MDS

Full Material Declaration for attached parts list
Full Material Declaration for attached parts list
Report generated: 25 February 2016, 14:38 GMT
Diotec Semiconductor AG
DUNS number: 330866844
-, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany
Declarations authorised by:
Udo Steinebrunner, Product Manager, -
Declaration effective from: 1 May 2009 [Approved on 25 February 2016, 14:38 GMT]
Materials and substances
Use/Location
Chip (die)
Die attach
Encapsulation
Material group
Other inorganic
materials
% w/w of
material in
the part
0.30000%
Lead and Lead alloys 0.20000%
EP (Epoxy resin)
22.10000%
Substances in the
material
CAS Number
% w/w of
substance
in the
material
Nickel
7440-02-0
1.00000%
Gold
7440-57-5
11.50000%
Polydimethyl
siloxane
63148-62-9
25.00000%
Silicon
7440-21-3
62.50000%
Silver
7440-22-4
2.50000%
Tin
7440-31-5
5.00000%
Lead
7439-92-1
92.50000%
Carbon black
1333-86-4
0.30000%
ANTIMONY
TRIOXIDE
1309-64-4
0.80000%
Tetrabromobisphenol
A (TBBPA)
79-94-7
0.99000%
Epoxy resin 89
26335-32-0
27.61000%
Quartz sand
60676-86-0
70.30000%
Leadfinish
Tin plating
2.30000%
Tin
7440-31-5
100.00000%
Leadframe
Copper (e.g. copper
amounts in cable
harnesses)
75.10000%
Copper
7440-50-8
100.00000%
Attached parts list
Part number
Part name
Part Mass
Part Mass UoM
D 5.4x7.5
Diode axial
1
g
Page 1
Report generated: 25 February 2016, 14:38 GMT