Computer On Modules Pioneering Technology and Design-in Service 3.0 Deliver Fast Time-to-Market COM Express® Basic COM Express® Compact COM Express® Mini Qseven ETX COM Design-in Services 3.0 COM.advantech.com About Advantech and COM Founded in 1983, Advantech is a leader in providing trusted innovative embedded solutions. Advantech offers comprehensive system integration, hardware, software, customer-centric design services, and global logistics support; all backed by industry-leading front and back office e-business solutions. We cooperate closely with our partners to help provide complete solutions for a wide array of applications across a diverse range of industries. Advantech has always been an innovator in the development and manufacturing of high-quality, highperformance computing platforms, and our mission is to empower these innovations by offering trustworthy ePlatform products and services. As a smart system integrator, knowing how to differentiate applications with faster solutions is the most important point. In a dynamic market, technical specifications keep changing. However, Computer On Modules can help you to reduce the time and work involved with designing new carrier boards. Advantech seamlessly supports you in handling the complexities of technical research at each development stage, which greatly minimizes development times. Advantech keeps developing innovative COM Design-in Service and provides scalable reliable Computer On Modules. When we stand by you, you can concentrate on your core competence. With Advantech, there is no limit to the applications and innovations our products make possible. For more information, visit: COM.advantech.com 2 Computer-On-Module Introduction Computer-On-Module, or COM, is a highly integrated board with CPU, chipset, memory, and peripherals designed into a component module. COM requires a carrier board to power up and provide expansion interfaces and I/O for use. Since the COM architecture provides various standard specifications in different form factors and pin-out types, it not only gives OEM customers flexibility to choose a suitable solution for their applications but also saves development time. The COM standard includes COM Express®, ETX and Qseven, providing a wide variety of interfaces like PCI Express, SATA, IDE, USB, DDI, etc. These standards cover electrical and mechanical compatibilities for easy replacement or upgrade, regardless of the mechanical and thermal design. As a result, COM is one of the most popular choices for customers to design their application-specific solutions. Time-to-Market: • Modularized design concept speeds up product development • Immediate assistance for carrier board design Focused Resource Allocation: • Resources focused on carrier board design for key applications COM Introduction Key Benefits of COM Easy Migration: • Modularized thermal solution • Unified electrical, mechanical properties, and software utilities Secured Core Knowledge: • Customer keeps domain know-how on their own carrier board COM Express® COM Express® is becoming the most popular COM specification due to the latest expansion interfaces and I/O, generating various pin-out types and three different form-factors. COM customers benefit from its flexibility and easy learning curve to serve a variety of applications. COM Express® provides not only high-speed interfaces like HDMI/DisplayPort, PCI Express, SATA and USB 3.0 for volume data transportation, but also LVDS, VGA and LPC for legacy applications. COM Express® defines 3 dimensions: - 125 x 95mm, 95 x 95mm, and 84 x 55mm - suitable from high performance, to low power designs. It also defines the PCB thickness to 2mm, onboard component height to less than 8 mm, and the total height from the bottom surface of the PCB module to the standard equipped heat-spreader top surface is 13mm. COM Express® allows a wide-range of input power voltages in a specific form factor, which makes it more suitable for mobile, and battery-powered environments. Form Factor COM Express® defines 3 different form factors: COM Express® Basic Full feature sets with extreme performance platforms for high-demand applications. 125 X 95mm COM Express® Compact Compact form factor sets with good balance of performance and features for embedded systems 95 X 95mm COM Express® Mini Small PCB size with all components onboard for compact, robust devices in harsh environments. 84 X 55mm 3 Computer-On-Module Introduction Functionality In the COM Express® R2.1 standard, there are 4 popular pin-out types that provide various features, and apply to different customer expansion or I/O requirements. Function / Interface Display Interface Expansion Interface I/O System Management Power Form Factor 4 Type 1 Type 2 Type 6 Type 10 VGA Port 1 1 1 - LVDS Channel A 1 1 1 1 LVDS Channel B 1 1 1 - eDP (Muxed LVDS Channel A) - - 1 1 DDI (HDMI/DVI/DP) - - 3 1 SDVO (Muxed PEG Port) - 2 - - PCI Express x16 (PEG Port) - 1 1 - PCI Express x1 6 6 8 4 PCI Bus - 32 Bit - 1 - - AC’97 / HD Audio I/F 1 1 1 1 LPC Bus 1 1 1 1 Gigabit LAN 1 1 1 1 SATA / SAS Ports 4 4 4 2 PATA Channel - 1 - - USB 3.0 Ports - - 4 2 USB 2.0 Ports 8 8 8 8 USB Client 1 1 1 1 SDIO - - 1 1 Serial Ports - - 2 2 General Purpose I/O 8 8 8 8 SPI Bus 2 2 2 2 SMBus 1 1 1 1 I2C 1 1 1 1 Watchdog Trigger Output 1 1 1 1 Express Card Support 2 2 2 2 Fan Control/Speed Detection - - 2 2 12V 12V 12V 4.75 - 20V All All All All Supply Voltage Qseven Qseven is built with a 70 x 70mm or 70 x 40mm form factor, 1.2 mm thick PCB, 5-volt power input, power consumption limited to below 12W, and limited overall height to approximately 9.2mm from the bottom surface of module PCB to top surface of heat-spreader. These mechanical and power specifications make Qseven suitable for small form-factor, mobile or battery target applications. Qseven uses MXM as a board-to-board connector which is easily obtained and cost effective, along with proven high speed integration for PCI Express. This small module provides digital display interfaces including LVDS/eDP, HDMI/DisplayPort, expansion interface PCI Express x1, and I/O like Gigabit Ethernet, SATA, and USB3.0/2.0, etc. For size-crucial designs, Qseven provides the necessary functionality to minimize design effort for limited spaces. Form Factor Maximum Configuration Function / Interface Expansion I/F I/O System Management Dual Channel 24-bit / 2 Ports 1 4 1 1 1 2 2 8 8-bit 1 2 (x4, x2) 1 1 1 1 1 1 40mm LVDS/eDP HDMI/DP/DVI(TMDS) PCI Express x1 HD Audio/AC’97/I2S LPC Gigabit Ethernet SATA USB3.0 USB2.0 SDIO UART MIPI-CSI2 SPI Bus SMBus I2C Bus CAN Bus Watchdog Trigger Fan Control Display I/F COM Introduction Functionality ETX ETX is widely used in many industrial markets like automation, medical, networking, and transportation. It has a compact size of 114 x 95 mm, which makes it easy for customers to integrate, and provides legacy interfaces such as PCI, ISA, IDE, TTL/LVDS and LAN for vertical application continuity. ETX board-to-board connectivity is robust enough for rugged conditions and only requires 5V input voltage, for easy system design. These features make ETX a widely adopted platform in many crucial, legacy-interface type applications. Functionality Connector Location X1 X2 X3 Form Factor Interfaces Description PCI USB2.0 Audio ISA VGA TTL/LVDS TV-out 32-bit 4 Masters 4 Ports Line-in, Line-out, MIC 16-bit data width, 16-bit I/O address R, G, B TTL: 18-bit, LVDS: 2 channel 24-bit CVBS or S-Video RS-232, RS-422, or RS-485 depends on carrier board design Keyboard, Mouse Serial Port PS/2 IRDA LPT/FDD X4 Onboard IDE LAN SMBus I2C Bus GPE/GPIO WDTOUT SATA Multi-function pin selected in BIOS or boot up strapping 2 Channel, up to 4 devices 10/100 Mbps 2-bit Watchdog trigger output 2 Ports 5 COM Design-in Services 3.0 Advantech COM Design-in Services covers all your questions from the design-in process to volume production, with product lifecycle management. We act as your in-house engineer as well as your personal consultant. Customers benefit from easy selection of modules, accessories and software, all backed up by our expert-integrated team. We transform complex COM development into easy tasks so our customers can better meet new market challenges. COM Design-in Service 1.0 was focused on timely response to customers’ issues. Services 2.0 offered proactive services with pre-validated technology to ensure project success and life cycle management. Now, Services 3.0 not only include 6 phases of design-in process but also add 4 customization services for our customers to develop various applications. Design-in Service for Standard Products 2 Design 1 Planning Schematic Review Placement & Layout Review Documents & IP Library Technical Feasibility Study Proposal Consulting Li f ec yc le M SI Test Board 6 End of Life ana ge men t Debugging Card Product Change Notice Last Time Buy & Shipment Product Migration Proposal Fully Customization Services Extension Board BIOS &EC Customization Riser Card 3 Validation Issue Debugging BIOS Customization COM Design-in Services 25 For 5 Production Assured Quality Control Ramp-Up Management Global Logistics & RMA Watts 15 mm 45 mm 4 Integration Software Customization Thermal Solution Peripheral Consultation Design-in Service for Standard Products Phase 1: Planning │ Deliver project proposal SOM-5894FG-U4A1E SOM-5892FG-U3A1E SOM-5892FG-U1A1E SOM-5892FG-U5A1E SOM-5892FG-S7A1E SOM-5892FG-U7A1E SOM-5892FG-U4A1E SOM-5892FG-S6A1E SOM-5892FG-U2A1E SOM-5892FG-S4A1E SOM-5892FG-S5A1E SOM-5890FG-U1A1E SOM-5890FG-U2A1E SOM-5890FG-S5A1E SOM-5890FG-U5A1E SOM-5890FG-U0A1E SOM-5890FG-S3A1E SOM-5890FG-S6A1E SOM-5890FG-S1A1E SOM-5890FG-S4A1E SOM-5788FG-U5A1E SOM-5788FG-U0A1E SOM-5788FG-S3A1E SOM-5788FG-S1A1E SOM-5788FG-U4A1E SOM-5788FG-U1A1E SOM-5788FG-S9A1E SOM-5788FG-S0A1E Performance-Sandra 2009 CPU Benchmark 6 Consulting Services During our client's planning phase, Advantech’s integrated COM expert team provides various hardware and software suggestions for potential issues that our clients might face, such as technical specifications and schedules. • Technical feasibility study • Off-the-shelf or customized product selection • Hardware & software proposal • Performance & power consumption comparison • Product selection guide • Evaluation board Phase 2: Design │Schematic review and design document Design Documents Advantech provides plenty of product-related information and services for designing carrier boards, such as design check lists and mechanical drawings. For details, please visit the “Download” page of the COM design support website at Http://com.advantech.com 3D Board Model Expert-Integrated COM Design-in Services • Schematic & layout checklist • User’s manual • Application note • 2D/3D mechanical model Schematic Checklist IP Library Advantech