2016 Computer On Modules

Computer On Modules
Pioneering Technology and Design-in Service 3.0
Deliver Fast Time-to-Market
COM Express® Basic
COM Express® Compact
COM Express® Mini
Qseven
ETX
COM Design-in Services 3.0
COM.advantech.com
About Advantech and COM
Founded in 1983, Advantech is a leader in providing trusted innovative embedded solutions. Advantech offers comprehensive system
integration, hardware, software, customer-centric design services, and global logistics support; all backed by industry-leading front and
back office e-business solutions. We cooperate closely with our partners to help provide complete solutions for a wide array of applications
across a diverse range of industries. Advantech has always been an innovator in the development and manufacturing of high-quality, highperformance computing platforms, and our mission is to empower these innovations by offering trustworthy ePlatform products and
services.
As a smart system integrator, knowing how to differentiate applications with faster solutions is the most important point. In a dynamic
market, technical specifications keep changing. However, Computer On Modules can help you to reduce the time and work involved with
designing new carrier boards. Advantech seamlessly supports you in handling the complexities of technical research at each development
stage, which greatly minimizes development times. Advantech keeps developing innovative COM Design-in Service and provides scalable
reliable Computer On Modules. When we stand by you, you can concentrate on your core competence.
With Advantech, there is no limit to the applications and innovations our products make possible.
For more information, visit: COM.advantech.com
2
Computer-On-Module Introduction
Computer-On-Module, or COM, is a highly integrated board with CPU, chipset, memory, and peripherals designed into a component
module. COM requires a carrier board to power up and provide expansion interfaces and I/O for use. Since the COM architecture provides
various standard specifications in different form factors and pin-out types, it not only gives OEM customers flexibility to choose a suitable
solution for their applications but also saves development time. The COM standard includes COM Express®, ETX and Qseven, providing
a wide variety of interfaces like PCI Express, SATA, IDE, USB, DDI, etc. These standards cover electrical and mechanical compatibilities for
easy replacement or upgrade, regardless of the mechanical and thermal design. As a result, COM is one of the most popular choices for
customers to design their application-specific solutions.
Time-to-Market:
• Modularized design concept speeds up product development
• Immediate assistance for carrier board design
Focused Resource Allocation:
• Resources focused on carrier board design for key applications
COM Introduction
Key Benefits of COM
Easy Migration:
• Modularized thermal solution
• Unified electrical, mechanical properties, and software utilities
Secured Core Knowledge:
• Customer keeps domain know-how on their own carrier board
COM Express®
COM Express® is becoming the most popular COM specification due to the latest expansion interfaces and I/O, generating various
pin-out types and three different form-factors. COM customers benefit from its flexibility and easy learning curve to serve a variety of
applications. COM Express® provides not only high-speed interfaces like HDMI/DisplayPort, PCI Express, SATA and USB 3.0 for volume
data transportation, but also LVDS, VGA and LPC for legacy applications. COM Express® defines 3 dimensions: - 125 x 95mm, 95 x 95mm,
and 84 x 55mm - suitable from high performance, to low power designs. It also defines the PCB thickness to 2mm, onboard component
height to less than 8 mm, and the total height from the bottom surface of the PCB module to the standard equipped heat-spreader top
surface is 13mm. COM Express® allows a wide-range of input power voltages in a specific form factor, which makes it more suitable for
mobile, and battery-powered environments.
Form Factor
COM Express® defines 3 different form factors:
COM Express® Basic
Full feature sets with extreme
performance platforms for
high-demand applications.
125 X 95mm
COM Express® Compact
Compact form factor sets with good
balance of performance and features
for embedded systems
95 X 95mm
COM Express® Mini
Small PCB size with all components
onboard for compact, robust devices in
harsh environments.
84 X 55mm
3
Computer-On-Module Introduction
Functionality
In the COM Express® R2.1 standard, there are 4 popular pin-out types that provide various features, and apply to different customer
expansion or I/O requirements.
Function / Interface
Display Interface
Expansion Interface
I/O
System
Management
Power
Form Factor
4
Type 1
Type 2
Type 6
Type 10
VGA Port
1
1
1
-
LVDS Channel A
1
1
1
1
LVDS Channel B
1
1
1
-
eDP (Muxed LVDS Channel A)
-
-
1
1
DDI (HDMI/DVI/DP)
-
-
3
1
SDVO (Muxed PEG Port)
-
2
-
-
PCI Express x16 (PEG Port)
-
1
1
-
PCI Express x1
6
6
8
4
PCI Bus - 32 Bit
-
1
-
-
AC’97 / HD Audio I/F
1
1
1
1
LPC Bus
1
1
1
1
Gigabit LAN
1
1
1
1
SATA / SAS Ports
4
4
4
2
PATA Channel
-
1
-
-
USB 3.0 Ports
-
-
4
2
USB 2.0 Ports
8
8
8
8
USB Client
1
1
1
1
SDIO
-
-
1
1
Serial Ports
-
-
2
2
General Purpose I/O
8
8
8
8
SPI Bus
2
2
2
2
SMBus
1
1
1
1
I2C
1
1
1
1
Watchdog Trigger Output
1
1
1
1
Express Card Support
2
2
2
2
Fan Control/Speed Detection
-
-
2
2
12V
12V
12V
4.75 - 20V
All
All
All
All
Supply Voltage
Qseven
Qseven is built with a 70 x 70mm or 70 x 40mm form factor, 1.2 mm thick PCB, 5-volt power input, power consumption limited to below
12W, and limited overall height to approximately 9.2mm from the bottom surface of module PCB to top surface of heat-spreader.
These mechanical and power specifications make Qseven suitable for small form-factor, mobile or battery target applications. Qseven
uses MXM as a board-to-board connector which is easily obtained and cost effective, along with proven high speed integration for PCI
Express. This small module provides digital display interfaces including LVDS/eDP, HDMI/DisplayPort, expansion interface PCI Express x1,
and I/O like Gigabit Ethernet, SATA, and USB3.0/2.0, etc. For size-crucial designs, Qseven provides the necessary functionality to minimize
design effort for limited spaces.
