VLMY3191 Vishay Semiconductors Standard SMD LED PLCC2 FEATURES • Lead (Pb)-free product - RoHS compliant • SMD LED with exceptional brightness • Luminous intensity categorized e3 • Compatible with automatic placement equipment • EIA and ICE standard package • Compatible with infrared, vapor phase and wave solder processes according to CECC • Available in 8 mm tape • Low profile package • Non-diffused lens: excellent for coupling to light pipes and backlighting • Low power consumption • Luminous intensity ratio in one packaging unit IVmax/IVmin ≤ 1.6 • Lead (Pb)-free device • Preconditioning: acc. to JEDEC level 2 a 94 8553 DESCRIPTION This device has been designed for applications requiring narrow brightness and color selection. The package of this device is the PLCC-2. It consists of a lead frame which is embedded in a white thermoplast. The reflector inside this package is filled up with clear epoxy. PRODUCT GROUP AND PACKAGE DATA • Product series: LED • Package: SMD PLCC-2 • Product group: standard • Angle of half intensity: ± 60° APPLICATIONS • Automotive: backlighting in dashboards and switches • Telecommunication: indicator and backlighting in telephone and fax • Indicator and backlight for audio and video equipment • Indicator and backlight in office equipment • Flat backlight for LCDs, switches and symbols • General use PARTS TABLE PART COLOR, LUMINOUS INTENSITY TECHNOLOGY VLMY3191-GS08 Yellow, IV = (7.1 to 18) mcd GaAsP on GaP VLMY3191-GS18 Yellow, IV = (7.1 to 18) mcd GaAsP on GaP Document Number 84760 Rev. 1.4, 24-Sep-07 www.vishay.com 1 VLMY3191 Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS1) VLMY3191 PARAMETER TEST CONDITION SYMBOL VALUE UNIT VR 6 V mA 2) Reverse voltage DC Forward current Surge forward current Power dissipation Tamb ≤ 60 °C IF 30 tp ≤ 10 μs IFSM 0.5 A Tamb ≤ 60 °C PV 100 mW Tj 100 °C Operating temperature range Tamb - 40 to + 100 °C Storage temperature range Tstg - 55 to + 100 °C t≤5s Tsd 260 °C mounted on PC board (pad size > 16 mm2) RthJA 400 K/W Junction temperature Soldering temperature Thermal resistance junction/ ambient Note: 1) Tamb = 25 °C, unless otherwise specified 2) Driving the LED in reverse direction is suitable for short term application OPTICAL AND ELECTRICAL CHARACTERISTICS1) VLMY3191, YELLOW PARAMETER TEST CONDITION PART SYMBOL MIN IF = 10 mA VLMY 3191 IV 7.1 583 Luminous intensity TYP. MAX UNIT 18 mcd Dominant wavelength IF = 10 mA λd Peak wavelength IF = 10 mA λp 590 nm Angle of half intensity IF = 10 mA ϕ ± 60 deg Forward voltage IF = 20 mA VF Reverse voltage IR = 10 μA VR VR = 0, f = 1 MHz Cj Junction capacitance 588 2.4 6 592 nm 3.0 V 15 V 15 pF Note: 1) Tamb = 25 °C, unless otherwise specified LUMINOUS INTENSITY CLASSIFICATION GROUP LUMINOUS INTENSITY (MCD) MIN. MAX. K1 7.10 9.00 K2 9.00 11.20 L1 11.20 L2 14.00 COLOR CLASSIFICATION GROUP DOMINANT WAVELENGTH (NM) YELLOW MIN. MAX. 1 581 584 14.00 2 583 586 18.00 3 585 588 Note: 4 587 590 Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ± 11 %. 