provides itsclients with a hardware design library for choosing features such as dual LVDS, TV-out solutions, second Super I/O, and smart battery. Our client reference library makes it simple to implement features on carrier boards, saving overall design and verification efforts. Review Service Schematic Check Advantech design assistance is a review service based on our clients’ carrier board schematic for COM module functions. This service helps to catch design errors before they happen. Placement/Layout Check After the schematic review, Advantech provides a placement & layout review on our clients’ carrier boards, with respect to COM module related functions. These reviews provide suggestions for improving signal quality and anticipate possible mechanical conflicts. Phase 3: Validation │Troubleshooting and risk management Debugging, Verification and Feasibility Testing Advantech strives to deal with customers' carrier board design issues even when it cannot be there. We not only have a dedicated FAE and engineering team to help customers debug, but also provide a sequential debugging SOP and various debug cards for customers to implement self analysis. Dedicated FAE & engineering team • Phenomenon duplication • Analysis and verification • Solutions and suggestions Customer self-analysis/debugging tools • Sequential debugging SOP • Debug cards Debug Card 7 COM Design-in Services 3.0 Phase 4: Integration │Custom software and thermal solution Wide Temperature Design for Extreme Environments Customer applications that operate in harsh environments require high-reliability system designs to sustain normal functions. Particularly in industrial automation, transportation, and medical environments, systems are often exposed to extreme conditions; extreme temperatures, humidity, dust, etc., that may hamper bottom-line business success. With that in mind, Advantech provides wide temperature solutions with a range of -20 °C to +80 °C and -40 °C to +85 °C for highly demanding industrial applications. These wide temperature solutions can be used by all the Advantech COM products. Thermal Solutions: • Two-part thermal solution for standard products • One-part thermal solution (DHCS) for high TDP products • Customized thermal solution Phase 5: Production│Assured product quality & delivery From initial design concept to final production, Advantech helps its customers take full control of quality management. In the first stage, our “Design Quality Assurance” process ensures that New Product Introduction (NPI) is fully understood and executed by our project team before moving to the next stage. The second stage involves Advantech’s core competence of product mass production. The final stage “Customer Quality Control” guarantees product satisfaction after delivery. “Time to value” weighs in our customers’ requirements. As an international company with global presence, Advantech offers direct shipment from our manufacturing factories to our customers’ designated locations. As a trusted consultant and partner, Advantech’s global customer care services help save our customers’ time and resources. Phase 6: EOL & Migration The market is ever changing, making today’s innovative product obsolete over time. Advantech’s experienced consulting team is able to give market insights to help our customers make the right decisions. When a product comes into the End-Of-Life (EOL) stage, we offer the following services: Product change notice Last-time buy & last shipment Product migration proposal 8 Full Customization Services Why do you need COM Customization Services Expert-Integrated COM Design-in Services In addition to its strong design-in ability for standard COM products, Advantech has released its advanced customized service, called COM Design-in Service 3.0, in order to take care of more vertically-focused markets. With this advanced customized service, customers save time and costs on design and production of COM modules or carrier boards; they are able to focus on developing their core businesses to meet new market challenges. Benefits of COM Customization Services Advantech is experienced in product design and project management; we clearly understand the needs and expectations of our customers. With the new, comprehensive COM customization services, customers can save 50% of their development schedule time, 20% on production cost, and 30% on their workforce, all of which ensure that customers meet time-to-market expectations. COM customization services provide flexible integration including COM module customization, carrier board design and production, semi-system integration services, and manufacturing service. The four key solutions benefit our customers with faster time-to-market. Without wasting time on collecting resources and stock management, customers can focus on their own products and businesses. Ensuring Design Quality Our COM Design-in Services team has long experience working with customers in integrating their proprietary-designed carrier boards with particular features, and ensuring design quality right at the development phase. Since ensuring design quality is critical, COM customization services provide a complete signal and power integrity service for customer-designed carrier boards. Faster Time-to-Market Integration Capability Simulation Design Our thermal design team can optimize system size, power