RoHS COMPLIANT RELIABILITY TEST DATA RoHS Compliant - CTS ClearONE Terminator Reliability Test Data © 2006 CTS Corporation. All rights reserved. Information subject to change. CTS Electronic Components 1 3/8/2006 RoHS COMPLIANT RELIABILITY TEST DATA Table of Contents RoHS Compliant CTS ClearONE Terminator Reliability Test Data ...................................................1 Table of Contents...................................................................................................................................2 List of Tables..........................................................................................................................................2 RoHS Compliant BGA Resistor Array Design Validation Test Plan .................................................3 Design Verification Plan & Report................................................................................................4 Assembly Process Component Classification............................................................................5 Thermal Cycle Testing...........................................................................................................................6 Device Details .................................................................................................................................6 Test Board Details..........................................................................................................................6 Test Board Assembly Steps..........................................................................................................8 Test Details .....................................................................................................................................8 Failure criteria.................................................................................................................................9 Test Results ....................................................................................................................................9 1.00mm Pitch Groups ....................................................................................................................9 Characteristic Life for 1.00mm Pitch Groups............................................................................10 Weibull Plot of Product-Limit Survival Fit for 3x9 Baseline ..................................................10 Weibull Plot of Product-Limit Survival Fit for 3x9 .................................................................10 Weibull Plot of Product-Limit Survival Fit for 4x9 Baseline ..................................................11 Weibull Plot of Product-Limit Survival Fit for 4x9 .................................................................11 1.27mm Pitch Groups ..................................................................................................................12 Characteristic Life for 1.27mm Pitch Group1.27mm Pitch Groups.........................................13 Weibull Plot of Product-Limit Survival Fit for 4x9 Baseline ..................................................13 Weibull Plot of Product-Limit Survival Fit for 4x9 .................................................................13 Ball Shear Testing................................................................................................................................14 Ball Co-Planarity ..................................................................................................................................16 Vanguard Co-Planarity Data .................................................................... 