RoHS Compliant ClearONE Terminator Reliability Test

RoHS COMPLIANT RELIABILITY
TEST DATA
RoHS Compliant - CTS ClearONE
Terminator Reliability Test Data
© 2006 CTS Corporation. All rights reserved. Information subject to change.
CTS Electronic Components
1
3/8/2006
RoHS COMPLIANT RELIABILITY
TEST DATA
Table of Contents
RoHS Compliant CTS ClearONE Terminator Reliability Test Data ...................................................1
Table of Contents...................................................................................................................................2
List of Tables..........................................................................................................................................2
RoHS Compliant BGA Resistor Array Design Validation Test Plan .................................................3
Design Verification Plan & Report................................................................................................4
Assembly Process Component Classification............................................................................5
Thermal Cycle Testing...........................................................................................................................6
Device Details .................................................................................................................................6
Test Board Details..........................................................................................................................6
Test Board Assembly Steps..........................................................................................................8
Test Details .....................................................................................................................................8
Failure criteria.................................................................................................................................9
Test Results ....................................................................................................................................9
1.00mm Pitch Groups ....................................................................................................................9
Characteristic Life for 1.00mm Pitch Groups............................................................................10
Weibull Plot of Product-Limit Survival Fit for 3x9 Baseline ..................................................10
Weibull Plot of Product-Limit Survival Fit for 3x9 .................................................................10
Weibull Plot of Product-Limit Survival Fit for 4x9 Baseline ..................................................11
Weibull Plot of Product-Limit Survival Fit for 4x9 .................................................................11
1.27mm Pitch Groups ..................................................................................................................12
Characteristic Life for 1.27mm Pitch Group1.27mm Pitch Groups.........................................13
Weibull Plot of Product-Limit Survival Fit for 4x9 Baseline ..................................................13
Weibull Plot of Product-Limit Survival Fit for 4x9 .................................................................13
Ball Shear Testing................................................................................................................................14
Ball Co-Planarity ..................................................................................................................................16
Vanguard Co-Planarity Data .................................................................... Error! Bookmark not defined.
List of Tables
Table 1 – DV Plan...................................................................................................................................3
Table 2 – DESIGN VERIFICATION PLAN & REPORT..........................................................................4
Table 3 – Test Board Measured Tg and CTE.........................................................................................6
Table 4 – Stencil Thickness and Aperture Opening ...............................................................................7
Table 5 – 1.0mm Measured Paste Test Results ....................................................................................7
Table 6 – 1.27mm Measured Paste Test Results ..................................................................................7
Table 7 – Shape and Characteristic Life of 1mm pitch groups...............................................................9
Table 8 – Shape and Characteristic Life of 1.27mm pitch groups........................................................12
© 2006 CTS Corporation. All rights reserved. Information subject to change.
CTS Electronic Components
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3/8/2006
RoHS COMPLIANT RELIABILITY
TEST DATA
RoHS Compliant BGA Resistor Array Design Validation Test Plan
Table 1 below lists the tests performed as part of the Design Validation Test Plan.
Table 1 – DV Plan
Test Name
Max
Resistance
Change
Thermal Cycling (Joint Integrity)
N/A
Standard
Method
Test
Condition
JESD22A104-B
J, Soak
Mode 2
Test Description
>33% part failure rate # cycles, 0°C to +100°C,
5 Minute Dwell, continuous data collection to 100%
failure point
Thermal Cycling (Resistors)
0.50%
MIL-STD202G, Method
107G
B
5 cycles, -65°C to +125°C
Short Time Overload
0.50%
MIL-PRF83401 Para
4.8.10
-
2 ½ x rated voltage, 5 sec, (50V Max.) 1.5 watt
max. per package, 0.06watt/resistor
Moisture Resistance
0.50%
MIL-STD202G, Method
106G
-
240 hours, 0.1 rated load, -10°C to 65°C, 90% RH
1 watt max. package, 0.04watt @70C
Load Humidity
1.00%
MIL-STD202G, Method
103B
-
1,000 hours, 0.1 rated load, 70 °C, 85-92% RH
High Temp Exposure
1.00%
MIL-PRF83401 Para
4.8.19
-
240 hours, no load @ 125 °C
Load Life
1.00%
MIL-STD202G, Method
108A
F
2,000 hours @ 70°C, rated load with forced air
circulation.