consumption, and noise and vibration to extend product longevity. The design team utilizes the Computer Aided Design tool Flotherm to simulate and analyze hot-spots and air flow conditions. This provides a scientifically based scheme optimum thermal solution before the system is physically built or tooled. Thermal Testing IR analysis monitors a variety of processors and chipsets for significantly different heat loads across time. Takes the biggest value as the result and follows strain limits from Intel® BFI report 450 & 500 micro strain. Process included in heatsink module and assembly PCBA. Highly Effective Production System To ensure products meet customers’ requirements and budget, we specialize in project management to deliver cost-effective manufacturing services on time and within budget. Design Integration Production 9 COM Design-in Services 3.0 Four Key Solutions for Customization Service 10 COM Module Customization Service Semi-system Integration Service As an industry leader, Advantech has provided a wide range of COM modules and design-In services to customers for years. To service more vertically-focused markets and respond various requirements, we also provide customized COM service for our customers to develop multiple applications easily. Most customers face the problem of LCD, storage device, and Wi-Fi module integration. We provide component integration services including resource matching and integration testing that can help customers to adapt and certify devices with longevity support. Services include: • Advantech proven design IPs • Design and project management • Prototype validation • Strict revision controls Services include: • Validating LCD, storage with longevity support • Certifying Wi-Fi, 3G, and Bluetooth modules • Assembling devices on carrier board and performance testing Carrier Board Design and Production Services Manufacturing Service COM customized service provides customers with comprehensive carrier board solutions, either designing a customized carrier board (ODM) based on the customer’s needs, or providing a costeffective carrier board (OEM) production service. With our help on designing and producing carrier boards, customers can focus on developing their core businesses. Advantech has great production capacity and is able to leverage resource deployment as well as maintenance. With our advantages and experience in manufacture, we deliver cost-effective manufacturing services on time and within budget. Services include: • Longevity component support • SI, PWR, QE+QA testing of module + carrier board • Accessory integration and assembly • Module + carrier board functionality testing Services include: • Highly effective production system • Flexible, high temperature, burn-in testing service • Advanced testing and inspection • Shop-Flow control system • Certified quality assurance systems Advanced Technologies High Efficiency Thermal Solution-Dynamic Heat Conduction System (DHCS) Advantech Innovative Thermal Solution - 20 °C Decrease The Dynamic Heat Conduction System is an innovative technology that benefits high-computing power SOM series products. It resolves mechanical tolerance issues and makes a tight CPU to heatsink contact, while preventing board bending and CPU damage. It offers significant heat dissipation efficiency for high-power CPUs. More effective than traditional thermal modules, DHCS provides more than 20 °C temperature drop. Embedded Software Services Key features: • Mates 100% with CPU for better heat transfer performance • Automatic CPU pressure adjustment keeps board flat • Standard screws keep assembly tight, even under vibration • Thin and compact design for space-limited systems 11 Advanced Technologies Intelligent Self-Management - iManager To fulfill the ever-changing yet specialized demands of industrial applications, Advantech has designed an intelligent self-management tool with software control functions implemented in hardware. iManager is a built-in chip solution that provides a standardized API that integrates several unique platform consolidating functions that are needed by embedded system integrators to help improve consistency, lighten the development effort, and speed-up a product’s time-to-market. Key Benefits OS-Independent Self-Management Cross-Platform Programming Intelligent Resource Management Operates independent of any OS. iManager 2.0 runs automatically without depending on any operating system; it increases stability for managing platform resources. Fan speed auto adjusts based on temperature, with multi-control interfaces for peripheral devices. System health inspection includes real-time monitoring of fan speed, temperature sensors, voltages, etc. Real-Time Response Instant reaction for real-time status monitoring. iManager 2.0 source code is a built-in, onboard embedded controller, providing faster response time for processing hardware control and interrupts. Auto-protection & System Restore Platformy Securit ***** Plug & Play Power on and run without any driver installation. iManager 2.0 works well without any software installed, easing the deployment process for developers. Multi-level failover protection quickly puts systems back in service. CPU Throttling feature automatically reduces clock frequency to lower temperature, protecting the CPU from physical damage and preventing data processing errors. Security Enhancement