s10993-02ct kpic0087e

Si PIN photodiode
S10993-02CT
COB type, applicable to lead-free solder reflow
The S10993-02CT is a Si PIN photodiode for visible to near infrared range and is compatible with lead-free solder reflow processes. The small and thin leadless package allows reducing the mount area on a printed circuit board.
Features
Applications
COB type
Optical switches
t
Small package: 3.1 × 1.8 × 0.8 mm
Applicable to lead-free solder reflow
Photosensitive area: 1.06 × 1.06 mm
Structure
Parameter
Photosensitive area
Package
Seal material
Specification
1.06 × 1.06
Glass epoxy
Silicone resin
Unit
mm
-
Absolute maximum ratings
Parameter
Reverse voltage
Operating temperature
Storage temperature
Reflow soldering conditions*2
Symbol
VR max
Topr
Tstg
Tsol
Condition
Ta=25 °C
No dew condensation*1
No dew condensation*1
Value
10
-25 to +85
-40 to +100
Peak temperature 260 °C max., 2 times (see P.6)
Unit
V
°C
°C
-
*1: When there is a temperature difference between a product and the surrounding area in high humidity environment, dew
condensation may occur on the product surface. Dew condensation on the product may cause deterioration in characteristics and
reliability.
*2: JEDEC level 2a
Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the
product within the absolute maximum ratings.
Electrical and optical characteristics (Ta=25 °C)
Parameter
Spectral response range
Peak sensitivity wavelength
Photosensitivity
Symbol
λ
λp
S
Short circuit current
Dark current
Isc
ID
Cutoff frequency
fc
Terminal capacitance
Ct
Condition
λ=650 nm
λ=λp
100 lx, 2856 K
VR=2.5 V
VR=2.5 V, λ=650 nm
RL=50 Ω, -3 dB
VR=2.5 V, f=1 MHz
Min.
0.41
-
Typ.
380 to 1100
960
0.46
0.6
1.2
0.02
Max.
1
5
10
-
MHz
-
6
12
pF
www.hamamatsu.com
Unit
nm
nm
A/W
μA
nA
1
Si PIN photodiode
S10993-02CT
Spectral response
Photosensitivity temperature characteristics
(Typ. Ta=25 °C)
0.7
Temperature coefficient (%/°C)
0.6
Photosensitivity (A/W)
QE=100%
0.5
0.4
0.3
0.2
0.1
0
200
400
600
800
1000
(Typ.)
1.5
1
0.5
0
-0.5
700
1200
800
900
1000
1100
Wavelength (nm)
Wavelength (nm)
KPINB0390EA
KPINB0398EA
Linearity
Dark current vs. reverse voltage
(Typ. 2856 K)
10 mA
(Typ. Ta=25 °C)
1 nA
1 mA
Dark current
Short circuit current
100 pA
100 μA
10 μA
10 pA
1 pA
1 μA
100 nA
101
102
103
104
105
106
100 fA
0.01
0.1
1
10
100
Reverse voltage (V)
Illuminance (lx)
KPINB0397EA
KPINB0391EA
2
Si PIN photodiode
S10993-02CT
Terminal capacitance vs. reverse voltage
(Typ. Ta=25 °C, f=1 MHz)
Terminal capacitance
100 pF
10 pF
1 pF
100 fF
0.1
1
10
100
Reverse voltage (V)
KPINB0392EA
Directivity
(Typ. light: tungsten lamp)
20°
10°
0°
10°
20°
30°
30°
40°
40°
50°
50°
60°
60°
70°
70°
X direction
80°
90°
100
Y direction
80
60
40
20
0
20
40
60
80
80°
Y
90°
100
X
Relative sensitivity (%)
KPINB0399EA
3
Si PIN photodiode
S10993-02CT
Dimensional outline (unit: mm)
3.1
Photosensitive
surface
(0.25)
(0.25)
1.2
0.6
(0.2)
0.2
Photosensitive surface
0.8 ± 0.2
1.8
Photosensitive area
1.06 × 1.06
1.2
1.75
0.6
Cathode
Anode
Tolerance unless otherwise noted: ± 0.1
Chip position accuracy with respect to package center
X, Y≤±0.15
Electrode
Index mark
KPINA0118EA
Recommended land pattern (unit: mm)
3.05
1.75
0.65
2.4
0.65
KPINC0022EA
4
Si PIN photodiode
S10993-02CT
Standard packing specifications
Reel (conforms to JEITA ET-7200)
Dimensions
Hub diameter
Tape width
Material
180 mm
60 mm
8 mm
PS
Electrostatic
characteristics
Conductive
Embossed tape (unit: mm, material: PS, conductive)
1.75 ± 0.1
4.0 ± 0.1
1.4 ± 0.1
0.2 ± 0.05
3.45 ± 0.1
3.5 ± 0.05
2.0 ± 0.05
8.0 ± 0.2
+0.1
ϕ1.5 - 0
ϕ1.1 ± 0.1
2.15 ± 0.1
Reel feed direction
KPINC0023EA
Packing quantity
3000 pcs/reel
Packing type
Reel and desiccant in moisture-proof packaging (vacuum-sealed)
5
Si PIN photodiode
S10993-02CT
Measured example of temperature profile with our hot-air reflow oven for product testing
300 °C
260 °C max.
