DATASHEET

ISL4489E, ISL4491E
®
Data Sheet
April 28, 2006
±15kV ESD Protected, 1/8 Unit Load, 5V,
Low Power, High Speed and Slew Rate
Limited, Full Duplex, RS-485/RS-422
Transceivers
FN6074.3
Features
• Pb-free Available as an Option (RoHS Compliant)
(See Ordering Info)
• RS-485 I/O Pin ESD Protection . . . . . . . . . . . . . ±15kV HBM
- Class 3 ESD Level on all Other Pins . . . . . . >7kV HBM
The ISL4489E, ISL4491E are ESD protected, “fractional”
unit load, BiCMOS, 5V powered, single transceivers that
meet both the RS-485 and RS-422 standards for balanced
communication. Each driver output and receiver input is
protected against ±15kV ESD strikes, without latch-up.
Unlike competitive versions, these Intersil devices are
specified for 10% tolerance supplies (4.5V to 5.5V).
• 1/8 Unit Load Allows up to 256 Devices on the Bus
• High Data Rates (ISL4491E) . . . . . . . . . . . up to 15Mbps
• Slew Rate Limited Version for Error Free Data
Transmission (ISL4489E)
• Very Low Quiescent Current:
- 140μA (ISL4489E)
- 370μA (ISL4491E)
Rx inputs and Tx outputs present a “1/8 unit load” to the
RS-485 bus, which allows a total of 256 transmitters and
receivers on the network for large node count systems.
• -7V to +12V Common Mode Input Voltage Range
These devices are configured for full duplex (separate Rx
input and Tx output pins) applications, so they are ideal for
RS-422 networks requiring high ESD tolerance on the bus
pins.
• Three-State Rx and Tx Outputs
• Full Duplex Pinout
• Operates from a Single +5V Supply (10% Tolerance)
The ISL4489E utilizes a slew rate limited driver which
reduces EMI, and minimizes reflections from improperly
terminated transmission lines, or unterminated stubs in
multidrop and multipoint applications.
• Current Limiting and Thermal Shutdown for driver
Overload Protection
Data rates up to 15Mbps are achievable by using the
ISL4491E, which features higher slew rates.
• Factory Automation
Receiver (Rx) inputs feature a “fail-safe if open” design,
which ensures a logic high Rx output if Rx inputs are floating.
• Building Environmental Control Systems
Applications
• Security Networks
• Industrial/Process Control Networks
Driver (Tx) outputs are short circuit protected, even for
voltages exceeding the power supply voltage. Additionally,
on-chip thermal shutdown circuitry disables the Tx outputs to
prevent damage if power dissipation becomes excessive.
• Level Translators (e.g., RS-232 to RS-422)
• RS-232 “Extension Cords”
TABLE 1. SUMMARY OF FEATURES
PIN
SLEW-RATE
RECEIVER/
QUIESCENT
COUNT
LIMITED?
DRIVER ENABLE?
ICC (μA)
PART
NUMBER
HALF/FULL
DUPLEX
HIGH ESD?
NO. OF DEVICES
ALLOWED ON BUS
DATA RATE
(Mbps)
ISL4489E
Full
Yes
256
0.25
Yes
Yes
140
14
ISL4491E
Full
Yes
256
15
No
Yes
370
14
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2004, 2006. All Rights Reserved.
All other trademarks mentioned are the property of their respective owners.
ISL4489E, ISL4491E
Ordering Information
PART
NUMBER
PART
TEMP.
MARKING RANGE (°C)
Pinout
ISL4489E, ISL4491E (SOIC)
TOP VIEW
PKG.