Boot information and data both securely protected. iManager Function Set Advanced Watchdog Multi-level Programmable Unified S/W API/ Utility Smart Fan Smart battery Brightness Control Control LCD levels Hardware Monitoring Voltage Temperature Fan speed Data Security Area 64 Bytes for customer data 8 Byte key Board Information Boot record Running hours Board data Power Saving Multi-control Interface I2C GPIO SMBus Deep sleep 12 Remote Monitoring and Management - WISE-PaaS/RMM WISE-PaaS/RMM for Remote Device Management WISE-PaaS/RMM is a value-added intelligent management agent which transforms traditional embedded systems into intelligent systems, helping shape new business models and opportunities in COM development. Key benefits of WISE-PaaS/RMM consists of efficient remote monitoring, quick recovery & backup, and real-time remote configuration. Key Benefits Embedded Software Services Embedded OS Windows Embedded We offer a ready-to-use embedded OS image that provides a complete set of components for rapid proto-typing and application development. • Windows 7 Pro/ Ult for Embedded System, Windows embedded 8/8.1 Pro, Windows 10 IoT Enterprise LTSB • XP Embedded, Windows Embedded Standard 2009, 7, and Windows Embedded 8 Standard • Windows Embedded POSReady 2009,7, Windows Embedded 8/8.1 Industry Pro for Retail, and Win10 IoT Enterprise LTSB for Retail • Windows CE4.2,5.0, 6.0, and Windows Embedded Compact 7 and 2013 Linux Linux OS is popular in the embedded market, and the fast growth of IoT is accelerating the move toward open source Linux. Advantech works with a wide range of Linux partners for integration services. Android Android gives you everything you need to build best-in-class app experiences. It gives you a single application model that lets you deploy your apps broadly to hundreds of millions of users across a wide range of devices—from phones to tablets and beyond. Wind River VxWorks VxWorks provides you with the functionality and support you require to stay competitive. And as your platform plans evolve to take advantage of next-generation processor capabilities, we continue to stay ahead of the technology curve, continually expanding VxWorks’ proficiency to extract maximum performance from the new multi-core landscape. QNX The QNXR NeutrinoR RTOS is a full-featured and robust OS that scales down to meet the constrained resource requirements of realtime embedded systems. Its true microkernel design and its modular architecture enable customers to create highly optimized and reliable systems with low total cost of ownership. 13 Application Stories New Thermal Solution Enhances Performance in Harsh Environments Introduction Test equipment requires precision and high reliability, and is used widely in demanding industries such as medical, aerospace and transportation. Usually these delicate systems are designed with highend processors that support extreme performance and collect exact test data. Since they require high computing ability in often harsh environments, thermal solution efficiency is an important factor for extreme performance. Application Requirements and Challenges Test equipment can consist of a simple computer like a tablet or portable device, or of a complicated system with a bundle of built in test instruments. A flexible configuration was required to meet wide testing device applications for different industries. These devices needed to provide real-time signal measurements, with quick, reliable data transmission to the backend system for rapid analysis. SOM5894 with i7-4700EQ is a 47W CPU module which provided perfect computing performance; it was deemed very suitable for this highend test device. In this case, however, system space was very limited, and heat could only be transfered through a short, air-flow heat sink. So the customer focused on heat conduction efficiency, the crucial factor in high CPU performance. The customer's intent was to adopt their ultimate thermal solution into different systems that could easily be migrated to new generations. Because of this multipurpose approach, there were some special challenges: 1. Top computing performance required effective heat dissipation 2. Traditional thermal modules are simple and stable, but the heat conduction path is too long 3. Ideal thermal solution should be reliable, with easy assembly and applicable to different system spaces, even portable test devices Advantech Solution and Benefits The new Dynamic Heat Conduction System (DHCS) thermal module was deemed suitable for this high end test equipment, especially considering that it is powered by a high TDP CPU. The DHCS resolved the customer’s problems without design change, and did not require any extra assembly processes. Benefits included: 1. High CPU performance: Because we shortened the heat flow path, the DHCS could conduct heat quickly from the CPU, to the heat sink, and then into the air. CPU could run at max without throttling. 2. No vibration issue for portable devices. Since DHCS uses normal screws for assembly, there is no loosening issue if the device is moved about in most application scenarios. 3. Easy execution: DCHS is compatible with traditional thermal solutions, so assembly is easy, and does not require any extra fixtures to attach it to products. Besides, DCHS was thin enough to comply with the customer’s chassis, and also suitable for a wide range of test equipment. The customer plans to use the DHCS in most of their products in the future. 