5962-7802005M2A SMD

REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
G
Convert to SMD format. Add vendor CAGE 01295. Add device types 03 and
04.
87-07-28
M. A. Frye
H
Convert to one part-one part number format. Technical changes to 1.3, 4.2,
and tables I and II. Add device type 05. Add vendor CAGE 18324 and 27014.
Add figures 2 and 3.
91-07-05
M. A. Frye
J
Changes in accordance with N.O.R. 5962-R061-92.
91-11-22
M. L. Poelking
K
Redrawn with changes. Add device type 06.
95-10-31
M. A. Frye
L
Changes in accordance with N.O.R. 5962-R089-96.
96-03-28
M. A. Frye
M
Redrawn with changes to table I for device type 05. - drw
97-10-14
R. Monnin
N
Add radiation hardened information. - drw
99-05-25
R. Monnin
P
Make changes to 3.1, 3.5.1, and 6.6.3. - ro
00-02-15
R. Monnin
R
Add radiation hardness assurance level R devices. - ro
00-08-08
R. Monnin
T
Add case outline Z. - ro
01-05-03
R. Monnin
U
Make a change to 6.6.3 and footnote 3/ as specified under the BULLETIN
SHEET. - ro
07-07-17
R. Heber
V
Add device type 07. Editorial changes throughout. – drw
10-03-03
Charles F. Saffle
CURRENT CAGE CODE 67268
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
V
V
V
SHEET
15
16
17
REV STATUS
REV
V
V
V
V
V
V
V
V
V
V
V
V
V
V
OF SHEETS
SHEET
1
2
3
4
5
6
7
8
9
10
11
12
13
14
PMIC N/A
PREPARED BY
Monica L. Poelking
STANDARD
MICROCIRCUIT
DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
CHECKED BY
Charles E. Besore
APPROVED BY
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
Michael A. Frye
DRAWING APPROVAL DATE
MICROCIRCUIT, LINEAR, QUAD DIFFERENTIAL
LINE RECEIVER, MONOLITHIC SILICON
79-01-26
AMSC N/A
REVISION LEVEL
V
SIZE
CAGE CODE
A
14933
SHEET
DSCC FORM 2233
APR 97
1 OF
78020
17
5962-E183-10
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
R
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
78020
01
Q
E
A
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
/
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device types. The device types identify the circuit function as follows:
Device type
Generic number
01
02
03
04
05
06
07
Circuit function
26LS32
26LS33
26LS32A
26LS33A
26F32
26LS32
26LS33A
Quad, differential line receiver
Quad, differential line receiver
Quad, differential line receiver
Quad, differential line receiver
Quad, differential line receiver
Quad, differential line receiver
Quad, differential line receiver
1/
2/
1/
2/
1/
1/
2/
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
Device requirements documentation
M
Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Q or V
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
E
F
Z
2
Descriptive designator
GDIP1-T16 or CDIP2-T16
GDFP2-F16 or CDFP3-F16
GDFP1-G16
CQCC1-N20
Terminals
Package style
16
16
16
20
Dual-in-line
Flat package
Flat pack with gullwing leads
Square leadless chip carrier
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
____
1/ Input voltage range (differential or common mode)  7 V. Input sensitivity 200 mV.
2/ Input voltage range (differential or common mode)  15 V. Input sensitivity 500 mV.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78020
A
REVISION LEVEL
V
SHEET
2
1.3 Absolute maximum ratings. 3/
Power supply voltage (VCC) .............................................................................
Common mode range .....................................................................................
Differential input voltage .................................................................................
Enable voltage ................................................................................................
Output sink current .........................................................................................
Storage temperature range .............................................................................
Power dissipation (PD) ....................................................................................
Lead temperature (soldering, 10 seconds) .....................................................
Junction temperature (TJ) ...............................................................................
Thermal resistance, junction-to-case (JC) ......................................................