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List of Tables Table 1 – DV Plan...................................................................................................................................3 Table 2 – DESIGN VERIFICATION PLAN & REPORT..........................................................................4 Table 3 – Test Board Measured Tg and CTE.........................................................................................6 Table 4 – Stencil Thickness and Aperture Opening ...............................................................................7 Table 5 – 1.0mm Measured Paste Test Results ....................................................................................7 Table 6 – 1.27mm Measured Paste Test Results ..................................................................................7 Table 7 – Shape and Characteristic Life of 1mm pitch groups...............................................................9 Table 8 – Shape and Characteristic Life of 1.27mm pitch groups........................................................12 © 2006 CTS Corporation. All rights reserved. Information subject to change. CTS Electronic Components 2 3/8/2006 RoHS COMPLIANT RELIABILITY TEST DATA RoHS Compliant BGA Resistor Array Design Validation Test Plan Table 1 below lists the tests performed as part of the Design Validation Test Plan. Table 1 – DV Plan Test Name Max Resistance Change Thermal Cycling (Joint Integrity) N/A Standard Method Test Condition JESD22A104-B J, Soak Mode 2 Test Description >33% part failure rate # cycles, 0°C to +100°C, 5 Minute Dwell, continuous data collection to 100% failure point Thermal Cycling (Resistors) 0.50% MIL-STD202G, Method 107G B 5 cycles, -65°C to +125°C Short Time Overload 0.50% MIL-PRF83401 Para 4.8.10 - 2 ½ x rated voltage, 5 sec, (50V Max.) 1.5 watt max. per package, 0.06watt/resistor Moisture Resistance 0.50% MIL-STD202G, Method 106G - 240 hours, 0.1 rated load, -10°C to 65°C, 90% RH 1 watt max. package, 0.04watt @70C Load Humidity 1.00% MIL-STD202G, Method 103B - 1,000 hours, 0.1 rated load, 70 °C, 85-92% RH High Temp Exposure 1.00% MIL-PRF83401 Para 4.8.19 - 240 hours, no load @ 125 °C Load Life 1.00% MIL-STD202G, Method 108A F 2,000 hours @ 70°C, rated load with forced air circulation. Resistance to Solder Heat 0.25% IPC/JEDEC J-STD-020A I Convection Reflow: 260°C Peak 20-40 seconds above 255°C 60-150 seconds above 217°C Mechanical Shock 0.25% MIL-STD202G, Method 213D I 100g, 1 msec., 3 shocks each plane Low Temp Storage 0.25% MIL-PRF83401 Para 4.8.20 - 24 hours @ -65°C, no load Low Temperature Operation 0.25% MIL-PRF83401 Para 4.8.9 - 24 hours @ -65°C, full load 200 ppm/°C MIL-STD202G, Method 304 - -55°C to +125°C UL 94 - UL 94V-0 MIL-STD202G, Method 215K - TCR Flammability Resistance to Solvents © 2006 CTS Corporation. All rights reserved. Information subject to change. CTS Electronic Components 3 3/8/2006 RoHS COMPLIANT RELIABILITY TEST DATA Design Verification Plan & Report Table 2 – DESIGN VERIFICATION PLAN & REPORT SYSTEM: ASSEMBLY PROGRAM: ClearONE RoHS BGA TEST REPORT NO. BL#22422 & #22423 RESISTANCE 25 Ohm – 475 Ohm DESIGN ENG.: S. Hreha REMARKS # OF RESISTORS/PART 18-27 DATE OPEN: 12/02/05 TEST NAME/SOURCE ACCEPT. TEST RESULTS SAMPLE SIZE REQ'D PART ID NO. START