Form Factor
Maximum
Configuration
Function / Interface
Expansion I/F
I/O
System
Management
Dual Channel 24-bit / 2 Ports
1
4
1
1
1
2
2
8
8-bit
1
2 (x4, x2)
1
1
1
1
1
1
40mm
LVDS/eDP
HDMI/DP/DVI(TMDS)
PCI Express x1
HD Audio/AC’97/I2S
LPC
Gigabit Ethernet
SATA
USB3.0
USB2.0
SDIO
UART
MIPI-CSI2
SPI Bus
SMBus
I2C Bus
CAN Bus
Watchdog Trigger
Fan Control
Display I/F
COM Introduction
Functionality
ETX
ETX is widely used in many industrial markets like automation, medical, networking, and transportation. It has a compact size of 114 x 95
mm, which makes it easy for customers to integrate, and provides legacy interfaces such as PCI, ISA, IDE, TTL/LVDS and LAN for vertical
application continuity. ETX board-to-board connectivity is robust enough for rugged conditions and only requires 5V input voltage, for
easy system design. These features make ETX a widely adopted platform in many crucial, legacy-interface type applications.
Functionality
Connector
Location
X1
X2
X3
Form Factor
Interfaces
Description
PCI
USB2.0
Audio
ISA
VGA
TTL/LVDS
TV-out
32-bit 4 Masters
4 Ports
Line-in, Line-out, MIC
16-bit data width, 16-bit I/O address
R, G, B
TTL: 18-bit, LVDS: 2 channel 24-bit
CVBS or S-Video
RS-232, RS-422, or RS-485 depends on
carrier board design
Keyboard, Mouse
Serial Port
PS/2
IRDA
LPT/FDD
X4
Onboard
IDE
LAN
SMBus
I2C Bus
GPE/GPIO
WDTOUT
SATA
Multi-function pin selected in BIOS or boot
up strapping
2 Channel, up to 4 devices
10/100 Mbps
2-bit
Watchdog trigger output
2 Ports
5
COM Design-in Services 3.0
Advantech COM Design-in Services covers all your questions from the design-in process to volume production, with product
lifecycle management. We act as your in-house engineer as well as your personal consultant. Customers benefit from easy selection
of modules, accessories and software, all backed up by our expert-integrated team. We transform complex COM development into
easy tasks so our customers can better meet new market challenges. COM Design-in Service 1.0 was focused on timely response
to customers’ issues. Services 2.0 offered proactive services with pre-validated technology to ensure project success and life cycle
management. Now, Services 3.0 not only include 6 phases of design-in process but also add 4 customization services for our
customers to develop various applications.
Design-in Service for
Standard Products
2 Design
1 Planning
Schematic Review
Placement & Layout Review
Documents & IP Library
Technical Feasibility Study
Proposal Consulting
Li f
ec
yc
le M
SI Test
Board
6 End of Life
ana
ge
men
t
Debugging
Card
Product Change Notice
Last Time Buy & Shipment
Product Migration Proposal
Fully Customization Services
Extension
Board
BIOS &EC Customization
Riser
Card
3 Validation
Issue Debugging
BIOS Customization
COM
Design-in Services
25
For
5 Production
Assured Quality Control
Ramp-Up Management
Global Logistics & RMA
Watts
15 mm
45 mm
4 Integration
Software Customization
Thermal Solution
Peripheral Consultation
Design-in Service for Standard Products
Phase 1: Planning │ Deliver project proposal
SOM-5894FG-U4A1E
SOM-5892FG-U3A1E
SOM-5892FG-U1A1E
SOM-5892FG-U5A1E
SOM-5892FG-S7A1E
SOM-5892FG-U7A1E
SOM-5892FG-U4A1E
SOM-5892FG-S6A1E
SOM-5892FG-U2A1E
SOM-5892FG-S4A1E
SOM-5892FG-S5A1E
SOM-5890FG-U1A1E
SOM-5890FG-U2A1E
SOM-5890FG-S5A1E
SOM-5890FG-U5A1E
SOM-5890FG-U0A1E
SOM-5890FG-S3A1E
SOM-5890FG-S6A1E
SOM-5890FG-S1A1E
SOM-5890FG-S4A1E
SOM-5788FG-U5A1E
SOM-5788FG-U0A1E
SOM-5788FG-S3A1E
SOM-5788FG-S1A1E
SOM-5788FG-U4A1E
SOM-5788FG-U1A1E
SOM-5788FG-S9A1E
SOM-5788FG-S0A1E
Performance-Sandra 2009 CPU Benchmark
6
Consulting Services
During our client's planning phase, Advantech’s integrated COM expert team
provides various hardware and software suggestions for potential issues that our
clients might face, such as technical specifications and schedules.
• Technical feasibility study
• Off-the-shelf or customized product selection
• Hardware & software proposal
• Performance & power consumption comparison
• Product selection guide
• Evaluation board
Phase 2: Design │Schematic review and design document
Design Documents
Advantech provides plenty of product-related information and services for
designing carrier boards, such as design check lists and mechanical drawings. For
details, please visit the “Download” page of the COM design support website at
Http://com.advantech.com
3D Board Model
Expert-Integrated COM Design-in Services
• Schematic & layout checklist
• User’s manual
• Application note
• 2D/3D mechanical model
Schematic Checklist
IP Library
Advantech provides itsclients with a hardware design library for choosing features such as dual LVDS, TV-out solutions, second Super
I/O, and smart battery. Our client reference library makes it simple to implement features on carrier boards, saving overall design and
verification efforts.
Review Service
Schematic Check
Advantech design assistance is a review service based on our clients’ carrier board schematic
for COM module functions. This service helps to catch design errors before they happen.
Placement/Layout Check
After the schematic review, Advantech provides a placement & layout review on our clients’
carrier boards, with respect to COM module related functions. These reviews provide
suggestions for improving signal quality and anticipate possible mechanical conflicts.
Phase 3: Validation │Troubleshooting and risk management
Debugging, Verification and Feasibility Testing
Advantech strives to deal with customers' carrier board design issues even when it cannot be there. We not only have
a dedicated FAE and engineering team to help customers debug, but also provide a sequential debugging SOP and
various debug cards for customers to implement self analysis.
Dedicated FAE & engineering team
• Phenomenon duplication
• Analysis and verification
• Solutions and suggestions
Customer self-analysis/debugging tools
• Sequential debugging SOP
• Debug cards
Debug Card
7
COM Design-in Services 3.0
Phase 4: Integration │Custom software and thermal solution
Wide Temperature Design for Extreme Environments
Customer applications that operate in harsh environments require high-reliability system designs to sustain normal functions.
