ISL43485 ® Data Sheet January 2004 3.3V, Low Power, 30Mbps, RS-485/RS-422 Transceiver The Intersil ISL43485 is a high speed BiCMOS 3.3V powered, single transceiver that meets both the RS-485 and RS-422 standards for balanced communication. Unlike some competitive devices, this Intersil transceiver is specified for 10% tolerance supplies (3V to 3.6V). Data rates up to 30Mbps are achievable by using this transceiver, which features higher slew rates. Receiver (Rx) inputs feature a “fail-safe if open” design, which ensures a logic high output if Rx inputs are floating, and the ISL43485 presents a “single unit load” to the RS-485 bus, which allows up to 32 transceivers on the network. Driver (Tx) outputs are short circuit protected, even for voltages exceeding the power supply voltage. Additionally, on-chip thermal shutdown circuitry disables the Tx outputs to prevent damage if power dissipation becomes excessive. • High Data Rate. . . . . . . . . . . . . . . . . . . . . . up to 30Mbps • Operates from a Single +3.3V Supply (10% Tolerance) • Interoperable with 5V Logic • Single Unit Load Allows up to 32 Devices on the Bus • Low Current Shutdown Mode. . . . . . . . . . . . . . . . . . 15nA • Three State Rx and Tx Outputs • 10ns Propagation Delay, 1ns Skew • Half Duplex Pinout • Current Limiting and Thermal Shutdown for driver Overload Protection Applications • SCSI “Fast 20” Drivers and Receivers • Factory Automation • Data Loggers • Security Networks ISL43485 (SOIC) TOP VIEW RO 1 Features • -7V to +12V Common Mode Input Voltage Range Logic inputs (e.g., DI and DE) accept signals in excess of 5.5V, making them compatible with 5V logic families. Pinout FN6071 • Building Environmental Control Systems • Industrial/Process Control Networks 8 VCC RE 2 7 B/Z • Level Translators DE 3 6 A/Y Ordering Information 5 GND DI 4 R D 1 PART NO. (BRAND) TEMP. RANGE (°C) PACKAGE PKG. DWG. # ISL43485IB (43485IB) -40 to 85 8 Ld SOIC M8.15 ISL43485IB-T (43485IB) -40 to 85 8 Ld SOIC Tape and Reel M8.15 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2004. All Rights Reserved All other trademarks mentioned are the property of their respective owners. ISL43485 Truth Tables TRANSMITTING RECEIVING INPUTS OUTPUTS INPUTS OUTPUT RE DE DI Z Y RE DE A-B RO X 1 1 0 1 0 0 ≥ +0.2V 1 X 1 0 1 0 0 0 ≤ -0.2V 0 0 0 X High-Z High-Z 0 0 Inputs Open 1 1 0 X High-Z * High-Z * 1 0 X High-Z * 1 1 X High-Z NOTE: *Shutdown Mode NOTE: *Shutdown Mode Pin Descriptions PIN FUNCTION RO Receiver output: If A > B by at least 0.2V, RO is high; If A < B by 0.2V or more, RO is low; RO = High if A and B are unconnected (floating). RE Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. DE Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They are high impedance when DE is low. DI Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. GND Ground connection. A/Y Noninverting receiver input and noninverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. B/Z Inverting receiver input and inverting driver output. Pin is an input if DE = 0; pin is an output if DE = 1. VCC System power supply input (3V to 3.6V). Typical Operating Circuit ISL43485 +3.3V +3.3V + 8 0.1µF 0.1µF + 8 VCC 1 RO VCC R D 2 RE B/Z 7 3 DE A/Y 6 4 DI RT RT 7 B/Z DE 3 6 A/Y RE 2 R D GND GND 5 5 2 DI 4 RO 1 ISL43485 Absolute Maximum Ratings Thermal Information VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V Input Voltages DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7V Input/Output Voltages A/Y, B/Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +12.5V RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V) Short Circuit Duration Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous Thermal Resistance (Typical, Note 1) θJA (°C/W) 8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . 170 Maximum Junction Temperature (Plastic Package) . . . . . . . . 150°C Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C (Lead Tips Only) Operating Conditions Temperature Range ISL43485I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to 85°C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Electrical Specifications Test Conditions: VCC = 3V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = 25°C, Note 2 PARAMETER TEMP (°C) MIN TYP MAX UNITS Full - - VCC V RL = 100Ω (RS-422) (Figure 1A) Full 2 2.7 - V RL = 54Ω (RS-485) (Figure 1A) Full 1.5 2.3 VCC V RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 1B) Full 1.5 2.6 - V ∆VOD RL = 54Ω or 100Ω (Figure 1A) Full - 0.01 0.2 V VOC RL = 54Ω or 100Ω (Figure 1A) Full - 1.8 3 V ∆VOC RL = 54Ω or 100Ω (Figure 1A) Full - 0.01 0.2 V SYMBOL TEST CONDITIONS DC CHARACTERISTICS Driver Differential VOUT (no load) VOD1 Driver Differential VOUT (with load) VOD2 Change in Magnitude of Driver Differential VOUT for Complementary Output States Driver Common-Mode VOUT Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States Logic Input High Voltage VIH DE, DI, RE Full 2 - - V Logic Input Low Voltage VIL DE, DI, RE Full - - 0.8 V Logic Input Current IIN1 DE, DI Full -2 - 2 µA RE Full -25 - 25 µA VIN = 12V Full - 0.6 1 mA VIN = -7V Full - -0.3 -0.8 mA -7V ≤ VCM ≤ 12V Full -0.2 - 0.2 V Input Current (A/Y, B/Z) IIN2 Receiver Differential Threshold Voltage VTH DE = 0V, VCC = 0V or 3.6V Receiver Input Hysteresis ∆VTH VCM = 0V 25 - 50 - mV Receiver Output High Voltage VOH IO = -4mA, VID = 200mV Full VCC 0.4 - - V Receiver Output Low Voltage VOL IO = -4mA, VID = 200mV Full - - 0.4 V 3 ISL43485 Electrical Specifications Test Conditions: VCC = 3V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = 25°C, Note 2 (Continued) PARAMETER SYMBOL TEST CONDITIONS TEMP (°C) MIN TYP MAX UNITS Three-State (high impedance) Receiver Output Current IOZR 0.4V ≤ VO ≤ 2.4V Full -1 - 1 µA Receiver Input Resistance RIN -7V ≤ VCM ≤ 12V Full 12 19 - kΩ No-Load Supply Current (Note 3) ICC DI = 0V or VCC DE = VCC, RE = 0V or VCC Full - 0.75 1.2 mA DE = 0V, RE = 0V Full - 0.65 1 mA Shutdown Supply Current ISHDN DE = 0V, RE = VCC, DI = 0V or VCC Full - 15 100 nA Driver Short-Circuit Current, VO = High or Low IOSD1 DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 4) Full - - 250 mA Receiver Short-Circuit Current IOSR 0V ≤ VO ≤ VCC Full 8 - 60 mA (Figure 2A) Full 30 50 - Mbps tDD RDIFF = 60Ω, CL = 15pF (Figure 2A) Full 3 10 25 ns tR, tF RDIFF = 60Ω, CL = 15pF (Figure 2A) Full 3 6 12 ns Full 6 10 22 ns RL = 27Ω, CL = 15pF (Figure 2C) Full - 1 5 ns DRIVER SWITCHING CHARACTERISTICS Maximum Data Rate fMAX Driver Differential Output Delay Driver Differential Rise or Fall Time Driver Input to Output Delay tPLH, tPHL RL = 27Ω, CL = 15pF (Figure 2C) Driver Output Skew tSKEW Driver Enable to Output High tZH RL = 110Ω, CL = 50pF, SW = GND (Figure 3), (Note 5) Full - 45 90 ns Driver Enable to Output Low tZL RL = 110Ω, CL = 50pF, SW = VCC (Figure 3), (Note 5) Full - 45 90 ns Driver Disable from Output High tHZ RL = 110Ω, CL = 50pF, SW = GND (Figure 3) Full - 60 90 ns Driver Disable from Output Low tLZ RL = 110Ω, CL = 50pF, SW = VCC (Figure 3) Full - 70 100 ns Driver Enable from Shutdown to Output High tZH(SHDN) RL = 110Ω, CL = 50pF, SW = GND (Figure 3), (Notes 7, 8) Full - 115 150 ns Driver Enable from Shutdown to Output Low tZL(SHDN) RL = 110Ω, CL = 50pF, SW = VCC (Figure 3), (Notes 7, 8) Full - 115 150 ns VID ≥ 1.5V with tr/tf = 10ns, RO tH & tL ≥ 60% tUI (Figure 4) Full 27 35 - Mbps Full 25 45 80 ns (Figure 4) Full - 2 12 ns RECEIVER SWITCHING CHARACTERISTICS Maximum Data Rate fMAX Receiver Input to Output Delay tPLH, tPHL (Figure 4) Receiver