DWG. #
PACKAGE
ISL4489EIB
ISL4489EIB
-40 to 85
14 Ld SOIC
M14.15
ISL4489EIBZ
(Note)
4489EIBZ
-40 to 85
14 Ld SOIC
(Pb-free)
M14.15
ISL4491EIB
ISL4491EIB
-40 to 85
14 Ld SOIC
M14.15
RE 3
12 A
ISL4491EIBZ
(Note)
4491EIBZ
-40 to 85
14 Ld SOIC
(Pb-free)
M14.15
DE 4
11 B
14 VCC
NC 1
RO 2
13 NC
R
D
DI 5
Add “-T” suffix for tape and reel.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
10 Z
GND 6
9 Y
GND 7
8 NC
Truth Tables
TRANSMITTING
RECEIVING
INPUTS
OUTPUTS
INPUTS
OUTPUT
RE
DE
DI
Z
Y
RE
DE
A-B
RO
X
1
1
0
1
0
X
≥ +0.2V
1
X
1
0
1
0
0
X
≤ -0.2V
0
X
0
X
High-Z
High-Z
0
X
Inputs Open
1
1
X
X
High-Z
Pin Descriptions
PIN
FUNCTION
RO
Receiver output: If A > B by at least 0.2V, RO is high; If A < B by 0.2V or more, RO is low; RO = High if A and B are unconnected (floating).
RE
Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high.
DE
Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They are high impedance when DE is low.
DI
Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low.
GND
Ground connection.
A
±15kV HBM ESD Protected, Noninverting receiver input.
B
±15kV HBM ESD Protected, Inverting receiver input.
Y
±15kV HBM ESD Protected, Noninverting driver output.
Z
±15kV HBM ESD Protected, Inverting driver output.
VCC
System power supply input (4.5V to 5.5V).
NC
No Connection.
2
FN6074.3
ISL4489E, ISL4491E
Typical Operating Circuit
ISL4489E, ISL4491E
+5V
+5V
+
+
0.1µF
0.1µF
14
14
VCC
2
RO
R
A
12
B
11
RT
9
Y
10
Z
VCC
DI
5
D
3
RE
DE
4
4
DE
RE
3
5
DI
RO
2
D
Z
10
Y
9
GND
RT
11
B
12
A
R
GND
6, 7
6, 7
3
FN6074.3
ISL4489E, ISL4491E
Absolute Maximum Ratings
Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V)
Input/Output Voltages
A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +12.5V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V)
Short Circuit Duration
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Thermal Resistance (Typical, Note 1)
θJA (°C/W)
14 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
128
Maximum Junction Temperature (Plastic Package) . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C
(Lead Tips Only)
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to 85°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = 25°C,
Note 2
PARAMETER
TEMP
(°C)
MIN
TYP
MAX
UNITS
Full
-
-
VCC
V
R = 50Ω (RS-422) (Figure 1)
Full
2
3
-
V
SYMBOL
TEST CONDITIONS
DC CHARACTERISTICS
Driver Differential VOUT (no load)
VOD1
Driver Differential VOUT (with load)
VOD2
R = 27Ω (RS-485) (Figure 1)
Full
1.5
2.3
5
V
Change in Magnitude of Driver
Differential VOUT for
Complementary Output States
ΔVOD
R = 27Ω or 50Ω (Figure 1)
Full
-
0.01
0.2
V
VOC
R = 27Ω or 50Ω (Figure 1)
Full
-
-
3
V
ΔVOC
R = 27Ω or 50Ω (Figure 1)
Full
-
0.01
0.2
V
Driver Common-Mode VOUT
Change in Magnitude of Driver
Common-Mode VOUT for
Complementary Output States
Logic Input High Voltage
VIH
DE, DI, RE
Full
2
-
-
V
Logic Input Low Voltage
VIL
DE, DI, RE
Full
0.8
-
-
V
Logic Input Current
IIN1
DI
Full
-2
-
2
μA