COMP. DATE DATE PASS/ FAIL Thermal Shock/ Thermal Cycle (Resistors) Max. Delta R = 0.5% Min. -0.009% Avg. 0.004% Max. 0.014% 10 parts with 18-27 resistors per part N1N10 12/08/05 12/08/05 PASS Short Time Overload Max. Delta R = 0.5% Min. -0.043% Avg. -0.014% Max. 0.006% 10 parts with 18-27 resistors per part N1N10 2/8/06 2/8/06 PASS Moisture Resistance Max Delta R =0.5% Min. -0.035% Avg. -0.009% Max. 0.029% 10 parts with 18-27 resistors per part N41 to N50 12/16/05 12/26/05 PASS Load Humidity (0.9V per Resistor) 250 hr Max Delta R =1.0% Min. -0.017% Avg. -0.008% Max. 0.082% 10 parts with 18-27 resistors per part N51 to N60 12/26/05 1/06/06 PASS 500 hr Max Delta R =1.0% Min. -0.007% Avg. -0.019% Max. 0.082% 10 parts with 18-27 resistors per part N51 to N60 12/26/05 1/16/06 PASS 1000 hr Max Delta R =1.0% Min. 0.008% Avg. 0.038% Max. 0.104% 10 parts with 18-27 resistors per part N51 to N60 12/9/05 12/19/05 PASS CRITERIA Load Humidity BL21731 (0.9V per Resistor) 250 hr Max Delta R =1.0% Min. -0.015% Avg. 0.002% Max. 0.023% 10 parts with 18-27 resistors per part N1 to N10 12/26/05 1/06/05 PASS 500 hr Max Delta R =1.0% Min. 0.002% Avg. 0.024% Max. 0.058% 10 parts with 18-27 resistors per part N1 to N10 12/26/05 1/16/06 PASS 1000 hr Max Delta R =1.0% Min. -0.007% Avg. 0.027% Max. 0.086% 10 parts with 18-27 resistors per part N1 to N10 12/26/05 2/6/06 PASS High Temp Exposure Max Delta R =1.0% Min. -0.030% Avg. -0.007% Max. 0.018% 10 parts with 18-27 resistors per part N11N20 12/9/05 12/19/05 PASS 250 hr Max Delta R =1.0% Min. -0.049% Avg. -0.029% Max. 0.005% 10 parts with 18-27 resistors per part N61N70 12/15/05 12/26/05 PASS 500 hr Max Delta R =1.0% Min. -0.044% Avg. -0.024% Max. 0.014% 10 parts with 18-27 resistors per part N61N70 12/15/05 1/05/06 PASS 1000 hr Max Delta R =1.0% Min. -0.041% Avg. -0.014% Max. 0.025% 10 parts with 18-27 resistors per part N61N70 12/15/05 1/26/06 PASS 2000 hr Max Delta R =1.0% Min. -0.043% Avg. -0.018% Max. 0.030% 10 parts with 18-27 resistors per part N61N70 12/15/05 3/08/06 PASS Resistance to Solder Process Max Delta R =0.25% Min. 0.000% Avg. 0.037% 10 parts with 18-27 resistors N11N20 2/3/06 2/6/06 PASS Load Life © 2006 CTS Corporation. All rights reserved. Information subject to change. CTS Electronic Components 4 3/8/2006 RoHS COMPLIANT RELIABILITY TEST DATA Table 2 – DESIGN VERIFICATION PLAN & REPORT SYSTEM: ASSEMBLY PROGRAM: ClearONE RoHS BGA TEST REPORT NO. BL#22422 & #22423 RESISTANCE 25 Ohm – 475 Ohm # OF RESISTORS/PART 18-27 DATE OPEN: 12/02/05 TEST NAME/SOURCE TEST RESULTS SAMPLE SIZE REQ'D ACCEPT. CRITERIA Heat Max. 0.210% per part DESIGN ENG.: S. Hreha REMARKS PART ID NO. START COMP. DATE DATE PASS/ FAIL Mechanical Shock Max Delta R =0.25% Min. -0.038% Avg. -0.014% Max. 0.005% 10 parts with 18-27 resistors per part N21N30 1/17/06 1/17/06 PASS Low Temp Storage Max Delta R =0.25% Min. -0.014% Avg. 0.000% Max. 0.020% 10 parts with 18-27 resistors per part N11N20 1/16/06 1/17/06 PASS Low Temp Operation Max Delta R =0.25% Min. -0.018% Avg. -0.004% Max. 0.012% 10 parts with 18-27 resistors per part N1N10 2/07/06 2/07/06 PASS TCR Cold Max Delta R =200 PPM Min. 48 PPM/C Avg. 65 PPM/C Max. 85 PPM/C 10 parts with 18-27 resistors per part N1N10 12/15/05 12/20/05 PASS TCR HOT Max Delta R =200 PPM Min. 95 PPM/C Avg. 109 PPM/C Max. 132 PPM/C 10 parts with 18-27 resistors per part N1N10 12/15/05 12/20/05 PASS Flammability V0 NR 10 parts with 18-27 resistors per part N31N40 2/08/06 2/08/06 PASS Solvent