Thermal resistance, junction-to-ambient (JA):
7.0 V dc
25 V dc
25 V dc
7.0 V dc
50 mA
-65C to +150C
500 mW 4/
+300C
+150C
See MIL-STD-1835
Device types
Device type
01-04, 06, 07
05__
Case outline E ................................................................................................. 100C/W
100C/W
Case outlines F and Z ..................................................................................... 140C/W
142C/W
Case outline 2 ................................................................................................. 130C/W
87C/W
1.4 Recommended operating conditions.
Supply voltage range (VCC) .............................................................................
Minimum high level input voltage (VIH) ............................................................
Maximum low level input voltage (VIL) .............................................................
Input hysteresis (VHYST) ..................................................................................
Ambient operating temperature range (TA) .....................................................
+4.5 V dc to +5.5 V dc
2.0 V dc
0.8 V dc
50 mV typical
-55C to +125C
1.5 Radiation features.
Maximum total dose available (dose rate = 50 - 300 rads (Si)/s) ................ 100 Krads(Si) 5/
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
_______
3/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
4/ Must withstand the added PD due to short circuit test, e.g., IOS.
5/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883,
method 1019, condition A.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78020
A
REVISION LEVEL
V
SHEET
3
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Test circuit and switching waveforms. The test circuit and switching waveforms shall be as specified on figure 2.
3.2.4 Radiation exposure circuit. The radiation exposure circuit shall be as specified on figure 3.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer’s PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML” or “Q” as required in
MIL-PRF-38535. The compliance mark for device class M shall be a “C” as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this
drawing shall affirm that the manufacturer’s product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and
herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC’s agent, and the acquiring activity retain the
option to review the manufacturer’s facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 53 (see MIL-PRF-38535, appendix A).
3.11 PIN supersession information. The PIN supersession information shall be as specified in the appendix.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78020
A
REVISION LEVEL
V
SHEET
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/ 2/
Group A
Device
-55C  TA  +125C
subgroups
type
Min
Max
1, 2, 3
01,03,
05,06
-0.2
+0.2
1
05
-0.2
+0.2
1, 2, 3
02,04,
-0.5
+0.5
unless otherwise specified
Differential input voltage
sensitivity
VTH
VOUT = VOL or VOH,
-7 V  VCM  +7 V
M,D,P,L,R
VOUT = VOL or VOH,
-15 V  VCM  +15 V
Input resistance 3/
RIN
IIN
-15 V  VCM  +15 V
4, 5, 6
01,02
1, 2, 3
VIN = +15 V,
M,D,P,L,R
VIN = -15 V,
M,D,P,L,R
VIN = +15 V,
V ENABLE = 0.8 V, IOH = -440 A
M,D,P,L,R
VCC = 4.5 V, IOL = 4.0 mA,
V ENABLE = 0.8 V, VIN = -1.0 V
M,D,P,L,R
VCC = 4.5 V, IOL = 8.0 mA,
12.0
05
14.0
2.3
05
2.3
1, 2, 3
01,02,
-2.8
1
05
-2.8
1, 2, 3
03,04
2.3
07
1.2
03,04
-2.8
07
-1.7
1, 2, 3
All
2.5
V
1
05
2.5
1, 2, 3
All
0.4
1
05
0.4
1, 2, 3
All
0.45
1
05
0.45
V ENABLE = 0.8 V, VIN = -1.0 V
M,D,P,L,R
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
mA
05,06
(other input -15 V  VIN  10 V)
VCC = 4.5 V, VIN = 1.0 V,
03,04,
07
1
VIN = -15 V,
VOL
k
05,06
(other input -10 V  VIN  15 V)
Output low voltage (3007)
6.0
01,02,
(other input -15 V  VIN  15 V)
VOH
V
06
(other input -15 V  VIN  15 V)
Output high voltage (3006)
Limits
07
(one input ac ground)
Input current (under test)
Unit
SIZE
78020
A
REVISION LEVEL
V
SHEET
5
V
TABLE I. Electrical performance characteristics. – Continued.
