Full Material Declaration for attached parts list Full Material Declaration for attached parts list Report generated: 14 June 2016, 10:23 GMT Diotec Semiconductor AG DUNS number: 330866844 -, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany Declarations authorised by: Udo Steinebrunner, Product Manager, - Declaration effective from: 24 February 2011 [Approved on 14 June 2016, 10:21 GMT] Materials and substances Use/Location Material group Chip (die) Other inorganic materials Die attach Encapsulation Sn-Pb solder % w/w of material in the part 3.89000% 4.37000% EP (Epoxy resin) 44.78000% Leadfinish Tin plating 0.55000% Leadframe Copper (e.g. copper amounts in cable harnesses) 46.41000% Substances in the material CAS Number % w/w of substance in the material Nickel 8049-31-8 1.50000% Silicon dioxide 14808-60-7 5.05000% Silicon 7440-21-3 93.45000% Silver 7440-22-4 2.50000% Tin 7440-31-5 5.00000% Lead 7439-92-1 92.50000% Carbon black 1333-86-4 0.50000% ALUMINUM(III) 21645-51-2 HYDROXIDE 2.80000% resin 9060-05-3 8.60000% Epoxy resin 89 26335-32-0 18.00000% Silica, Crystalline 14808-60-7 70.10000% Tin 7440-31-5 100.00000% iron 14127-53-8 0.10000% Copper 7440-50-8 99.90000% Attached parts list Part number Part name Part Mass Part Mass UoM SOD-123FL Diode SMD 0.018 g Page 1 Report generated: 14 June 2016, 10:23 GMT