Reliability Data Report Product Family R386 LT1500/01/06/07 LT1533/34 LT1611/13 LT1761/62/63/64/65 LT1959 LT1962/63/64 LT3012/13/14 LT3021/27/28/32 LT3150 Reliability Data Report Report Number: R386 Report generated on: Wed Sep 19 10:21:02 PDT 2012 OPERATING LIFE TEST PACKAGE TYPE SIDEBRAZE QFN/DFN SSOP/TSSOP SOIC/SOT/MSOP TO-220 Totals SAMPLE SIZE 30 77 231 1403 145 1,886 OLDEST DATE NEWEST DATE CODE CODE 9601 0502 0502 9601 9940 - 9601 0502 0650 0533 0213 - K DEVICE No. of FAILURES HRS (125°C) 1 30 73 585 1240 84 2,012 2,3 0 0 0 0 0 0 HIGHLY ACCELERATED STRESS TEST AT +131 DEG C / 85% RH PACKAGE TYPE SOIC/SOT/MSOP Totals SAMPLE SIZE 437 437 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES 4 CODE CODE HOURS (+85°C) 9943 - 0620 - 2543 2,543 0 0 No. of FAILURES PRESSURE COOKER TEST AT 15 PSIG , +121 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN SSOP/TSSOP PLASTIC DIP SOIC/SOT/MSOP TO-220 TO-92 Totals 6273 7707 50 47779 2300 50 64,159 OLDEST DATE NEWEST DATE K DEVICE CODE CODE HOURS 0000 9740 9607 9610 0121 0808 - 1124 1120 9607 1122 1025 0808 - 559 532 1 3507 63 1 4,663 0 0 0 0 0 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 0509 9740 9607 9605 0121 0808 - 1124 1120 9607 1122 1025 0808 - 1875 1761 5 10453 497 5 14,596 0 0 0 0 0 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 0913 - 0914 - 9 9 TEMP CYCLE FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN SSOP/TSSOP PLASTIC DIP SOIC/SOT/MSOP TO-220 TO-92 Totals 7740 8009 50 46169 4325 50 66,343 TEMP CYCLE FROM -55 TO 125 DEG C PACKAGE TYPE SAMPLE SIZE SOIC/SOT/MSOP Totals 99 99 (1) Assumes Activation Energy = 1.0 Electron Volts (2) Failure Rate Equivalent to +55 °C, 60% Confidence Level =0.91 FITS (3) Mean Time Between Failure in Years = 125289.44 (4) Assumes 20X Acceleration from 85 °C to +131 °C Note 1: 1 FIT = 1 Failure in One Billion Hours. Note 2: HAST, Temp Cycle & Thermal Shock are subjected to J-STD-020 MSL Preconditioning 0 0 Reliability Data Report Report Number: R386 Report generated on: Wed Sep 19 10:21:02 PDT 2012 THERMAL SHOCK FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN SSOP/TSSOP PLASTIC DIP SOIC/SOT/MSOP TO-220 Totals 8327 8088 50 38164 2275 56,904 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 0509 0210 9607 9605 0121 - 1124 1120 9607 1122 1025 - 1939 1633 5 7976 247 11,800 0 0 0 0 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE HOURS 0650 0824 0822 - 0709 0918 1015 - 1038 175 2121 3,334 0 0 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE HOURS 0650 0829 - 0850 0832 - 1686 398 2,084 HIGH TEMPERATURE BAKE AT 175 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN SSOP/TSSOP SOIC/SOT/MSOP Totals 1077 350 2420 3,847 HIGH TEMPERATURE BAKE AT 150 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN SOIC/SOT/MSOP Totals 1149 398 1,547 0 0 0