Test
Symbol
Conditions 1/ 2/
Group A
Device
-55C  TA  +125C
subgroups
type
unless otherwise specified
Unit
Limits
Min
Max
Enable low voltage
VIL
VCC = 5.5 V 4/
1, 2, 3
All
Enable high voltage
VIH
VCC = 4.5 V 4/
1, 2, 3
All
Enable clamp voltage
(3022)
VIC
1, 2, 3
All
-1.5
V
1, 2, 3
All
20
A
1
05
20
1, 2, 3
All
-20
1
05
-20
Off-state (high
impedance) output
output current (3021)
IO
VCC = 4.5 V, IIN = -18 mA 4/
VCC = 5.5 V
VCC = 5.5 V, VO = 2.4 V
M,D,P,L,R
VCC = 5.5 V, VO = 0.4 V
M,D,P,L,R
0.8
2.0
V
V
Enable low current (3009)
IIL
VIN = 0.4 V, VCC = 5.5 V 5/
1, 2, 3
All
-0.36
mA
Enable high current
sensitivity (3010)
IIH
VIN = 2.7 V, VCC = 5.5 V 5/
1, 2, 3
All
20
A
Output short circuit
current (3011)
IOS
VIN = 1.0 V
1, 2, 3
All
-85
mA
Supply current (3005)
ICC
VCC = 5.5 V, data inputs = GND,
1, 2, 3
01-04,
70
mA
VO = 0 V, VCC = 5.5 V, 6/
outputs disabled
06,07
M,D,P,L,R
Enable input high current
II
-15
VIN = 5.5 V, VCC = 5.5 V 5/
05
50
1
05
50
1, 2, 3
01-04,
100
A
06,07
05
Propagation delay,
input to output (3003)
tPLH
9
VCC = 5.0 V, CL = 15 pF,
see figure 2
01,02
10, 11
CL = 50 pF
-10
50
25
ns
38
9
03,04,
35
10, 11
07
53
9
05
23
10, 11
31
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78020
A
REVISION LEVEL
V
SHEET
6
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/ 2/
Group A
Device
-55C  TA  +125C
subgroups
type
unless otherwise specified
Propagation delay,
input to output (3003)
tPLH
VCC = 5.0 V, CL = 15 pF,
05
22
10, 11
7/
30
9, 11
06
30
9
tPHL
01,02
9
03,04,
35
10, 11
07
53
9
05
23
31
9
05
22
10, 11
7/
30
9, 11
06
30
10
9
see figure 2
120
01,02
10, 11
CL = 50 pF
25
38
10, 11
VCC = 5.0 V, CL = 5 pF,
ns
120
10, 11
CL = 50 pF
Max
9
10
tPLZ
Limits
Min
see figure 2
Output disable time,
ENABLE to output
(3003)
Unit
30
ns
45
9
03,04,
40
10, 11
07
60
9
05
30
10, 11
42
9
05
18
10, 11
7/
30
9
06
34
10
64
11
27
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78020
A
REVISION LEVEL
V
SHEET
7
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/ 2/
Group A
Device
-55C  TA  +125C
subgroups
type
unless otherwise specified
Output disable time,
ENABLE to output
(3003)
tPHZ
9
VCC = 5.0 V, CL = 5 pF,
see figure 2
01,02
10, 11
03,04,
30
10, 11
07
45
9
05
55
05
20
10, 11
7/
27
9, 11
06
32
35
01,02
10, 11
CL = 50 pF
ns
62
9
9
see figure 2
22
9
10
VCC = 5.0 V, CL = 15 pF,
Max
33
10, 11
tPZL
Limits
Min
CL = 50 pF
Output enable time,
ENABLE to output (3003)
Unit
22
ns
33
9
03,04,
25
10, 11
07
38
9
05
20
10, 11
29
9
05
18
10, 11
7/
27
9
06
34
10
65
11
27
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78020
A
REVISION LEVEL
V
SHEET
8
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/ 2/
Group A
Device
-55C  TA  +125C
subgroups
type
unless otherwise specified
Output enable time,
ENABLE to output (3003)
tPZH
Unit
Limits
Min
9
VCC = 5.0 V, CL = 15 pF,
see figure 2
Max
01,02
22
10, 11
CL = 50 pF
ns
33
9
03,04,
25
10, 11
07
38
9
05
18
10, 11
29
9
05
16
10, 11
7/
27
9,11
06
35
10
65
1/
Devices supplied to this drawing will meet all levels M, D, P, L, R of irradiation. However, this device is only tested at the
‘R’ level. Pre and post irradiation values are identical unless otherwise specified in table I. When performing post
irradiation electrical measurements for any RHA level, TA = +25C.
