R357 Reliability Data

Reliability Data Report
Product Family R357
LT1461 / LT1634
Reliability Data Report
Report Number: R357
Report generated on: Wed Jun 18 10:34:29 PDT 2014
OPERATING LIFE TEST
PACKAGE TYPE
SOIC/SOT/MSOP
TO-92
Totals
SAMPLE SIZE
453
100
553
OLDEST DATE
NEWEST DATE
K DEVICE HRS
1
CODE
CODE
(+125°C)
9714
9908
-
1028
9924
-
441
175
616
No. of FAILURES
2,3
0
0
0
HIGHLY ACCELERATED STRESS TEST AT +130 DEG C / 85% RH
PACKAGE TYPE
SOIC/SOT/MSOP
Totals
SAMPLE SIZE
77
77
OLDEST DATE
NEWEST DATE
K DEVICE HRS
No. of FAILURES
4
CODE
CODE
(+85°C)
1251
-
1251
-
147
147
0
0
K DEVICE HRS
No. of FAILURES
PRESSURE COOKER TEST AT 15 PSIG , +121 DEG C
PACKAGE TYPE
SAMPLE SIZE
SOIC/SOT/MSOP
TO-92
Totals
24250
1649
25,899
OLDEST DATE
NEWEST DATE
CODE
CODE
9726
9733
-
1322
1315
-
1509
53
1,562
0
0
0
OLDEST DATE
NEWEST DATE
K DEVICE
No. of FAILURES
CODE
CODE
CYCLES
9726
0104
9746
-
1322
0104
1315
-
3143
5
120
3,268
0
0
0
0
OLDEST DATE
NEWEST DATE
K DEVICE
No. of FAILURES
CODE
CODE
CYCLES
9744
9740
-
1322
1315
-
2213
65
2,278
TEMP CYCLE FROM -65 TO 150 DEG C
PACKAGE TYPE
SAMPLE SIZE
SOIC/SOT/MSOP
PLASTIC DIP
TO-92
Totals
21003
50
1201
22,254
THERMAL SHOCK FROM -65 TO 150 DEG C
PACKAGE TYPE
SAMPLE SIZE
SOIC/SOT/MSOP
TO-92
Totals
15932
654
16,586
(1) Assumes Activation Energy = 1.0 Electron Volts
(2) Failure Rate Equivalent to +55 °C, 60% Confidence Level =2.98 FITS
(3) Mean Time Between Failure in Years = 38359
(4) Assumes 20X Acceleration from 85 °C to +130 °C
Note 1: 1 FIT = 1 Failure in One Billion Hours.
Note 2: HAST, Temp Cycle & Thermal Shock are subjected to J-STD-020 MSL Preconditioning
0
0
0
Reliability Data Report
Report Number: R357
Report generated on: Wed Jun 18 10:34:29 PDT 2014
HIGH TEMPERATURE BAKE AT 150 DEG C
PACKAGE TYPE
SAMPLE SIZE
SOIC/SOT/MSOP
Totals
902
902
OLDEST DATE
NEWEST DATE
CODE
CODE
0804
-
0906
-
K DEVICE HRS
No. of FAILURES
892
892
0
0