Copper 0.03816 Die Attach Soft Solder 0.00083 Wire Bond Aluminum Ribbon 0.00093 Al 7429-90-5 0.00093 100% 1.1% Wire Bond Lead Finish Copper Matte Tin* 0.00031 0.00146 Cu Sn Total Weight (g) 7440-50-8 7440-31-5 0.00031 0.00146 100% 100% 0.4% 1.8% 0.08122 *Tin whisker mitigation strategy is 150 °C, 1 hour anneal within 24 hours of tin plating. This part is compliant with EU Directive 2011/65/EU (RoHS Directive) and does not contain lead, mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%, except as permitted by Annex III. Further part complies with 3 reflow cycles per JEDEC J-STD-020 The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 5 October 2014 PQFN 5X6 BOM 6 Ribbon Component Material Name Material Mass (g) Element Name Composition CAS # Substance Mass (g) Si SiO2 Epoxy Cu Fe Pb Sn Ag 7440-21-3 7631-86-9 90598-46-2 7440-50-8 7439-89-6 7439-92-1 7440-31-5 7440-22-4 0.00131 0.03409 0.00413 0.03727 0.00089 0.00079 0.00002 0.00002 Material Analysis Weight (%) 100% 89% 11% 98% 2% 92.5% 5% 2.5% % of Total Weight Chip Silicon 0.00131 1.6% 42.0% 5.1% 45.9% 1.1% 0.9% 0.0% 0.0% Encapsulant Epoxy Resin 0.03822 Lead Frame Copper 0.03816 Die Attach Soft Solder 0.00083 Wire Bond Aluminum Ribbon 0.00093 Al 7429-90-5 0.00093 100% 1.1% Wire Bond Lead Finish Gold Matte Tin* 0.00031 0.00146 Au Sn Total Weight (g) 7440-57-5 7440-31-5 0.00031 0.00146 100% 100% 0.4% 1.8% 0.08122 *Tin whisker mitigation strategy is 150 °C, 1 hour anneal within 24 hours of tin plating. This part is compliant with EU Directive 2011/65/EU (RoHS Directive) and does not contain lead, mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%, except as permitted by Annex III. Further part complies with 3 reflow cycles per JEDEC J-STD-020 The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 6 2014 PQFN 5X6 BOM 7 Ribbon Component Material Name Material Mass (g) Element Name Composition CAS # Substance Mass (g) Si SiO2 Epoxy Cu Fe Pb Sn Ag 7440-21-3 7631-86-9 90598-46-2 7440-50-8 7439-89-6 7439-92-1 7440-31-5 7440-22-4 0.00131 0.03409 0.00413 0.03727 0.00089 0.00079 0.00002 0.00002 Material Analysis Weight (%) 100% 89% 11% 98% 2% 92.5% 5% 2.5% % of Total Weight Chip Silicon 0.00131 1.6% 42.5% 5.1% 46.4% 1.1% 1.0% 0.0% 0.1% Encapsulant Epoxy Resin 0.03822 Lead Frame Copper 0.03816 Die Attach Soft Solder 0.00083 Wire Bond Aluminum Ribbon 0.00093 Al 7429-90-5 0.00093 100% 1.1% Wire Bond Lead Finish Copper Matte Tin* 0.00031 0.00146 Cu Sn Total Weight (g) 7440-50-8 7440-31-5 0.00031 0.00146 100% 100% 0.4% 1.8% 0.08122 *Tin whisker mitigation strategy is 150 °C, 1 hour anneal within 24 hours of tin plating. This part is compliant with EU Directive 2011/65/EU (RoHS Directive) and does not contain lead, mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%, except as permitted by Annex III. Further part complies with 3 reflow cycles per JEDEC J-STD-020 The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 7 2014 PQFN 5X6 BOM 8 Component Material Name Material Mass (g) Chip Silicon 0.00131 Encapsulant Epoxy Resin 0.03822 Lead