TSM2N7002K_F15.pdf

TSM2N7002K
Taiwan Semiconductor
N-Channel Power MOSFET
60V, 300mA, 2Ω
FEATURES
KEY PERFORMANCE PARAMETERS
●
Low On-Resistance
●
ESD Protected 2KV
●
High Speed Switching
●
Low Voltage Drive
PARAMETER
VALUE
UNIT
VDS
60
V
RDS(on) (max)
VGS = 10V
2
VGS = 4.5V
4
Qg
Ω
0.4
nC
APPLICATION
●
●
Logic Level translators
DC-DC Converter
SOT-23
Notes: Moisture sensitivity level: level 3. Per J-STD-020
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
VDS
60
V
Gate-Source Voltage
VGS
±20
V
Continuous Drain Current
Pulsed Drain Current
TA = 25°C
(Note 1)
ID
TA = 100°C
(Note 2)
Total Power Dissipation @ TA = 25°C
300
180
mA
IDM
800
mA
PDTOT
300
mW
Single Pulsed Avalanche Energy
(Note 3)
EAS
0.2
mJ
Single Pulsed Avalanche Current
(Note 3)
IAS
2
A
TJ, TSTG
- 55 to +150
°C
SYMBOL
LIMIT
UNIT
RӨJA
350
°C/W
Operating Junction and Storage Temperature Range
THERMAL PERFORMANCE
PARAMETER
Junction to Ambient Thermal Resistance
Notes: RӨJA is the sum of the junction-to-case and case-to-ambient thermal resistances. The case thermal reference is defined
at the solder mounting surface of the drain pins. RӨJA is guaranteed by design while RӨCA is determined by the user’s board
design. RӨJA shown below for single device operation on FR-4 PCB in still air
Document Number: DS_P0000068
1
Version: F15
TSM2N7002K
Taiwan Semiconductor
ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted)
PARAMETER
Static
CONDITIONS
SYMBOL
MIN
TYP
MAX
UNIT
(Note 4)
Drain-Source Breakdown Voltage
VGS = 0V, ID = 10µA
BVDSS
60
--
--
V
Gate Threshold Voltage
VDS = VGS, ID = 250µA
VGS(TH)
1.0
1.5
2.5
V
Gate Body Leakage
VGS =±20V, VDS =0V
IGSS
--
--
±10
µA
Zero Gate Voltage Drain Current
VDS =60V, VGS =0V
IDSS
--
--
1.0
µA
--
1.2
2
--
2
4
Drain-Source On-State Resistance
VGS =10V, ID =300mA
VGS =4.5V, ID =200mA
RDS(ON)
mΩ
Forward Transconductance
VDS =10V, ID =200mA
gfs
100
--
--
mS
Diode Forward Voltage
IS =300mA, VGS =0V
VSD
--
0.8
1.4
V
Qg
--
0.4
0.6
nC
Ciss
--
30
--
Coss
--
6
--
Crss
--
2.5
--
Rg
--
70
--
Dynamic
(Note 5)
VDS =10V, ID = 250mA,
Total Gate Charge
VGS =4.5V
Input Capacitance
VDS = 25V, VGS = 0V,
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Switching
f = 1.0MHz
F = 1MHz, open drain
pF
Ω
(Note 6)
Turn-On Delay Time
VDD =30V, RG =10Ω
td(on)
--
25
--
Turn-Off Delay Time
ID =200mA, VGEN =10V,
td(off)
--
35
--
Diode Forward Voltage
IS =300mA, VGS =0V
VSD
--
0.8
1.4
Reverse Recovery Time
IS = 0.5A
trr
--
40
--
ns
Reverse Recovery Charge
dIF/dt = 100A/µs
Qrr
--
39
--
nC
Source-Drain Diode
ns
(Note 4)
Notes:
1.
Current limited by package
2.
Pulse width limited by the maximum junction temperature
3.
L = 0.1mH, IAS = 2A, VDD = 25V, RG = 25Ω, Starting TJ = 25 C
4.
Pulse test: PW ≤ 300µs, duty cycle ≤ 2%
5.
For DESIGN AID ONLY, not subject to production testing.
6.
Switching time is essentially independent of operating temperature.
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Document Number: DS_P0000068
2
Version: F15
TSM2N7002K
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
TSM2N7002KCX RFG
PACKAGE
PACKING
SOT-23
3,000pcs / 7” Reel
Note:
1. Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC
2. Halogen-free according to IEC 61249-2-21 definition
Document Number: DS_P0000068
3
Version: F15
TSM2N7002K
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TC = 25°C unless otherwise noted)
Output Characteristics
Transfer Characteristics
On-Resistance vs. Drain Current
Gate Charge
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
Document Number: DS_P0000068
4
Version: F15
TSM2N7002K
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TC = 25°C unless otherwise noted)
On-Resistance vs. Gate-Source Voltage
Threshold Voltage
Single Pulse Power
Normalized Thermal Transient Impedance, Junction-to-Ambient
Document Number: DS_P0000068
5
Version: F15
TSM2N7002K
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS (Unit: Millimeters)
SOT-23
SUGGESTED PAD LAYOUT (Unit: Millimeters)
MARKING DIAGRAM
702 = TSM2N7002KCX Device Code
X = Internal Code
Document Number: DS_P0000068
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Version: F15
TSM2N7002K
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_P0000068
7
Version: F15