Particularly in industrial automation, transportation, and medical environments, systems are often exposed to extreme conditions;
extreme temperatures, humidity, dust, etc., that may hamper bottom-line
business success. With that in mind, Advantech provides wide temperature
solutions with a range of -20 °C to +80 °C and -40 °C to +85 °C for highly
demanding industrial applications. These wide temperature solutions can
be used by all the Advantech COM products.
Thermal Solutions:
• Two-part thermal solution for standard products
• One-part thermal solution (DHCS) for high TDP products
• Customized thermal solution
Phase 5: Production│Assured product quality & delivery
From initial design concept to final production, Advantech helps its customers take full control of quality management. In the first
stage, our “Design Quality Assurance” process ensures that New Product Introduction (NPI) is fully understood and executed by our
project team before moving to the next stage. The second stage involves Advantech’s core competence of product mass production.
The final stage “Customer Quality Control”
guarantees product satisfaction after delivery. “Time
to value” weighs in our customers’ requirements.
As an international company with global presence,
Advantech offers direct shipment from our
manufacturing factories to our customers’ designated
locations. As a trusted consultant and partner,
Advantech’s global customer care services help save
our customers’ time and resources.
Phase 6: EOL & Migration
The market is ever changing, making today’s innovative product
obsolete over time. Advantech’s experienced consulting team is
able to give market insights to help our customers make the right
decisions. When a product comes into the End-Of-Life (EOL) stage,
we offer the following services:
Product change notice
Last-time buy & last shipment
Product migration proposal
8
Full Customization Services
Why do you need COM Customization Services
Expert-Integrated COM Design-in Services
In addition to its strong design-in ability for standard COM products, Advantech has released its advanced customized service, called
COM Design-in Service 3.0, in order to take care of more vertically-focused markets. With this advanced customized service, customers
save time and costs on design and production of COM modules or carrier boards; they are able to focus on developing their core
businesses to meet new market challenges.
Benefits of COM Customization Services
Advantech is experienced in product design and project management; we clearly understand the needs and expectations of our
customers. With the new, comprehensive COM customization services, customers can save 50% of their development schedule
time, 20% on production cost, and 30% on their workforce, all of which ensure that customers meet time-to-market expectations.
COM customization services provide flexible integration including COM module customization, carrier board design and
production, semi-system integration services, and manufacturing service. The four key solutions benefit our customers with faster
time-to-market. Without wasting time on collecting resources and stock management, customers can focus on their own products
and businesses.
Ensuring Design Quality
Our COM Design-in Services team has long experience working with customers in integrating their proprietary-designed carrier
boards with particular features, and ensuring design quality right at the development phase. Since ensuring design quality is
critical, COM customization services provide a complete signal and power integrity service for customer-designed carrier boards.
Faster Time-to-Market Integration Capability
Simulation Design
Our thermal design team can optimize system size, power
consumption, and noise and vibration to extend product
longevity. The design team utilizes the Computer Aided Design
tool Flotherm to simulate and analyze hot-spots and air flow
conditions. This provides a scientifically based scheme optimum
thermal solution before the system is physically built or tooled.
Thermal Testing
IR analysis monitors a variety of processors and chipsets for
significantly different heat loads across time. Takes the biggest
value as the result and follows strain limits from Intel® BFI report
450 & 500 micro strain. Process included in heatsink module and
assembly PCBA.
Highly Effective Production System
To ensure products meet customers’ requirements and budget, we specialize in project management to deliver cost-effective
manufacturing services on time and within budget.
Design
Integration
Production
9
COM Design-in Services 3.0
Four Key Solutions for Customization Service
10
COM Module Customization Service
Semi-system Integration Service
As an industry leader, Advantech has provided a wide
range of COM modules and design-In services to
customers for years. To service more vertically-focused
markets and respond various requirements, we also
provide customized COM service for our customers to
develop multiple applications easily.
Most customers face the problem of LCD, storage device, and
Wi-Fi module integration. We provide component integration
services including resource matching and integration testing
that can help customers to adapt and certify devices with
longevity support.
Services include:
• Advantech proven design IPs
• Design and project management • Prototype validation
• Strict revision controls
Services include:
• Validating LCD, storage with longevity support
• Certifying Wi-Fi, 3G, and Bluetooth modules
• Assembling devices on carrier board and performance testing
Carrier Board Design and Production Services
Manufacturing Service
COM customized service provides customers with comprehensive
carrier board solutions, either designing a customized carrier
board (ODM) based on the customer’s needs, or providing a costeffective carrier board (OEM) production service. With our help on
designing and producing carrier boards, customers can focus on
developing their core businesses.
Advantech has great production capacity and is able to
leverage resource deployment as well as maintenance.
With our advantages and experience in manufacture, we
deliver cost-effective manufacturing services on time and
within budget.
Services include:
• Longevity component support
• SI, PWR, QE+QA testing of module + carrier board • Accessory integration and assembly
• Module + carrier board functionality testing Services include:
• Highly effective production system
• Flexible, high temperature, burn-in testing service
• Advanced testing and inspection
• Shop-Flow control system
• Certified quality assurance systems
Advanced Technologies
High Efficiency Thermal Solution-Dynamic Heat Conduction System (DHCS)
Advantech Innovative Thermal Solution - 20 °C Decrease
The Dynamic Heat Conduction System is an innovative technology that benefits high-computing power SOM series products. It resolves
mechanical tolerance issues and makes a tight CPU to heatsink contact, while preventing board bending and CPU damage. It offers
significant heat dissipation efficiency for high-power CPUs. More effective than traditional thermal modules, DHCS provides more than
20 °C temperature drop.
Embedded Software Services
Key features:
• Mates 100% with CPU for better heat transfer performance
• Automatic CPU pressure adjustment keeps board flat
• Standard screws keep assembly tight, even under vibration
• Thin and compact design for space-limited systems
11
Advanced Technologies
Intelligent Self-Management - iManager
To fulfill the ever-changing yet specialized demands of industrial applications,
Advantech has designed an intelligent self-management tool with software
control functions implemented in hardware. iManager is a built-in chip solution
that provides a standardized API that integrates several unique platform
consolidating functions that are needed by embedded system integrators to help
improve consistency, lighten the development effort, and speed-up a product’s
time-to-market.
