L11854 307 05E

3 Stack
Pulsed Laser Diode
L11854-307-05
Features
Radiant peak output power: >
=21 W
Peak emission wavelength: 905 nm
Emitting area size: 70 μm × 10 μm
Applications
Laser range finder
Security
Measuring instruments
Absolute maximum ratings (Top(c) = 25 ℃)
Symbol
Value
Unit
Forward current
Parameter
Ifp
10
A
Reverse voltage
Vr
6
V
Pulse duration
tw
100
ns
Duty ratio
DR
0.075
%
Operating Temperature
Top(c)
-40 to +85
℃
Storage temperature
Tstg
-40 to +100
℃
Electrical and optical characteristics (Top(c) = 25 ℃)
Parameter
Symbol
Conditions
Value
Typ.
21
Max.
—
Unit
Radiant peak output power
Φep
Min.
17
Peak emission wavelength
λp
895
905
915
Forward voltage
Vop
—
11
14
V
Spectral radiation half bandwidth
Δλ
—
6
10
nm
Rise time
Beam spread angle
Ifp = 7 A
W
nm
—
—
2
ns
Parallel
θ//
Ifp = 7 A
7
11
15
degree
Vertical
θ⊥
FWHM
18
23
28
degree
tr
Lasing threshold current
Ith
—
—
0.4
1
A
Emitting area
—
Value at designing
—
70 × 10
—
μm × μm
Note: General operating condition: pulse width tw = 50 ns, repetition frequency fr = 1 kHz
Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions.
Specifications are subject to change without notice. No patent rights are granted to any of the circuits described herein. ©2015 Hamamatsu Photonics K.K.
3 Stack Pulsed Laser Diode L11854-307-05
Figure 1: Radiant output power vs. Forward current (typ.)
35
25
20
15
10
5
0
2
4
6
8
10
(Ifp = 7 A, Top(c) = 25 ℃)
100
Relative radiant output power (%)
Radiant output power Φep (W)
30
0
Figure 2: Typical emission spectrum
(Top(c) = 25 ℃)
80
60
40
20
0
885
12
895
Forward current Ifp (A)
905
915
925
Wavelength (nm)
Figure 4: Dimensional outline (unit: mm)
Figure 3: Directivity (typ.)
(Ifp = 7 A, Top(c) = 25 ℃)
100
+0.01
5.6 - 0.05
2.4±0.1
0.2 MAX.
Parallel θ//
Glass window
1.0 MIN.
1.3±0.2
3.55±0.2
80
60
1.2±0.1
40
0.45±0.05
Lead
6.5±0.5
Vertical θ⊥
0.4 MAX.
Relative radiant output power (%)
4.4 MAX.
2.0±0.2
20
0.4
-20
-10
0
10
20
30
40
LD
Angle (degree)
0.4
-30
90°±2°
0
-40
1.0
Handling Precautions for L11854-307-05
1. Precautions for handling
The LD (laser diode) may be damaged or its performance may deteriorate
due to such factors as electrostatic discharge from the human body, surge
voltages from measurement equipment, leakage voltages from soldering
irons, and packing materials. As a countermeasure against static electricity,
the device, operator, work place and measuring jigs must all be set at the
same electric potential. In using LD, observe the following precautions:
∑To protect the device from static electricity charges which accumulate on
the operator or the operator's clothes, use a wrist strap etc. to ground the
operator's body via a high impedance resistor (1 MΩ).
∑A semiconductive sheet should be laid on both the work table and the
floor in the work area. When soldering, use an electrically grounded
soldering iron with an isolation resistance of more than 10 MΩ.
∑For containers for transportation and packing, use of antistatic material
(material that minimizes the generation of static change when rubbed
against or separated from itself or other similar materials).
2. Precautions for mounting
(1)Lead forming
To form the leads, hold the base of the leads securely and bend them so
that no force is applied to the package. Lead forming should be done
before soldering.
(2)Cutting off the leads
If leads are out when still at a high temperature, this may cause an
electrical discontinuity. Always cut off the leads when they are at room
temperature. Never cut off the leads immediately after they are soldered.
HAMAMATSU PHOTONICS K.K.
N.C. (no connection)
LD cathode
LD anode
(Case)
Handling Precautions for L11854-307-05
1. Precautions for handling
The LD (laser diode) may be damaged or its performance may deteriorate due to such factors as electrostatic discharge from the human body,
surge voltages from measurement equipment, leakage voltages from
soldering irons, and packing materials. As a countermeasure against
static electricity, the device, operator, work place and measuring jigs
must all be set at the same electric potential. In using LD, observe the
following precautions:
∑To protect the device from static electricity charges which accumulate
on the operator or the operator's clothes, use a wrist strap etc. to ground
the operator's body via a high impedance resistor (1 MΩ).
∑A semiconductive sheet should be laid on both the work table and the
floor in the work area. When soldering, use an electrically grounded
soldering iron with an isolation resistance of more than 10 MΩ.
∑For containers for transportation and packing, use of antistatic material
(material that minimizes the generation of static change when rubbed
against or separated from itself or other similar materials).
2. Precautions for mounting
(1)Lead forming
To form the leads, hold the base of the leads securely and bend them so
that no force is applied to the package. Lead forming should be done
before soldering.
(2)Cutting off the leads
If leads are out when still at a high temperature, this may cause an
electrical discontinuity. Always cut off the leads when they are at room
temperature. Never cut off the leads immediately after they are soldered.
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Cat. No. LPLD2017E03
Italy: Hamamatsu Photonics Italia S.r.l.: Strada della Moia, 1 int. 6, 20020 Arese, (Milano), Italy, Telephone: (39)02-93581733, Fax: (39)02-93581741, E-mail: [email protected]
China: Hamamatsu Photonics (China) Co., Ltd.: B1201 Jiaming Center, No.27 Dongsanhuan Beilu, Chaoyang District, Beijing 100020, China, Telephone: (86)10-6586-6006, Fax: (86)10-6586-2866, E-mail: [email protected] JUN. 2015 HPK