2/
These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883,
method 1019, condition A.
3/
Guaranteed by design.
4/
The VIH and VIL tests are not required and shall be applied as forcing functions for the VOL and VOH tests.
5/
These limits are not tested. The limits specified for the input low current represent the numerical range in which this
parameter will pass: -0.36 to +0.10.
6/
Not more than output should be shorted at one time and the duration of the short circuit condition should not exceed
one second.
7/
This parameter is guaranteed by correlation to the testing at CL = 50 pF.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78020
A
REVISION LEVEL
V
SHEET
9
Case outlines
2
E, F, Z
Device types
All
Terminal
number
Terminal symbol
1
NC
INPUT A-
2
INPUT A-
INPUT A+
3
INPUT A+
OUTPUT A
4
OUTPUT A
ENABLE
5
ENABLE
OUTPUT C
6
NC
INPUT C+
7
OUTPUT C
INPUT C-
8
INPUT C+
GND
9
INPUT C-
INPUT D-
10
GND
INPUT D+
11
NC
OUTPUT D
12
INPUT D-
ENABLE
13
INPUT D+
OUTPUT B
14
OUTPUT D
INPUT B+
15
ENABLE
INPUT B-
16
NC
VCC
17
OUTPUT B
---
18
INPUT B+
---
19
INPUT B-
---
20
VCC
---
FIGURE 1. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78020
A
REVISION LEVEL
V
SHEET
10
Switch matrix
Parameter
SW1
SW2
tPLH
Closed
Closed
tPHL
Closed
Closed
tPZL
Closed
Open
tPZH
Open
Closed
tPLZ
Closed
Closed
tPHZ
Closed
Closed
NOTES:
1. Pulse generator, rate  10 MHz, ZO = 50 , tr  5.0 ns, tf  5.0 ns.
2. All diodes, 1N916 or 1N3064
FIGURE 2. Test circuit and switching waveforms.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78020
A
REVISION LEVEL
V
SHEET
11
FIGURE 2. Test circuit and switching waveforms – continued.
C1 = 0.1 F
R1 = 1 k, 1/4 W
FIGURE 3. Radiation exposure circuit.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78020
A
REVISION LEVEL
V
SHEET
12
4. VERIFICATION
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in
accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a.
Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
(2) TA = +125C, minimum.
b.
Interim and final electrical test parameters shall be as specified in table IIA herein.
4.2.2 Additional criteria for device classes Q and V.
a.
The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
b.
Interim and final electrical test parameters shall be as specified in table IIA herein.
c.
Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups
A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for
device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed
for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections
(see 4.4.1 through 4.4.4).
4.4.1 Group A inspection.
a.
Tests shall be as specified in table IIA herein.
b.
Subgroups 7 and 8 in table I, method 5005 of MIL-STD-883 shall be omitted.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78020
A
REVISION LEVEL
V
SHEET
13
TABLE IIA. Electrical test requirements.
