BCM847BV; BCM847BS; BCM847DS NPN/NPN matched double transistors Rev. 06 — 28 August 2009 Product data sheet 1. Product profile 1.1 General description NPN/NPN matched double transistors in small Surface-Mounted Device (SMD) plastic packages. The transistors are fully isolated internally. Table 1. Product overview Type number Package NXP JEITA PNP/PNP complement Matched version of BCM847BV SOT666 - BCM857BV BC847BV BCM847BS SOT363 SC-88 BCM857BS BC847BS BCM847DS SOT457 SC-74 BCM857DS - 1.2 Features n Current gain matching n Base-emitter voltage matching n Drop-in replacement for standard double transistors 1.3 Applications n Current mirror n Differential amplifier 1.4 Quick reference data Table 2. Symbol Quick reference data Parameter Conditions Min Typ Max Unit open base - - 45 V - - 100 mA 200 290 450 Per transistor VCEO collector-emitter voltage IC collector current hFE DC current gain VCE = 5 V; IC = 2 mA BCM847BV/BS/DS NXP Semiconductors NPN/NPN matched double transistors Table 2. Quick reference data …continued Symbol Parameter Conditions hFE1/hFE2 hFE matching VCE = 5 V; IC = 2 mA VBE1−VBE2 VBE matching VCE = 5 V; IC = 2 mA Min Typ Max [1] 0.9 1 - [2] - - 2 Unit Per device [1] The smaller of the two values is taken as the numerator. [2] The smaller of the two values is subtracted from the larger value. mV 2. Pinning information Table 3. Pinning Pin Description 1 emitter TR1 2 base TR1 3 collector TR2 4 emitter TR2 5 base TR2 6 collector TR1 Simplified outline 6 5 Symbol 6 4 5 4 TR2 TR1 1 2 3 1 2 3 001aab555 sym020 3. Ordering information Table 4. Ordering information Type number Package Name Description Version BCM847BV - plastic surface-mounted package; 6 leads SOT666 BCM847BS SC-88 plastic surface-mounted package; 6 leads SOT363 BCM847DS SC-74 plastic surface-mounted package (TSOP6); 6 leads SOT457 4. Marking Table 5. Marking codes Type number Marking code[1] BCM847BV 3A BCM847BS M1* BCM847DS R6 [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China BCM847BV_BS_DS_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 28 August 2009 2 of 15 BCM847BV/BS/DS NXP Semiconductors NPN/NPN matched double transistors 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per transistor VCBO collector-base voltage open emitter - 50 V VCEO collector-emitter voltage open base - 45 V VEBO emitter-base voltage open collector - 6 V IC collector current - 100 mA ICM peak collector current single pulse; tp ≤ 1 ms - 200 mA Ptot total power dissipation Tamb ≤ 25 °C SOT666 [1][2] - 200 mW SOT363 [1] - 200 mW SOT457 [1] - 250 mW SOT666 [1][2] - 300 mW SOT363 [1] - 300 mW SOT457 [1] - 380 mW Per device total power dissipation Ptot Tamb ≤ 25 °C Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. 6. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Per transistor Rth(j-a) thermal resistance from junction to ambient in free air SOT666 [1][2] - - 625 K/W SOT363 [1] - - 625 K/W SOT457 [1] - - 500 K/W BCM847BV_BS_DS_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 28 August 2009 3 of 15 BCM847BV/BS/DS NXP Semiconductors NPN/NPN matched double transistors Table 7. Thermal characteristics …continued Symbol Parameter Conditions thermal resistance from junction to ambient in free air Min Typ Max Unit Per device Rth(j-a) SOT666 [1][2] - - 416 K/W SOT363 [1] - - 416 K/W SOT457 [1] - - 328 K/W [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. 