5 589 592 6 591 594 The above Type Numbers represent the order groups which include only a few brightness groups. Only one group will be shipped on each reel (there will be no mixing of two groups on each reel). In order to ensure availability, single brightness groups will not be orderable. In a similar manner for colors where wavelength groups are measured and binned, single wavelength groups will be shipped on any one reel. In order to ensure availability, singe wavelength groups will not be orderable. www.vishay.com 2 Document Number 84760 Rev. 1.4, 24-Sep-07 VLMY3191 Vishay Semiconductors TYPICAL CHARACTERISTICS Tamb = 25 °C, unless otherwise specified 0° IV rel - Relative Luminous Intensity PV - Power Dissipation (mW) 125 100 75 50 25 10° 20° 30° 40° 1.0 0.9 50° 0.8 60° 70° 0.7 80° 0 0 20 40 60 80 100 95 10319 0.6 0.4 0.2 0 0.2 0.4 0.6 Tamb - Ambient Temperature (°C) 95 10904 Figure 1. Power Dissipation vs. Ambient Temperature Figure 4. Rel. Luminous Intensity vs. Angular Displacement 60 100 - Forward Current (mA) 40 30 10 0 0.1 0 20 40 60 80 100 0 Figure 2. Forward Current vs. Ambient Temperature 3 4 5 I v rel - Relative Luminous Intensity 2.0 Tamb < 60 °C t p /T = 0.005 0.01 1000 0.02 0.05 0.2 0.5 DC 10 1 0.01 95 9985 2 V F - Forward Voltage (V) Figure 5. Forward Current vs. Forward Voltage 10000 100 1 95 9987 Tamb - Ambient Temperature (°C) 95 10905 I F - Forward Current (mA) 1 F 20 10 I IF - Forward Current (mA) yellow 50 0.1 yellow 1.6 1.2 0.8 0.4 0 0.1 1 10 100 t p - Pulse Length (ms) Figure 3. Forward Current vs. Pulse Length Document Number 84760 Rev. 1.4, 24-Sep-07 0 95 9992 20 40 60 80 100 T amb - Ambient Temperature (°C) Figure 6. Rel. Luminous Intensity vs. Ambient Temperature www.vishay.com 3 VLMY3191 Vishay Semiconductors 1.2 yellow IV rel - Relative Luminous Intensity I v rel - Relative Luminous Intensity 2.4 2.0 1.6 1.2 0.8 0.4 yellow 1.0 0.8 0.6 0.4 0.2 0 550 0 95 10260 10 1 20 0.5 50 0.2 100 0.1 200 0.05 500 I F (mA) 0.02 tp /T 570 Figure 7. Rel. Lumin. Intensity vs. Forw. Current/Duty Cycle 590 610 630 650 λ - Wavelength (nm) 95 10039 Figure 9. Relative Luminous Intensity vs. Wavelength I v rel - Relative Luminous Intensity 10 yellow 1 0.1 0.01 1 95 9999 100 10 I F - Forward Current (mA) Figure 8. Relative Luminous Intensity vs. Forward Current PACKAGE DIMENSIONS in millimeters 3.5 ± 0.2 0.9 1.75 ± 0.10 technical drawings according to DIN specifications Mounting Pad Layout Pin identification area covered with solder resist 4 2.6 (2.8) A 2.8 C 2.2 + 0.15 1.2 4 1.6 (1.9) ? 3 2.4 + 0.15 Drawing-No.: 6.541-5025.01-4 Issue: 8; 22.11.05 95 11314-1 www.vishay.com 4 Document Number 84760 Rev. 1.4, 24-Sep-07 VLMY3191 Vishay Semiconductors METHOD OF TAPING/POLARITY AND TAPE AND REEL REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS18 (=8000 PCS.) PREFERRED SMD LED (VLM.3 - SERIES) Vishay’s LEDs in SMD packages are available in an antistatic 8 mm blister tape (in accordance with DIN IEC 40 (CO) 564) for automatic component insertation. The blister tape is a plastic strip with impressed component cavaties, covered by a top tape. 10.4 8.4 120° 4.5 3.5 13.00 12.75 2.5 1.5 62.5 60.0 Identification Label: Vishay Type Group Tape Code Production Code Quantity Adhesive Tape 14.4 max. 321 329 18857 Figure 12. Reel Dimensions - GS18 Blister Tape SOLDERING PROFILE IR Reflow Soldering Profile for lead (Pb)-free soldering Preconditioning acc. to JEDEC Level 2a 300 Component Cavity 94 8670 Temperature (°C) TAPING OF VLM.3... 