Resistance No physical damage NR 10 parts with 18-27 resistors per part N31N40 1/16/06 1/16/06 PASS Assembly Process Component Classification These components have been evaluated per IPC/JEDEC J-STD-020C Moisture Sensitivity, LEVEL 1 unlimited at 30°C/90% RH Soldering Process, LEVEL 1:IR/Convection Reflow 255-260°C, 20-40 seconds. Chemical Compatibility, LEVEL 1. © 2006 CTS Corporation. All rights reserved. Information subject to change. CTS Electronic Components 5 3/8/2006 RoHS COMPLIANT RELIABILITY TEST DATA Thermal Cycle Testing Device Details The device is a Ceramic BGA package. Solder ball is copper with a Sn/Ni plating; the ball diameter is .030” for the 1.27mm pitch packages and 0.025” diameter for the 1.0mm pitch packages. The package substrate is 96% alumina solid ceramic with filled vias. Package properties: CTE of package is 5.9 x 10-6 in/in/°C in the X direction CTE of package is 5.6 x 10-6 in/in/°C in the Y direction Young’s Modulus is 330 GPa Test Board Details Material is FR4 board with 3/8-ounce copper. Thickness is 0.062 inch. Number of layers is one. Size is 1 inch by 2 ¾ inch. Solder pad designed size, Pad type for all groups is non-solder mask defined style (NSMD). Designed solder mask clearance is 0.001 inch. Measured clearance is –0.001 to 0.002 inch. PCB supplier applied a solder mask over the exposed trace. Trace designed width is 0.010 inch and space is 0.029 inch. Measured width and space is 0.010 inch width and 0.028 inch spaces. Measured Tg and CTE (above and below Tg) 1.00mm: 0.020 inch diameter (actual 0.18 inch diameter) 1.27mm: 0.020 inch diameter (actual 0.18 inch diameter) Table 3 – Test Board Measured Tg and CTE Sample CTE below Tg CTE above Tg Orientation (mm/mm °C) (mm/mm °C) X 8.3 X 10-6 7.5 X 10-6 -6 Y 14.1 X 10 12.0 X 10-6 -6 Z 5.0 X 10 25.0 X 10-6 Tg (°C) 135.7 135.2 135.2 A thermo-mechanical analyzer (TMA) was used to perform the analysis. © 2006 CTS Corporation. All rights reserved. Information subject to change. CTS Electronic Components 6 3/8/2006 RoHS COMPLIANT RELIABILITY TEST DATA Solder Paste Type Water-Soluble paste, mildly activated. Indium WMA-SMQ 65 The paste is an 90% solids version using –325 to +500 mesh size spherical powder of 63/37 Sn/Pb alloy. Type 3. Eutectic solder was selected for device attach so that the Baseline and Lead-Free Test groups would each see the same attach processes and temperatures. This allows for comparison of the device failure modes. Stencil Thickness and Aperture Opening (Desired Properties) Table 4 – Stencil Thickness and Aperture Opening Pitch Stencil Thickness Aperture Opening 1.27mm .006” 1:1 with land pad (.025”) 1.00mm .006” 1:1 with land pad (.020”) Note: Stencil aperture is dependent on solids loading, printing conditions including squeegee type, and squeegee speed. Measured paste dimensions Table 5 – 1.0mm Measured Paste Test Results Measured Paste Dimensions Theoretical Ave. Min. Max. Range Std. Dev. Thickness (mils) 6 3.87 3.45 4.44 .99 .29 Volume 3 (mils ) 1,884 1089 869 1381 512 148 Area 2 (mils ) 314 280 233 311 78 17 Table 6 – 1.27mm Measured Paste Test Results Measured Paste Dimensions Theoretical Ave. Min. Max. Range Std. Dev. Thickness (mils) 6 3.88 3.25 4.21 .96 0.24 Volume 3 (mils ) 2,946 1395 1112 1572 638 150 Area 2 (mils ) 491 359 332 400 68 17 © 2006 CTS Corporation. All rights reserved. Information subject to change. CTS Electronic Components 7 3/8/2006 RoHS COMPLIANT RELIABILITY TEST DATA Test Board Assembly Steps 1. 