Frame Copper 0.03816 Die Attach Soft Solder 0.00083 Wire Bond Lead Finish Copper Matte Tin* 0.00031 0.00146 Element Name Composition Si SiO2 Epoxy Cu Fe Pb Sn Ag Cu Sn Total Weight (g) CAS # Substance Mass (g) 7440-21-3 7631-86-9 90598-46-2 7440-50-8 7439-89-6 7439-92-1 7440-31-5 7440-22-4 7440-50-8 7440-31-5 0.00131 0.03409 0.00413 0.03727 0.00089 0.00079 0.00002 0.00002 0.00031 0.00146 Material Analysis Weight (%) 100% 89% 11% 98% 2% 95.5% 2% 2.5% 100% 100% % of Total Weight 1.6% 42.5% 5.1% 46.4% 1.1% 1.0% 0.0% 0.1% 0.4% 1.8% 0.08029 *Tin whisker mitigation strategy is 150 °C, 1 hour anneal within 24 hours of tin plating. This part is compliant with EU Directive 2011/65/EU (RoHS Directive) and does not contain lead, mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%, except as permitted by Annex III. Further part complies with 3 reflow cycles per JEDEC J-STD-020 The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 8 October 2014 PQFN 5X6 BOM 9 Component Material Name Material Mass (g) Chip Silicon 0.00131 Encapsulant Epoxy Resin 0.03822 Lead Frame Copper 0.03816 Die Attach Soft Solder 0.00083 Wire Bond Lead Finish Copper Matte Tin* 0.00031 0.00146 Element Name Composition Si SiO2 Epoxy Cu Fe Pb Sn Ag Cu Sn Total Weight (g) CAS # Substance Mass (g) 7440-21-3 7631-86-9 90598-46-2 7440-50-8 7439-89-6 7439-92-1 7440-31-5 7440-22-4 7440-50-8 7440-31-5 0.00131 0.03409 0.00413 0.03727 0.00089 0.00077 0.00004 0.00002 0.00031 0.00146 Material Analysis Weight (%) 100% 89% 11% 98% 2% 92.5% 5% 2.5% 100% 100% % of Total Weight 1.6% 42.5% 5.1% 46.4% 1.1% 1.0% 0.1% 0.0% 0.4% 1.8% 0.08029 *Tin whisker mitigation strategy is 150 °C, 1 hour anneal within 24 hours of tin plating. This part is compliant with EU Directive 2011/65/EU (RoHS Directive) and does not contain lead, mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%, except as permitted by Annex III. Further part complies with 3 reflow cycles per JEDEC J-STD-020 The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 9 October 2014 PQFN 5X6 BOM 10 Component Material Name Material Mass (g) Chip Silicon 0.00131 Encapsulant Epoxy Resin 0.03822 Lead Frame Copper 0.03816 Die Attach Silver Epoxy 0.00083 Wire Bond Lead Finish Copper Matte Tin* 0.00031 0.00146 Element Name Composition Si SiO2 Epoxy Cu Fe Ag Epoxy Cu Sn Total Weight (g) CAS # Substance Mass (g) 7440-21-3 7631-86-9 90598-46-2 7440-50-8 7439-89-6 7440-22-4 90598-46-2 7440-50-8 7440-31-5 0.00131 0.03409 0.00413 0.03727 0.00089 0.00060 0.00023 0.00031 0.00146 Material Analysis Weight (%) 100% 89% 11% 98% 2% 72% 28% 100% 100% % of Total Weight 1.6% 42.5% 5.1% 46.4% 1.1% 0.7% 0.3% 0.4% 1.8% 0.08029 *Tin whisker mitigation strategy is 150 °C, 1 hour anneal within 24 hours of tin plating. This part is compliant with EU Directive 2011/65/EU (RoHS Directive) and does not contain lead, mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%, except as permitted by Annex III. Further part complies with 3 reflow cycles per JEDEC J-STD-020 The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 