RS1AL SERIES_M15.pdf

RS1AL - RS1ML
Taiwan Semiconductor
CREAT BY ART
0.8A, 50V - 1000V Surface Mount Fast Recovery Rectifiers
FEATURES
- Glass passivated junction chip
- Ideal for automated placement
- Fast switching for high efficiency
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
MECHANICAL DATA
Case: Sub SMA
Sub SMA
Molding compound, UL flammability classification rating 94V-0
Moisture sensitivity level: level 1, per J-STD-020
Part No. with suffix "H" means AEC-Q101 qualified
Packing code with suffix "G" means green compound (halogen-free)
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
Polarity: Indicated by cathode band
Weight: 0.019 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted)
PARAMETER
SYMBOL
Marking code
RS1
RS1
RS1
RS1
RS1
RS1
RS1
AL
BL
DL
GL
JL
KL
ML
UNIT
RAL
RBL
RDL
RGL
RJL
RKL
RML
Maximum repetitive peak reverse voltage
VRRM
50
100
200
400
600
800
1000
Maximum RMS voltage
VRMS
35
70
140
280
420
560
700
V
Maximum DC blocking voltage
VDC
50
100
200
400
600
800
1000
V
Maximum average forward rectified current
IF(AV)
0.8
A
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
IFSM
30
A
VF
1.3
V
Maximum instantaneous forward voltage (Note 1)
@ 0.8 A
Maximum reverse current @ rated VR
TJ=25°C
TJ=125°C
Typical junction capacitance (Note 2)
CJ
Maximum reverse recovery time (Note 3)
trr
Typical thermal resistance
Operating junction temperature range
Storage temperature range
5
IR
μA
50
10
150
V
pF
250
500
ns
RθJL
RθJA
32
105
°C/W
TJ
- 55 to +150
°C
TSTG
- 55 to +150
°C
Note 1: Pulse test with PW=300μs, 1% duty cycle
Note 2: Measured at 1 MHz and Applied VR=4.0 Volts.
Note 3: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
Document Number: DS_D1409037
Version: M15
RS1AL - RS1ML
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
PART NO.
PACKING CODE
PACKING CODE
PACKAGE
PACKING
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
Sub SMA
1,800 / 7" Plastic reel (8mm tape)
3,000 / 7" Plastic reel (8mm tape)
7,500 / 13" Paper reel (8mm tape)
7,500 / 13" Plastic reel (8mm tape)
10,000 / 13" Paper reel (8mm tape)
10,000 / 13" Plastic reel (8mm tape)
1,800 / 7" Plastic reel (12mm tape)
3,000 / 7" Plastic reel (12mm tape)
7,500 / 13" Paper reel (12mm tape)
7,500 / 13" Plastic reel (12mm tape)
RH
Sub SMA
10,000 / 13" Paper reel (12mm tape)
MH
Sub SMA
10,000 / 13" Plastic reel (12mm tape)
SUFFIX
RS1xL
(Note 1)
SUFFIX
RU
RV
RT
MT
RQ
MQ
R3
RF
R2
M2
H
G
Note 1: "x" defines voltage from 50V (RS1AL) to 1000V (RS1ML)
EXAMPLE
PREFERRED
PART NO.
RS1MLHRUG
PART NO.
PART NO.
SUFFIX
RS1ML
PACKING CODE
PACKING CODE
H
DESCRIPTION
SUFFIX
RU
AEC-Q101 qualified
Green compound
G
RATINGS AND CHARACTERISTICS CURVES
(TA=25°C unless otherwise noted)
1
AVERAGE FORWARD A
CURRENT (A)
0.9
RESISTIVE OR
INDUCTIVE LOAD
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
25
50
75
100
125
150
175
INSTANTANEOUS REVERSE CURRENT
(μA)
FIG.1 FORWARD CURRENT DERATING CURVE
1
8.3ms Single Half Sine Wave
40
30
20
10
0
1
10
NUMBER OF CYCLES AT 60 Hz
Document Number: DS_D1409037
100
TJ=100oC
0.1
0.01
TJ=25oC
0.001
0
INSTANTANEOUS FORWARD CURRENT
(A)
PEAK FORWARD SURGE CURRENT
(A)
50
TJ=125oC
10
LEAD TEMPERATURE (oC)
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
FIG. 2 TYPICAL REVERSE CHARACTERISTICS
100
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 4 TYPICAL FORWARD CHARACTERISTICS
10
Pulse Width=300μs
1% Duty Cycle
TJ=125oC
1
TJ=25oC
0.1
0.4
0.6
0.8
1
1.2
1.4
FORWARD VOLTAGE (V)
1.6
1.8
Version: M15
RS1AL - RS1ML
Taiwan Semiconductor
FIG. 5 TYPICAL JUNCTION CAPACITANCE
100
CAPACITANCE (pF)
f=1.0MHz
Vsig=50mVp-p
10
1
1
10
REVERSE VOLTAGE (V)
100
PACKAGE OUTLINE DIMENSIONS
Sub SMA
Unit (mm)
DIM.
Unit (inch)
Min
Max
Min
Max
B
1.70
1.90
0.067
0.075
C
2.70
2.90
0.106
0.114
D
0.16
0.30
0.006
0.012
E
1.23
1.43
0.048
0.056
F
0.80
1.20
0.031
0.047
G
3.40
3.80
0.134
0.150
H
2.45
2.60
0.096
0.102
I
0.35
0.85
0.014
0.033
J
0.00
0.10
0.000
0.004
SUGGESTED PAD LAYOUT
Symbol
Unit (mm)
Unit (inch)
A
1.4
0.055
B
1.2
0.047
C
3.1
0.122
D
1.9
0.075
E
4.3
0.169
MARKING DIAGRAM
P/N
= Marking Code
G
= Green compound Code
YW
= Date Code
F
= Factory Code
Document Number: DS_D1409037
Version: M15
RS1AL - RS1ML
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1409037
Version: M15