4. Value-added service: If the customer requires it, Advantech can also provide the COM and thermal module pre-assembly service without design change. This can reduce the customer’s working time in adopting SOM-5894 plus heat spreader. Heat Spreader Keep Tight Assembly DHCS Deliver High Heat Transfer Performance 14 COM Express Mini Module Enables Locomotive Remote Monitoring and Diagnostic System Introduction Application Requirements and Challenges This railway system needed to provide locomotive locations, real-time status data monitoring and fault alarms, remote diagnostics, video surveillance, statistical analysis, onboard electronic records management, information sharing, and a functional interface, as well as conducting detailed analysis by calling various specialist software packages. The operating environment was demanding. Space was at a premium as well, and the system had to remain reliable in spite of constant shaking and vibration; it also had to be fanless, yet able to function under a wide range of ambient temperatures. Embedded Software Services Creating this wireless transmission platform to operate between railway locomotives and their control center required a complex system design. It needed to integrate all locomotive travel logs and alerts, as well as collect, process, and transmit data between the rolling stock and the command center. Thus, a reliable partner and integrated services were important in this case. Advantech Solution and Benefits We recommended Advantech’s COM Express mini to the customer. The dimensions of the SOM-7568 are 84mm x 55mm. Other key features of SOM-7568 are: • Intel® Pentium® and Celeron® N3000 Series SoC • Dual Channel DDR3L 1600 non-ECC onboard memory up to 4 GB • Supports HEVC/H.265, H.264 MPEG2 HW Decode • Supports: LVDS/eDP, HDMI/DisplayPort/DVI • iManager, WISE-PaaS/RMM and Embedded Software APIs Advantages: Daylight Readability and an Easy-to-use Interface The customer was more than satisfied by the SOM-7568, equipped with the latest Intel® Atom™ processor. Its significantly improved CPU performance fulfilled the target performance requirements. Environmental conditions in the transportation business, especially the vibration and shock encountered, demand rock-solid, dependable performance. The on-board memory and storage served by the COMe SOM-7568 high-precision connector provide outstanding shock resistance. In addition, the on-board storage capacity can be adjusted from 4GB to 32GB to suit different system requirements. As part of the COM express mini series, the SOM-7568 is about the size of a business card, with low power consumption, and it fully supports fanless cooling with no problem at all. It thrives across a wide range of temperatures, ensuring stable operation at different latitudes. Application Diagram 15 Product Selection SOM-5991 SOM-5897 SOM-5894 SOM-5893 SOM-5892 SOM-5890 Form Factor Model Name COM Express Basic COM Express Basic COM Express Basic COM Express Basic COM Express Basic COM Express Basic Pin-out Type COM R2.1 Type 6 Intel® Xeon® Processor D-1500 Product Family 2.0 - 1.4GHz 16/8/4/2 12/9/6/3MB 45/35/25W - COM R2.1 Type 6 6th Gen. Intel Core i7/i5/i3/ Celeron/ Xeon 2.8 - 1.9GHz 4/2 8/6/3MB 45/35/25W Intel QM170/CM236 COM R2.1 Type 6 4th Gen. Intel Core i7/i5/i3/ Celeron 2.7-1.5GHz 4/2 6/3/2MB 47/37/25W Intel QM87 COM R2.1 Type6 COM R2.0 Type 6 2nd Gen. Intel Core i7/i5/i3/ Celeron 2.5 - 1.4GHz 4/2/1 6/4/3/2/1.5MB 45/35/25/17W Intel QM67 DDR4-2400 DDR4-2133 DDR3L 1600/1333 Support 32GB 32GB B1 version only 16GB 2.7 - 2.2GHz 4/2 4/2MB 35W/17W A77E DDR3 2133 ; DDR3L 1866/1600 16GB COM R2.0 Type 6 3rd Gen. Intel Core i7/i5/i3/ Celeron 2.7-1.4GHz 4/2/1 6/4/3/2/1MB 45/35/25/17W Intel QM77 DDR3/DDR3L 1600/1333 B1 version only 16GB 2 x 260P SODIMM - 2 x 260P SODIMM Intel® HD Graphics 1000 - 950MHz 1 LVDS 2-CH 18/24-bit BOM optional eDP 2 Up to 3 3 1 8 - 2 x 204P SODIMM Intel HD Graphics 1GHz - 900MHz 1 2 x 204P SODIMM AMD Radeon HD9000 686MHz 1 2 x 204P SODIMM Intel HD Graphic 1GHz - 900MHz 1 2 x 204P SODIMM Intel HD Graphic 1.1GHz - 800MHz 1 LVDS 2-CH 18/24-bit LVDS 2-CH 18/24-bit LVDS 2-CH 18/24-bit LVDS 2-CH 18/24-bit 3 4 3 3 Dual/Triple 1 7 - Dual/Triple/Quad 1(option) 7 - 1 Dual/Triple 1 7 - 1 Dual 1 7 - CPU Processor System Base Frequency Processor Core LLC CPU TDP Chipset Technology Memory ECC Support Max. Capacity Socket Controller Max. Frequency VGA LCD (TTL/LVDS/eDP) Graphics Expansion Serial Bus Ethernet - AMD R-Series Bald Eagle DDR3 1333/1066 B1 version only 16GB DDI (HDMI/DVI/DisplayPort) SDVO TV-out Multiple Displays PCIe x16 PCIe x1 PCI Masters 1 8 - PCI Masters 2 - - - - - ISA Bus LPC SMBus I2C Bus 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 - CAN Bus - - - - - - Controller Speed i201AT 10/100/1000Mbps i219LM 10/100/1000Mbps Intel i217LM 10/100/1000Mbps Intel i211AT 10/100/1000 Mbps Intel 82579LM 10/100/1000Mbps Intel 82579LM 10/100/1000Mbps 4 4 4 4 4 4 SATA PATA Channel USB3.0 USB2.0 Audio SPI Bus GPIO SDIO (GPIO pin shared) Watchdog COM Port LPT/FDD PS/2 IR Onboard Storage TPM Power Type 4 4 4 4 4 4 8 8 4 8 8 HD Audio HD Audio HD Audio HD Audio HD Audio 1 1 1 1 1 8 8 8 8 8 8 I/O 1 1 1 1 1 1 2 (2-wire) 2 (2-wire) 2 (2-wire) 2 (2-wire) 2 (2-wire) 2 (2-wire) Optional Optional Optional Optional Optional ATX: Vin, VSB, AT: Vin ATX: Vin, VSB, AT: Vin ATX: Vin, VSB, AT: Vin ATX: Vin, VSB, AT: Vin ATX: Vin, VSB, AT: Vin ATX: Vin, VSB, AT: Vin Vin: 8.5-20V Vin: 8.5-20V Vin: 8.5-20V, Vin: 8.5-20V Vin: 11.4-12.6V, Vin:8.5-20V, Supply Voltage VSB: 4.75-5.25V VSB: 4.75-5.25V VSB: 4.75-5.25V VSB: 4.75-5.25V VSB: 4.75-5.25V VSB: 4.75-5.25V Power Power Consumption Max. TBD TBD 41.8 Watt 39.6 Watt 41.8 Watt 42.8 Watt Power Consumption Idle TBD TBD 8.5 Watt 16.8 Watt 5.4 Watt 9.6 Watt Environment Operating Temp. 0 ~ 60 °C (32 ~ 140 °F) 0 ~ 60 °C (32 ~ 140 °F) 0 ~ 60 °C (32 ~ 140 °F) 0 ~ 60 °C (32 ~ 140 °F) 0 ~ 60 °C (32 ~ 140 °F) 0 ~ 60 °C (32 ~ 140 °F) 125 x 95mm 125 x 95mm 125 x 95mm 125 x 95 mm 125 x 95mm 125 x 95mm Mechanical Dimensions (4.92" x 3.74") (4.92" x 3.74") (4.92" x 3.74") (4.92'' x 3.74") (4.92" x 3.74") (4.92" x 3.74") 16 SOM-6896 SOM-6894 SOM-6868 SOM-6867 SOM-6765 COM Express Compact COM Express Compact COM Express Compact COM Express Compact COM Express Compact COM R2.1 Type 6 6th Gen. Intel Core i7/i5/i3/Celeron U-Series 2.6 - 2.0GHz 2 4/3/2MB 15W - COM R2.1 Type 6 COM R2.1 Type 6 Intel® Pentium®/Celeron® N3000 Series and Atom™ SoC 1.6 - 1.04GHz 4/2 2MB 6/5/4W - COM R2.0 Type 6 COM R2.0 Type 2 Intel Atom E3800 & Celeron J1900 Intel Atom D2550/N2600/ N2800 1.9-2.2GHz 2 4/3/2 MB 15W N/A COM R2.1 Type 6 4th Gen. Intel Core i7/i5/i3/Celeron (U-Processor Line) 1.9 - 1.6GHz 2 4/3/2MB 15W - 1.91/ 2.0GHz 4 2MB 10W - 1.86 - 1.6GHz 2 1MB 10/6.5/3.5W Intel NM10 DDR3L-1600 DDR3L 1600 MHz DDR3L 1600/1333 DDR3L-1600 DDR3L 1333 DDR3 1066/800 16GB 16GB 16GB 8GB 8GB 4GB/2GB 2 x 204P SODIMM Intel® HD Graphics 1050 - 900MHz 1 LVDS 2-CH 18/24-bit BOM optional eDP 1 Up to 2 3 5 Controllers, 8 Lanes - 2 x 204P SODIMM Intel® HD Graphics 1GHz-850MHz 1 2 x 204P SODIMM Intel HD Graphic 1.1 - 1GHz 1 2 x 204P SODIMM Intel HD Graphic 688MHz 1 LVDS 2-CH 18-bit/24-bit LVDS 2-CH 18/24-bit 1 x 204P SODIMM Intel GMA3650/3600 640 - 400MHz 1 D Series: LVDS 1-CH 18/24-bit N Series: LVDS 1-CH 18-bit Intel 5th Generation Core i Processor 2 (DDI2 for option) - Dual/Triple 4 - 2 (DDI 2: Optional) Dual/Triple 4 - 2 x 204P SODIMM Intel® HD Graphics 700 MHz 1 LVDS 2-CH 18/24-bit BOM optional eDP 1 BOM optional 2 3 5 - - - - 1 1 1 1 (24MHz) 1 1 1 1 1 LVDS 2-CH 18-bit/24-bit 2 2 Dual 3 - Dual 2 (Optional 4) 4 - - - 1 1 1 1 1 1 1 1 1 - - - - 1 - i219LM 10/100/1000Mbps 3 (Sku dependency) 4 8 HD Audio 1 8 1 2 (2-wire) Optional ATX: Vin, VSB, AT: Vin Vin: 8.5-20V VSB: 4.75-5.25V TBD TBD 0 ~ 60 °C (32 ~ 140 °F) 95 x 95 mm (3.74" x 3.74") Intel i218LM 10/100/1000Mbps Intel i218LM 10/100/1000Mbps i211AT 10/100/1000 Mbps Intel i210 10/100/1000 Mbps Intel 82583V 10/100/1000 Mbps 4 4 2 2 2 2 8 HD Audio 2 8 HD Audio 1 8 1 2 (2-wire) ATX: Vin, VSB, AT: Vin Vin: 4.75-20V, VSB: 4.75-5.25V 21.7W 4.4W 0 ~ 60 °C (32 ~ 140 °F) 95 x 95 mm (3.74" x 3.74") 4 8 HD Audio 1 8 SD3.0 1 2 (2-wire) Optional ATX: Vin, VSB, AT: Vin Vin: 4.75-20V VSB: 4.75-5.25V TBD TBD 0 ~ 60 °C (32 ~ 140 °F) 95 x 95 mm (3.74" x 3.74") 1 8 HD Audio 1 8 HD Audio 1 8 1 ATX: Vin, VSB, AT: Vin Vin: 11.4-12.6V, VSB: 4.75-5.25V 10.3 W 7.06 W 0 ~ 60 °C (32 ~ 140 °F) 95 x 95 mm (3.74" x 3.74") 8 1 2 (2-wire) Yes ATX: Vin, VSB, AT: Vin Vin: 4.75-20V VSB: 4.75-5.25V 21.9W 3.3W 0 ~ 60 °C (32 ~ 140 °F) 95 x 95 mm (3.74'' x 3.74") 8 1 2 (2-wire) 1 (option) ATX: Vin, VSB, AT: Vin Vin: 4.75-20V VSB: 4.75-5.25V TBD TBD 0 ~ 60 °C (32 ~ 140 °F) 95 x 95 mm (3.74'' x 3.74") Embedded Software Services SOM-6897 COM Express Compact 17 Product Selection SOM- 7568 SOM-7567 SOM-7565 SOM-5790 SOM-9890 Form Factor Model Name COM Express Mini COM Express Mini COM Express Mini COM Express Basic COM Express Basic Pin-out Type COM R2.1 Type 10 Intel Pentium N3700/N3710 Intel Celeron 3160/N3060/ N3010 Intel Atom™ X5-E8000 1.6/1.04GHz 4/2 2MB 6/5/4W Dual Channel DDR3L-1600 8GB COM R2.1 Type 10 COM R2.1 Type 10 COM R2.0 Type 2 COM R2.0 Type 6 Intel Atom E3845/E3825/E3815 Intel Celeron J1900/N2930 Intel Atom N2800/N2600 2nd Gen. Intel Core i7/i5/i3/Celeron 3rd Gen. Intel Core i7/i5/i3/Celeron 1.33~2GHz 4/2/1 2/1/512KB 10/7.5/6/5W DDR3L 1333/1066 4GB 1.86 - 1.6 GHz 2 1MB 6.5/3.5W Intel NM10 DDR3 1066/800 4GB/2GB 2.5 - 1.4GHz 4/2/1 6/4/3/2/1.5MB 45/35/25/17W Intel QM67 DDR3 1333/1066 16GB 2.7-2.2GHz 4/2 6/3/2MB 45/35W Intel QM77 DDR3/DDR3L 1600/1333 16GB Onboard Intel HD Graphics 792-854MHz - Onboard Intel GMA3650/3600 640 - 400MHz - 2 x 204P SODIMM Intel HD Graphic 1.1GHz - 800MHz 1 2 x 204P SODIMM Intel HD Graphic 1GHz - 900MHz 1 LVDS 1-CH 18/24-bit LVDS 1-CH 18-bit LVDS 2-CH 18/24-bit LVDS 2-CH 18/24-bit 1 1 1 - 3 Dual 3 1 1 1 Dual 3 (Optional 4) 1 1 1 Dual 3 (Optional 4) 1 1 1 1 Dual 5 4 1 1 1 1 Dual/Triple 1 7 1 1 1 CPU Processor System Memory Base Frequency Processor Core LLC CPU TDP Chipset Technology ECC Support Max. Capacity Socket Controller Max. Frequency VGA LCD (TTL/LVDS/eDP) Graphics Expansion Serial Bus DDI (HDMI/DVI/DisplayPort) SDVO TV-out Multiple Displays PCIe x16 PCIe x1 PCI Masters ISA Bus LPC SMBus I2C Bus CAN Bus Ethernet 18 Controller Speed SATA PATA Channel USB3.0 USB2.0 Audio SPI Bus GPIO SDIO (GPIO pin shared) Watchdog COM Port LPT/FDD PS/2 IR Onboard Storage TPM Power Type Onboard Intel HD Graphics 320-700MHz LVDS 2-CH 18/24-bit BOM optional eDP - Optional - - - Intel® i210AT Speed 10/100/1000 Mbps 2 Intel i210E 10/100/1000 Mbps 1 (Optional 2) 1 4 HD Audio 1 8 1 2 (2-wire) SLC/MLC SSD ATX: Vin, VSB, AT: Vin Intel 