Key Benefits
OS-Independent
Self-Management
Cross-Platform Programming
Intelligent Resource Management
Operates independent of any OS. iManager
2.0 runs automatically without depending on
any operating system; it increases stability for
managing platform resources.
Fan speed auto adjusts based on temperature,
with multi-control interfaces for peripheral
devices. System health inspection includes
real-time monitoring of fan speed, temperature
sensors, voltages, etc.
Real-Time Response
Instant reaction for real-time status monitoring.
iManager 2.0 source code is a built-in, onboard
embedded controller, providing faster response
time for processing hardware control and
interrupts.
Auto-protection & System Restore
Platformy
Securit
*****
Plug & Play
Power on and run without any driver installation.
iManager 2.0 works well without any software
installed, easing the deployment process for
developers.
Multi-level failover protection quickly puts
systems back in service. CPU Throttling feature
automatically reduces clock frequency to lower
temperature, protecting the CPU from physical
damage and preventing data processing errors.
Security Enhancement
Boot information and data both securely
protected.
iManager Function Set
Advanced Watchdog
Multi-level
Programmable
Unified S/W API/ Utility
Smart Fan
Smart battery
Brightness Control
Control LCD levels
Hardware Monitoring
Voltage
Temperature
Fan speed
Data Security Area
64 Bytes for customer data
8 Byte key
Board Information
Boot record
Running hours
Board data
Power Saving
Multi-control Interface
I2C
GPIO
SMBus
Deep sleep
12
Remote Monitoring and Management - WISE-PaaS/RMM
WISE-PaaS/RMM for Remote Device Management
WISE-PaaS/RMM is a value-added intelligent management agent which transforms traditional embedded systems into intelligent
systems, helping shape new business models and opportunities in COM development. Key benefits of WISE-PaaS/RMM consists of
efficient remote monitoring, quick recovery & backup, and real-time remote configuration.
Key Benefits
Embedded Software Services
Embedded OS
Windows Embedded
We offer a ready-to-use embedded OS image that provides a complete set of components for rapid proto-typing
and application development.
• Windows 7 Pro/ Ult for Embedded System, Windows embedded 8/8.1 Pro, Windows 10 IoT Enterprise LTSB
• XP Embedded, Windows Embedded Standard 2009, 7, and Windows Embedded 8 Standard
• Windows Embedded POSReady 2009,7, Windows Embedded 8/8.1 Industry Pro for Retail, and Win10 IoT Enterprise LTSB for Retail
• Windows CE4.2,5.0, 6.0, and Windows Embedded Compact 7 and 2013
Linux
Linux OS is popular in the embedded market, and the fast growth of IoT is accelerating the move toward open source Linux.
Advantech works with a wide range of Linux partners for integration services.
Android
Android gives you everything you need to build best-in-class app experiences. It gives you a single application model that lets you
deploy your apps broadly to hundreds of millions of users across a wide range of devices—from phones to tablets and beyond.
Wind River VxWorks
VxWorks provides you with the functionality and support you require to stay competitive. And as your platform plans evolve to take
advantage of next-generation processor capabilities, we continue to stay ahead of the technology curve, continually expanding
VxWorks’ proficiency to extract maximum performance from the new multi-core landscape.
QNX
The QNXR NeutrinoR RTOS is a full-featured and robust OS that scales down to meet the constrained resource requirements
of realtime embedded systems. Its true microkernel design and its modular architecture enable customers to create highly
optimized and reliable systems with low total cost of ownership.
13
Application Stories
New Thermal Solution Enhances Performance in Harsh Environments
Introduction
Test equipment requires precision and high reliability, and is used
widely in demanding industries such as medical, aerospace and
transportation. Usually these delicate systems are designed with highend processors that support extreme performance and collect exact
test data. Since they require high computing ability in often harsh
environments, thermal solution efficiency is an important factor for
extreme performance.
Application Requirements and Challenges
Test equipment can consist of a simple computer like a tablet or portable device, or of a complicated system with a bundle of built in
test instruments. A flexible configuration was required to meet wide testing device applications for different industries. These devices
needed to provide real-time signal measurements, with quick, reliable data transmission to the backend system for rapid analysis. SOM5894 with i7-4700EQ is a 47W CPU module which provided perfect computing performance; it was deemed very suitable for this highend test device. In this case, however, system space was very limited, and heat could only be transfered through a short, air-flow heat
sink. So the customer focused on heat conduction efficiency, the crucial factor in high CPU performance. The customer's intent was to
adopt their ultimate thermal solution into different systems that could easily be migrated to new generations. Because of this multipurpose approach, there were some special challenges:
1. Top computing performance required effective heat dissipation
2. Traditional thermal modules are simple and stable, but the heat conduction path is too long
3. Ideal thermal solution should be reliable, with easy assembly and applicable to different system spaces,
even portable test devices
Advantech Solution and Benefits
The new Dynamic Heat Conduction System (DHCS) thermal module was deemed suitable for this high end test equipment, especially
considering that it is powered by a high TDP CPU. The DHCS resolved the customer’s problems without design change, and did not
require any extra assembly processes. Benefits included:
1. High CPU performance: Because we shortened the heat flow path, the DHCS could conduct heat quickly from the CPU, to the heat
sink, and then into the air. CPU could run at max without throttling.
2. No vibration issue for portable devices. Since DHCS uses normal screws for assembly,
there is no loosening issue if the device is moved about in most application scenarios.
3. Easy execution: DCHS is compatible with traditional thermal solutions, so assembly is easy, and does not require any extra fixtures
to attach it to products. Besides, DCHS was thin enough to comply with the customer’s chassis, and also suitable for a wide range
of test equipment. The customer plans to use the DHCS in most of their products in the future.
4. Value-added service: If the customer requires it, Advantech can also provide the COM and thermal module pre-assembly service
without design change. This can reduce the customer’s working time in adopting SOM-5894 plus heat spreader.
Heat Spreader
Keep Tight Assembly
DHCS
Deliver High Heat
Transfer Performance
14
COM Express Mini Module Enables Locomotive Remote Monitoring and Diagnostic System
Introduction
Application Requirements and Challenges
This railway system needed to provide locomotive locations, real-time status data monitoring and fault alarms, remote diagnostics,
video surveillance, statistical analysis, onboard electronic records management, information sharing, and a functional interface, as well
as conducting detailed analysis by calling various specialist software packages. The operating environment was demanding. Space was
at a premium as well, and the system had to remain reliable in spite of constant shaking and vibration; it also had to be fanless, yet able
to function under a wide range of ambient temperatures.
