ISL54211 ® Data Sheet August 25, 2008 FN6662.1 MP3/USB 2.0 High Speed Switch with Negative Signal Handling/Click and Pop Suppression Features The Intersil ISL54211 dual SPDT (Single Pole/Double Throw) switches combine low distortion audio and accurate USB 2.0 high speed data (480Mbps) signal switching in the same low voltage device. When operated with a 2.7V to 5.0V single supply these analog switches allow audio signal swings below-ground, allowing the use of a common USB and audio headphone connector in Personal Media Players and other portable battery powered devices. • Low Distortion Negative Signal Capability • High Speed (480Mbps) and Full Speed (12Mbps) Signaling Capability per USB 2.0 • Clickless/Popless Audio Switches • Enable Control Pin (CTRL) to Open all Switches • Low Distortion Headphone Audio Signals - THD+N at 1mW into 32Ω Load . . . . . . . . . . . . . 0.014% • Crosstalk (20Hz to 20kHz). . . . . . . . . . . . . . . . . . . -100dB • OFF-Isolation (20Hz to 100kHz) . . . . . . . . . . . . . . . 95dB The ISL54211 logic control pins are 1.8V compatible with a supply voltage of 2.7V to 3.6V, which allows for control via a standard µcontroller. • Single Supply Operation (VDD) . . . . . . . . . . . . 2.7V to 5.0V • -3dB Bandwidth USB Switch . . . . . . . . . . . . . . . . . 700MHz The part has an audio enable control pin (CTRL) to open all in-line switches and activate the audio click and pop circuitry. The high OFF-isolation and special click/pop circuitry of the audio switches eliminates click and pops in the head-phones when the audio CODEC drivers are powering up or down or when a headphone is inserted or removed from the headphone jack. • Available in µTQFN and TDFN Packages • Compliant with USB 2.0 Short Circuit Requirements Without Additional External Components • Pb-Free (RoHS Compliant) Applications It’s available in a tiny 10 Ld 1.8mmx1.4mm ultra-thin µTQFN package and a 10 Ld 3mmx3mm TDFN package. It operates over a temperature range of -40 to +85°C. • MP3 and other Personal Media Players • Cellular/Mobile Phones • PDA’s Related Literature • Audio/USB Switching • Technical Brief TB363 “Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs)” Application Block Diagram µCONTROLLER 3.3V VDD ISL54211 USB/HEADPHONE JACK IN VBUS LOGIC CONTROL 4MΩ 4MΩ D- USB HIGH-SPEED TRANSCEIVER COM D+ 200kΩ COM + 200kΩ CLICK AND POP GND 1 CTRL R L AUDIO CODEC CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2008. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL54211 Pinouts (Note 1) ISL54211 (10 LD 3.0mmx3.0mm TDFN) TOP VIEW ISL54211 (10 LD 1.8mmx1.4mm µTQFN) TOP VIEW CTRL VDD L 7 6 CLICK/POP 8 LOGIC CONTROL D- D+ 9 10 5 R 4 GND 3 COM + VDD 1 IN 2 LOGIC CONTROL 9 D- 8 D+ 7 L 6 R 4MΩ COM - 3 200kΩ COM + 4 CLICK/ POP 200kΩ GND 1 10 CTRL 4MΩ 5 2 IN COM - NOTE: 1. Switches Shown for IN = Logic “0” and CTRL = Logic “1”. Truth Table Pin Descriptions ISL54211 ISL54211 IN CTRL L, R D+, D- µTQFN TDFN NAME 0 0 OFF OFF 1 2 IN 0 1 ON OFF 2 3 COM- 1 X OFF ON 3 4 COM+ Voice and Data Common Pin 4 5 GND 5 6 R Audio Right Input 6 7 L Audio Left Input 7 8 D+ USB Differential Input 8 9 D- USB Differential Input 9 10 CTRL Digital Control Input (Audio Enable) 10 1 VDD Power Supply IN, CTRL: Logic “0” when ≤ 0.5V or Floating, Logic “1” when ≥ 1.4V with 2.7V to 3.6V supply. FUNCTION Digital Control Input Voice and Data Common Pin Ground Connection Ordering Information PART NUMBER PART MARKING ISL54211IRUZ-T* (Note 3) 1 TEMP. RANGE (°C) -40 to +85 PACKAGE (Pb-Free) 10 Ld 1.8x1.4mm µTQFN PKG. DWG. # L10.1.8x1.4A ISL54211IRTZ (Note 2) 4211 -40 to +85 10 Ld 3mmx3mm TDFN L10.3x3A ISL54211IRTZ-T* (Note 2) 4211 -40 to +85 10 Ld 3mmx3mm TDFN L10.3x3A *Please refer to TB347 for details on reel specifications. NOTES: 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 2 FN6662.1 August 25, 2008 ISL54211 Absolute Maximum Ratings Thermal Information VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 5.5V Input Voltages D+, D-, L, R (Note 4) . . . . . . . . . . . . . . . . . . -2V to ((VDD) + 0.3V) IN (Note 4). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -2V to 5.5V CTRL (Note 4) . . . . . . . . . . . . . . . . . . . . . . -0.3 to ((VDD) + 0.3V) Output Voltages COM-, COM+ (Note 4) . . . . . . . . . . . . . . . . -2V to ((VDD) + 0.3V) Continuous Current (Audio Switches). . . . . . . . . . . . . . . . . ±150mA Peak Current (Audio Switches) (Pulsed 1ms, 10% Duty Cycle, Max). . . . . . . . . . . . . . . . ±300mA Continuous Current (USB Switches). . . . . . . . . . . . . . . . . . . ±40mA Peak Current (USB Switches) (Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . . ±100mA ESD Rating Human Body Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6kV Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300V Charged Device Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2kV Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) 10 Ld µTQFN Package (Note 5) . . . . . 160 N/A 10 Ld 3x3 TDFN Package (Notes 6, 7) 55 18 Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C Maximum Storage Temperature Range. . . . . . . . . . . . -65°C to +150°C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 4. Signals on D+, D-, L, R, COM-, COM+, CTRL, IN exceeding VDD or GND by specified amount are clamped. Limit current to maximum current ratings. 5. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 6. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 7. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. Electrical Specifications - 2.7V to 3.6V Supply Test Conditions: VDD = +3.0V, GND = 0V, VINH = 1.4V, VINL = 0.5V, VCTRLH = 1.4V, VCTRLL = 0.5V, (Note 8), Unless Otherwise Specified. PARAMETER TEST CONDITIONS TEMP (°C) MIN TYP MAX (Notes 9, 10) (Note 12) (Notes 9, 10) UNITS ANALOG SWITCH CHARACTERISTICS Audio Switches (L, R) Analog Signal Range, VANALOG VDD = 2.7V to 3.6V, IN = float, CTRL = 1.4V Full -1.5 - 1.5 V ON-Resistance, rON VDD = 3.0V, IN = float, CTRL = 1.4V, ICOMx = 40mA, VL or VR = -0.85V to 0.85V (see Figure 2) +25 - 2.4 2.8 Ω Full - - 3.8 Ω rON Matching Between Channels, ΔrON VDD = 3.0V, IN = 0.5V, CTRL = 1.4V, ICOMx = 40mA, VL or VR = Voltage at max rON over signal range of -0.85V to 0.85V, (Note 13) +25 - 0.1 0.32 Ω Full - - 0.4 Ω rON Flatness, RFLAT(ON) VDD = 3.0V, IN = 0.5V, CTRL = 1.4V, ICOMx = 40mA, VL or VR = -0.85V to 0.85V, (Note 11) +25 - 0.02 0.06 Ω Full - - 0.07 Ω Insertion Loss, GON VDD = 3.0V, IN = 0.5V, CTRL = VDD, RLOAD = 32Ω +25 - -0.78 - dB Insertion Loss, GON VDD = 3.0V, IN = 0.5V, CTRL = VDD, RLOAD = 15Ω +25 - -1.5 - dB Discharge Pull-Down Resistance, RL, RR VDD = 3.6V, IN = 0.5V, CTRL = 0.5V, VCOM- or VCOM+ = -0.85V, 0.85V, VL or VR = -0.85V, 0.85V, VD+ and VD- = floating; measure current through the discharge pull-down resistor and calculate resistance value. +25 - 40 - Ω Analog Signal Range, VANALOG VDD = 2.7V to 3.6V, IN = VDD, CTRL = 0V or VDD Full 0 - VDD V ON-Resistance, rON VDD = 3.3V, IN = 1.4V, CTRL = 1.4V, ICOMx = 1mA, VD+ or VD- = 3.3V (see Figure 3) +25 - 25 35 Ω Full - - 40 Ω USB Switches (D+, D-) 3 FN6662.1 August 25, 2008 ISL54211 Electrical Specifications - 2.7V to 3.6V Supply Test Conditions: VDD = +3.0V, GND = 0V, VINH = 1.4V, VINL = 0.5V, VCTRLH = 1.4V, VCTRLL = 0.5V, (Note 8), Unless Otherwise Specified. (Continued) PARAMETER TEST CONDITIONS TEMP (°C) MIN TYP MAX (Notes 9, 10) (Note 12) (Notes 9, 10) UNITS VDD = 3.3V, IN = 1.4V, CTRL = 0V or VDD, ICOMx = 40mA, VD+ or VD- = 0V to 400mV (see Figure 3) +25 - 5.4 6 Ω Full - - 7.5 Ω rON Matching Between Channels, ΔrON VDD = 3.3V, IN = 1.4V, CTRL = 0V or VDD, ICOMx = 40mA, VD+ or VD- = Voltage at max rON, (Note 13) +25 - 0.02 0.25 Ω Full - - 0.25 Ω rON Flatness, RFLAT(ON) VDD = 3.3V, IN = 1.4V, CTRL = 0V or VDD, ICOMx = 40mA, VD+ or VD- = 0V to 400mV, (Note 9) +25 - 0.45 0.55 Ω Full - - 0.6 Ω OFF Leakage Current, ID+(OFF) or ID-(OFF) VDD = 3.6V, IN = 0V, CTRL = 3.6V, VCOM- or VCOM+ = 0.5V, 0V, VD+ or VD- = 0V, 0.5V, VL and VR = float +25 -10 4 10 nA Full -50 - 50 nA ON Leakage Current, IDX VDD = 3.6V, IN = VDD, CTRL = 0V or VDD, VD+ or VD- = 2.7V, VCOM- or VCOM+ = Float, VL and VR = float; measuring current through 200k resistor at com side +25 -20 11 20 µA Full -30 - 30 µA ns ON-Resistance, rON DYNAMIC CHARACTERISTICS USB Turn-ON Time, tON VDD = 2.7V, RL = 50Ω, CL = 10pF (see Figure 1) +25 - 43 - USB Turn-OFF Time, tOFF VDD = 2.7V, RL = 50Ω, CL = 10pF (see Figure 1) +25 - 14.5 - ns Audio Turn-ON Time, tON VDD = 2.7V, RL = 50Ω, CL = 10pF (see Figure 1) +25 - 7.5 - µs Audio Turn-OFF Time, tOFF VDD = 2.7V, RL = 50Ω, CL = 10pF (see Figure 1) +25 - 130 - ns Skew, tSKEW VDD = 3.0V, IN = 3.0V, CTRL = 0V or 3V, RL = 45Ω, CL = 10pF, tR = tF = 750ps at 480Mbps, (Duty Cycle = 50%) (see Figure 6) +25 - 50 - ps Total Jitter, tJ VDD = 3.0V, IN = 3.0V, CTRL = 0V or 3V, RL = 50Ω, CL = 10pF, tR = tF = 750ps at 480Mbps +25 - 210 - ps Propagation Delay, tPD VDD = 3.0V, IN = 3.0V, CTRL = 0V or 3V, RL = 45Ω, CL = 10pF (see Figure 6) +25 - 250 - ps Audio Crosstalk R to COM-, L to COM+ VDD = 3.0V, IN = float, CTRL = 3.0V, RL = 32Ω, f = 20Hz to 20kHz, VR or VL = 0.707VRMS (2VP-P) (see Figure 5) +25 - -100 - dB Crosstalk VDD = 3.0V, RL = 50Ω, f = 100kHz (see Figure 5) (Audio-to-USB, USB-to-Audio) +25 - -100 - dB OFF-Isolation VDD = 3.0V, RL = 50Ω, f = 100kHz +25 - 95 - dB VDD = 3.0V, RL = 15Ω, f = 20Hz to 20kHz +25 - 111 - dB VDD = 3.0V, RL = 32Ω, f = 20Hz to 20kHz +25 - 105 - dB VDD = 3.0V, RL = 1kΩ, f = 20Hz to 20kHz +25 - 75 - dB VDD = 3.0V, RL = 10kΩ, f = 20Hz to 20kHz +25 - 57 - dB Total Harmonic Distortion Click and Pop VDD = 3.0V, RL = 100kΩ, f = 20Hz to 20kHz +25 - 45 - dB f = 20Hz to 20kHz, VDD = 3.0V, IN = Float, CTRL = 3.0V, VL or VR = 180mVRMS (509mVP-P), RL = 32Ω +25 - 0.014 - % f = 20Hz to 20kHz, VDD = 3.0V, IN = Float, CTRL = 3.0V, VL or VR = 0.707VRMS (2VP-P), RL = 32Ω +25 - 0.056 - % f = 20Hz to 20kHz, VDD = 3.0V, IN = Float, CTRL = 3.0V, VL or VR = 180mVRMS (509mVP-P), RL = 15Ω +25 - 0.043 - % f = 20Hz to 20kHz, VDD = 3.0V, IN = Float, CTRL = 3.0V, VL or VR = 0.707VRMS (2VP-P), RL = 15Ω +25 - 0.19 - % VDD = 3.3V, CTRL = 0V, IN = float, RL = 1kΩ, VL or VR = 0 to 1.25V DC step or 1.25V to 0V DC step (see Figure 7) +25 - 60 - µVp VDD = 3.3V, CTRL = 0.5Hz Square Wave, IN = float, RL = 30.1Ω or 1kΩ , VL or VR = AC-coupled to ground (see Figure 8) +25 - 500 - µVp 4 FN6662.1 August 25, 2008 ISL54211 Electrical Specifications - 2.7V to 3.6V Supply Test Conditions: VDD = +3.0V, GND = 0V, VINH = 1.4V, VINL = 0.5V, VCTRLH = 1.4V, VCTRLL = 0.5V, (Note 8), Unless Otherwise Specified. (Continued) PARAMETER TEST CONDITIONS TEMP (°C) MIN TYP MAX (Notes 9, 10) (Note 12) (Notes 9, 10) UNITS USB Switch -3dB Bandwidth Signal = 0dBm, 0.2VDC offset, RL = 50Ω, CL = 5pF +25 - 700 - MHz D+/D- OFF Capacitance, CD+OFF, CD-OFF f = 1MHz, VDD = 3.0V, IN = float, CTRL = 3.0V, VD- or VD+ = VCOMx = 0V (see Figure 4) +25 - 4 - pF COM ON Capacitance, CCOM- f = 1MHz, VDD = 3.0V, IN = 3.0V, CTRL = 0V or 3V, VDor VD+ = VCOMx = 0V, (See Figure 4) (ON), CCOM+(ON) +25 - 9 - pF POWER SUPPLY CHARACTERISTICS Full 2.7 Positive Supply Current, IDD (Audio Mode) VDD = 3.6V, IN = 0V, CTRL = 3.6V +25 - Full Positive Supply Current, IDD (USB Mode) VDD = 3.6V, IN = 3.6V, CTRL = 3.6V +25 Full - - 5 µA Positive Supply Current, IDD (Mute Mode) VDD = 3.6V, IN = 0V, CTRL = 0V +25 - 2.4 4 µA Full - - 5 µA Power Supply Range, VDD 3.6 V 7 10 µA - - 12 µA - 2.4 4 µA DIGITAL INPUT CHARACTERISTICS IN Voltage Low, VINL VDD = 2.7V to 3.6V Full - - 0.5 V IN Voltage High, VINH VDD = 2.7V to 3.6V Full 1.4 - - V CTRL Voltage Low, VCTRLL VDD = 2.7V to 3.6V Full - - 0.5 V CTRL Voltage High, VCTRLH VDD = 2.7V to 3.6V Full 1.4 - - V Input Current, IINL, ICTRLL VDD = 3.6V, IN = 0V or float, CTRL = 0V or float Full -50 2 50 nA Input Current, IINH VDD = 3.6V, IN = 3.6V, CTRL = 0V or float Full -2 1 2 µA Input Current, ICTRLH VDD = 3.6V, IN = 0V or float, CTRL = 3.6V Full -2 1 2 µA IN Pull-Down Resistor, RIN VDD = 3.6V, IN = 3.6V, CTRL = 0V or float; measure current through the internal pull-down resistor and calculate resistance value. Full - 4 - MΩ CTRL Pull-Down Resistor, RCTRL VDD = 3.6V, IN = 0V or float, CTRL = 3.6V; measure current through the internal pull-down resistor and calculate resistance value. Full - 4 - MΩ NOTES: 8. Vlogic = Input voltage to perform proper function. 9. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet. 10. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. 11. Flatness is defined as the difference between maximum and minimum value of ON-resistance over the specified analog signal range. 12. Limits established by characterization and are not production tested. 13. rON matching between channels is calculated by subtracting the channel with the highest max rON value from the channel with lowest max rON value, between L and R or between D+ and D-. 