10 October 2014 PQFN 5X6 BOM 11 Component Material Name Material Mass (g) Chip Silicon 0.00131 Encapsulant Epoxy Resin 0.03822 Lead Frame Copper 0.03816 Die Attach Silver Epoxy 0.00083 Wire Bond Copper 0.00031 Lead Finish Ni/Pd/Au 0.00146 Element Name Composition Si SiO2 Epoxy Cu Fe Ag Epoxy Cu Ni Pd Au Total Weight (g) CAS # Substance Mass (g) 7440-21-3 7631-86-9 90598-46-2 7440-50-8 7439-89-6 7440-22-4 90598-46-2 7440-50-8 7440-02-0 7440-05-3 7440-57-5 0.00131 0.03409 0.00413 0.03727 0.00089 0.00060 0.00023 0.00031 0.00135 0.00009 0.00002 Material Analysis Weight (%) 100% 89% 11% 98% 2% 72% 28% 100% 92.4% 6.3% 1.3% % of Total Weight 1.6% 42.5% 5.1% 46.4% 1.1% 0.7% 0.3% 0.4% 1.7% 0.1% 0.0% 0.08029 *Tin whisker strategy is 150 °C, 1 hour anneal within 24 hours of tin plating. This part is compliant with EU Directive 2011/65/EU (RoHS Directive) and does not contain lead, mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%, except as permitted by Annex III. Further part complies with 3 reflow cycles per JEDEC J-STD-020 The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 11 October 2014 PQFN 5X6 BOM 12 Copper Clip Component Material Name Material Mass (g) Chip Silicon 0.00131 Encapsulant Epoxy Resin 0.03822 Lead Frame Copper 0.03816 Die Attach Soft Solder 0.00083 Copper Clip Wire Bond Lead Finish Copper Gold Matte Tin* 0.00995 0.00031 0.00146 Element Name Composition Si SiO2 Epoxy Cu Fe Pb Sn Cu Au Sn Total Weight (g) CAS # Substance Mass (g) 7440-21-3 7631-86-9 90598-46-2 7440-50-8 7439-89-6 7439-92-1 7440-31-5 7440-50-8 7440-57-5 7440-31-5 0.00131 0.03409 0.00413 0.03727 0.00089 0.00079 0.00004 0.00995 0.00031 0.00146 Material Analysis Weight (%) 100% 89% 11% 98% 2% 95% 5% 100% 100% 100% % of Total Weight 1.5% 37.8% 4.6% 41.3% 1.0% 0.9% 0.0% 11.0% 0.3% 1.6% 0.09024 *Tin whisker mitigation strategy is 150 °C, 1 hour anneal within 24 hours of tin plating. This part is compliant with EU Directive 2011/65/EU (RoHS Directive) and does not contain lead, mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%, except as permitted by Annex III. Further part complies with 3 reflow cycles per JEDEC J-STD-020 The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 12 October 2014 Test Definition Room Temperature Humidity Temperature Humidity Unbiase Temperature Cycling Test Conditions Inspection Total Interval Class Duration 1 and 2 Class 1 and 2 Products Products Maximum Whisker Length (µm) 30± 2°C/60± 3% RH 1000 hours 4000 hours 20 55± 3°C/85± 3% RH 1000 hours 4000 hours 20 500 cycles 1500 cycles 45 -40 to 55°C to 80 to 95°C, air to air, 10 min soak, approx 3 Tin Whisker testing per JESD201, Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finish Tin Whisker Results (number of failing whiskers) Test Room Temperature Humidity Storage Temperature Humidity Test Temperature Cycling 1000 Hours 2000 Hours 3000 Hours 4000 Hours 0/24 0/24 0/24 0/24 0/24 0/24 0/24 0/24 500 Cycles 1000 Cycles 1500 Cycles 0/24 0/24 0/24 The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 13 October 2014