Input Current (A, B) (Note 5)
IIN2
Full
-40
-
40
μA
VIN = 12V
Full
-
-
130
μA
VIN = -7V
Full
-100
-
-
μA
DE, RE
DE = 0V, VCC = 0V or
4.5 to 5.5V
Driver Three-State (high
impedance) Output Current (Y, Z)
IOZD
-7V ≤ VO ≤ 12V
Full
-100
-
100
μA
Receiver Differential Threshold
Voltage
VTH
-7V ≤ VCM ≤ 12V
Full
-0.2
-
0.2
V
Receiver Input Hysteresis
ΔVTH
VCM = 0V
25
-
70
-
mV
Receiver Output High Voltage
VOH
IO = -4mA, VID = 200mV
Full
3.5
-
-
V
Receiver Output Low Voltage
VOL
IO = -4mA, VID = 200mV
Full
-
-
0.4
V
Three-State (high impedance)
Receiver Output Current
IOZR
0.4V ≤ VO ≤ 2.4V
Full
-
-
±1
μA
Receiver Input Resistance
RIN
-7V ≤ VCM ≤ 12V
Full
92
120
-
kΩ
No-Load Supply Current (Note 3)
ICC
ISL4489E, DE, DI, RE = 0V or VCC
Full
-
140
190
μA
ISL4491E, DE, DI, RE = 0V or VCC
Full
-
370
460
μA
Driver Short-Circuit Current,
VO = High or Low
IOSD1
DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 4)
Full
35
-
250
mA
Receiver Short-Circuit Current
IOSR
0V ≤ VO ≤ VCC
Full
7
-
85
mA
4
FN6074.3
ISL4489E, ISL4491E
Electrical Specifications
Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = 25°C,
Note 2 (Continued)
TEMP
(°C)
MIN
TYP
MAX
tPLH, tPHL RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
250
400
2000
ns
tSKEW
RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
-
160
800
ns
tR, tF
RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
250
600
2000
ns
tZH
CL = 100pF, SW = GND (Figure 3)
Full
250
1000
2000
ns
Driver Enable to Output Low
tZL
CL = 100pF, SW = VCC (Figure 3)
Full
250
860
2000
ns
Driver Disable from Output High
tHZ
CL = 15pF, SW = GND (Figure 3)
Full
300
660
3000
ns
Driver Disable from Output Low
tLZ
CL = 15pF, SW = VCC (Figure 3)
Full
300
640
3000
ns
Full
250
500
2000
ns
PARAMETER
SYMBOL
TEST CONDITIONS
UNITS
SWITCHING CHARACTERISTICS (ISL4489E)
Driver Input to Output Delay
Driver Output Skew
Driver Differential Rise or Fall Time
Driver Enable to Output High
tPLH, tPHL Figure 4
Receiver Input to Output Delay
Receiver Skew | tPLH - tPHL |
Figure 4
25
-
60
-
ns
Receiver Enable to Output High
tSKD
tZH
CL = 15pF, SW = GND (Figure 5)
Full
-
10
50
ns
Receiver Enable to Output Low
tZL
CL = 15pF, SW = VCC (Figure 5)
Full
-
10
50
ns
Receiver Disable from Output High
tHZ
CL = 15pF, SW = GND (Figure 5)
Full
-
10
50
ns
Receiver Disable from Output Low
tLZ
CL = 15pF, SW = VCC (Figure 5)
Full
-
10
50
ns
Full
250
-
-
kbps
tPLH, tPHL RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
13
24
40
ns
tSKEW
RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
-
3
10
ns
tR, tF
RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
5
12
20
ns
Maximum Data Rate
fMAX
SWITCHING CHARACTERISTICS (ISL4491E)
Driver Input to Output Delay
Driver Output Skew
Driver Differential Rise or Fall Time
Driver Enable to Output High
tZH
CL = 100pF, SW = GND (Figure 3)
Full
-
14
70
ns
Driver Enable to Output Low
tZL
CL = 100pF, SW = VCC (Figure 3)
Full
-
14
70
ns
Driver Disable from Output High
tHZ
CL = 15pF, SW = GND (Figure 3)
