Solder Profile

TI S P ® T el ec om O ver v ol ta ge P r ote ctor s.
TISP® products in SMD pack ages meet the requir ements of JEDEC J-STD-020
MSL 1 when ass embled using the following s older pr ofile.
Lead Free SMD Solder Reflow Profile
Profile Feature
Condition
Preheat 150 oC (Tsmin) to 200 oC (Tsmax)
Time 60 - 150 s.
Average Ramp-Up Rate (Tsmax to tp)
3 oC/second max.
Time maintained above liquidus ( tL ) 217 oC
60 - 150 s
Time within 5 oC of Peak Temperature (tp)
20 - 40 s
260 oC +0/-5 oC max
Peak temperature (tp)
6 oC/second max
Ramp-Down Rate
Time from 25 oC to Peak Temperature
8 minutes max
SDA01
300
tp
Ramp-up
250
Ramp-down
Ts max
Temperature (°C)
200
tL
Ts min
150
100
Preheat
50
0
0
30
60
90
120
150
180
210
240
270
300
330
360
Time (Seconds)
TSP Lead Free SMD Profile
Rev2 Oct 06
390
420
450
480