MDS

Full Material Declaration for attached parts list
Full Material Declaration for attached parts list
Report generated: 14 June 2016, 08:25 GMT
Diotec Semiconductor AG
DUNS number: 330866844
-, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany
Declarations authorised by:
Udo Steinebrunner, Product Manager, -
Declaration effective from: 1 January 2007 [Approved on 14 June 2016, 08:22 GMT]
Materials and substances
Use/Location
Material
group
Chip (die)
Other
inorganic
materials
Die attach
Encapsulation
Lead and
Lead alloys
EP (Epoxy
resin)
% w/w of
material in the
part
0.55000%
0.38000%
41.00000%
Substances in
the material
CAS Number
% w/w of
substance in the
material
Gold
7440-57-5
1.50000%
Silicon dioxide
14808-60-7
5.05000%
Silicon
7440-21-3
93.45000%
Silver
7440-22-4
2.50000%
Tin
7440-31-5
5.00000%
Lead
7439-92-1
92.50000%
Carbon black
1333-86-4
0.50000%
ALUMINUM(III)
21645-51-2
HYDROXIDE
2.80000%
resin
9003-35-4
8.60000%
Epoxy resin 89
26335-32-0
18.00000%
Quartz silica
14808-60-7
70.10000%
Leadfinish
Tin plating
0.47000%
Tin
7440-31-5
100.00000%
Leadframe
Copper
alloys
57.60000%
Copper
7440-50-8
100.00000%
Attached parts list
Part number
Part name
Part Mass
Part Mass UoM
GBIxx
Bridge Rectifier Single Inline
7
g
Page 1
Report generated: 14 June 2016, 08:25 GMT