Full
-
44
70
ns
Driver Disable from Output Low
tLZ
CL = 15pF, SW = VCC (Figure 3)
Full
-
21
70
ns
tPLH, tPHL (Figure 4)
Receiver Input to Output Delay
Receiver Skew | tPLH - tPHL |
tSKD
Full
30
90
150
ns
(Figure 4)
25
-
5
-
ns
Receiver Enable to Output High
tZH
CL = 15pF, SW = GND (Figure 5)
Full
-
9
50
ns
Receiver Enable to Output Low
tZL
CL = 15pF, SW = VCC (Figure 5)
Full
-
9
50
ns
Receiver Disable from Output High
tHZ
CL = 15pF, SW = GND (Figure 5)
Full
-
9
50
ns
Receiver Disable from Output Low
tLZ
CL = 15pF, SW = VCC (Figure 5)
Full
-
9
50
ns
Full
15
-
-
Mbps
25
-
±15
-
kV
25
-
>±7
-
kV
Maximum Data Rate
fMAX
ESD PERFORMANCE
RS-485 Pins (A, B, Y, Z)
Human Body Model
All Other Pins
NOTES:
2. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless
otherwise specified.
3. Supply current specification is valid for loaded drivers when DE = 0V.
4. Applies to peak current. See “Typical Performance Curves” for more information.
5. Devices meeting these limits are denoted as “1/8 unit load (1/8 UL)” transceivers. The RS-485 standard allows up to 32 Unit Loads on the bus,
so there can be 256 1/8 UL devices on a bus.
5
FN6074.3
ISL4489E, ISL4491E
Test Circuits and Waveforms
R
VCC
DE
Z
DI
VOD
D
Y
VOC
R
FIGURE 1. DRIVER VOD AND VOC
3V
DI
1.5V
1.5V
0V
tPLH
VCC
tPHL
VOH
CL = 100pF
DE
50%
OUT (Y)
50%
VOL
Z
DI
RDIFF
D
Y
VOH
OUT (Z)
SIGNAL
GENERATOR
tPLH
tPHL
CL = 100pF
50%
50%
VOL
90%
DIFF OUT (Y - Z)
10%
tR
+VOD
90%
10%
-VOD
tF
SKEW = |tPLH (Y or Z) - tPHL (Z or Y)|
FIGURE 2A. TEST CIRCUIT
FIGURE 2B. MEASUREMENT POINTS
FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
6
FN6074.3
ISL4489E, ISL4491E
Test Circuits and Waveforms (Continued)
DE
Z
DI
3V
500Ω
VCC
D
SIGNAL
GENERATOR
SW
Y
DE
1.5V
1.5V
GND
0V
CL
tZH
OUTPUT HIGH
OUT (Y, Z)
PARAMETER OUTPUT
RE
DI
SW
CL (pF)
tHZ
Y/Z
X
1/0
GND
15
tLZ
Y/Z
X
0/1
VCC
15
Y/Z
tZH
X
Y/Z
tZL
1/0
X
GND
0/1
VOH - 0.5V VOH
2.3V
0V
tZL
tLZ
VCC
OUT (Y, Z)
2.3V
100
VCC
tHZ
OUTPUT LOW
100
FIGURE 3A. TEST CIRCUIT
VOL + 0.5V V
OL
FIGURE 3B. MEASUREMENT POINTS
FIGURE 3. DRIVER ENABLE AND DISABLE TIMES
RE
3V
15pF
B
+1.5V
R
A
A
1.5V
1.5V
RO
0V
tPLH
tPHL
VCC
SIGNAL
GENERATOR
50%
RO
50%
0V
FIGURE 4B. MEASUREMENT POINTS
FIGURE 4A. TEST CIRCUIT
FIGURE 4. RECEIVER PROPAGATION DELAY
RE
3V
B
RO
R
SIGNAL
GENERATOR
1kΩ
VCC
SW
A
RE
1.5V
1.5V
0V
GND
tZH
15pF
OUTPUT HIGH
RO
tHZ
VOH - 0.5V VOH
1.5V
0V
PARAMETER
DE
A
SW
tHZ
X
+1.5V
GND
tLZ
X
-1.5V
VCC
tZH
X
+1.5V
GND
tZL
X
-1.5V
VCC
FIGURE 5A. TEST CIRCUIT
tZL
tLZ
VCC
RO
1.5V
VOL + 0.5V V
OUTPUT LOW
OL
FIGURE 5B. MEASUREMENT POINTS
FIGURE 5. RECEIVER ENABLE AND DISABLE TIMES
7
FN6074.3
ISL4489E, ISL4491E
Application Information
RS-485 and RS-422 are differential (balanced) data
transmission standards for use in long haul or noisy
environments. RS-422 is a subset of RS-485, so RS-485
transceivers are also RS-422 compliant. RS-422 is a pointto-multipoint (multidrop) standard, which allows only one
driver and up to 10 (assuming one unit load devices)