5 FN6662.1 August 25, 2008 ISL54211 Test Circuits and Waveforms VINH LOGIC INPUT 50% VINL CTRL VINPUT tOFF SWITCH INPUT VINPUT SWITCH INPUT VOUT AUDIO OR USB COMx IN VOUT 90% 90% SWITCH OUTPUT C VDD tr < 20ns tf < 20ns VIN RL 50Ω GND CL 10pF 0V tON Logic input waveform is inverted for switches that have the opposite logic sense. Repeat test for all switches. CL includes fixture and stray capacitance. RL V OUT = V (INPUT) -----------------------R L + r ON FIGURE 1B. TEST CIRCUIT FIGURE 1A. MEASUREMENT POINTS FIGURE 1. SWITCHING TIMES VDD VDD C C rON = V1/ICOM rON = V1/40mA CTRL D- OR D+ CTRL L OR R VD- OR VD+ VL OR VR IN V1 40mA 0V OR FLOAT IN V1 ICOM COMx VDD COMx GND GND Repeat test for all switches. Repeat test for all switches. FIGURE 2. AUDIO rON TEST CIRCUIT 6 FIGURE 3. USB rON TEST CIRCUIT FN6662.1 August 25, 2008 ISL54211 Test Circuits and Waveforms (Continued) VDD VDD C C CTRL CTRL SIGNAL GENERATOR AUDIO OR USB L OR R 32Ω COMx IN IN 0V OR FLOAT IMPEDANCE ANALYZER VINL OR VINH COMx GND R OR L COMx ANALYZER NC GND RL Repeat test for all switches. Repeat test for all switches. FIGURE 5. AUDIO CROSSTALK TEST CIRCUIT FIGURE 4. CAPACITANCE TEST CIRCUIT VDD C tri 90% DIN+ 10% CTRL 50% VINH tskew_i 15.8Ω DIN90% IN DIN+ 50% 15.8Ω DIN- OUT+ D+ 143Ω 10% tfi tro COM+ CL COM- OUT- DCL 143Ω 45Ω 45Ω 90% 10% 50% OUT+ OUT- GND tskew_o 50% 90% |tro - tri| Delay Due to Switch for Rising Input and Rising Output Signals. |tfo - tfi| Delay Due to Switch for Falling Input and Falling Output Signals. 10% tf0 |tskew_0| Change in Skew through the Switch for Output Signals. |tskew_i| Change in Skew through the Switch for Input Signals. FIGURE 6A. MEASUREMENT POINTS FIGURE 6B. TEST CIRCUIT FIGURE 6. SKEW TEST 7 FN6662.1 August 25, 2008 ISL54211 Test Circuits and Waveforms (Continued) 3.3V AUDIO PRECISION SYSTEM II CASCADE ANALYZER CHA FLOAT VDD IN CHB COM- L CLICK AND POP COM+ R RLOAD 0V TO 1.25V DC STEP OR 1.25V TO 0V DC STEP RLOAD GND CTRL Set Audio Analyzer for Peak Detection, 32 Samples/Sec, Aweighted Filter, Manual Range 1X/Y, Units to dBV FIGURE 7. CLICK AND POP TEST CIRCUIT 3.3V AUDIO PRECISION SYSTEM II CASCADE ANALYZER CHA FLOAT IN CHB C VDD COM- L CLICK AND POP COM+ RLOAD R RLOAD CTRL GND 0V TO VDD SQUARE WAVE Set Audio Analyzer for Peak Detection, 32 Samples/Sec, Aweighted Filter, Manual Range 1X/Y, Units to dBV FIGURE 8. CLICK AND POP TEST CIRCUIT Power Supply Turn-On/Turn-Off Click and Pop Transient Test 0V TO 3.0V DC STEP OR 3.0V TO 0V DC STEP 1Hz VDD L COMCLICK AND POP COM+ 220µF R 20kΩ 220µF 20kΩ 1.5V OR 0V GND IN CTRL FIGURE 9. CLICK AND POP TEST CIRCUIT #2 8 FN6662.1 August 25, 2008 ISL54211 Typical Application Block Diagrams 3.3V VDD ISL54211 IN µCONTROLLER CTRL USB/HEADPHONE JACK LOGIC CONTROL VBUS 4MΩ 4MΩ D- USB HIGH-SPEED D+ TRANSCEIVER COM 200kΩ COM + 200kΩ R CLICK AND POP L AUDIO CODEC GND LOGIC CONTROL VIA MICROPROCESSOR 3.3V VDD ISL54211 IN CTRL µCONTROLLER USB/HEADPHONE JACK LOGIC CONTROL VBUS 500kΩ 4MΩ 4MΩ DCOM D+ 200kΩ USB HIGH-SPEED TRANSCEIVER COM + 200kΩ CLICK AND POP R L AUDIO CODEC GND LOGIC CONTROL VIA VBUS VOLTAGE FROM COMPUTER OR USB HUB Detailed Description The ISL54211 device is a dual single pole/double throw (SPDT) analog switch that operates from a single DC power supply in the range of 2.7V to 5.0V. It was designed to function as dual 2-to-1 multiplexer to select between USB differential data signals and audio L and R stereo signals. It 9 comes in a tiny µTQFN package for use in MP3 players, PDAs, cellphones, and other personal media players. The part consists of two 2.5Ω audio switches and two 5.5Ω USB switches. The audio switches can accept signals that swing below ground. They were designed to pass audio left and right stereo signals, that are ground referenced, with minimal distortion. The USB switches were designed to pass FN6662.1 August 25, 2008 ISL54211 high-speed USB differential data signals with minimal edge and phase distortion. The ISL54211 was specifically designed for MP3 players, personal media players and cellphone applications that need to combine the audio headphone jack and the USB data connector into a single shared connector, thereby saving space and component cost. See “Typical Application Block Diagrams” on page 9 regarding functionality. The ISL54211 has a single logic control pin (IN) that selects between the audio and the USB switches. This pin can be driven low or high to switch between the audio CODEC drivers and USB transceiver of the MP3 player or cellphone. The ISL54211 also contains