VLMU3100 Datasheet

VLMU3100
www.vishay.com
Vishay Semiconductors
UV SMD LED PLCC-2
FEATURES
• UV SMD LED with exceptional brightness
• High efficient InGaN technology
• Long life time due to silicone casting
• Compatible
equipment
with
automatic
placement
• EIA and ICE standard package
19225
• Compatible with IR reflow and vapor phase
• Available in 8 mm tape
DESCRIPTION
• Low profile package
The package of the VLMU3100-series is the PLCC-2.
It consists of a lead frame which is embedded in a
white thermoplast. The reflector inside this package is filled
up with clear silicone which guarantees long life time.
The viewing angle is 120°, package dimensions are
3.2 mm x 2.8 mm x 1.9 mm.
• Non-diffused lens: Excellent for coupling to light pipes and
backlighting
• Low power consumption
• Preconditioning according to JEDEC® level 3
• ESD-withstand voltage: Up to 1 kV according to
JESD22-A114-B
PRODUCT GROUP AND PACKAGE DATA
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
• Product group: LED
• Package: SMD PLCC-2
• Product series: standard
APPLICATIONS
• Angle of half intensity: ± 60°
• Curing of glue and laquer
• Lead-finishing: Ag
• Recognition of safety features of money bills
SAFETY ADVICES
Depending on the mode of operation, these devices emit
highly concentrated non visible ultraviolet light which can be
hazardous to the human eye. Products which incorporate
these devices have to follow the safety precautions given in
IEC 60825-1 “Safety of Laser Products”.
PARTS TABLE
PART
VLMU3100-GS08
COLOR
Ultraviolet
RADIANT INTENSITY
(mW/sr)
MIN.
TYP.
MAX.
1.8
2.5
3
at IF
(mA)
20
WAVELENGTH
(nm)
MIN. TYP. MAX.
400
405
410
at IF
(mA)
FORWARD VOLTAGE
at IF
(V)
TECHNOLOGY
(mA)
MIN. TYP. MAX.
20
2.8
3.2
3.8
20
InGaN
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
VLMU3100
PARAMETER
TEST CONDITION
Forward current
Surge forward current
Power dissipation
Junction temperature
tp ≤ 10 μs
SYMBOL
VALUE
UNIT
IF
30
mA
IFSM
0.1
A
Ptot
120
mW
°C
Tj
+100
Operating temperature range
Tamb
-40 to +80
°C
Storage temperature range
Tstg
-40 to +100
°C
Solder temperature
Tsol
260/5
°C/s
Document Number: 82556
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Rev. 1.2, 07-Oct-13
VLMU3100
www.vishay.com
Vishay Semiconductors
OPTICAL AND ELECTRICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
VLMU3100, ULTRAVIOLET
PARAMETER
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
UNIT
Radiant intensity
IF = 20 mA
le
1.8
2.5
3
mW/sr
mW
Radiant power
IF = 20 mA
φe
-
6.8
-
Peak wavelength
IF = 20 mA
λp
400
405
410
nm
Angle of half intensity
IF = 20 mA
ϕ
-
± 60
-
deg
Forward voltage
IF = 20 mA
VF
2.8
3.2
3.8
V
Reverse current
VR = 5 V
IR
-
-
10
μA
TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
0°
30
25
20
15
10
5
0
0
40°
1.0
0.9
50°
0.8
60°
70°
0.7
80°
0.6
0.4
0.2
0
95 10319
Fig. 1 - Forward Current vs. Ambient Temperature
Fig. 3 - Relative Luminous Intensity vs. Angular Displacement
100
100
90
90
Irel - Relative Intensity (%)
IF - Forward Current (mA)
20°
30°
10 20 30 40 50 60 70 80 90 100
Tamb - Ambient Temperature (°C)
10°
ϕ - Angular Displacement
IV rel - Relative Luminous Intensity
IF - Forward Current (mA)
35
80
70
60
50
40
30
20
10
80
70
60
50
40
30
20
10
0
0
1
2
3
4
VF - Forward Voltage (V)
Fig. 2 - Forward Current vs. Forward Voltage
5
0
375
400
425
450
475
λ - Wavelength (nm)
Fig. 4 - Relative Intensity vs. Wavelength
Document Number: 82556
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Rev. 1.2, 07-Oct-13
VLMU3100
www.vishay.com
Vishay Semiconductors
2.4
Ie rel - Relative Radiant Intensity
Relative Luminous Intensity
(Tamb = 25 °C)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
2
4
6
8
10 12 14 16 18 20
IF - Forward Current (mA)
Fig. 5 - Specific Luminous Intensity vs. Forward Current
2.0
1.6
1.2
0.8
0.4
0
-40
-20
0
20
40
60
80
100
Tamb - Ambient Temperature (°C)
Fig. 6 - Relative Radiant Intensity vs. Ambient Temperature
PACKAGE DIMENSIONS in millimeters
SOLDER PAD LAYOUT
Document Number: 82556
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Rev. 1.2, 07-Oct-13
VLMU3100
www.vishay.com
Vishay Semiconductors
METHOD OF TAPING/POLARITY AND TAPE AND REEL
SMD LED (VLM3 - SERIES)
Vishay’s LEDs in SMD packages are available in an
antistatic 8 mm blister tape (in accordance with DIN IEC 40
(CO 564) for automatic component insertation. The blister
tape is a plastic strip with impressed component cavities,
covered by a top tape.