Test requirements
Interim electrical
parameters (see 4.2)
Final electrical
parameters (see 4.2)
Group A test
requirements (see 4.4)
Group C end-point electrical
parameters (see 4.4)
Group D end-point electrical
parameters (see 4.4)
Group E end-point electrical
parameters (see 4.4)
Subgroups
(in accordance with
MIL-PRF-38535, table III)
Subgroups
(in accordance with
MIL-STD-883,
method 5005, table I)
Device
class M
Device
class Q
Device
class V
---
1
1
1, 2, 3, 9 1/
1, 2, 3, 9 1/
1, 2, 3, 9 2/
1, 2, 3, 4, 5, 6, 3/
9, 10, 11
1, 2, 3, 4, 5, 6,
9,10,11
1, 2, 3, 4, 5, 6,
9,10,11
1, 2, 3
1, 2, 3
1, 2, 3 2/
1, 2, 3
1, 2, 3
1, 2, 3
1
1
1
1/ PDA applies to subgroup 1.
2/ PDA applies to subgroups 1 and delta limits. Delta limits shall be in accordance with
table IIB and shall be computed with reference to the previous interim electrical parameters.
3/ Subgroups 4, 5, 6, 10, and 11, if not tested, shall be guaranteed to the specified limits in table I.
TABLE IIB. Delta limits at +25C.
Parameter 1/
Device
Limit
type
VOH
All
 250 mV
VOL
All
 45 mV
IIN
All
 0.28 mA
1/ These parameters shall be read and recorded at TA = +25C
before and after each burn-in and shall not change by more
than the limits indicated. The delta rejects shall be included
in the PDA calculation.
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a.
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of
MIL-STD-883.
b.
TA = +125C, minimum.
c.
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78020
A
REVISION LEVEL
V
SHEET
14
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD883.
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured
(see 3.5 herein).
a.
End-point electrical parameters shall be as specified in table IIA herein.
b.
For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as
specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to
radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device
classes must meet the postirradiation end-point electrical parameter limits as defined in table I at
TA = +25C 5C, after exposure, to the subgroups specified in table IIA herein.
4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883
method 1019, condition A, and as specified herein.
4.4.4.1.1 Accelerated aging test. Accelerated aging tests shall be performed on all devices requiring a RHA level greater than
5k rads(Si). The post-anneal end-point electrical parameter limits shall be as specified in table I herein and shall be the preirradiation end-point electrical parameter limit at 25C ±5C. Testing shall be performed at initial qualification and after any
design or process changes which may affect the RHA response of the device.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes
Q and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor
prepared specification or drawing.
6.1.2 Substitutability. Device class Q devices will replace device class M devices.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus (DSCC) when a system
application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users
and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic
devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544.
6.4 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614)
692-0547.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78020
A
REVISION LEVEL
V
SHEET
15
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.
The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to
this drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.
The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been
submitted to and accepted by DSCC-VA.
6.6.3 Caution to designers. Device type 01 (26LS32) previously supplied by vendor 27014 (National Semiconductor) through
June 1984, was manufactured without a failsafe input/output design (output is always high when inputs are open).
All other vendors supplying device type 01 have the failsafe input/output design.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
78020
A
REVISION LEVEL
V
SHEET
16
APPENDIX
10. SCOPE
10.1 Scope. This appendix contains the PIN supersession information to support the one part - one part number
system. For new system designs, after the date of this document the new PIN shall be used in lieu of the old PIN.
For existing system designs prior to the date of this document the new PIN can be used in lieu of the old PIN. This is a
mandatory part of the specification. The information contained herein is intended for compliance. The PIN supersession
data shall be as specified in 30.