2.2 2.0 3.5 3.1 3.6 3.4 240 °C 217 °C 200 max. 30 s 150 0 8.3 7.7 0 1.85 1.65 4.1 3.9 max. Ramp Down 6 °C/sec max. Ramp Up 3 °C/sec 4.0 3.6 50 100 0.25 4.1 3.9 150 200 250 300 Time (s) 19470-2 1.6 1.4 max. 100 sec max. 120 sec 100 50 5.75 5.25 max. 260 °C 245 °C 255 255°C°C 250 max. 2 cycles allowed Figure 13. Vishay Lead (Pb) -free Reflow Soldering Profile (acc. to J-STD-020B) 2.05 1.95 94 8668 TTW Soldering Figure 10. Tape Dimensions in mm for PLCC-2 300 948626-1 (acc. to CECC00802) 5s Lead Temperature REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS08 (=1500 PCS.) 10.0 9.0 120° Temperature (°C) 250 200 second wave 235 °C...260 °C first wave full line: typical dotted line: process limits ca. 2 K/s ca. 200 K/s 150 100 °C...130 °C 100 ca. 5 K/s 2 K/s 50 forced cooling 4.5 3.5 0 2.5 1.5 63.5 60.5 180 178 50 100 150 200 250 Time (s) Identification Label: Vishay Type Group Tape Code Production Code Quantity 0 13.00 12.75 Figure 14. Double Wave Soldering of Opto Devices (all packages) 14.4 max. 94 8665 Figure 11. Reel Dimensions - GS08 Document Number 84760 Rev. 1.4, 24-Sep-07 www.vishay.com 5 VLMY3191 Vishay Semiconductors BAR CODE PRODUCT LABEL 106 A H VISHAY 37 B C D E F G 19799 A) Type of componenent B) Manufacturing plant C) SEL - selection code (bin): e.g.: K2 = code for luminous intensity group 3 = code for color group D) Date code year/week E) Day code (e.g. 3: Wednesday) F) Batch no. G) Total quantity H) Company code RECOMMENDED METHOD OF STORAGE Dry box storage is recommended as soon as the aluminium bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: • Storage temperature 10 °C to 30 °C • Storage humidity ≤ 60 % RH max. After more than 672 h under these conditions moisture content will be too high for reflow soldering. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 192 h at 40 °C + 5 °C/ - 0 °C and < 5 % RH (dry air/ nitrogen) or 96 h at 60 °C + 5 °C and < 5 % RH for all device containers or 24 h at 100 °C + 5 °C not suitable for reel or tubes. An EIA JEDEC standard JESD22-A112 level 2a label is included on all dry bags. L E V E L CAUTION This bag contains MOISTURE –SENSITIVE DEVICES DRY PACKING The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. 2a 1. Shelf life in sealed bag 12 months at <40°C and < 90% relative humidity (RH) 2. After this bag is opened devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. 260°C) must be: a) Mounted within 672 hours at factory condition of < 30°C/60%RH or b) Stored at <10% RH. 3. Devices require baking before mounting if: a) Humidity Indicator Card is >10% when read at 23°C + 5°C or b) 2a or 2b is not met. Aluminum bag Label Reel 4. If baking is required, devices may be baked for: 192 hours at 40°C + 5°C/-0°C and <5%RH (dry air/nitrogen) or o or 96 hours at 60±5 Cand <5%RH For all device containers 24 hours at 100±5°C Not suitable for reels or tubes Bag Seal Date: ______________________________ (If blank, see bar code label) Note: LEVEL defined by EIA JEDEC Standard JESD22-A113 15973 FINAL PACKING The sealed reel is packed into a cardboard box. A secondary cardboard box is used for shipping purposes. 19786 Example of JESD22-A112 level 2a label ESD PRECAUTION Proper storage and handling procedures should be followed to prevent ESD damage to the devices especially when they are removed from the antistatic shielding bag. Electro-static sensitive devices warning labels are on the packaging. VISHAY SEMICONDUCTORS STANDARD BAR CODE LABELS The Vishay Semiconductors standard bar code labels are printed at final packing areas. The labels are on each packing unit and contain Vishay Semiconductors specific data. www.vishay.com 6 Document Number 84760 Rev. 1.4, 24-Sep-07 VLMY3191 Vishay Semiconductors OZONE DEPLETING SUBSTANCES POLICY STATEMENT It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Document Number 84760 Rev. 1.4, 24-Sep-07 www.vishay.com 7 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1