Embedded Software Services
Creating this wireless transmission platform to operate between
railway locomotives and their control center required a complex
system design. It needed to integrate all locomotive travel logs and
alerts, as well as collect, process, and transmit data between the
rolling stock and the command center. Thus, a reliable partner and
integrated services were important in this case.
Advantech Solution and Benefits
We recommended Advantech’s COM Express mini to the customer. The dimensions of the SOM-7568 are 84mm x 55mm.
Other key features of SOM-7568 are:
• Intel® Pentium® and Celeron® N3000 Series SoC
• Dual Channel DDR3L 1600 non-ECC onboard memory up to 4 GB
• Supports HEVC/H.265, H.264 MPEG2 HW Decode
• Supports: LVDS/eDP, HDMI/DisplayPort/DVI
• iManager, WISE-PaaS/RMM and Embedded Software APIs
Advantages: Daylight Readability and an Easy-to-use Interface
The customer was more than satisfied by the SOM-7568, equipped with the latest Intel® Atom™ processor. Its significantly improved CPU
performance fulfilled the target performance requirements. Environmental conditions in the transportation business, especially the vibration and shock encountered, demand rock-solid, dependable performance. The on-board memory and storage served by the COMe
SOM-7568 high-precision connector provide outstanding shock resistance. In addition, the on-board storage capacity can be adjusted
from 4GB to 32GB to suit different system requirements. As part of the COM express mini series, the SOM-7568 is about the size of a
business card, with low power consumption, and it fully supports fanless cooling with no problem at all. It thrives across a wide range of
temperatures, ensuring stable operation at different latitudes.
Application Diagram
15
Product Selection
SOM-5991
SOM-5897
SOM-5894
SOM-5893
SOM-5892
SOM-5890
Form Factor
Model Name
COM Express Basic
COM Express Basic
COM Express Basic
COM Express Basic
COM Express Basic
COM Express Basic
Pin-out Type
COM R2.1 Type 6
Intel® Xeon®
Processor D-1500
Product Family
2.0 - 1.4GHz
16/8/4/2
12/9/6/3MB
45/35/25W
-
COM R2.1 Type 6
6th Gen.
Intel Core i7/i5/i3/
Celeron/ Xeon
2.8 - 1.9GHz
4/2
8/6/3MB
45/35/25W
Intel QM170/CM236
COM R2.1 Type 6
4th Gen.
Intel Core i7/i5/i3/
Celeron
2.7-1.5GHz
4/2
6/3/2MB
47/37/25W
Intel QM87
COM R2.1 Type6
COM R2.0 Type 6
2nd Gen.
Intel Core i7/i5/i3/
Celeron
2.5 - 1.4GHz
4/2/1
6/4/3/2/1.5MB
45/35/25/17W
Intel QM67
DDR4-2400
DDR4-2133
DDR3L 1600/1333
Support
32GB
32GB
B1 version only
16GB
2.7 - 2.2GHz
4/2
4/2MB
35W/17W
A77E
DDR3 2133 ; DDR3L
1866/1600
16GB
COM R2.0 Type 6
3rd Gen.
Intel Core i7/i5/i3/
Celeron
2.7-1.4GHz
4/2/1
6/4/3/2/1MB
45/35/25/17W
Intel QM77
DDR3/DDR3L
1600/1333
B1 version only
16GB
2 x 260P SODIMM
-
2 x 260P SODIMM
Intel® HD Graphics
1000 - 950MHz
1
LVDS 2-CH 18/24-bit
BOM optional eDP
2
Up to 3
3
1
8
-
2 x 204P SODIMM
Intel HD Graphics
1GHz - 900MHz
1
2 x 204P SODIMM
AMD Radeon HD9000
686MHz
1
2 x 204P SODIMM
Intel HD Graphic
1GHz - 900MHz
1
2 x 204P SODIMM
Intel HD Graphic
1.1GHz - 800MHz
1
LVDS 2-CH 18/24-bit
LVDS 2-CH 18/24-bit
LVDS 2-CH 18/24-bit
LVDS 2-CH 18/24-bit
3
4
3
3
Dual/Triple
1
7
-
Dual/Triple/Quad
1(option)
7
-
1
Dual/Triple
1
7
-
1
Dual
1
7
-
CPU
Processor
System
Base Frequency
Processor Core
LLC
CPU TDP
Chipset
Technology
Memory
ECC Support
Max. Capacity
Socket
Controller
Max. Frequency
VGA
LCD (TTL/LVDS/eDP)
Graphics
Expansion
Serial Bus
Ethernet
-
AMD R-Series Bald
Eagle
DDR3 1333/1066
B1 version only
16GB
DDI
(HDMI/DVI/DisplayPort)
SDVO
TV-out
Multiple Displays
PCIe x16
PCIe x1
PCI Masters
1
8
-
PCI Masters
2
-
-
-
-
-
ISA Bus
LPC
SMBus
I2C Bus
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
-
CAN Bus
-
-
-
-
-
-
Controller
Speed
i201AT
10/100/1000Mbps
i219LM
10/100/1000Mbps
Intel i217LM
10/100/1000Mbps
Intel i211AT
10/100/1000 Mbps
Intel 82579LM
10/100/1000Mbps
Intel 82579LM
10/100/1000Mbps
4
4
4
4
4
4
SATA
PATA Channel
USB3.0
USB2.0
Audio
SPI Bus
GPIO
SDIO (GPIO pin shared)
Watchdog
COM Port
LPT/FDD
PS/2
IR
Onboard Storage
TPM
Power Type
4
4
4
4
4
4
8
8
4
8
8
HD Audio
HD Audio
HD Audio
HD Audio
HD Audio
1
1
1
1
1
8
8
8
8
8
8
I/O
1
1
1
1
1
1
2 (2-wire)
2 (2-wire)
2 (2-wire)
2 (2-wire)
2 (2-wire)
2 (2-wire)
Optional
Optional
Optional
Optional
Optional
ATX: Vin, VSB, AT: Vin
ATX: Vin, VSB, AT: Vin
ATX: Vin, VSB, AT: Vin
ATX: Vin, VSB, AT: Vin
ATX: Vin, VSB, AT: Vin
ATX: Vin, VSB, AT: Vin
Vin: 8.5-20V
Vin: 8.5-20V
Vin: 8.5-20V,
Vin: 8.5-20V
Vin: 11.4-12.6V,
Vin:8.5-20V,
Supply Voltage
VSB: 4.75-5.25V
VSB: 4.75-5.25V
VSB: 4.75-5.25V
VSB: 4.75-5.25V
VSB: 4.75-5.25V
VSB: 4.75-5.25V
Power
Power Consumption Max.