2. 3. 4. 5. 6. Stencil solder paste Place parts in placement machine Load parts into nozzle Place on PCB Reflow per IPC/JEDEC J-STD-020C, Level 1 profile. Batch clean in DI H2O (resistivity requirement: 2-8 M ohm) Air dry. Profile Temp. Tin Lead (Sn-Pb) Profile Reflow Profile per IPC/JEDEC J-STD-020C Reflow Temp. Peak Temp. 300 275 250 Temperature in °C 225 200 175 150 125 100 75 50 25 0 5 25 45 65 85 105 125 145 165 185 205 225 245 265 Time in Seconds Note: This profile was used for test board processing with eutectic solder. Assembly with lead-free solders will require a different profile. Each assembly site must establish a profile that works best in their unique application. Test Details Sample size: 32-piece minimum per group (1mm & 1.27mm) tested. Temperature cycle condition and temperature profile plot measured at board surface Extended thermal cycle test conditions: Low temperature: 0 -0/-5°C High temperature: 100 -0/-5°C Dwell time at High temperature: 5 minutes Environmental transition time = 10-15 seconds, UUT transition time = 4-6 minutes. Dwell time at Low temperature: 5 minutes. T-Device T-Environment 110 100 90 Temperature in °C 80 70 60 50 40 30 20 10 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 Time in Minutes Threshold resistance was nominal plus 10%. The resistance readings were monitored with a Cable Scan Series 90. Each part was monitored every 1 minute and 58 seconds. The testing was done in a double zone chamber. © 2006 CTS Corporation. All rights reserved. Information subject to change. CTS Electronic Components 8 3/8/2006 RoHS COMPLIANT RELIABILITY TEST DATA Failure criteria Open circuit (i.e. any resistance reading >100 Ohms) Any instance of measured resistance value exceeding the threshold resistance value (R>100 Ohms) shall be considered as OPEN. An OPEN followed by 10 additional OPENS within 10% of the time of the 1st OPEN shall be considered as a FAILURE and the TIME TO FAILURE shall be the time at which the 1st OPEN occurred. This is to avoid any measurement anomaly or noise. In case of multiple resistors per device, the 1st failure of any resistor within the device shall be considered as the device failure. Test Results 1.00mm Pitch Groups Table 7 – Shape and Characteristic Life of 1mm pitch groups Group Part Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Notes: 1. 3x9 Baseline Lead 2037 2852 2781 2544 2738 3036 3299 1786 2788 2813 2000 2903 2669 2988 2499 2497 3026 3441 3434 1412 2984 3899 2670 2406 2356 2121 1805 2411 1871 2943 2015 1568 3x9 Lead-Free 6224 6405 Note 1 Note 1 Note 1 Note 1 Note 1 Note 1 Note 1 Note 1 Note 1 4237 7065 5424 Note 1 4956 Note 1 6778 Note 1 Note 1 Note 1 6407 Note 1 Note 1 Note 1 7133 4394 Note 1 Note 1 Note 1 Note 1 Note 1 4x9 Baseline Lead 2019 2841 2972 2670 2195 2504 3410 2361 2813 2406 1933 2840 3086 2751 2544 1498 5797 4008 3311 3395 4150 2639 6185 2632 2949 2115 1645 2019 3470 1511 1638 1988 4x9 Lead-Free 5156 Note 1 5685 Note 1 Note 1 6099 6815 Note 1 Note 1 6325 5110 5307 3667 4524 5493 5068 Note 1 4883 6096 Note 1 Note 1 6135 Note 1 Note 1 6135 3430 6475 6028 6930 3065 Note 1 4739 These units were still functioning when the testing stopped after 7249 cycles. © 2006 CTS Corporation. All rights reserved. Information subject to change. CTS Electronic Components 9 3/8/2006 RoHS COMPLIANT RELIABILITY TEST DATA Characteristic Life for 1.00mm Pitch Groups Baseline “Lead” - Weibull Plot of Product-Limit Survival Fit for 3x9 .05 .1 .2 1 log(-log(Surv)) 