7. Characteristics Table 8. Characteristics Tamb = 25 °C unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit VCB = 30 V; IE = 0 A - - 15 nA VCB = 30 V; IE = 0 A; Tj = 150 °C - - 5 µA nA Per transistor ICBO collector-base cut-off current IEBO emitter-base cut-off current VEB = 5 V; IC = 0 A - - 100 hFE DC current gain VCE = 5 V; IC = 10 µA - 250 - VCE = 5 V; IC = 2 mA 200 290 450 IC = 10 mA; IB = 0.5 mA - 50 200 mV IC = 100 mA; IB = 5 mA - 200 400 mV VCEsat VBEsat VBE collector-emitter saturation voltage base-emitter saturation voltage base-emitter voltage IC = 10 mA; IB = 0.5 mA [1] - 760 - mV IC = 100 mA; IB = 5 mA [1] - 910 - mV VCE = 5 V; IC = 2 mA [2] 610 660 710 mV VCE = 5 V; IC = 10 mA [2] - - 770 mV Cc collector capacitance VCB = 10 V; IE = ie = 0 A; f = 1 MHz - - 1.5 pF Ce emitter capacitance VEB = 0.5 V; IC = ic = 0 A; f = 1 MHz - 11 - pF BCM847BV_BS_DS_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 28 August 2009 4 of 15 BCM847BV/BS/DS NXP Semiconductors NPN/NPN matched double transistors Table 8. Characteristics …continued Tamb = 25 °C unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit fT transition frequency VCE = 5 V; IC = 10 mA; f = 100 MHz 100 250 - MHz NF noise figure VCE = 5 V; IC = 0.2 mA; RS = 2 kΩ; f = 10 Hz to 15.7 kHz - 2.8 - dB VCE = 5 V; IC = 0.2 mA; RS = 2 kΩ; f = 1 kHz; B = 200 Hz - 3.3 - dB Per device hFE matching VCE = 5 V; IC = 2 mA [3] 0.9 1 - VBE1−VBE2 VBE matching VCE = 5 V; IC = 2 mA [4] - - 2 hFE1/hFE2 [1] VBEsat decreases by about 1.7 mV/K with increasing temperature. [2] VBE decreases by about 2 mV/K with increasing temperature. [3] The smaller of the two values is taken as the numerator. [4] The smaller of the two values is subtracted from the larger value. BCM847BV_BS_DS_6 Product data sheet mV © NXP B.V. 2009. All rights reserved. Rev. 06 — 28 August 2009 5 of 15 BCM847BV/BS/DS NXP Semiconductors NPN/NPN matched double transistors 0.20 IC (A) 0.16 006aaa532 IB (mA) = 4.50 4.05 3.60 3.15 006aaa533 600 hFE 2.70 2.25 1.80 1.35 0.12 400 (1) 0.90 (2) 0.08 0.45 200 (3) 0.04 0 10−2 0 0 2 4 6 8 10 VCE (V) Tamb = 25 °C 10−1 1 10 102 103 IC (mA) VCE = 5 V (1) Tamb = 100 °C (2) Tamb = 25 °C (3) Tamb = −55 °C Fig 1. Collector current as a function of collector-emitter voltage; typical values Fig 2. 006aaa534 1.3 VBEsat (V) 1.1 DC current gain as a function of collector current; typical values 006aaa535 10 VCEsat (V) 0.9 1 (1) (2) 0.7 (3) 10−1 0.5 (1) (2) (3) 0.3 0.1 10−1 1 10 102 103 10−2 10−1 1 IC (mA) IC/IB = 20 IC/IB = 20 (1) Tamb = 100 °C (2) Tamb = 25 °C (2) Tamb = 25 °C (3) Tamb = 100 °C (3) Tamb = −55 °C Base-emitter saturation voltage as a function of collector current; typical values Fig 4. 103 Collector-emitter saturation voltage as a function of collector current; typical values BCM847BV_BS_DS_6 Product data sheet 102 IC (mA) (1) Tamb = −55 °C Fig 3. 10 © NXP B.V. 2009. All rights reserved. Rev. 06 — 28 August 2009 6 of 15 BCM847BV/BS/DS NXP Semiconductors NPN/NPN matched double transistors 006aaa536 1 VBE (V) 006aaa537 103 fT (MHz) 0.8 102 0.6 0.4 10−1 1 102 10 10 103 1 IC (mA) VCE = 5 V; Tamb = 25 °C Fig 5. VCE = 5 V; Tamb = 25 °C Base-emitter voltage as a function of collector current; typical values Fig 6. 006aaa538 5 Cc (pF) Transition frequency as a function of collector current; typical values 006aaa539 15 4 Ce (pF) 13 3 11 2 9 1 7 5 0 0 2 4 6 8 10 VCB (V) 0 4 6 f = 1 MHz; Tamb = 25 °C Collector capacitance as a function of collector-base voltage; typical values Fig 8. Emitter capacitance as a function of emitter-base voltage; typical values BCM847BV_BS_DS_6 Product data sheet 2 VEB (V) f = 1 MHz; Tamb = 25 °C Fig 7. 102 10 IC (mA) © NXP B.V. 2009. All rights reserved. Rev. 06 — 28 August 2009 7 of 15 BCM847BV/BS/DS NXP Semiconductors NPN/NPN matched double transistors 8. Application information V+ VCC OUT1 OUT2 IN1 R1 TR1 IN2 TR2 l out TR1 TR2 V− 006aaa523 Fig 9. 006aaa525 Current mirror Fig 10. Differential amplifier 9. Package outline 1.7 1.5 6 2.2 1.8 0.6 0.5 5 6 4 1.1 0.8 5 4 2 3 0.45 0.15 0.3 0.1 1.7 1.5 2.2 1.35 2.0 1.15 1.3 1.1 pin 1 index pin 1 index 1 2 1 3 0.18 0.08 0.27 0.17 0.5 1.3 1 Dimensions in mm 0.25 0.10 0.3 0.2 0.65 04-11-08 Fig 11. Package outline SOT666 Dimensions in mm 06-03-16 Fig 12. Package outline SOT363 (SC-88) 3.1 2.7 6 3.0 2.5 1.7 1.3 1.1 0.9 5 4 2 3 0.6 0.2 pin 1 index 1 0.40 0.25 0.95 0.26 0.10 1.9 Dimensions in mm 04-11-08 Fig 13. Package outline SOT457 (SC-74) BCM847BV_BS_DS_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 28 August 2009 8 of 15 BCM847BV/BS/DS NXP Semiconductors NPN/NPN matched double transistors 10. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 4000 8000 10000 BCM847BV BCM847BS BCM847DS SOT666 SOT363 SOT457 2 mm pitch, 8 mm tape and reel - - -315 - 4 mm pitch, 8 mm tape and reel - -115 - - 4 mm pitch, 8 mm tape and reel; T1 [2] -115 - - -135 4 mm pitch, 8 mm tape and reel; T2 [3] -125 - - -165 4 mm pitch, 8 mm tape and reel; T1 [2] -115 - - -135 4 mm pitch, 8 mm tape and reel; T2 [3] -125 - - -165 [1] For further information and the availability of packing methods, see Section 14. [2] T1: normal taping [3] T2: reverse taping BCM847BV_BS_DS_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 28 August 2009 9 of 15 BCM847BV/BS/DS NXP Semiconductors NPN/NPN matched double transistors 11. Soldering 2.75 2.45 2.1 1.6 solder lands 0.4 (6×) 0.25 (2×) 0.538 2 1.7 1.075 0.3 (2×) placement area 0.55 (2×) solder paste occupied area 0.325 0.375 (4×) (4×) Dimensions in mm 1.7 0.45 (4×) 0.6 (2×) 0.5 (4×) 0.65 (2×) sot666_fr Reflow soldering is the only recommended soldering method. Fig 14. Reflow soldering footprint SOT666 2.65 solder lands 2.35 1.5 0.4 (2×) 0.6 0.5 (4×) (4×) solder resist solder paste 0.5 (4×) 0.6 (2×) 0.6 (4×) occupied area Dimensions in mm 1.8 sot363_fr Fig 15. Reflow soldering footprint SOT363 (SC-88) BCM847BV_BS_DS_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 28 August 2009 10 of 15 BCM847BV/BS/DS NXP Semiconductors NPN/NPN matched double transistors 1.5 solder lands 0.3 2.5 4.5 solder resist occupied area 1.5 Dimensions in mm 1.3 preferred transport direction during soldering 1.3 2.45 5.3 sot363_fw Fig 16. Wave soldering footprint SOT363 (SC-88) 3.45 1.95 solder lands 0.95 solder resist 0.45 0.55 3.30 2.825 occupied area solder paste 1.60 1.70 3.10 3.20 msc422 Dimensions in mm Fig 17. Reflow soldering footprint SOT457 (SC-74) BCM847BV_BS_DS_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 28 August 2009 11 of 15 BCM847BV/BS/DS NXP Semiconductors NPN/NPN matched double transistors 5.30 solder lands 5.05 0.45 1.45 4.45 solder resist occupied area 1.40 msc423 4.30 Dimensions in mm Fig 18. Wave soldering footprint SOT457 (SC-74) BCM847BV_BS_DS_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 28 August 2009 12 of 15 BCM847BV/BS/DS NXP Semiconductors NPN/NPN matched double transistors 12. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes BCM847BV_BS_DS_6 20090828 Product data sheet - BCM847BV_BS_DS_5 Modifications: • This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • • • • • Figure 12 “Package outline SOT363 (SC-88)”: updated Figure 14 “Reflow soldering footprint SOT666”: updated Figure 15 “Reflow soldering footprint SOT363 (SC-88)”: updated Figure 16 “Wave soldering footprint SOT363 (SC-88)”: updated Figure 18 “Wave soldering footprint SOT457 (SC-74)”: updated BCM847BV_BS_DS_5 20060627 Product data sheet - BCM847BS_DS_4 BCM847BS_DS_4 20060216 Product data sheet - BCM847BS_DS_3 BCM847BS_DS_3 20060123 Product data sheet - BCM847BS_2 BCM847BS_2 20050406 Product data sheet - BCM847BS_1 BCM847BS_1 20040914 Product data sheet - - BCM847BV_BS_DS_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 28 August 2009 13 of 15 BCM847BV/BS/DS NXP Semiconductors NPN/NPN matched double transistors 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 13.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BCM847BV_BS_DS_6 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 06 — 28 August 2009 14 of 15 BCM847BV/BS/DS NXP Semiconductors NPN/NPN matched double transistors 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Packing information. . . . . . . . . . . . . . . . . . . . . . 9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 28 August 2009 Document identifier: BCM847BV_BS_DS_6