receivers on each bus. RS-485 is a true multipoint standard,
which allows up to 32 one unit load devices (any
combination of drivers and receivers) on each bus. To allow
for multipoint operation, the RS-485 spec requires that
drivers must handle bus contention without sustaining any
damage.
Another important advantage of RS-485 is the extended
common mode range (CMR), which specifies that the driver
outputs and receiver inputs withstand signals that range from
+12V to -7V. RS-422 and RS-485 are intended for runs as
long as 4000’, so the wide CMR is necessary to handle
ground potential differences, as well as voltages induced in
the cable by external fields.
Receiver Features
These devices utilize a differential input receiver for
maximum noise immunity and common mode rejection.
Input sensitivity is ±200mV, as required by the RS-422 and
RS-485 specifications.
Receiver input resistance of 120kΩ surpasses the RS-422
spec of 4kΩ, and is more than eight times the RS-485 “Unit
Load” requirement of 12kΩ. Thus, these products are known
as “one-eighth UL” transceivers, and there can be up to 256
of these devices on a network while still complying with the
RS-485 loading spec.
Receiver inputs function with common mode voltages as
great as ±7V outside the power supplies (i.e., +12V and
-7V), making them ideal for long networks where induced
voltages are a realistic concern.
All the receivers include a “fail-safe if open” function that
guarantees a high level receiver output if the receiver inputs
are unconnected (floating).
Receivers easily meet the data rate supported by the
corresponding driver, and receiver outputs are three-statable
via the active low RE input.
Driver Features
The RS-485/422 driver is a differential output device that
delivers at least 1.5V across a 54Ω load (RS-485), and at
least 2V across a 100Ω load (RS-422). The drivers feature
low propagation delay skew to maximize bit width, and to
minimize EMI, and driver outputs are three-statable via the
active high DE input.
The ISL4489E driver outputs are slew rate limited to further
reduce EMI, and to minimize reflections in unterminated or
improperly terminated networks. Data rates on these slew
8
rate limited versions are a maximum of 250kbps. Outputs of
ISL4491E drivers are not limited, so faster output transition
times allow data rates of at least 15Mbps.
Data Rate, Cables, and Terminations
Twisted pair is the cable of choice for RS-485/422 networks.
Twisted pair cables tend to pick up noise and other
electromagnetically induced voltages as common mode
signals, which are effectively rejected by the differential
receivers in these ICs.
RS-485/422 are intended for network lengths up to 4000’,
but the maximum system data rate decreases as the
transmission length increases. Devices operating at 15Mbps
are limited to lengths of a few hundred feet, while the
250kbps versions can operate at full data rates with lengths
in excess of 1000’.