Resistance to Solder Heat
0.25%
IPC/JEDEC
J-STD-020A
I
Convection Reflow: 260°C Peak
20-40 seconds above 255°C
60-150 seconds above 217°C
Mechanical Shock
0.25%
MIL-STD202G, Method
213D
I
100g, 1 msec., 3 shocks each plane
Low Temp Storage
0.25%
MIL-PRF83401 Para
4.8.20
-
24 hours @ -65°C, no load
Low Temperature Operation
0.25%
MIL-PRF83401 Para
4.8.9
-
24 hours @ -65°C, full load
200 ppm/°C
MIL-STD202G, Method
304
-
-55°C to +125°C
UL 94
-
UL 94V-0
MIL-STD202G, Method
215K
-
TCR
Flammability
Resistance to Solvents
© 2006 CTS Corporation. All rights reserved. Information subject to change.
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3/8/2006
RoHS COMPLIANT RELIABILITY
TEST DATA
Design Verification Plan & Report
Table 2 – DESIGN VERIFICATION PLAN & REPORT
SYSTEM:
ASSEMBLY
PROGRAM: ClearONE RoHS
BGA
TEST REPORT NO.
BL#22422 & #22423
RESISTANCE
25 Ohm – 475 Ohm
DESIGN ENG.:
S. Hreha
REMARKS
# OF RESISTORS/PART
18-27
DATE OPEN: 12/02/05
TEST
NAME/SOURCE
ACCEPT.
TEST RESULTS
SAMPLE SIZE
REQ'D
PART
ID NO.
START
COMP.
DATE
DATE
PASS/
FAIL
Thermal Shock/
Thermal Cycle
(Resistors)
Max. Delta
R = 0.5%
Min. -0.009%
Avg. 0.004%
Max. 0.014%
10 parts with
18-27 resistors
per part
N1N10
12/08/05
12/08/05
PASS
Short Time
Overload
Max. Delta
R = 0.5%
Min. -0.043%
Avg. -0.014%
Max. 0.006%
10 parts with
18-27 resistors
per part
N1N10
2/8/06
2/8/06
PASS
Moisture
Resistance
Max Delta
R =0.5%
Min. -0.035%
Avg. -0.009%
Max. 0.029%
10 parts with
18-27 resistors
per part
N41 to
N50
12/16/05
12/26/05
PASS
Load Humidity
(0.9V per Resistor)
250 hr
Max Delta
R =1.0%
Min. -0.017%
Avg. -0.008%
Max. 0.082%
10 parts with
18-27 resistors
per part
N51 to
N60
12/26/05
1/06/06
PASS
500 hr
Max Delta
R =1.0%
Min. -0.007%
Avg. -0.019%
Max. 0.082%
10 parts with
18-27 resistors
per part
N51 to
N60
12/26/05
1/16/06
PASS
1000 hr
Max Delta
R =1.0%
Min. 0.008%
Avg. 0.038%
Max. 0.104%
10 parts with
18-27 resistors
per part
N51 to
N60
12/9/05
12/19/05
PASS
CRITERIA
Load Humidity BL21731 (0.9V per Resistor)
250 hr
Max Delta
R =1.0%
Min. -0.015%
Avg. 0.002%
Max. 0.023%
10 parts with
18-27 resistors
per part
N1 to
N10
12/26/05
1/06/05
PASS
500 hr
Max Delta
R =1.0%
Min. 0.002%
Avg. 0.024%
Max. 0.058%
10 parts with
18-27 resistors
per part
N1 to
N10
12/26/05
1/16/06
PASS
1000 hr
Max Delta
R =1.0%
Min. -0.007%
Avg. 0.027%
Max. 0.086%
10 parts with
18-27 resistors
per part
N1 to
N10
12/26/05
2/6/06
PASS
High Temp
Exposure
Max Delta
R =1.0%
Min. -0.030%
Avg. -0.007%
Max. 0.018%
10 parts with
18-27 resistors
per part
N11N20
12/9/05
12/19/05
PASS
250 hr
Max Delta
R =1.0%
Min. -0.049%
Avg. -0.029%
Max. 0.005%
10 parts with
18-27 resistors
per part
N61N70
12/15/05
12/26/05
PASS
500 hr
Max Delta
R =1.0%
Min. -0.044%
Avg. -0.024%
Max. 0.014%
10 parts with
18-27 resistors
per part
N61N70
12/15/05
1/05/06
PASS
1000 hr
Max Delta
R =1.0%
Min. -0.041%
Avg. -0.014%
Max. 0.025%
10 parts with
18-27 resistors
per part
N61N70
12/15/05
1/26/06
PASS
2000 hr
Max Delta
R =1.0%
Min. -0.043%
Avg. -0.018%
Max. 0.030%
10 parts with
18-27 resistors
per part
N61N70
12/15/05
3/08/06
PASS
Resistance to
Solder Process
Max Delta
R =0.25%
Min. 0.000%
Avg. 0.037%
10 parts with
18-27 resistors
N11N20
2/3/06
2/6/06
PASS
Load Life
© 2006 CTS Corporation. All rights reserved. Information subject to change.