a logic control pin (CTRL) that when driven low while IN is low, opens all switches and activates the audio click and pop circuitry. A detailed description of the two types of switches are provided in the following sections. In a typical application, the USB transmission and audio playback are intended to be mutually exclusive operations. USB Switches The two USB switches (D+, D-) are 5.5Ω bidirectional switches that were specifically designed to pass high-speed USB differential signals typically in the range of 0V to 400mV. The switches have low capacitance and high bandwidth to pass USB high-speed signals (480Mbps) with minimum edge and phase distortion to meet USB 2.0 signal quality specifications. See Figure 20 for High-speed Eye Pattern taken with the switch in the signal path. These switches can also swing rail to rail and pass USB full-speed signals (12Mbps) with minimal distortion. See Figure 21 for Full-speed Eye Pattern taken with the switch in the signal path. The maximum signal range for the USB switches is from -1.5V to VDD. The signal voltage at D- and D+ should not be allow to exceed the VDD voltage rail or go below ground by more than -1.5V. The USB switches are active (turned ON) whenever the IN voltage is ≥ to 1.4V. Audio Switches ISL54211 Operation The two audio switches (L, R) are 2.5Ω switches that can pass signals that swing below ground. Crosstalk between the audio switches is <-100dB over the audio band. These switches have excellent OFF-isolation >105dB over the audio band with a 32Ω load. The following sections discuss using the ISL54211 in the “Typical Application Block Diagrams” on page 9. Over a signal range of ±1V (0.707VRMS) with VDD > 2.7V, these switches have an extremely low rON resistance variation. They can pass ground referenced audio signals with very low distortion (<0.06% THD+N) when delivering 15.6mW into a 32Ω headphone speaker load. See Figures 16, 17, 18, and 19 (THD+N “Typical Performance Curves” beginning on page 12). The audio drivers should be connected at the L and R side of the switch (pins 5 and 6 for µTQFN; pins 6 and 7 for TDFN) and the speaker loads should be connected at the COM side of the switch (pins 2 and 3 for µTQFN; pins 3 and 4 for TDFN). The switches have click and pop circuitry on the L and R side that is activated when the IN voltage is ≤ 0.5V or floating and the CTRL voltage ≤ to 0.5V or floating. The ISL54211 should be put in this mode before powering down or powering up of the audio CODEC drivers. In this mode, both the audio and USB in-line switches will be OFF and the audio click and pop circuitry will be ON. The high OFF-isolation of the audio switches along with the click and pop circuitry will isolate the transients generated during power-up and power-down of the audio CODECs from getting through to the headphones, thus eliminating click and pop noise in the headphones. The audio switches are active (turned ON) whenever the IN voltage is ≤ 0.5V or floating and the CTRL voltage ≥ to 1.4V. 10 VDD SUPPLY The DC power supply connected at VDD (pin 10 for µTQFN, pin 1 for TDFN) provides the required bias voltage for proper switch operation. The part can operate with a supply voltage in the range of 2.7V to 5.0V. In a typical USB/Audio application for portable battery powered devices, the VDD voltage will come from a battery or an LDO and be in the range of 2.7V to 4.3V. For best possible USB full-speed operation (12Mbps), it is recommended that the VDD voltage be ≥2.7V in order to get a USB data signal level above 2.7V. LOGIC CONTROL The state of the ISL54211 device is determined by the voltage at the IN pin (pin 1 for µTQFN; pin 2 for TDFN) and the CTRL pin (pin 9 for µTQFN, pin 10 for TDFN). These logic pins are 1.8V logic compatible when VDD is in the range of 2.7V to 3.6V and can be controlled by a standard µprocessor. The part has three states or modes of operation: Audio Mode; USB Mode; and Mute Mode. Refer to “Truth Table” on page 2. The IN pin and CTRL pin are internally pulled low through 4MΩ resistors to ground and can be left floating or tri-stated by the µprocessor. The CTRL control pin is only active when IN is logic “0”. Logic Control Voltage Levels IN = Logic “0” (Low) when ≤ 0.5V or Floating. IN = Logic “1” (High) when ≥ 1.4V FN6662.1 August 25, 2008 ISL54211 CTRL = Logic “0” (Low) when ≤ 0.5V or Floating. CTRL = Logic “1” (High) when ≥ 1.4V Audio Mode If the IN pin = Logic “0” and CTRL pin = Logic “1” the part will be in the Audio mode. In Audio mode the L (left) and R (right) 2.5Ω audio switches are ON, the D- and D+ 5.5Ω switches are OFF (high impedance) and the audio click and pop circuitry is OFF (high impedance). When nothing is plugged into the common connector or a headphone is plugged into the common connector, the µprocessor will sense that there is no voltage at the VBUS pin of the connector and will drive and hold the IN control pin of the ISL54211 low. As long as the CTRL = Logic “1”, the ISL54211 part remains in the audio mode and the audio drivers of the player can drive the headphones and play music. USB Mode If the IN pin = Logic “1” and CTRL pin = Logic “0” or Logic “1”, the part will go into USB mode. In USB mode the D- and D+ 5.5Ω switches are ON and the L and R 2.5Ω audio switches are OFF (high impedance). When a USB cable from a computer or USB hub is connected at the common connector, the µprocessor will sense the presence of the 5V VBUS voltage and drive the IN pin voltage high. The ISL54211 part will go into the USB mode. In USB mode the computer or USB hub transceiver and the MP3 player or cellphone USB transceiver are connected and digital data will be able to be transmit back and forth. When the USB cable is disconnected, the µprocessor will sense that the 5V VBUS voltage is no longer connected and will drive the IN pin low and put the part back into the Audio or Mute mode. Mute Mode If the IN pin = Logic “0” and CTRL pin = Logic “0”, the part will be in the Mute mode. In the Mute mode, the audio switches and the USB switches are OFF (high impedance) and the audio click and pop circuitry is ON. Before powering down or powering up of the audio CODECs drivers, the ISL54211 should be put in the Mute mode. In Mute mode, transients present at the L and R signal pins due to the changing DC voltage of the audio drivers will not pass to the headphones, preventing clicks and pops in the headphones. Before power-up and power-down of the ISL54211, part the IN and CTRL control pins should be driven to ground or tri-stated. This will put the switch in the mute state, which turns all switches OFF and activates the click and pop circuitry. This will minimize transients at the speaker loads during power-up and power-down. See Figure 30 in the “Typical Performance Curves” on page 17. 11 AC-COUPLED CLICK AND POP OPERATION Single supply audio drivers have their signal biased at a DC offset voltage, usually at 1/2 the DC supply voltage of the driver. As this DC bias voltage comes up or goes down during power-up or power-down of the driver, a transient can be coupled into the speaker load through the DC blocking capacitor (see “Typical Application Block Diagrams” on page 9). When a driver is OFF and suddenly turned ON, the rapidly changing DC bias voltage at the output of the driver will cause an equal voltage at the input side of the switch due to the fact that the voltage across the blocking capacitor cannot change instantly. If the switch is in the Audio mode or there is no low impedance path to discharge the blocking capacitor voltage at the input of the switch, before turning on the audio switch, a transient discharge will occur in the speaker, generating a click/pop noise. Proper elimination of a click/pop transient at the speaker loads while powering up or down of the audio drivers requires that the ISL54211 have its click/pop circuitry activated by putting the part in the Mute mode. This allows the transients generated by the audio drivers to be discharged through the click and pop shunt circuitry. Once the driver DC bias has reached VDD/2 and the transient on the switch side of the DC blocking capacitor has been discharged to ground through the click/pop shunt circuitry, the audio switches can be turned ON and connected through to the speaker loads without generating any undesirable click/pop noise in the speakers. With a typical DC blocking capacitor of 220µF and the click/pop shunt circuitry designed to have a resistance of 20Ω to 70Ω, allowing a 100ms wait time to discharge the transient before placing the switch in the Audio mode will prevent the transient from getting through to the speaker load. See Figures 