82574L 10/100/1000 Mbps 1 (Optional 2) 8 HD Audio 1 8 1 2 (2-wire) SLC/MLC SSD ATX: Vin, VSB, AT: Vin Intel 82579LM 10/100/1000Mbps 4 1 8 HD Audio 1 8 1 ATX: Vin, VSB, AT: Vin Intel 82579LM 10/100/1000Mbps 4 4 8 HD Audio 1 8 1 2 (2-wire) Optional ATX: Vin, VSB, AT: Vin 2 8 HD Audio 1 I/O 1 2 (2-Wire) ATX: Vin, VSB, AT: Vin Vin: 4.75 (5-5%) ~ 20V Supply Voltage (19+5%), VSB: 5V±5%, RTC Power Battery: 2.0-3.3V Power Consumption Max. 7.29 Watt Power Consumption Idle 3.05 Watt Operating Temp. 0 ~ 60 °C (32 ~ 140 °F) Environment Extended Temp. (Optional) - Vin: 4.75-20V, VSB: 4.75-5.25V Vin: 4.75-20V, VSB: 4.75-5.25V Vin: 11.4-12.6V, VSB: 4.75-5.25V Vin: 11.4-12.6V, VSB: 4.75-5.25V 16.56 Watt 8.04 Watt (E3845) 0 ~ 60 °C (32 ~ 140 °F) -40 ~ 85 °C (-40 ~ 185 °F) 8.64 Watt. 6.96 Watt. 0 ~ 60 °C (32 ~ 140 °F) -40 ~ 85 °C (-40 ~ 185 °F) 40.1 Watt 11.4 Watt 0 ~ 60 °C (32 ~ 140 °F) - 41.8 Watt 4.7 Watt 0 ~ 60 °C (32 ~ 140 °F) - Mechanical Dimensions 84 x 55 mm (3.3" x 2.17") 84 x 55mm (3.3" x 2.17") 125 x 95mm (4.92" x 3.74") 125 x 95mm (4.92" x 3.74") 84 x 55 mm (3.3" x 2.17") SOM-3567 SOM-3565 SOM-4466 Qseven Qseven Qseven ETX SOM-4455 ETX Qseven 2.0 Qseven 2.0 Qseven R1.2 ETX 3.0 ETX 3.0 Intel Pentium N3710 Intel Celeron N3160/N3060/N3010 Intel Atom™ X5-E8000 Intel Atom/Celeron E3800/J1900/N2900 Series SoC Intel Atom N2600 AMD G-Series T56N/T40E/T16R AMD LX800 1.6 - 1.04GHz 4/2 2MB 6/5/4W DDR3L-1600 8GB 1.91 - 1.33GHz 4/2 2/1MB 10/8/6/4.3W DDR3L-1333/1066 4GB 1.6GHz 2 1MB 3.5W Intel NM10 DDR3 800 2GB 615MHz-1G 1 512KB 4.5/6.4/18W AMD A55E DDR3 1066 4GB 500MHz 1 128KB 3.6W AMD CS5536 DDR 400/333 1GB Onboard Intel® HD Graphics 320-700MHz LVDS 2-CH 18/24-bit BOM optional eDP Onboard Intel® HD Graphics 792 - 400MHz - Onboard Intel GMA3600 400MHz - LVDS 2-CH 18/24-bit LVDS 1-CH 18-bit 1 x 204P SODIMM AMD Radeon HD6320/HD6250 276MHz 1 LVDS 1-CH 18/24-bit TTL 1-CH 18-bit 1 x 200P SODIMM AMD LX800 1 LVDS 1-CH 18/24-bit TTL 1-CH 18-bit 2 1 1 - - Dual/Triple 3 (Optional 4) 1 1 1 Dual 3 (Optional 4) 1 1 1 Dual 3 (Optional 4) 1 1 1 Dual 4 1 1 1 Dual 4 1 1 1 - - - - - i211AT 10/100/1000 Mbps 2 Up to 3 4 (optional 5) HD Audio 1 SD3.0 1 1 (4-wire) eMMC4.51 up to 32GB ATX: Vin, VSB, AT: Vin I211IT 10/100/1000 Mbps 2 1 6 HD Audio 1 SD3.0 1 1 (4-wire) eMMC4.51 up to 32GB ATX: Vin, VSB, AT: Vin Intel 82574L 10/100/1000 Mbps Up to 2 8 HD Audio 1 8 1 1 (2-wire) SLC/MLC SSD ATX: Vin, VSB, AT: Vin Realtek RTL8105E 10/100 Mbps 2 2 4 HD Audio 1 1 2 1 KB/MS 1 mSATA socket ATX: Vin, VSB, AT: Vin Realtek RTL8100CL 10/100Mbps 2 2 4 Line-in/Line-out/MIC 1 1 2 1 KB/MS 1 CF socket ATX: Vin, VSB, AT: Vin Vin: 4.75-5.25V VSB: 4.75-5.25V Vin: 4.75-5.25V VSB: 4.75-5.25V Vin: 4.75-5.25V, VSB: 4.75-5.25V Vin: 4.75-5.25V, VSB: 4.75-5.25V Vin: 4.75-5.25V, VSB: 4.75-5.25V 6.85 Watt 3.04 Watt 0 ~ 60 °C (32 ~ 140 °F) -40 ~ 85 °C (-40 ~ 185 °F) TBD TBD 0 ~ 60 °C (32 ~ 140 °F) -40 ~ 85 °C (-40 ~ 185 °F) 7.8 Watt. 4.9 Watt. 0 ~ 60 °C (32 ~ 140 °F) -40 ~ 85 °C (-40 ~ 185 °F) 7.75 Watt. 6.1 Watt. 0 ~ 60 °C (32 ~ 140 °F) -40 ~ 85 °C (-40 ~ 185 °F) 10.05 Watt. 9.0 Watt. 0 ~ 60 °C (32 ~ 140 °F) -20~80 °C (-4~176 °F) 70 x 70 mm (2.75" x 2.75") 70 x 70 mm (2.75" x 2.75") 70 x 70mm (2.75" x 2.75") 114 x 95 mm (3.74" x 4.5") 114 x 95 mm (3.74" x 4.5") Embedded Software Services SOM-3568 19 COM Solutions and Services • Faster Time-to-Market • Flexible to Customer Demands • Simplify System Design Complexity • Enhance System Reliability • Time and Resources Saving • Quality Assurance Regional Service & Customization Centers China Taiwan Kunshan 86-512-5777-5666 Taipei 886-2-2792-7818 Netherlands Eindhoven 31-40-267-7000 Poland Warsaw 48-22-33-23-730 USA Milpitas, CA 1-408-519-3898 Worldwide Offices Greater China Asia Pacific Europe Americas China Beijing Shanghai Shenzhen Chengdu Hong Kong 800-810-0345 86-10-6298-4346 86-21-3632-1616 86-755-8212-4222 86-28-8545-0198 852-2720-5118 Japan Tokyo Osaka 0800-500-1055 81-3-6802-1021 81-6-6267-1887 Korea Seoul 080-363-9494 82-2-3663-9494 Taiwan Neihu Xindian Taichung Kaohsiung 0800-777-111 886-2-2792-7818 886-2-2218-4567 886-4-2329-0371 886-7-229-3600 Singapore Singapore 65-6442-1000 France Paris 33-1-4119-4666 Malaysia Kuala Lumpur Penang 1800-88-1809 60-3-7725-4188 60-4-537-9188 Italy Milano 39-02-9544-961 Europe 00800-2426-8080 Germany Münich Hilden/ D'dorf 49-89-12599-0 49-2103-97-885-0 North America Cincinnati Milpitas Irvine 1-888-576-9668 1-513-742-8895 1-408-519-3898 1-949-420-2500 Mexico Mexico 1-800-467-2415 52-55-6275-2777 Brazil São Paulo 0800-770-5355 55-11-5592-5355 Benelux & Nordics 31-76-5233-100 Breda Indonesia Jakarta 62-21-751-1939 UK Reading 44-0118-929-4540 Thailand Bangkok 66-2-248-3140 48-22-33-23-740/741 India Pune Bangalore 1800-425-5071 91-20-3948-2075 91-80-2545-0206 Poland Warsaw 8-800-555-01-50 7-495-644-0364 7-812-332-5727 Australia Melbourne Sydney 1300-308-531 61-3-9797-0100 61-2-9476-9300 Russia Moscow St. Petersburg www.advantech.com Please verify specifications before ordering. This guide is intended for reference purposes only. All product specifications are subject to change without notice. No part of this publication may be reproduced in any form or by any means, electronic, photocopying, recording or otherwise, without prior written permission of the publisher. All brand and product names are trademarks or registered trademarks of their respective companies. © Advantech Co., Ltd. 2016 8600000245