CTS Electronic Components
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3/8/2006
RoHS COMPLIANT RELIABILITY
TEST DATA
Table 2 – DESIGN VERIFICATION PLAN & REPORT
SYSTEM:
ASSEMBLY
PROGRAM: ClearONE RoHS
BGA
TEST REPORT NO.
BL#22422 & #22423
RESISTANCE
25 Ohm – 475 Ohm
# OF RESISTORS/PART
18-27
DATE OPEN: 12/02/05
TEST
NAME/SOURCE
TEST RESULTS
SAMPLE SIZE
REQ'D
ACCEPT.
CRITERIA
Heat
Max. 0.210%
per part
DESIGN ENG.:
S. Hreha
REMARKS
PART
ID NO.
START
COMP.
DATE
DATE
PASS/
FAIL
Mechanical Shock
Max Delta
R =0.25%
Min. -0.038%
Avg. -0.014%
Max. 0.005%
10 parts with
18-27 resistors
per part
N21N30
1/17/06
1/17/06
PASS
Low Temp
Storage
Max Delta
R =0.25%
Min. -0.014%
Avg. 0.000%
Max. 0.020%
10 parts with
18-27 resistors
per part
N11N20
1/16/06
1/17/06
PASS
Low Temp
Operation
Max Delta
R =0.25%
Min. -0.018%
Avg. -0.004%
Max. 0.012%
10 parts with
18-27 resistors
per part
N1N10
2/07/06
2/07/06
PASS
TCR Cold
Max Delta
R =200
PPM
Min. 48 PPM/C
Avg. 65 PPM/C
Max. 85 PPM/C
10 parts with
18-27 resistors
per part
N1N10
12/15/05
12/20/05
PASS
TCR HOT
Max Delta
R =200
PPM
Min. 95 PPM/C
Avg. 109 PPM/C
Max. 132 PPM/C
10 parts with
18-27 resistors
per part
N1N10
12/15/05
12/20/05
PASS
Flammability
V0
NR
10 parts with
18-27 resistors
per part
N31N40
2/08/06
2/08/06
PASS
Solvent
Resistance
No physical
damage
NR
10 parts with
18-27 resistors
per part
N31N40
1/16/06
1/16/06
PASS
Assembly Process Component Classification
ƒ
These components have been evaluated per IPC/JEDEC J-STD-020C
Moisture Sensitivity, LEVEL 1 unlimited at 30°C/90% RH
Soldering Process, LEVEL 1:IR/Convection Reflow 255-260°C, 20-40 seconds.
Chemical Compatibility, LEVEL 1.
© 2006 CTS Corporation. All rights reserved. Information subject to change.
CTS Electronic Components
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3/8/2006
RoHS COMPLIANT RELIABILITY
TEST DATA
Thermal Cycle Testing
Device Details
ƒ
The device is a Ceramic BGA package.
ƒ
Solder ball is copper with a Sn/Ni plating; the ball diameter is .030” for the 1.27mm pitch
packages and 0.025” diameter for the 1.0mm pitch packages.
ƒ
The package substrate is 96% alumina solid ceramic with filled vias.
ƒ
Package properties:
CTE of package is 5.9 x 10-6 in/in/°C in the X direction
CTE of package is 5.6 x 10-6 in/in/°C in the Y direction
Young’s Modulus is 330 GPa
Test Board Details
ƒ
Material is FR4 board with 3/8-ounce copper. Thickness is 0.062 inch. Number of layers is
one. Size is 1 inch by 2 ¾ inch.
ƒ
Solder pad designed size,
ƒ
Pad type for all groups is non-solder mask defined style (NSMD).
ƒ
Designed solder mask clearance is 0.001 inch. Measured clearance is –0.001 to 0.002 inch.