0 .4 .6 -1 .8 -2 .9 -3 .95 -4 2000 1000 3000 4000 Group 1 Failure @ Cycle Number Weibull Parameter Estimates Parameter Alpha Beta Estimate 2807.188 5.0715871 Lower 95% 2601.4683 3.8121746 Upper 95% 3018.6 6.4944274 N Failed 32 32 Lead-Free - Weibull Plot of Product-Limit Survival Fit for 3x9 -1.0 log(-log(Surv)) -1.5 .8 -2.0 .9 -2.5 .95 -3.0 -3.5 -4.0 3000 4000 5000 6000 7000 8000 10000 Group 2 Failure @ Cycle Number Weibull Parameter Estimates Parameter Alpha Beta Estimate 8842.5059 4.9291743 Lower 95% 7779.0253 2.546213 Upper 95% 11768.793 8.4381017 N Failed 10 10 © 2006 CTS Corporation. All rights reserved. Information subject to change. CTS Electronic Components 10 3/8/2006 RoHS COMPLIANT RELIABILITY TEST DATA Baseline “Lead” - Weibull Plot of Product-Limit Survival Fit for 4x9 .05 .1 .2 1 log(-log(Surv)) 0 .4 .6 -1 .8 -2 .9 -3 .95 -4 2000 1000 3000 4000 5000 6000 7000 Group 3 Failure @ Cycle Number Weibull Parameter Estimates Parameter Alpha Beta Estimate 3167.3575 2.7304739 Lower 95% 2750.8119 2.1036932 Upper 95% 3626.7316 3.4119288 N Failed 32 32 Lead-Free - Weibull Plot of Product-Limit Survival Fit for 4x9 .2 0 .4 log(-log(Surv)) .6 -1 .8 -2 .9 -3 .95 -4 3000 4000 5000 6000 7000 8000 9000 Group 4 Failure @ Cycle Number Weibull Parameter Estimates Parameter Alpha Beta Estimate 7031.6114 4.1823158 Lower 95% 6381.0915 2.7784814 Upper 95% 7982.593 5.9437929 N Failed 21 21 © 2006 CTS Corporation. All rights reserved. Information subject to change. CTS Electronic Components 11 3/8/2006 RoHS COMPLIANT RELIABILITY TEST DATA 1.27mm Pitch Groups Table 8 – Shape and Characteristic Life of 1.27mm pitch groups Group Part Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Notes: 1. 4x9 Baseline Lead 5414 4502 5107 3998 3975 4031 3101 2535 6103 3126 2702 2734 5330 3645 2955 3059 3457 2887 Note 1 2824 Note 1 2817 Note 1 Note 1 5509 Note 1 4290 4248 3723 2451 2799 2111 4x9 Lead-Free 2172 1934 2012 3593 5989 3516 Note 1 2445 1886 4508 1935 4837 5258 6774 5290 2628 3561 2276 2000 4320 3142 1982 6835 6113 1869 3740 2076 3717 6611 3295 3191 3531 These units were still functioning when the testing stopped after 7249 cycles. © 2006 CTS Corporation. All rights reserved. Information subject to change. CTS Electronic Components 12 3/8/2006 RoHS COMPLIANT RELIABILITY TEST DATA Characteristic Life for 1.27mm Pitch Group1.27mm Pitch Groups Baseline “Lead” - Weibull Plot of Product-Limit Survival Fit for 4x9 1 .1 .2 log(-log(Surv)) 0 .4 .6 -1 .8 -2 .9 -3 .95 -4 2000 3000 4000 5000 6000 7000 8000 Group 5 Failure @ Cycle Number Weibull Parameter Estimates Parameter Alpha Beta Estimate 4994.0044 2.3657455 Lower 95% 4236.785 1.7153472 Upper 95% 5934.1143 3.11969 N Failed 27 27 Lead-Free - Weibull Plot of Product-Limit Survival Fit for 4x9 .05 .1 .2 1 log(-log(Surv)) 0 .4 .6 -1 .8 -2 .9 -3 .95 -4 2000 3000 4000 5000 6000 7000 9000 Group 6 Failure @ Cycle Number Weibull Parameter Estimates Parameter Alpha Beta Estimate 4291.7803 2.3341892 Lower 95% 3634.506 1.7437945 Upper 95% 5037.6627 3.0154001 N Failed 31 31 © 2006 CTS Corporation. All rights reserved. Information subject to change. CTS Electronic Components 13 3/8/2006 RoHS COMPLIANT RELIABILITY TEST DATA Ball Shear Testing Ball-shear Testing per JEDEC JESD22-B117 Shear (ram) speed = 100µm/second. Shear height = ¼ of the ball diameter. 