TBD
TBD
41.8 Watt
39.6 Watt
41.8 Watt
42.8 Watt
Power Consumption Idle
TBD
TBD
8.5 Watt
16.8 Watt
5.4 Watt
9.6 Watt
Environment Operating Temp.
0 ~ 60 °C (32 ~ 140 °F) 0 ~ 60 °C (32 ~ 140 °F) 0 ~ 60 °C (32 ~ 140 °F) 0 ~ 60 °C (32 ~ 140 °F) 0 ~ 60 °C (32 ~ 140 °F) 0 ~ 60 °C (32 ~ 140 °F)
125 x 95mm
125 x 95mm
125 x 95mm
125 x 95 mm
125 x 95mm
125 x 95mm
Mechanical Dimensions
(4.92" x 3.74")
(4.92" x 3.74")
(4.92" x 3.74")
(4.92'' x 3.74")
(4.92" x 3.74")
(4.92" x 3.74")
16
SOM-6896
SOM-6894
SOM-6868
SOM-6867
SOM-6765
COM Express Compact
COM Express Compact
COM Express Compact
COM Express Compact
COM Express Compact
COM R2.1 Type 6
6th Gen.
Intel Core i7/i5/i3/Celeron
U-Series
2.6 - 2.0GHz
2
4/3/2MB
15W
-
COM R2.1 Type 6
COM R2.1 Type 6
Intel® Pentium®/Celeron®
N3000 Series and Atom™
SoC
1.6 - 1.04GHz
4/2
2MB
6/5/4W
-
COM R2.0 Type 6
COM R2.0 Type 2
Intel Atom E3800 & Celeron
J1900
Intel Atom D2550/N2600/
N2800
1.9-2.2GHz
2
4/3/2 MB
15W
N/A
COM R2.1 Type 6
4th Gen.
Intel Core i7/i5/i3/Celeron
(U-Processor Line)
1.9 - 1.6GHz
2
4/3/2MB
15W
-
1.91/ 2.0GHz
4
2MB
10W
-
1.86 - 1.6GHz
2
1MB
10/6.5/3.5W
Intel NM10
DDR3L-1600
DDR3L 1600 MHz
DDR3L 1600/1333
DDR3L-1600
DDR3L 1333
DDR3 1066/800
16GB
16GB
16GB
8GB
8GB
4GB/2GB
2 x 204P SODIMM
Intel® HD Graphics
1050 - 900MHz
1
LVDS 2-CH 18/24-bit
BOM optional eDP
1
Up to 2
3
5 Controllers, 8 Lanes
-
2 x 204P SODIMM
Intel® HD Graphics
1GHz-850MHz
1
2 x 204P SODIMM
Intel HD Graphic
1.1 - 1GHz
1
2 x 204P SODIMM
Intel HD Graphic
688MHz
1
LVDS 2-CH 18-bit/24-bit
LVDS 2-CH 18/24-bit
1 x 204P SODIMM
Intel GMA3650/3600
640 - 400MHz
1
D Series: LVDS 1-CH 18/24-bit
N Series: LVDS 1-CH 18-bit
Intel 5th Generation Core i
Processor
2 (DDI2 for option)
-
Dual/Triple
4
-
2 (DDI 2: Optional)
Dual/Triple
4
-
2 x 204P SODIMM
Intel® HD Graphics
700 MHz
1
LVDS 2-CH 18/24-bit
BOM optional eDP
1
BOM optional 2
3
5
-
-
-
-
1
1
1
1 (24MHz)
1
1
1
1
1
LVDS 2-CH 18-bit/24-bit
2
2
Dual
3
-
Dual
2 (Optional 4)
4
-
-
-
1
1
1
1
1
1
1
1
1
-
-
-
-
1
-
i219LM
10/100/1000Mbps
3
(Sku dependency)
4
8
HD Audio
1
8
1
2 (2-wire)
Optional
ATX: Vin, VSB, AT: Vin
Vin: 8.5-20V
VSB: 4.75-5.25V
TBD
TBD
0 ~ 60 °C (32 ~ 140 °F)
95 x 95 mm
(3.74" x 3.74")
Intel i218LM
10/100/1000Mbps
Intel i218LM
10/100/1000Mbps
i211AT
10/100/1000 Mbps
Intel i210
10/100/1000 Mbps
Intel 82583V
10/100/1000 Mbps
4
4
2
2
2
2
8
HD Audio
2
8
HD Audio
1
8
1
2 (2-wire)
ATX: Vin, VSB, AT: Vin
Vin: 4.75-20V,
VSB: 4.75-5.25V
21.7W
4.4W
0 ~ 60 °C (32 ~ 140 °F)
95 x 95 mm
(3.74" x 3.74")
4
8
HD Audio
1
8
SD3.0
1
2 (2-wire)
Optional
ATX: Vin, VSB, AT: Vin
Vin: 4.75-20V
VSB: 4.75-5.25V
TBD
TBD
0 ~ 60 °C (32 ~ 140 °F)
95 x 95 mm
(3.74" x 3.74")
1
8
HD Audio
1
8
HD Audio
1
8
1
ATX: Vin, VSB, AT: Vin
Vin: 11.4-12.6V,
VSB: 4.75-5.25V
10.3 W
7.06 W
0 ~ 60 °C (32 ~ 140 °F)
95 x 95 mm
(3.74" x 3.74")
8
1
2 (2-wire)
Yes
ATX: Vin, VSB, AT: Vin
Vin: 4.75-20V
VSB: 4.75-5.25V
21.9W
3.3W
0 ~ 60 °C (32 ~ 140 °F)
95 x 95 mm
(3.74'' x 3.74")
8
1
2 (2-wire)
1 (option)
ATX: Vin, VSB, AT: Vin
Vin: 4.75-20V
VSB: 4.75-5.25V
TBD
TBD
0 ~ 60 °C (32 ~ 140 °F)
95 x 95 mm
(3.74'' x 3.74")
Embedded Software Services
SOM-6897
COM Express Compact
17
Product Selection
SOM- 7568
SOM-7567
SOM-7565
SOM-5790
SOM-9890
Form Factor
Model Name
COM Express Mini
COM Express Mini
COM Express Mini
COM Express Basic
COM Express Basic
Pin-out Type
COM R2.1 Type 10
Intel Pentium N3700/N3710
Intel Celeron 3160/N3060/
N3010
Intel Atom™ X5-E8000
1.6/1.04GHz
4/2
2MB
6/5/4W
Dual Channel DDR3L-1600
8GB
COM R2.1 Type 10
COM R2.1 Type 10
COM R2.0 Type 2
COM R2.0 Type 6
Intel Atom E3845/E3825/E3815
Intel Celeron J1900/N2930
Intel Atom N2800/N2600
2nd Gen.