PCB supplier applied a solder mask over the exposed trace.
ƒ
Trace designed width is 0.010 inch and space is 0.029 inch. Measured width and space is
0.010 inch width and 0.028 inch spaces.
ƒ
Measured Tg and CTE (above and below Tg)
1.00mm: 0.020 inch diameter (actual 0.18 inch diameter)
1.27mm: 0.020 inch diameter (actual 0.18 inch diameter)
Table 3 – Test Board Measured Tg and CTE
Sample
CTE below Tg
CTE above Tg
Orientation
(mm/mm °C)
(mm/mm °C)
X
8.3 X 10-6
7.5 X 10-6
-6
Y
14.1 X 10
12.0 X 10-6
-6
Z
5.0 X 10
25.0 X 10-6
Tg (°C)
135.7
135.2
135.2
A thermo-mechanical analyzer (TMA) was used to perform the analysis.
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RoHS COMPLIANT RELIABILITY
TEST DATA
Solder Paste Type
ƒ
Water-Soluble paste, mildly activated. Indium WMA-SMQ 65
ƒ
The paste is an 90% solids version using –325 to +500 mesh size spherical powder of
63/37 Sn/Pb alloy. Type 3.
ƒ
Eutectic solder was selected for device attach so that the Baseline and Lead-Free Test
groups would each see the same attach processes and temperatures. This allows for
comparison of the device failure modes.
Stencil Thickness and Aperture Opening (Desired Properties)
Table 4 – Stencil Thickness and Aperture Opening
Pitch
Stencil Thickness
Aperture Opening
1.27mm
.006”
1:1 with land pad (.025”)
1.00mm
.006”
1:1 with land pad (.020”)
Note: Stencil aperture is dependent on solids loading, printing conditions including squeegee type,
and squeegee speed.
Measured paste dimensions
Table 5 – 1.0mm Measured Paste Test Results
Measured Paste
Dimensions
Theoretical
Ave.
Min.
Max.
Range
Std. Dev.
Thickness
(mils)
6
3.87
3.45
4.44
.99
.29
Volume
3
(mils )
1,884
1089
869
1381
512
148
Area
2
(mils )
314
280
233
311
78
17
Table 6 – 1.27mm Measured Paste Test Results
Measured Paste
Dimensions
Theoretical
Ave.
Min.
Max.
Range
Std. Dev.
Thickness
(mils)
6
3.88
3.25
4.21
.96
0.24
Volume
3
(mils )
2,946
1395
1112
1572
638
150
Area
2
(mils )
491
359
332
400
68
17
© 2006 CTS Corporation. All rights reserved. Information subject to change.
CTS Electronic Components
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3/8/2006
RoHS COMPLIANT RELIABILITY
TEST DATA
Test Board Assembly Steps
1.
2.
3.
4.
5.
6.
Stencil solder paste
Place parts in placement machine
Load parts into nozzle
Place on PCB
Reflow per IPC/JEDEC J-STD-020C, Level 1 profile.
Batch clean in DI H2O (resistivity requirement: 2-8 M ohm)
Air dry.
Profile Temp.
Tin Lead (Sn-Pb) Profile
Reflow Profile per IPC/JEDEC J-STD-020C
Reflow Temp.
Peak Temp.
300
275
250
Temperature in °C
225
200
175
150
125
100
75
50
25
0
5
25
45
65
85
105
125
145
165
185
205
225
245
265
Time in Seconds
Note:
This profile was used for test board processing with eutectic solder. Assembly with lead-free
solders will require a different profile. Each assembly site must establish a profile that works
best in their unique application.
Test Details
ƒ
ƒ
ƒ
Sample size: 32-piece minimum per group (1mm & 1.27mm) tested.
Temperature cycle condition and temperature profile plot measured at board surface
Extended thermal cycle test conditions:
ƒ Low temperature: 0 -0/-5°C
ƒ High temperature: 100 -0/-5°C
ƒ Dwell time at High temperature: 5 minutes
ƒ Environmental transition time = 10-15 seconds, UUT transition time = 4-6 minutes.
ƒ Dwell time at Low temperature: 5 minutes.
T-Device
T-Environment
110
100
90
Temperature in °C
80
70
60
50
40
30
20
10
0
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
Time in Minutes
ƒ
ƒ
Threshold resistance was nominal plus 10%. The resistance readings were monitored with a Cable
Scan Series 90. Each part was monitored every 1 minute and 58 seconds.
