Reliability Data Report Product Family R596 LTM2881 / LTM2882 / LTM2883 / LTM2884 / LTM2892 Reliability Data Report Report Number: R596 Report generated on: Sat Oct 26 10:14:08 PDT 2013 OPERATING LIFE TEST PACKAGE TYPE LGA 11X15 Totals SAMPLE SIZE OLDEST DATE NEWEST DATE K DEVICE HRS CODE CODE (+125°C) 0920 - 1149 - 308 308 308 308 1 No. of FAILURES 2,3 0 0 HIGHLY ACCELERATED STRESS TEST AT +131 DEG C / 85% RH PACKAGE TYPE SAMPLE SIZE OLDEST DATE NEWEST DATE K DEVICE HRS No. of FAILURES 4 CODE CODE (+85°C) BGA 11X15 LGA 11X15 76 52 1015 1250 1015 1250 145 199 0 0 Totals 128 - - 344 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 1242 - 1242 - 450 450 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES TEMP CYCLE FROM +20+70 DEG C PACKAGE TYPE BGA 11X15 Totals SAMPLE SIZE 150 150 TEMP CYCLE FROM 0 TO 100 DEG C PACKAGE TYPE SAMPLE SIZE CODE CODE CYCLES BGA 11X15 267 1242 1302 523 0 Totals 267 - - 523 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 1015 0940 - 1318 1319 - 1024 1246 2,270 0 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES TEMP CYCLE FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE BGA 11X15 LGA 11X15 Totals 4589 2496 7,085 TEMP CYCLE FROM -40 TO 125 DEG C PACKAGE TYPE SAMPLE SIZE CODE CODE CYCLES BGA 11X15 318 0940 1302 457 0 LGA 11X15 Totals 268 586 0920 - 0931 - 509 966 0 0 (1) Assumes Activation Energy = 1.0 Electron Volts (2) Failure Rate Equivalent to +55 °C, 60% Confidence Level =5.94 FITS (3) Mean Time Between Failure in Years = 19232.187 (4) Assumes 20X Acceleration from 85 °C to +131 °C Note 1: 1 FIT = 1 Failure in One Billion Hours. Note 2: HAST, Temp Cycle & Thermal Shock are subjected to J-STD-020 MSL 3/4 Preconditioning Reliability Data Report Report Number: R596 Report generated on: Sat Oct 26 10:14:08 PDT 2013 TEMP CYCLE FROM -55 TO 125 DEG C PACKAGE TYPE SAMPLE SIZE BGA 11X15 LGA 11X15 Totals 401 460 861 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 1209 1017 - 1231 1250 - 212 579 791 0 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CYCLES THERMAL SHOCK FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE CODE CODE BGA 11X15 4290 0940 1318 1227 0 LGA 11X15 Totals 2330 6,620 0950 - 1319 - 1035 2,262 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES THERMAL SHOCK FROM -40 TO 125 DEG C PACKAGE TYPE SAMPLE SIZE CODE CODE CYCLES LGA 11X15 292 0920 0931 584 0 Totals 292 - - 584 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 1209 1017 - 1231 1250 - 239 614 853 0 0 0 OLDEST DATE NEWEST DATE K DEVICE HRS No. of FAILURES CODE CODE THERMAL SHOCK FROM -55 TO 125 DEG C PACKAGE TYPE SAMPLE SIZE BGA 11X15 LGA 11X15 Totals 335 461 796 HIGH TEMPERATURE BAKE AT 150 DEG C PACKAGE TYPE SAMPLE SIZE BGA 11X15 2994 0940 1328 2692 0 LGA 11X15 Totals 2090 5,084 0920 - 1316 - 2069 4,761 0 0 OLDEST DATE NEWEST DATE K DEVICE HRS No. of FAILURES CODE CODE HIGH TEMPERATURE BAKE AT 175 DEG C PACKAGE TYPE SAMPLE SIZE LGA 11X15 154 0920 0920 231 0 Totals 154 - - 231 0 Reliability Data Report Report Number: R596 Report generated on: Sat Oct 26 10:14:08 PDT 2013 HIGH TEMPERATURE BAKE AT 125 DEG C PACKAGE TYPE SAMPLE SIZE BGA 11X15 LGA 11X15 Totals 445 100 545 OLDEST DATE NEWEST DATE CODE CODE 1225 1316 - 1318 1319 - K DEVICE HRS No. of FAILURES 321 50 371 0 0 0