Intel Core i7/i5/i3/Celeron
3rd Gen.
Intel Core i7/i5/i3/Celeron
1.33~2GHz
4/2/1
2/1/512KB
10/7.5/6/5W
DDR3L 1333/1066
4GB
1.86 - 1.6 GHz
2
1MB
6.5/3.5W
Intel NM10
DDR3 1066/800
4GB/2GB
2.5 - 1.4GHz
4/2/1
6/4/3/2/1.5MB
45/35/25/17W
Intel QM67
DDR3 1333/1066
16GB
2.7-2.2GHz
4/2
6/3/2MB
45/35W
Intel QM77
DDR3/DDR3L 1600/1333
16GB
Onboard
Intel HD Graphics
792-854MHz
-
Onboard
Intel GMA3650/3600
640 - 400MHz
-
2 x 204P SODIMM
Intel HD Graphic
1.1GHz - 800MHz
1
2 x 204P SODIMM
Intel HD Graphic
1GHz - 900MHz
1
LVDS 1-CH 18/24-bit
LVDS 1-CH 18-bit
LVDS 2-CH 18/24-bit
LVDS 2-CH 18/24-bit
1
1
1
-
3
Dual
3
1
1
1
Dual
3 (Optional 4)
1
1
1
Dual
3 (Optional 4)
1
1
1
1
Dual
5
4
1
1
1
1
Dual/Triple
1
7
1
1
1
CPU
Processor
System
Memory
Base Frequency
Processor Core
LLC
CPU TDP
Chipset
Technology
ECC Support
Max. Capacity
Socket
Controller
Max. Frequency
VGA
LCD (TTL/LVDS/eDP)
Graphics
Expansion
Serial Bus
DDI
(HDMI/DVI/DisplayPort)
SDVO
TV-out
Multiple Displays
PCIe x16
PCIe x1
PCI Masters
ISA Bus
LPC
SMBus
I2C Bus
CAN Bus
Ethernet
18
Controller
Speed
SATA
PATA Channel
USB3.0
USB2.0
Audio
SPI Bus
GPIO
SDIO (GPIO pin shared)
Watchdog
COM Port
LPT/FDD
PS/2
IR
Onboard Storage
TPM
Power Type
Onboard
Intel HD Graphics
320-700MHz
LVDS 2-CH 18/24-bit
BOM optional eDP
-
Optional
-
-
-
Intel® i210AT
Speed 10/100/1000 Mbps
2
Intel i210E
10/100/1000 Mbps
1 (Optional 2)
1
4
HD Audio
1
8
1
2 (2-wire)
SLC/MLC SSD
ATX: Vin, VSB, AT: Vin
Intel 82574L
10/100/1000 Mbps
1 (Optional 2)
8
HD Audio
1
8
1
2 (2-wire)
SLC/MLC SSD
ATX: Vin, VSB, AT: Vin
Intel 82579LM
10/100/1000Mbps
4
1
8
HD Audio
1
8
1
ATX: Vin, VSB, AT: Vin
Intel 82579LM
10/100/1000Mbps
4
4
8
HD Audio
1
8
1
2 (2-wire)
Optional
ATX: Vin, VSB, AT: Vin
2
8
HD Audio
1
I/O
1
2 (2-Wire)
ATX: Vin, VSB, AT: Vin
Vin: 4.75 (5-5%) ~ 20V
Supply Voltage
(19+5%), VSB: 5V±5%, RTC
Power
Battery: 2.0-3.3V
Power Consumption Max.
7.29 Watt
Power Consumption Idle
3.05 Watt
Operating Temp.
0 ~ 60 °C (32 ~ 140 °F)
Environment
Extended Temp. (Optional)
-
Vin: 4.75-20V,
VSB: 4.75-5.25V
Vin: 4.75-20V,
VSB: 4.75-5.25V
Vin: 11.4-12.6V,
VSB: 4.75-5.25V
Vin: 11.4-12.6V,
VSB: 4.75-5.25V
16.56 Watt
8.04 Watt (E3845)
0 ~ 60 °C (32 ~ 140 °F)
-40 ~ 85 °C (-40 ~ 185 °F)