The testing was done in a double zone chamber.
© 2006 CTS Corporation. All rights reserved. Information subject to change.
CTS Electronic Components
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RoHS COMPLIANT RELIABILITY
TEST DATA
Failure criteria
ƒ
ƒ
Open circuit (i.e. any resistance reading >100 Ohms)
Any instance of measured resistance value exceeding the threshold resistance value (R>100
Ohms) shall be considered as OPEN. An OPEN followed by 10 additional OPENS within 10% of
the time of the 1st OPEN shall be considered as a FAILURE and the TIME TO FAILURE shall be
the time at which the 1st OPEN occurred. This is to avoid any measurement anomaly or noise. In
case of multiple resistors per device, the 1st failure of any resistor within the device shall be
considered as the device failure.
Test Results
1.00mm Pitch Groups
Table 7 – Shape and Characteristic Life of 1mm pitch groups
Group
Part Number
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
Notes:
1.
3x9
Baseline
Lead
2037
2852
2781
2544
2738
3036
3299
1786
2788
2813
2000
2903
2669
2988
2499
2497
3026
3441
3434
1412
2984
3899
2670
2406
2356
2121
1805
2411
1871
2943
2015
1568
3x9
Lead-Free
6224
6405
Note 1
Note 1
Note 1
Note 1
Note 1
Note 1
Note 1
Note 1
Note 1
4237
7065
5424
Note 1
4956
Note 1
6778
Note 1
Note 1
Note 1
6407
Note 1
Note 1
Note 1
7133
4394
Note 1
Note 1
Note 1
Note 1
Note 1
4x9
Baseline
Lead
2019
2841
2972
2670
2195
2504
3410
2361
2813
2406
1933
2840
3086
2751
2544
1498
5797
4008
3311
3395
4150
2639
6185
2632
2949
2115
1645
2019
3470
1511
1638
1988
4x9
Lead-Free
5156
Note 1
5685
Note 1
Note 1
6099
6815
Note 1
Note 1
6325
5110
5307
3667
4524
5493
5068
Note 1
4883
6096
Note 1
Note 1
6135
Note 1
Note 1
6135
3430
6475
6028
6930
3065
Note 1
4739
These units were still functioning when the testing stopped after 7249
cycles.
© 2006 CTS Corporation. All rights reserved. Information subject to change.
CTS Electronic Components
9
3/8/2006
RoHS COMPLIANT RELIABILITY
TEST DATA
Characteristic Life for 1.00mm Pitch Groups
Baseline “Lead” - Weibull Plot of Product-Limit Survival Fit for 3x9
.05
.1
.2
1
log(-log(Surv))
0
.4
.6
-1
.8
-2
.9
-3
.95
-4
2000
1000
3000
4000
Group 1 Failure @ Cycle Number
Weibull Parameter Estimates
Parameter
Alpha
Beta
Estimate
2807.188
5.0715871
Lower 95%
2601.4683
3.8121746
Upper 95%
3018.6
6.4944274
N Failed
32
32
Lead-Free - Weibull Plot of Product-Limit Survival Fit for 3x9
-1.0
log(-log(Surv))
-1.5
.8
-2.0
.9
-2.5
.95
-3.0
-3.5
-4.0
3000
4000
5000
6000
7000
8000
10000
Group 2 Failure @ Cycle Number
Weibull Parameter Estimates
Parameter
Alpha
Beta
Estimate
8842.5059
4.9291743
Lower 95%
7779.0253
2.546213
Upper 95%
11768.793
8.4381017
N Failed
10
10
© 2006 CTS Corporation. All rights reserved. Information subject to change.
