Si PIN photodiode S10993-02CT COB type, applicable to lead-free solder reflow The S10993-02CT is a Si PIN photodiode for visible to near infrared range and is compatible with lead-free solder reflow processes. The small and thin leadless package allows reducing the mount area on a printed circuit board. Features Applications COB type Optical switches t Small package: 3.1 × 1.8 × 0.8 mm Applicable to lead-free solder reflow Photosensitive area: 1.06 × 1.06 mm Structure Parameter Photosensitive area Package Seal material Specification 1.06 × 1.06 Glass epoxy Silicone resin Unit mm - Absolute maximum ratings Parameter Reverse voltage Operating temperature Storage temperature Reflow soldering conditions*2 Symbol VR max Topr Tstg Tsol Condition Ta=25 °C No dew condensation*1 No dew condensation*1 Value 10 -25 to +85 -40 to +100 Peak temperature 260 °C max., 2 times (see P.6) Unit V °C °C - *1: When there is a temperature difference between a product and the surrounding area in high humidity environment, dew condensation may occur on the product surface. Dew condensation on the product may cause deterioration in characteristics and reliability. *2: JEDEC level 2a Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the product within the absolute maximum ratings. Electrical and optical characteristics (Ta=25 °C) Parameter Spectral response range Peak sensitivity wavelength Photosensitivity Symbol λ λp S Short circuit current Dark current Isc ID Cutoff frequency fc Terminal capacitance Ct Condition λ=650 nm λ=λp 100 lx, 2856 K VR=2.5 V VR=2.5 V, λ=650 nm RL=50 Ω, -3 dB VR=2.5 V, f=1 MHz Min. 0.41 - Typ. 380 to 1100 960 0.46 0.6 1.2 0.02 Max. 1 5 10 - MHz - 6 12 pF www.hamamatsu.com Unit nm nm A/W μA nA 1 Si PIN photodiode S10993-02CT Spectral response Photosensitivity temperature characteristics (Typ. Ta=25 °C) 0.7 Temperature coefficient (%/°C) 0.6 Photosensitivity (A/W) QE=100% 0.5 0.4 0.3 0.2 0.1 0 200 400 600 800 1000 (Typ.) 1.5 1 0.5 0 -0.5 700 1200 800 900 1000 1100 Wavelength (nm) Wavelength (nm) KPINB0390EA KPINB0398EA Linearity Dark current vs. reverse voltage (Typ. 2856 K) 10 mA (Typ. Ta=25 °C) 1 nA 1 mA Dark current Short circuit current 100 pA 100 μA 10 μA 10 pA 1 pA 1 μA 100 nA 101 102 103 104 105 106 100 fA 0.01 0.1 1 10 100 Reverse voltage (V) Illuminance (lx) KPINB0397EA KPINB0391EA 2 Si PIN photodiode S10993-02CT Terminal capacitance vs. reverse voltage (Typ. Ta=25 °C, f=1 MHz) Terminal capacitance 100 pF 10 pF 1 pF 100 fF 0.1 1 10 100 Reverse voltage (V) KPINB0392EA Directivity (Typ. light: tungsten lamp) 20° 10° 0° 10° 20° 30° 30° 40° 40° 50° 50° 60° 60° 70° 70° X direction 80° 90° 100 Y direction 80 60 40 20 0 20 40 60 80 80° Y 90° 100 X Relative sensitivity (%) KPINB0399EA 3 Si PIN photodiode S10993-02CT Dimensional outline (unit: mm) 3.1 Photosensitive surface (0.25) (0.25) 1.2 0.6 (0.2) 0.2 Photosensitive surface 0.8 ± 0.2 1.8 Photosensitive area 1.06 × 1.06 1.2 1.75 0.6 Cathode Anode Tolerance unless otherwise noted: ± 0.1 Chip position accuracy with respect to package center X, Y≤±0.15 Electrode Index mark KPINA0118EA Recommended land pattern (unit: mm) 3.05 1.75 0.65 2.4 0.65 KPINC0022EA 4 Si PIN photodiode S10993-02CT Standard packing specifications Reel (conforms to JEITA ET-7200) Dimensions Hub diameter Tape width Material 180 mm 60 mm 8 mm PS Electrostatic characteristics Conductive Embossed tape (unit: mm, material: PS, conductive) 1.75 ± 0.1 4.0 ± 0.1 1.4 ± 0.1 0.2 ± 0.05 3.45 ± 0.1 3.5 ± 0.05 2.0 ± 0.05 8.0 ± 0.2 +0.1 ϕ1.5 - 0 ϕ1.1 ± 0.1 2.15 ± 0.1 Reel feed direction KPINC0023EA Packing quantity 3000 pcs/reel Packing type Reel and desiccant in moisture-proof packaging (vacuum-sealed) 5 Si PIN photodiode S10993-02CT Measured example of temperature profile with our hot-air reflow oven for product testing 300 °C 260 °C max. Temperature 230 °C 190 °C 170 °C Preheat 60 to 120 s Soldering 20 to 40 s Time KPINB0403EB ∙ This product supports lead-free soldering. After unpacking, store it in an environment at a temperature of 30 °C or less and a humidity of 60% or less, and perform soldering within 4 weeks. ∙ The effect that the product receives during reflow soldering varies depending on the circuit board and reflow oven that are used. Before actual reflow soldering, check for any problems by testing out the reflow soldering methods in advance. Precautions Do not touch the silicone resin surface. As the silicone resin is soft, applying external force to it can cause damage to the resin surface and cause short circuit or broken circuit due to wire deformation. Related information www.hamamatsu.com/sp/ssd/doc_en.html Precautions ∙ Disclaimer ∙ Surface mount type products Technical information ∙ Si photodiode / Application circuit examples Information described in this material is current as of September, 2015. Product specifications are subject to change without prior notice due to improvements or other reasons. This document has been carefully prepared and the information contained is believed to be accurate. In rare cases, however, there may be inaccuracies such as text errors. Before using these products, always contact us for the delivery specification sheet to check the latest specifications. The product warranty is valid for one year after delivery and is limited to product repair or replacement for defects discovered and reported to us within that one year period. However, even if within the warranty period we accept absolutely no liability for any loss caused by natural disasters or improper product use. Copying or reprinting the contents described in this material in whole or in part is prohibited without our prior permission. www.hamamatsu.com HAMAMATSU PHOTONICS K.K., Solid State Division 1126-1 Ichino-cho, Higashi-ku, Hamamatsu City, 435-8558 Japan, Telephone: (81) 53-434-3311, Fax: (81) 53-434-5184 U.S.A.: Hamamatsu Corporation: 360 Foothill Road, Bridgewater, N.J. 08807, U.S.A., Telephone: (1) 908-231-0960, Fax: (1) 908-231-1218 Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49) 8152-375-0, Fax: (49) 8152-265-8 France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: 33-(1) 69 53 71 00, Fax: 33-(1) 69 53 71 10 United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44) 1707-294888, Fax: (44) 1707-325777 North Europe: Hamamatsu Photonics Norden AB: Torshamnsgatan 35 16440 Kista, Sweden, Telephone: (46) 8-509-031-00, Fax: (46) 8-509-031-01 Italy: Hamamatsu Photonics Italia S.r.l.: Strada della Moia, 1 int. 6, 20020 Arese (Milano), Italy, Telephone: (39) 02-93581733, Fax: (39) 02-93581741 China: Hamamatsu Photonics (China) Co., Ltd.: B1201, Jiaming Center, No.27 Dongsanhuan Beilu, Chaoyang District, Beijing 100020, China, Telephone: (86) 10-6586-6006, Fax: (86) 10-6586-2866 Cat. No. KPIN1087E02 Sep. 2015 DN 6