20. APPLICABLE DOCUMENTS. This section is not applicable to this appendix.
30. SUPERSESSION DATA
New PIN
5962-7802001MEX
5962-7802001MFX
5962-7802001M2X
5962-7802002MEX
5962-7802002MFX
5962-7802002M2X
5962-7802003MEX
5962-7802003MFX
5962-7802003M2X
5962-7802004MEX
5962-7802004MFX
5962-7802004M2X
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
Old PIN
7802001EX
7802001FX
78020012X
7802002EX
7802002FX
78020022X
7802003EX
7802003FX
78020032X
7802004EX
7802004FX
78020042X
SIZE
78020
A
REVISION LEVEL
V
SHEET
17
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 10-03-03
Approved sources of supply for SMD 78020 are listed below for immediate acquisition information only and shall be
added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to
include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of
compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next
dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of
supply at http://www.dscc.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
5962-7802001MEA
3/
Vendor
CAGE
number
Vendor
similar
PIN 2/
0C7V7
QP26LS32/BEA
3V146
26LS32/BEA
0C7V7
QP26LS32/BFA
3V146
26LS32/BFA
0C7V7
QP26LS32/B2A
3V146
26LS32B2A
0C7V7
QP26LS33/BEA
3V146
26LS33/BEA
0C7V7
QP26LS33/BFA
3V146
26LS33/BFA
0C7V7
QP26LS33/B2A
3V146
26LS33/B2A
5962-7802003MEA
01295
AM26LS32AMJB
5962-7802003MFA
01295
AM26LS32AMWB
5962-7802003M2A
01295
AM26LS32AMFKB
5962-7802004MEA
01295
AM26LS33AMJB
5962-7802004MFA
01295
AM26LS33AMWB
5962-7802004M2A
01295
AM26LS33AMFKB
5962-7802005MEA
4/
DS26F32MJ/883
5962-7802005MFA
27014
DS26F32MW/883
5962-7802005MZA
4/
DS26F32MWG/883
5962-7802005M2A
27014
DS26F32ME/883
5962-7802001MFA
3/
5962-7802001M2A
3/
5962-7802002MEA
5962-7802002MFA
5962-7802002M2A
1 of 3
STANDARD MICROCIRCUIT DRAWING BULLETIN - CONTINUED
DATE: 10-03-03
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-7802005VEA
4/
DS26F32MJ-QMLV
5962-7802005VFA
4/
DS26F32MW-QMLV
5962-7802005VZA
4/
DS26F32MWG-QMLV
5962-7802006QEA
27014
DS26LS32MJ/883
5962-7802006QFA
4/
DS26LS32MW/883
5962-7802006Q2A
4/
DS26LS32ME/883
5962F7802005Q2A
4/
DS26F32MEF-QML
5962F7802005QEA
4/
DS26F32MJF-QML
5962F7802005QFA
4/
DS26F32MWF-QML
5962F7802005VEA
4/
DS26F32MJFQMLV
5962F7802005VFA
4/
DS26F32MWFQMLV
5962R7802005Q2A
4/
DS26F32MER-QML
5962R7802005QEA
4/
DS26F32MJR-QML
5962R7802005QFA
4/
DS26F32MWR-QML
5962R7802005VEA
27014
DS26F32MJRQMLV
5962R7802005VFA
27014
DS26F32MWRQMLV
5962R7802005VZA
4/
DS26F32MWGRQMLV
5962-7802007VEA
01295
AM26LS33A-SP
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
3/ Caution. The device type 01 previously supplied by vendor 27014
(National Semiconductor) through June 1984, was manufactured
without a failsafe input/output design (output always high when
inputs are open). All other vendors supplying device type 01 have
the failsafe input/output design.
4/ Not available from an approved source of supply.
2 of 3
STANDARD MICROCIRCUIT DRAWING BULLETIN - CONTINUED
DATE: 10-03-03
Vendor CAGE
number
Vendor name
and address
0C7V7
QP Semiconductor
2945 Oakmead Village Court
Santa Clara, CA 95051
01295
Texas Instruments, Inc.
Semiconductor Group
8505 Forest Lane
P.O. Box 660199
Dallas, TX 75243
Point of contact:
U.S. Highway 75 South
P.O. Box 84, M/S 853
Sherman, TX 75090-9493
27014
National Semiconductor
2900 Semiconductor Drive
P.O. Box 58090
Santa Clara, CA 95052-8090
3V146
Rochester Electronics Inc.
16 Malcolm Hoyt Drive
Newburyport, MA 01950
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
3 of 3