CTS Electronic Components
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3/8/2006
RoHS COMPLIANT RELIABILITY
TEST DATA
Baseline “Lead” - Weibull Plot of Product-Limit Survival Fit for 4x9
.05
.1
.2
1
log(-log(Surv))
0
.4
.6
-1
.8
-2
.9
-3
.95
-4
2000
1000
3000
4000
5000 6000 7000
Group 3 Failure @ Cycle Number
Weibull Parameter Estimates
Parameter
Alpha
Beta
Estimate
3167.3575
2.7304739
Lower 95%
2750.8119
2.1036932
Upper 95%
3626.7316
3.4119288
N Failed
32
32
Lead-Free - Weibull Plot of Product-Limit Survival Fit for 4x9
.2
0
.4
log(-log(Surv))
.6
-1
.8
-2
.9
-3
.95
-4
3000
4000
5000
6000
7000
8000 9000
Group 4 Failure @ Cycle Number
Weibull Parameter Estimates
Parameter
Alpha
Beta
Estimate
7031.6114
4.1823158
Lower 95%
6381.0915
2.7784814
Upper 95%
7982.593
5.9437929
N Failed
21
21
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CTS Electronic Components
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3/8/2006
RoHS COMPLIANT RELIABILITY
TEST DATA
1.27mm Pitch Groups
Table 8 – Shape and Characteristic Life
of 1.27mm pitch groups
Group
Part Number
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
Notes:
1.
4x9
Baseline
Lead
5414
4502
5107
3998
3975
4031
3101
2535
6103
3126
2702
2734
5330
3645
2955
3059
3457
2887
Note 1
2824
Note 1
2817
Note 1
Note 1
5509
Note 1
4290
4248
3723
2451
2799
2111
4x9
Lead-Free
2172
1934
2012
3593
5989
3516
Note 1
2445
1886
4508
1935
4837
5258
6774
5290
2628
3561
2276
2000
4320
3142
1982
6835
6113
1869
3740
2076
3717
6611
3295
3191
3531
These units were still functioning when
the testing stopped after 7249 cycles.
© 2006 CTS Corporation. All rights reserved. Information subject to change.
CTS Electronic Components
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3/8/2006
RoHS COMPLIANT RELIABILITY
TEST DATA
Characteristic Life for 1.27mm Pitch Group1.27mm Pitch Groups
Baseline “Lead” - Weibull Plot of Product-Limit Survival Fit for 4x9
1
.1
.2
log(-log(Surv))
0
.4
.6
-1
.8
-2
.9
-3
.95
-4
2000
3000
4000
5000
6000 7000 8000
Group 5 Failure @ Cycle Number
Weibull Parameter Estimates
Parameter
Alpha
Beta
Estimate
4994.0044
2.3657455
Lower 95%
4236.785
1.7153472
Upper 95%
5934.1143
3.11969
N Failed
27
27
Lead-Free - Weibull Plot of Product-Limit Survival Fit for 4x9
.05
.1
.2
1
log(-log(Surv))
0
.4
.6
-1
.8
-2
.9
-3
.95
-4
2000
3000
4000
5000
6000 7000
9000
Group 6 Failure @ Cycle Number
Weibull Parameter Estimates
Parameter
Alpha
Beta
Estimate
4291.7803
2.3341892
Lower 95%
3634.506
1.7437945
Upper 95%
5037.6627
3.0154001
N Failed
31
31
© 2006 CTS Corporation. All rights reserved. Information subject to change.
CTS Electronic Components
13
3/8/2006
RoHS COMPLIANT RELIABILITY
TEST DATA
Ball Shear Testing
ƒ
ƒ
ƒ
Ball-shear Testing per JEDEC JESD22-B117
Shear (ram) speed = 100µm/second.
Shear height = ¼ of the ball diameter.
1.00mm 757 Series Un-aged
1.00mm 757 Series Aged
1600
1800
1700
1500
1600
1400
1500
1300
1400
1300
1200
1200
1100
1100
1000
1000
Normal(1299.84,112.371)
Normal(1334.71,108.321)
Quantiles
100.0%
99.5%
97.5%
90.0%
75.0%
50.0%
25.0%
10.0%
2.5%
0.5%
0.0%
Quantiles
maximum
quartile
median
quartile
minimum
1597.4
1597.4
1551.0
1435.0
1369.3
1317.0
1222.1
1156.7
1066.2
1029.2
1029.2
100.0%
99.5%
97.5%
90.0%
75.0%
50.0%
25.0%
10.0%
2.5%
0.5%
0.0%
Moments
Mean
Std Dev
Std Err Mean
upper 95% Mean
lower 95% Mean
N
maximum
1702.5
1702.5
1589.8
1482.6
1403.3
1319.6
1254.0
1211.4
1149.5
1057.2
1057.2
quartile
median
quartile
minimum
Moments
1299.841
112.37091
11.237091
1322.1378
1277.5442
100
Mean
Std Dev
Std Err Mean
upper 95% Mean
lower 95% Mean
N
1334.707
108.32124
10.832124
1356.2003
1313.2137
100
© 2006 CTS Corporation. All rights reserved. Information subject to change.