Temperature
230 °C
190 °C
170 °C
Preheat
60 to 120 s
Soldering
20 to 40 s
Time
KPINB0403EB
∙ This product supports lead-free soldering. After unpacking, store it in an environment at a temperature of 30 °C or less and a
humidity of 60% or less, and perform soldering within 4 weeks.
∙ The effect that the product receives during reflow soldering varies depending on the circuit board and reflow oven that are used.
Before actual reflow soldering, check for any problems by testing out the reflow soldering methods in advance.
Precautions
Do not touch the silicone resin surface. As the silicone resin is soft, applying external force to it can cause damage to the resin
surface and cause short circuit or broken circuit due to wire deformation.
Related information
www.hamamatsu.com/sp/ssd/doc_en.html
Precautions
∙ Disclaimer
∙ Surface mount type products
Technical information
∙ Si photodiode / Application circuit examples
Information described in this material is current as of September, 2015.
Product specifications are subject to change without prior notice due to improvements or other reasons. This document has been carefully prepared and the
information contained is believed to be accurate. In rare cases, however, there may be inaccuracies such as text errors. Before using these products, always
contact us for the delivery specification sheet to check the latest specifications.
The product warranty is valid for one year after delivery and is limited to product repair or replacement for defects discovered and reported to us within that
one year period. However, even if within the warranty period we accept absolutely no liability for any loss caused by natural disasters or improper product use.
Copying or reprinting the contents described in this material in whole or in part is prohibited without our prior permission.
www.hamamatsu.com
HAMAMATSU PHOTONICS K.K., Solid State Division
1126-1 Ichino-cho, Higashi-ku, Hamamatsu City, 435-8558 Japan, Telephone: (81) 53-434-3311, Fax: (81) 53-434-5184
U.S.A.: Hamamatsu Corporation: 360 Foothill Road, Bridgewater, N.J. 08807, U.S.A., Telephone: (1) 908-231-0960, Fax: (1) 908-231-1218
Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49) 8152-375-0, Fax: (49) 8152-265-8
France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: 33-(1) 69 53 71 00, Fax: 33-(1) 69 53 71 10
United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44) 1707-294888, Fax: (44) 1707-325777
North Europe: Hamamatsu Photonics Norden AB: Torshamnsgatan 35 16440 Kista, Sweden, Telephone: (46) 8-509-031-00, Fax: (46) 8-509-031-01
Italy: Hamamatsu Photonics Italia S.r.l.: Strada della Moia, 1 int. 6, 20020 Arese (Milano), Italy, Telephone: (39) 02-93581733, Fax: (39) 02-93581741
China: Hamamatsu Photonics (China) Co., Ltd.: B1201, Jiaming Center, No.27 Dongsanhuan Beilu, Chaoyang District, Beijing 100020, China, Telephone: (86) 10-6586-6006, Fax: (86) 10-6586-2866
Cat. No. KPIN1087E02 Sep. 2015 DN
6