HS1A SERIES_K15.pdf

HS1A - HS1M
Taiwan Semiconductor
CREAT BY ART
1A, 50V - 1000V High Efficient Surface Mount Rectifiers
FEATURES
- Glass passivated chip junction
- Ideal for automated placement
- Low forward voltage drop
- Fast switching for high efficiency
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
MECHANICAL DATA
Case: DO-214AC (SMA)
DO-214AC (SMA)
Molding compound, UL flammability classification rating 94V-0
Moisture sensitivity level: level 1, per J-STD-020
Part no. with suffix "H" means AEC-Q101 qualified
Packing code with suffix "G" means green compound (halogen-free)
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
Polarity: Indicated by cathode band
Weight: 0.06 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted)
PARAMETER
SYMBOL
HS
HS
HS
HS
HS
HS
HS
HS
1A
1B
1D
1F
1G
1J
1K
1M
UNIT
Maximum repetitive peak reverse voltage
VRRM
50
100
200
300
400
600
800
1000
V
Maximum RMS voltage
VRMS
35
70
140
210
280
420
560
700
V
Maximum DC blocking voltage
VDC
50
100
200
300
400
600
800
1000
V
Maximum average forward rectified current
IF(AV)
1
A
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
IFSM
30
A
Maximum instantaneous forward voltage (Note 1)
@1A
VF
1.0
1.3
TJ=25°C
Maximum reverse current @ rated VR
1.7
V
5
IR
TJ=100°C
50
TJ=125°C
μA
150
Maximum reverse recovery time (Note 2)
trr
50
75
ns
Typical junction capacitance (Note 3)
CJ
20
15
pF
Typical thermal resistance
RθJA
70
°C/W
TJ
- 55 to +150
°C
TSTG
- 55 to +150
°C
Operating junction temperature range
Storage temperature range
Note 1: Pulse test with PW=300μs, 1% duty cycle
Note 2: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.
Document Number: DS_D1410042
Version: K15
HS1A - HS1M
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
PART NO.
PACKING CODE
PACKING CODE
PACKAGE
PACKING
R3
SMA
1,800 / 7" Plastic reel
R2
SMA
7,500 / 13" Paper reel
M2
SMA
7,500 / 13" Plastic reel
SUFFIX
HS1x
(Note 1)
SUFFIX
F3
H
Folded SMA
1,800 / 7" Plastic reel
Folded SMA
7,500 / 13" Paper reel
F4
Folded SMA
7,500 / 13" Plastic reel
E3
Clip SMA
1,800 / 7" Plastic reel
E2
Clip SMA
7,500 / 13" Plastic reel
G
F2
Note 1: "x" defines voltage from 50V (HS1A) to 1000V (HS1M)
EXAMPLE
PREFERRED
PART NO.
HS1MHR3G
PART NO.
PART NO.
PACKING CODE
SUFFIX
HS1M
H
PACKING CODE
DESCRIPTION
SUFFIX
R3
AEC-Q101 qualified
Green compound
G
RATINGS AND CHARACTERISTICS CURVES
(TA=25°C unless otherwise noted)
FIG. 2- TYPICAL REVERSE CHARACTERISTICS
FIG.1- MAXIMUM AVERAGE FORWARD
CURRENT DERATING
INSTANTANEOUS REVERSE CURRENT
(μA)
1000
AVERAGE FORWARD CURRENT (A)
1.2
1
0.8
0.6
0.4
0.2
0
80
90
100
110
120
130
140
TJ=125°C
100
150
35
30
8.3ms Single Half Sine Wave
25
20
15
10
5
1
10
NUMBER OF CYCLES AT 60 Hz
100
INSTANTANEOUS FORWARD CURRENT
(A)
PEAK FORWARD SURGE URRENT (A)
40
1
0
LEAD TEMPERATURE (oC)
FIG. 3- MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
TJ=25°C
10
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 4- TYPICAL INSTANTANEOUS FORWARD
CHARACTERISTICS
100
HS1A-HS1D
10
HS1G
1
HS1J-HS1M
0.1
0.4
0.6
0.8
1
1.2
1.4
1.6
FORWARD VOLTAGE (V)
Document Number: DS_D1410042
Version: K15
HS1A - HS1M
Taiwan Semiconductor
FIG. 5- TYPICAL JUNCTION CAPACITANCE
JUNCTION CAPACITANCE (pF)
70
f=1.0MHz
Vsig=50mVp-p
60
50
40
HS1A-HS1G
30
20
10
HS1J-HS1M
0
0.1
1
10
100
1000
REVERSE VOLTAGE (V)
PACKAGE OUTLINE DIMENSIONS
DO-214AC (SMA)
Unit (mm)
DIM.
Unit (inch)
Min
Max
Min
Max
A
1.27
1.58
0.050
0.062
B
4.06
4.60
0.160
0.181
C
2.29
2.83
0.090
0.111
D
1.99
2.50
0.078
0.098
E
0.90
1.41
0.035
0.056
F
4.95
5.33
0.195
0.210
G
0.10
0.20
0.004
0.008
H
0.15
0.31
0.006
0.012
SUGGESTED PAD LAYOUT
Symbol
Unit (mm)
Unit (inch)
A
1.68
0.066
B
1.52
0.060
C
3.93
0.155
D
2.41
0.095
E
5.45
0.215
MARKING DIAGRAM
P/N =
Specific Device Code
G=
Green Compound
YW =
Date Code
F=
Factory Code
Document Number: DS_D1410042
Version: K15
HS1A - HS1M
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1410042
Version: K15