1.00mm 757 Series Un-aged 1.00mm 757 Series Aged 1600 1800 1700 1500 1600 1400 1500 1300 1400 1300 1200 1200 1100 1100 1000 1000 Normal(1299.84,112.371) Normal(1334.71,108.321) Quantiles 100.0% 99.5% 97.5% 90.0% 75.0% 50.0% 25.0% 10.0% 2.5% 0.5% 0.0% Quantiles maximum quartile median quartile minimum 1597.4 1597.4 1551.0 1435.0 1369.3 1317.0 1222.1 1156.7 1066.2 1029.2 1029.2 100.0% 99.5% 97.5% 90.0% 75.0% 50.0% 25.0% 10.0% 2.5% 0.5% 0.0% Moments Mean Std Dev Std Err Mean upper 95% Mean lower 95% Mean N maximum 1702.5 1702.5 1589.8 1482.6 1403.3 1319.6 1254.0 1211.4 1149.5 1057.2 1057.2 quartile median quartile minimum Moments 1299.841 112.37091 11.237091 1322.1378 1277.5442 100 Mean Std Dev Std Err Mean upper 95% Mean lower 95% Mean N 1334.707 108.32124 10.832124 1356.2003 1313.2137 100 © 2006 CTS Corporation. All rights reserved. Information subject to change. CTS Electronic Components 14 3/8/2006 RoHS COMPLIANT RELIABILITY TEST DATA 1.27mm 756 Series Un-aged 1.27mm 756 Series Aged 1800 1800 1700 1700 1600 1600 1500 1500 1400 1400 1300 1300 1200 1200 1100 Normal(1454.66,118.366) Normal(1439.07,108.898) Quantiles 100.0% 99.5% 97.5% 90.0% 75.0% 50.0% 25.0% 10.0% 2.5% 0.5% 0.0% Quantiles maximum quartile median quartile minimum 1754.9 1754.9 1733.1 1626.3 1525.1 1445.9 1369.8 1307.9 1217.1 1151.1 1151.1 100.0% 99.5% 97.5% 90.0% 75.0% 50.0% 25.0% 10.0% 2.5% 0.5% 0.0% Moments Mean Std Dev Std Err Mean upper 95% Mean lower 95% Mean N maximum 1756.2 1756.2 1723.5 1603.1 1488.1 1431.4 1369.1 1296.0 1235.5 1186.6 1186.6 quartile median quartile minimum Moments 1454.659 118.366 11.8366 1478.1454 1431.1726 100 Mean Std Dev Std Err Mean upper 95% Mean lower 95% Mean N 1439.073 108.89755 10.889755 1460.6806 1417.4654 100 © 2006 CTS Corporation. All rights reserved. Information subject to change. CTS Electronic Components 15 3/8/2006 RoHS COMPLIANT RELIABILITY TEST DATA Ball Co-Planarity Ball Co-Planarity per JEDEC Standards: 0.10mm (0.004 inches) Instrument: Aetrium Test System Note: Limits are one-sided, therefore CpK = CpU = 2.589 (1.27mm) and 3.643 (1.00mm) Vanguard Co-planarity Data Co-planarity Distributions for 756 Series and 757 Series RT2300B6 co-planarity (mm) - 1.27mm pitch RT2402B7 co-planarity (mm) - 1.00mm pitch USL USL .01 .02 .03 .04 .05 .06 .07 .08 .09 .1 .01 .02 .03 .04 .05 .06 .07 .08 .09 .1 Quantiles: 100.0% 99.5% 97.5% 90.0% 75.0% 50.0% 25.0% 10.0% 2.5% 0.5% 0.0% Quantiles: maximum 0.07200 0.07196 0.05300 0.04400 0.03900 0.03300 0.02800 0.02300 0.01705 0.01501 0.01500 quartile median quartile minimum 100.0% 99.5% 97.5% 90.0% 75.0% 50.0% 25.0% 10.0% 2.5% 0.5% 0.0% Moments: Mean Std Dev Std Err Mean upper 95% Mean lower 95% Mean N 0.033615 0.008547 0.0006044 0.0348068 0.0324232 200 Capability CP CPK CPM CPL CPU Value . 0.1 . Index . 2.589 . . 2.589 quartile median quartile minimum Mean Std Dev Std Err Mean upper 95% Mean lower 95% Mean N Portion Below LSL Above USL Total Outside Lower CI . 2.330 . . 2.330 0.07300 0.07286 0.03997 0.03400 0.03000 0.02500 0.02200 0.02000 0.01600 0.01202 0.01200 Moments: Capability Analysis: Specification Lower Spec Limit Upper Spec Limit Spec Target maximum 0.026365 0.0067371 0.0004764 0.0273044 0.0254256 200 Capability Analysis: % Actual . 0.0000 0.0000 Specification Lower Spec Limit Upper Spec Limit Spec Target Upper CI . 2.847 . . 2.847 Capability CP CPK CPM CPL CPU Value . 0.1 . Index . 3.643 . . 3.643 Portion Below LSL Above USL Total Outside Lower CI . 3.282 . . 3.282 % Actual . 0.0000 0.0000 Upper CI . 4.004 . . 4.004 © 2006 CTS Corporation. All rights reserved. Information subject to change. CTS Electronic Components 16 3/8/2006