Proper termination is imperative, when using the 15Mbps
devices, to minimize reflections. Short networks using the
250kbps versions need not be terminated, but, terminations
are recommended unless power dissipation is an overriding
concern. In point-to-point, or point-to-multipoint (single driver
on bus) networks, the main cable should be terminated in its
characteristic impedance (typically 120Ω) at the end farthest
from the driver. In multi-receiver applications, stubs
connecting receivers to the main cable should be kept as
short as possible. Multipoint (multi-driver) systems require
that the main cable be terminated in its characteristic
impedance at both ends. Stubs connecting a transceiver to
the main cable should be kept as short as possible.
Built-In Driver Overload Protection
As stated previously, the RS-485 spec requires that drivers
survive worst case bus contentions undamaged. The
ISL44XXE devices meet this requirement via driver output
short circuit current limits, and on-chip thermal shutdown
circuitry.
The driver output stages incorporate short circuit current
limiting circuitry which ensures that the output current never
exceeds the RS-485 spec, even at the common mode
voltage range extremes. Additionally, these devices utilize a
foldback circuit which reduces the short circuit current, and
thus the power dissipation, whenever the contending voltage
exceeds either supply.
In the event of a major short circuit condition, ISL44XXE
devices also include a thermal shutdown feature that
disables the drivers whenever the die temperature becomes
excessive. This eliminates the power dissipation, allowing
the die to cool. The drivers automatically reenable after the
die temperature drops about 15 degrees. If the contention
persists, the thermal shutdown/reenable cycle repeats until
the fault is cleared. Receivers stay operational during
thermal shutdown.
FN6074.3
ISL4489E, ISL4491E
ESD Protection
All pins on these devices include class 3 Human Body
Model (HBM) ESD protection structures, but the RS-485
pins (driver outputs and receiver inputs) incorporate
advanced structures allowing them to survive ESD events
in excess of ±15kV HBM. The RS-485 pins are particularly
vulnerable to ESD damage because they typically connect
to an exposed port on the exterior of the finished product.
Simply touching the port pins, or connecting a cable, can
VCC = 5V, TA = 25°C; Unless Otherwise Specified
90
3.6
80
3.4
DIFFERENTIAL OUTPUT VOLTAGE (V)
DRIVER OUTPUT CURRENT (mA)
Typical Performance Curves
cause an ESD event that might destroy unprotected ICs.
These new ESD structures protect the device whether or
not it is powered up, protect without allowing any latchup
mechanism to activate, and without degrading the RS-485
common mode range of -7V to +12V. This built-in ESD
protection eliminates the need for board level protection
structures (e.g., transient suppression diodes), and the
associated, undesirable capacitive load they present.
70
60
50
40
30
20
10
0
0
1
2
3
4
3.2
RDIFF = 100Ω
3
2.8
2.6
2.4
RDIFF = 54Ω
2.2
2
-40
5
-25
DIFFERENTIAL OUTPUT VOLTAGE (V)