8.64 Watt.
6.96 Watt.
0 ~ 60 °C (32 ~ 140 °F)
-40 ~ 85 °C (-40 ~ 185 °F)
40.1 Watt
11.4 Watt
0 ~ 60 °C (32 ~ 140 °F)
-
41.8 Watt
4.7 Watt
0 ~ 60 °C (32 ~ 140 °F)
-
Mechanical Dimensions
84 x 55 mm (3.3" x 2.17")
84 x 55mm (3.3" x 2.17")
125 x 95mm (4.92" x 3.74")
125 x 95mm (4.92" x 3.74")
84 x 55 mm (3.3" x 2.17")
SOM-3567
SOM-3565
SOM-4466
Qseven
Qseven
Qseven
ETX
SOM-4455
ETX
Qseven 2.0
Qseven 2.0
Qseven R1.2
ETX 3.0
ETX 3.0
Intel Pentium N3710
Intel Celeron N3160/N3060/N3010
Intel Atom™ X5-E8000
Intel Atom/Celeron
E3800/J1900/N2900 Series SoC
Intel Atom N2600
AMD G-Series T56N/T40E/T16R
AMD LX800
1.6 - 1.04GHz
4/2
2MB
6/5/4W
DDR3L-1600
8GB
1.91 - 1.33GHz
4/2
2/1MB
10/8/6/4.3W
DDR3L-1333/1066
4GB
1.6GHz
2
1MB
3.5W
Intel NM10
DDR3 800
2GB
615MHz-1G
1
512KB
4.5/6.4/18W
AMD A55E
DDR3 1066
4GB
500MHz
1
128KB
3.6W
AMD CS5536
DDR 400/333
1GB
Onboard
Intel® HD Graphics
320-700MHz
LVDS 2-CH 18/24-bit
BOM optional eDP
Onboard
Intel® HD Graphics
792 - 400MHz
-
Onboard
Intel GMA3600
400MHz
-
LVDS 2-CH 18/24-bit
LVDS 1-CH 18-bit
1 x 204P SODIMM
AMD Radeon HD6320/HD6250
276MHz
1
LVDS 1-CH 18/24-bit
TTL 1-CH 18-bit
1 x 200P SODIMM
AMD LX800
1
LVDS 1-CH 18/24-bit
TTL 1-CH 18-bit
2
1
1
-
-
Dual/Triple
3 (Optional 4)
1
1
1
Dual
3 (Optional 4)
1
1
1
Dual
3 (Optional 4)
1
1
1
Dual
4
1
1
1
Dual
4
1
1
1
-
-
-
-
-
i211AT
10/100/1000 Mbps
2
Up to 3
4 (optional 5)
HD Audio
1
SD3.0
1
1 (4-wire)
eMMC4.51 up to 32GB
ATX: Vin, VSB, AT: Vin
I211IT
10/100/1000 Mbps
2
1
6
HD Audio
1
SD3.0
1
1 (4-wire)
eMMC4.51 up to 32GB
ATX: Vin, VSB, AT: Vin
Intel 82574L
10/100/1000 Mbps
Up to 2
8
HD Audio
1
8
1
1 (2-wire)
SLC/MLC SSD
ATX: Vin, VSB, AT: Vin
Realtek RTL8105E
10/100 Mbps
2
2
4
HD Audio
1
1
2
1
KB/MS
1
mSATA socket
ATX: Vin, VSB, AT: Vin
Realtek RTL8100CL
10/100Mbps
2
2
4
Line-in/Line-out/MIC
1
1
2
1
KB/MS
1
CF socket
ATX: Vin, VSB, AT: Vin
Vin: 4.75-5.25V
VSB: 4.75-5.25V
Vin: 4.75-5.25V
VSB: 4.75-5.25V
Vin: 4.75-5.25V,
VSB: 4.75-5.25V
Vin: 4.75-5.25V,
VSB: 4.75-5.25V
Vin: 4.75-5.25V,
VSB: 4.75-5.25V
6.85 Watt
3.04 Watt
0 ~ 60 °C (32 ~ 140 °F)
-40 ~ 85 °C (-40 ~ 185 °F)
TBD
TBD
0 ~ 60 °C (32 ~ 140 °F)
-40 ~ 85 °C (-40 ~ 185 °F)
7.8 Watt.
4.9 Watt.
0 ~ 60 °C (32 ~ 140 °F)
-40 ~ 85 °C (-40 ~ 185 °F)
7.75 Watt.
6.1 Watt.
0 ~ 60 °C (32 ~ 140 °F)
-40 ~ 85 °C (-40 ~ 185 °F)
10.05 Watt.
9.0 Watt.
0 ~ 60 °C (32 ~ 140 °F)
-20~80 °C (-4~176 °F)
70 x 70 mm (2.75" x 2.75")
70 x 70 mm (2.75" x 2.75")
70 x 70mm (2.75" x 2.75")
114 x 95 mm (3.74" x 4.5")
114 x 95 mm (3.74" x 4.5")
Embedded Software Services
SOM-3568
19
COM Solutions and Services
• Faster Time-to-Market
• Flexible to Customer Demands
• Simplify System Design Complexity
• Enhance System Reliability
• Time and Resources Saving
• Quality Assurance
Regional Service & Customization Centers
China
Taiwan
Kunshan
86-512-5777-5666
Taipei
886-2-2792-7818
Netherlands
Eindhoven
31-40-267-7000
Poland
Warsaw
48-22-33-23-730
USA
Milpitas, CA
1-408-519-3898
Worldwide Offices
Greater China
Asia Pacific
Europe
Americas
China
Beijing
Shanghai
Shenzhen
Chengdu
Hong Kong
800-810-0345
86-10-6298-4346
86-21-3632-1616
86-755-8212-4222
86-28-8545-0198
852-2720-5118
Japan
Tokyo
Osaka
0800-500-1055
81-3-6802-1021
81-6-6267-1887
Korea
Seoul
080-363-9494
82-2-3663-9494
Taiwan
Neihu
Xindian
Taichung
Kaohsiung
0800-777-111
886-2-2792-7818
886-2-2218-4567
886-4-2329-0371
886-7-229-3600
Singapore
Singapore
65-6442-1000
France
Paris
33-1-4119-4666
Malaysia
Kuala Lumpur
Penang
1800-88-1809
60-3-7725-4188
60-4-537-9188
Italy
Milano
39-02-9544-961
Europe
00800-2426-8080
Germany
Münich
Hilden/ D'dorf
49-89-12599-0
49-2103-97-885-0
North America
Cincinnati
Milpitas
Irvine
1-888-576-9668
1-513-742-8895
1-408-519-3898
1-949-420-2500
Mexico
Mexico
1-800-467-2415
52-55-6275-2777
Brazil
São Paulo
0800-770-5355
55-11-5592-5355
Benelux & Nordics
31-76-5233-100
Breda
Indonesia
Jakarta
62-21-751-1939
UK
Reading
44-0118-929-4540
Thailand
Bangkok
66-2-248-3140
48-22-33-23-740/741
India
Pune
Bangalore
1800-425-5071
91-20-3948-2075
91-80-2545-0206
Poland
Warsaw
8-800-555-01-50
7-495-644-0364
7-812-332-5727
Australia
Melbourne
Sydney
1300-308-531
61-3-9797-0100
61-2-9476-9300
Russia
Moscow
St. Petersburg
www.advantech.com
Please verify specifications before ordering. This guide is intended for reference purposes only.
All product specifications are subject to change without notice.
No part of this publication may be reproduced in any form or by any means, electronic, photocopying, recording or otherwise,
without prior written permission of the publisher.
All brand and product names are trademarks or registered trademarks of their respective companies.
© Advantech Co., Ltd. 2016
8600000245