28 and 29 in the “Typical Performance Curves” page 16. USING THE COMPUTER VBUS VOLTAGE TO DRIVE THE “IN” PIN Rather than using a micro-processor to control the IN logic pin, one can directly drive the IN pin using the VBUS voltage from the computer or USB hub. See the “Typical Application Block Diagrams” on page 9. When a headphone or nothing is connected at the common connector, the internal 4MΩ pull-down will pull the IN pin low, putting the ISL54211 in the Audio or Mute mode, depending on the condition of the CTRL pin. When a USB cable is connected at the common connector, the voltage at the IN pin will be driven to 5V and the part will automatically go into the USB mode. When the USB cable is disconnected from the common connector, the voltage at the IN pin will be pulled low by the FN6662.1 August 25, 2008 ISL54211 pull-down resistor and return to the Audio or Mute mode, depending on the condition of the CTRL pin. Note: The ISL54211 contains an internal diode between the IN pin and VDD pin. Whenever the IN voltage is greater than the VDD voltage by more than 0.7V, current will flow through this diode into the VDD power supply bus. An external series resistor in the range of 100kΩ to 500kΩ is required at the IN logic pin to limit the current when driving it with the VBUS voltage. This allows the VBUS voltage from a computer or USB hub (4.4V to 5.25V) to drive the IN pin while the VDD voltage is in the range of 2.7V to 3.6V. A 500kΩ resistor will limit the current to 3µA to 5µA and still allow the IN logic voltage to go to around 3V, which is will above the required VINH level of 1.4V. A smaller series resistor can be used but more current will flow. Typical Performance Curves TA = +25°C, Unless Otherwise Specified 2.70 4.0 ICOM = 40mA ICOM = 40mA VDD = 3.0V 3.6 VDD = 2.5V VDD = 3.6V VDD = 3.3V 2.60 2.55 2.50 -1.5 -1.0 rON (Ω) rON (Ω) 2.65 3.2 VDD = 4.3V 2.8 VDD = 2.7V VDD = 5.0V 2.4 VDD = 5.0V -0.5 0 0.5 1.0 2.0 -1.5 1.5 -1.0 -0.5 0 VCOM (V) VCOM (V) FIGURE 10. AUDIO ON-RESISTANCE vs SUPPLY VOLTAGE vs SWITCH VOLTAGE VDD = 3.6V 0.5 1.0 1.5 FIGURE 11. AUDIO ON-RESISTANCE vs SUPPLY VOLTAGE vs SWITCH VOLTAGE 25 4 VDD = 3.0V +85°C ICOM = 40mA 20 3 rON (Ω) rON (Ω) 15 +25°C 10 2 +25°C -40°C 5.0 VDD = 3.0V ICOM = 40mA 1 -1.5 -1.0 -0.5 0 0.5 1.0 1.5 VCOM (V) FIGURE 12. AUDIO ON-RESISTANCE vs SWITCH VOLTAGE vs TEMPERATURE 12 0 -1.5 +85°C -40°C -1.0 -0.5 0 0.5 1.0 VCOM (V) 1.5 2.0 2.5 3.0 FIGURE 13. AUDIO ON-RESISTANCE vs SWITCH VOLTAGE vs TEMPERATURE FN6662.1 August 25, 2008 ISL54211 Typical Performance Curves TA = +25°C, Unless Otherwise Specified (Continued) 7.0 7 VDD = 3.3V ICOM = 40mA ICOM = 40mA 6.5 +85°C 6 6.0 rON (Ω) rON (Ω) VDD = 3.3V 5.0 VDD = 3.6V 4.5 4.0 VDD = 5V 0 0.1 VDD = 4.3V 0.2 VCOM (V) 2 0.3 1 0.4 FIGURE 14. USB ON-RESISTANCE vs SUPPLY VOLTAGE vs SWITCH VOLTAGE 0.058 -40°C 4 3 3.5 3.0 +25°C 5 VDD = 2.7V 5.5 0 0.1 0.2 VCOM (V) 0.3 0.4 FIGURE 15. USB ON-RESISTANCE vs SWITCH VOLTAGE vs TEMPERATURE 0.08 VDD = 2.7V RLOAD = 32Ω VDD = 3V PEAK-TO-PEAK VOLTAGES AT LOAD 3VP-P 2.5VP-P THD+N (%) THD+N (%) 0.056 VDD = 3.0V VDD = 3.3V 0.054 VDD = 3.6V 0.06 2VP-P 0.04 1VP-P 0.052 RLOAD = 32Ω VLOAD = 0.707VRMS 20 200 2k FREQUENCY (Hz) 20k 20 FIGURE 16. THD+N vs SUPPLY VOLTAGE vs FREQUENCY 0.20 RLOAD = 32Ω FREQ = 1kHz VDD = 3V 0.10 THD+N (%) THD+N (%) 20k 0.30 RLOAD = 32Ω FREQ = 1kHz VDD = 3V 0.10 0.08 0.06 0.08 0.06 0.04 0.04 0.02 0.02 0 0.3 200 2k FREQUENCY (Hz) FIGURE 17. THD+N vs SIGNAL LEVELS vs FREQUENCY 0.14 0.12 510mVP-P 0.02 0.6 0.9 1.2 1.5 1.8 2.1 2.3 OUTPUT VOLTAGE (VP-P) FIGURE 18. THD+N vs OUTPUT VOLTAGE 13 2.6 2.9 0 5 10 15 20 25 30 OUTPUT POWER (mW) FIGURE 19. THD+N vs OUTPUT POWER FN6662.1 August 25, 2008 ISL54211 VOLTAGE SCALE (0.1V/DIV) Typical Performance Curves TA = +25°C, Unless Otherwise Specified (Continued) TIME SCALE (0.2ns/DIV) FIGURE 20. EYE PATTERN: 480Mbps WITH USB SWITCHES IN THE SIGNAL PATH 14 FN6662.1 August 25, 2008 ISL54211 Typical Performance Curves TA = +25°C, Unless Otherwise Specified (Continued) VOLTAGE SCALE (0.5V/DIV) VDD = 3.3V TIME SCALE (10ns/DIV) -40 VDD = 3.3V -45 VSIGNAL = 0.707VRMS -50 -55 RL = 10kΩ -60 -65 -70 -75 RL = 1kΩ -80 -85 -90 -95 -100 RL = 32Ω -105 -110 -115 -120 20 50 100 200 500 1k 2k FREQUENCY (Hz) -60 -65 -70 -80 -85 -90 -95 L TO R -100 -105 -110 R TO L -115 5k 10k 20k FIGURE 22. OFF-ISOLATION AUDIO