CTS Electronic Components
14
3/8/2006
RoHS COMPLIANT RELIABILITY
TEST DATA
1.27mm 756 Series Un-aged
1.27mm 756 Series Aged
1800
1800
1700
1700
1600
1600
1500
1500
1400
1400
1300
1300
1200
1200
1100
Normal(1454.66,118.366)
Normal(1439.07,108.898)
Quantiles
100.0%
99.5%
97.5%
90.0%
75.0%
50.0%
25.0%
10.0%
2.5%
0.5%
0.0%
Quantiles
maximum
quartile
median
quartile
minimum
1754.9
1754.9
1733.1
1626.3
1525.1
1445.9
1369.8
1307.9
1217.1
1151.1
1151.1
100.0%
99.5%
97.5%
90.0%
75.0%
50.0%
25.0%
10.0%
2.5%
0.5%
0.0%
Moments
Mean
Std Dev
Std Err Mean
upper 95% Mean
lower 95% Mean
N
maximum
1756.2
1756.2
1723.5
1603.1
1488.1
1431.4
1369.1
1296.0
1235.5
1186.6
1186.6
quartile
median
quartile
minimum
Moments
1454.659
118.366
11.8366
1478.1454
1431.1726
100
Mean
Std Dev
Std Err Mean
upper 95% Mean
lower 95% Mean
N
1439.073
108.89755
10.889755
1460.6806
1417.4654
100
© 2006 CTS Corporation. All rights reserved. Information subject to change.
CTS Electronic Components
15
3/8/2006
RoHS COMPLIANT RELIABILITY
TEST DATA
Ball Co-Planarity
ƒ
ƒ
ƒ
Ball Co-Planarity per JEDEC Standards: 0.10mm (0.004 inches)
Instrument: Aetrium Test System
Note: Limits are one-sided, therefore CpK = CpU = 2.589 (1.27mm) and 3.643 (1.00mm)
Vanguard Co-planarity Data
Co-planarity Distributions for 756 Series and 757 Series
RT2300B6 co-planarity (mm) - 1.27mm pitch
RT2402B7 co-planarity (mm) - 1.00mm pitch
USL
USL
.01 .02 .03 .04 .05 .06 .07 .08 .09 .1
.01 .02 .03 .04 .05 .06 .07 .08 .09 .1
Quantiles:
100.0%
99.5%
97.5%
90.0%
75.0%
50.0%
25.0%
10.0%
2.5%
0.5%
0.0%
Quantiles:
maximum
0.07200
0.07196
0.05300
0.04400
0.03900
0.03300
0.02800
0.02300
0.01705
0.01501
0.01500
quartile
median
quartile
minimum
100.0%
99.5%
97.5%
90.0%
75.0%
50.0%
25.0%
10.0%
2.5%
0.5%
0.0%
Moments:
Mean
Std Dev
Std Err Mean
upper 95% Mean
lower 95% Mean
N
0.033615
0.008547
0.0006044
0.0348068
0.0324232
200
Capability
CP
CPK
CPM
CPL
CPU
Value
.
0.1
.
Index
.
2.589
.
.
2.589
quartile
median
quartile
minimum
Mean
Std Dev
Std Err Mean
upper 95% Mean
lower 95% Mean
N
Portion
Below LSL
Above USL
Total Outside
Lower CI
.
2.330
.
.
2.330
0.07300
0.07286
0.03997
0.03400
0.03000
0.02500
0.02200
0.02000
0.01600
0.01202
0.01200
Moments:
Capability Analysis:
Specification
Lower Spec Limit
Upper Spec Limit
Spec Target
maximum
0.026365
0.0067371
0.0004764
0.0273044
0.0254256
200
Capability Analysis:
% Actual
.
0.0000
0.0000
Specification
Lower Spec Limit
Upper Spec Limit
Spec Target
Upper CI
.
2.847
.
.
2.847
Capability
CP
CPK
CPM
CPL
CPU
Value
.
0.1
.
Index
.
3.643
.
.
3.643
Portion
Below LSL
Above USL
Total Outside
Lower CI
.
3.282
.
.
3.282
% Actual
.
0.0000
0.0000
Upper CI
.
4.004
.
.
4.004
© 2006 CTS Corporation. All rights reserved. Information subject to change.
CTS Electronic Components
16
3/8/2006