0
25
50
75
85
TEMPERATURE (°C)
FIGURE 6. DRIVER OUTPUT CURRENT vs DIFFERENTIAL
OUTPUT VOLTAGE
FIGURE 7. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs
TEMPERATURE
400
160
ISL4491E
120
300
Y OR Z = LOW
100
80
ISL4489E
250
60
ICC (µA)
OUTPUT CURRENT (mA)
ISL4491E, DE = X, RE = X
350
140
40
20
200
0
Y OR Z = HIGH
-40
100
-60
ISL4491E
-80 ISL4489E
-100
-120
ISL4489E, DE = X, RE = X
150
-20
-7 -6
-4
50
-2
0
2
4
6
OUTPUT VOLTAGE (V)
8
10
12
-40
-25
0
25
TEMPERATURE (°C)
50
75
85
FIGURE 9. SUPPLY CURRENT vs TEMPERATURE
FIGURE 8. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT
VOLTAGE
9
FN6074.3
ISL4489E, ISL4491E
Typical Performance Curves
VCC = 5V, TA = 25°C; Unless Otherwise Specified (Continued)
750
250
200
tPLHY
tPLHZ
650
|tPLHY - tPHLZ|
150
600
SKEW (ns)
PROPAGATION DELAY (ns)
700
tPHLY
550
tPHLZ
|tPHLY - tPLHZ|
100
50
500
|CROSS PT. OF Y↑ & Z↓ - CROSS PT. OF Y↓ & Z↑|
450
-40
-25
0
25
TEMPERATURE (°C)
50
0
-40
85
75
FIGURE 10. DRIVER PROPAGATION DELAY vs
TEMPERATURE (ISL4489E)
-25
0
25
TEMPERATURE (°C)
50
85
75
FIGURE 11. DRIVER SKEW vs TEMPERATURE (ISL4489E)
5
30
28
|tPHLY - tPLHZ|
26
24
tPLHY
22
tPHLZ
tPLHZ
3
SKEW (ns)
PROPAGATION DELAY (ns)
4
|tPLHY - tPHLZ|
2
20
1
18
|CROSSING PT. OF Y↑ & Z↓ - CROSSING PT. OF Y↓ & Z↑|
tPHLY
-25
0
25
50
0
-40
85
75
-25
TEMPERATURE (°C)
DRIVER OUTPUT (V)
0
4
Z
3
2
RECEIVER OUTPUT (V)
0
DRIVER INPUT (V)
RECEIVER OUTPUT (V)
DRIVER OUTPUT (V)
5
RO
Y
1
0
TIME (400ns/DIV)
FIGURE 14. DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH (ISL4489E)
10
50
85
75
FIGURE 13. DRIVER SKEW vs TEMPERATURE
(ISL4491E)
RDIFF = 54Ω, CL = 100pF
5
25
TEMPERATURE (°C)
FIGURE 12. DRIVER PROPAGATION DELAY vs
TEMPERATURE (ISL4491E)
DI
0
RDIFF = 54Ω, CL = 100pF
5
DI
0
5
RO
DRIVER INPUT (V)
16
-40
0
4
3
2
Y
Z
1
0
TIME (400ns/DIV)
FIGURE 15. DRIVER AND RECEIVER WAVEFORMS,
HIGH TO LOW (ISL4489E)
FN6074.3
ISL4489E, ISL4491E
0
5
RO
0
4
Z
3
2
Y
1
0
TIME (20ns/DIV)
FIGURE 16. DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH (ISL4491E)
RDIFF = 54Ω, CL = 100pF
5
DI
0
5
RO
DRIVER INPUT (V)
5
DI
RECEIVER OUTPUT (V)
RDIFF = 54Ω, CL = 100pF
DRIVER INPUT (V)
VCC = 5V, TA = 25°C; Unless Otherwise Specified (Continued)
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
RECEIVER OUTPUT (V)
Typical Performance Curves
0
4
3
2
Y
Z
1
0
TIME (20ns/DIV)
FIGURE 17. DRIVER AND RECEIVER WAVEFORMS,
HIGH TO LOW (ISL4491E)
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
TRANSISTOR COUNT:
518
PROCESS:
Si Gate BiCMOS
11
FN6074.3
ISL4489E, ISL4491E
Small Outline Plastic Packages (SOIC)
M14.15 (JEDEC MS-012-AB ISSUE C)
N
INDEX
AREA
H
0.25(0.010) M
14 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
B M
E
INCHES
-B-
1
2
3
L
SEATING PLANE
-A-
h x 45o
A
D
-C-
α
e
A1
B
0.25(0.010) M
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.3367
0.3444
8.55
8.75
3
E
0.1497
0.1574
3.80
4.00
4
e
C
0.10(0.004)
B S
0.050 BSC
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N
NOTES:
MILLIMETERS
α
14
0o
14
8o
0o
7
8o
Rev. 0 12/93
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
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12
FN6074.3