SWITCHES vs LOADING 15 VDD = 3V RLOAD = 32Ω VSIGNAL = 0.707VRMS -75 CROSSTALK (dB) OFF- ISOLATION (dB) FIGURE 21. EYE PATTERN: 12Mbps USB SIGNAL WITH USB SWITCHES IN THE SIGNAL PATH -120 20 50 100 200 500 1k 2k FREQUENCY (Hz) 5k 10k 20k FIGURE 23. AUDIO CHANNEL-TO-CHANNEL CROSSTALK FN6662.1 August 25, 2008 ISL54211 Typical Performance Curves TA = +25°C, Unless Otherwise Specified (Continued) -60 0 VDD = 3V RLOAD = 50Ω VSIGNAL = 0.707VRMS -70 -80 -20 NORMALIZED GAIN (dB) -90 CROSSTALK (dB) -100 USB TO AUDIO -110 -120 -130 AUDIO TO USB -140 RL = 50Ω VIN = 0.2VP-P TO 2VP-P -150 -160 -40 -60 -80 -100 -120 -170 -180 20 50 100 200 500 1k 2k 5k 10k 20k 50k 100k -140 0.001 0.01 FREQUENCY (Hz) 500M 1 0 USB SWITCH RL = 50Ω VIN = 0.2VP-P TO 2VP-P 0 -1 -20 NORMALIZED GAIN (dB) NORMALIZED GAIN (dB) 100M FIGURE 25. OFF-ISOLATION USB SWITCHES FIGURE 24. CHANNEL-TO-CHANNEL CROSSTALK -10 0.1 1M 10M FREQUENCY (Hz) -30 -40 -50 -60 -70 -2 -3 -4 RL = 50Ω -80 VSIGNAL = 0.2VP-P TO 2VP-P -90 -100 0.001 0.01 0.1 1M 10M FREQUENCY (Hz) 100M 1M 500M FIGURE 26. OFF-ISOLATION AUDIO SWITCHES MUTE MUTE FIGURE 28. 32Ω AC-COUPLED CLICK/POP REDUCTION 16 VOLTAGE (V) VOLTAGE (V) TIME (s) 100ms/DIV 2V/DIV VDD/2 2V/DIV VDD/2 2V/DIV LOUT50mV/DIV 1G FIGURE 27. FREQUENCY RESPONSE 2V/DIV LIN 200mV/DIV 10M 100M FREQUENCY (Hz) LIN 200mV/DIV LOUT 50mV/DIV TIME (s) 100ms/DIV FIGURE 29. 1kΩ AC-COUPLED CLICK/POP REDUCTION FN6662.1 August 25, 2008 ISL54211 Typical Performance Curves TA = +25°C, Unless Otherwise Specified (Continued) Die Characteristics VDD 1V/DIV SUBSTRATE POTENTIAL (POWERED UP): GND VOLTAGE (V) TRANSISTOR COUNT: 98 PROCESS: Submicron CMOS VIN = 1.5V OR 0V IN = CTRL = 0V VOUT 10mV/DIV TIME (s) 200ms/DIV FIGURE 30. POWER-UP/POWER-DOWN CLICK AND POP TRANSIENT 17 FN6662.1 August 25, 2008 ISL54211 Thin Dual Flat No-Lead Plastic Package (TDFN) L10.3x3A 2X 0.10 C A A 10 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE D MILLIMETERS 2X 0.10 C B SYMBOL MIN NOMINAL MAX NOTES A 0.70 0.75 0.80 - A1 - - 0.05 - E A3 6 INDEX AREA TOP VIEW B // A C SEATING PLANE 0.08 C b 0.20 0.25 0.30 5, 8 D 2.95 3.0 3.05 - D2 2.25 2.30 2.35 7, 8 E 2.95 3.0 3.05 - E2 1.45 1.50 1.55 7, 8 e 0.50 BSC - k 0.25 - - - L 0.25 0.30 0.35 8 A3 SIDE VIEW D2 (DATUM B) 0.10 C 0.20 REF 7 8 N 10 2 Nd 5 3 Rev. 3 3/06 D2/2 NOTES: 6 INDEX AREA 1 2 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2. N is the number of terminals. NX k 3. Nd refers to the number of terminals on D. (DATUM A) 4. All dimensions are in millimeters. Angles are in degrees. E2 E2/2 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. NX L N N-1 NX b 8 e (Nd-1)Xe REF. BOTTOM VIEW 5 7. Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance. 0.10 M C A B 8. Nominal dimensions are provided to assist with PCB Land Pattern Design efforts, see Intersil Technical Brief TB389. 9. Compliant to JEDEC MO-229-WEED-3 except for D2 dimensions. CL NX (b) (A1) L1 5 9 L e SECTION "C-C" C C TERMINAL TIP FOR ODD TERMINAL/SIDE 18 FN6662.1 August 25, 2008 ISL54211 Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN) D 6 INDEX AREA A L10.1.8x1.4A B N 10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE MILLIMETERS E SYMBOL 2X MIN NOMINAL MAX NOTES 0.10 C 1 2X 2 0.10 C TOP VIEW 0.45 0.50 0.55 - A1 - - 0.05 - A3 0.10 C C A 0.05 C A 0.127 REF 0.15 0.20 0.25 5 D 1.75 1.80 1.85 - E 1.35 1.40 1.45 - e SEATING PLANE A1 SIDE VIEW (DATUM A) PIN #1 ID NX L 1 NX b 5 10X 0.10 M C A B 0.05 M C 2 L1 5 (DATUM B) 7 - b 0.40 BSC - L 0.35 0.40 0.45 L1 0.45 0.50 0.55 - N 10 2 Nd 2 3 Ne 3 3 θ 0 - 12 4 Rev. 3 6/06 NOTES: 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2. N is the number of terminals. e 3. Nd and Ne refer to the number of terminals on D and E side, respectively. BOTTOM VIEW 4. All dimensions are in millimeters. Angles are in degrees. CL (A1) NX (b) 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5 L 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. Maximum package warpage is 0.05mm. SECTION "C-C" e 8. Maximum allowable burrs is 0.076mm in all directions. TERMINAL TIP C C 2.20 1.00 0.60 1.00 9. JEDEC Reference MO-255. 10. For additional information, to assist with the PCB Land Pattern Design effort, see Intersil Technical Brief TB389. 0.50 1.80 0.40 0.20 0.20 0.40 10 LAND PATTERN All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 19 FN6662.1 August 25, 2008