ARRANGEMENT OF TAPE
FEEDING DIRECTION
SOLDERING PROFILE
IR Reflow Soldering Profile for Lead (Pb)-free Soldering
Preconditioning acc. to JEDEC level 3
300
Temperature (°C)
max. 260 °C
245 °C
255 °C
240 °C
217 °C
250
200
max. 30 s
150
max. 100 s
max. 120 s
100
max. ramp up 3 °C/s
50
max. ramp down 6 °C/s
0
0
DIMENSIONS OF REEL in millimeters
19885-1
50
100
150
Time (s)
200
250
300
max. 2 cycles allowed
Fig. 7 - Vishay Lead (Pb)-free Reflow Soldering Profile
(acc. to J-STD-020C)
Document Number: 82556
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Rev. 1.2, 07-Oct-13
VLMU3100
www.vishay.com
Vishay Semiconductors
BAR CODE PRODUCT LABEL (example only)
RECOMMENDED METHOD OF STORAGE
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
A
B
C
D
• Storage temperature 10 °C to 30 °C
L
E
I
G
F
H
M
K
A. 2D barcode
• Storage humidity ≤ 60 % RH max.
After more than 168 h under these conditions moisture
content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
B. Vishay part number
C. Quantity
D. SEL = selection code (binning)
E. Code of manufacturing plant
F. Batch = date code: year/week/plant code
G. Region code
192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air/nitrogen)
or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 100 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC standard JESD22-A112 level 3 label is
included on all dry bags.
H. SL = sales location
I. Terminations finishing
L E V E L
K. Lead (Pb)-free symbol
CAUTION
This bag contains
MOISTURE –SENSITIVE DEVICES
L. Halogen-free symbol
M. RoHS symbol
3
1. Shelf life in sealed bag 12 months at <40°C and < 90% relative humidity (RH)
DRY PACKING
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
Aluminum bag
Label
vapor-phase reflow, or equivalent processing (peak package body temp.
260°C) must be:
a) Mounted within 168 hours at factory condition of < 30°C/60%RH or
b) Stored at < 10% RH .
3. Devices require baking before mounting if:
a)
Humidity Indicator Card is >10% when read at 23°C + 5°C or
b)
2a or 2b is not met.
4. If baking is required, devices may be baked for:
192 hours at 40°C + 5°C/-0°C and <5%RH (dry air/nitrogen)
or
o
or
96 hours at 60±5 Cand <5%RH
For all device containers
24 hours at 100±5°C
Not suitable for reels or tubes
Bag Seal Date: ______________________________
(If blank, see bar code label)
Note: LEVEL defined by EIA JEDEC Standard JESD22-A112
20003
Reel
Example of JESD22-A112 level 3 label
ESD PRECAUTION
15973
FINAL PACKING
The sealed reel is packed into a cardboard box. A secondary
cardboard box is used for shipping purposes.
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electro-static
sensitive devices warning labels are on the packaging.
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
Document Number: 82556
5
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Rev. 1.2, 07-Oct-13
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
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provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
1
Document Number: 91000