Skew | tPLH - tPHL | tSKD Receiver Enable to Output High tZH RL = 1kΩ, CL = 15pF, SW = GND (Figure 5), (Note 6) Full - 11 25 ns Receiver Enable to Output Low tZL RL = 1kΩ, CL = 15pF, SW = VCC (Figure 5), (Note 6) Full - 11 25 ns Receiver Disable from Output High tHZ RL = 1kΩ, CL = 15pF, SW = GND (Figure 5) Full - 7 20 ns Receiver Disable from Output Low tLZ RL = 1kΩ, CL = 15pF, SW = VCC (Figure 5) Full - 7 20 ns 4 ISL43485 Electrical Specifications Test Conditions: VCC = 3V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = 25°C, Note 2 (Continued) PARAMETER SYMBOL Time to Shutdown tSHDN TEST CONDITIONS (Note 7) TEMP (°C) MIN TYP MAX UNITS Full 80 190 300 ns Receiver Enable from Shutdown to Output High tZH(SHDN) RL = 1kΩ, CL = 15pF, SW = GND (Figure 5), (Notes 7, 9) Full - 240 400 ns Receiver Enable from Shutdown to Output Low tZL(SHDN) RL = 1kΩ, CL = 15pF, SW = VCC (Figure 5), (Notes 7, 9) Full - 240 400 ns NOTES: 2. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 3. Supply current specification is valid for loaded drivers when DE = 0V. 4. Applies to peak current. See “Typical Performance Curves” for more information. 5. When testing this parameter, keep RE = 0 to prevent the device from entering SHDN. 6. When testing this parameter, the RE signal high time must be short enough (typically <100ns) to prevent the device from entering SHDN. 7. The ISL43485 is put into shutdown by bringing RE high and DE low. If the inputs are in this state for less than 80ns, the parts are guaranteed not to enter shutdown. If the inputs are in this state for at least 300ns, the parts are guaranteed to have entered shutdown. See “Low-Power Shutdown Mode” section. 8. Keep RE = VCC, and set the DE signal low time >300ns to ensure that the device enters SHDN. 9. Set the RE signal high time >300ns to ensure that the device enters SHDN. Test Circuits and Waveforms VCC RL/2 DE DI VCC Z DI VOD D 375Ω DE Z VOD D Y Y RL/2 FIGURE 1A. VOD AND VOC VOC VCM -7V TO +12V 375Ω FIGURE 1B. VOD WITH COMMON MODE LOAD FIGURE 1. DC DRIVER TEST CIRCUITS 5 RL = 60Ω ISL43485 Test Circuits and Waveforms (Continued) 3V CL = 15pF DE tr, tf = 4.5ns 3V Z DI DI 1.5V RDIFF = 60Ω D Y 1.5V 0V CL = 15pF tPLH SIGNAL GENERATOR tPHL VOH 50% OUT (Y) 50% VOL FIGURE 2A. DIFFERENTIAL TEST CIRCUIT tPLH tPHL VOH OUT 3V OUT (Z) 50% 50% DE VOL Z DI RL = 27Ω tDD VOM D Y DIFF OUT (Y - Z) CL = 15pF SIGNAL GENERATOR VOM = VOH + VOL 2 50% 10% tDD 90% 90% tR ≈ 1.5V +VOD 50% 10% -VOD tF SKEW = |tPLH (Y or Z) - tPHL (Z OR Y)| FIGURE 2C. SINGLE ENDED TEST CIRCUIT FIGURE 2B. MEASUREMENT POINTS FIGURE 2. DRIVER DATA RATE, PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES DE DI Z 110Ω VCC D SIGNAL GENERATOR SW Y GND 3V CL = 50pF DE NOTE 7 1.5V 1.5V 0V tZH, tZH(SHDN) PARAMETER OUTPUT RE DI SW tHZ Y/Z X 1/0 GND tLZ Y/Z X 0/1 VCC tZH Y/Z 0 (Note 5) 1/0 GND tZL Y/Z tZH(SHDN) Y/Z tZL(SHDN) Y/Z 0 (Note 5) 0/1 1 (Note 8) 1/0 1 (Note 8) 0/1 FIGURE 3A. TEST CIRCUIT VCC GND OUTPUT HIGH NOTE 7 VOH - 0.25V 50% OUT (Y, Z) VOH 0V tZL, tZL(SHDN) tLZ NOTE 7 VCC OUT (Y, Z) 50% VOL + 0.25V V OUTPUT LOW VCC FIGURE 3B. MEASUREMENT POINTS FIGURE 3. DRIVER ENABLE AND DISABLE TIMES 6 tHZ OL ISL43485 Test Circuits and Waveforms (Continued) RE GND +1.5V 3V 15pF B R A A RO 1.5V 1.5V 0V tPLH tPHL VCC SIGNAL GENERATOR 50% RO 50% 0V FIGURE 4A. TEST CIRCUIT FIGURE 4B. MEASUREMENT POINTS FIGURE 4. RECEIVER DATA RATE AND PROPAGATION DELAY RE GND B A 1kΩ RO R VCC SW SIGNAL GENERATOR NOTE 7 GND RE 15pF 3V 1.5V 1.5V 0V PARAMETER DE A SW tHZ 0 +1.5V GND tLZ 0 -1.5V VCC tZH (Note 6) 0 +1.5V GND tZL (Note 6) 0 -1.5V VCC tZH(SHDN) (Note 9) 0 +1.5V GND tZL(SHDN) (Note 9) 0 -1.5V tZH, tZH(SHDN) NOTE 7 tHZ VOH - 0.25V 1.5V RO VOH 0V tZL, tZL(SHDN) tLZ NOTE 7 VCC RO 1.5V VOL + 0.25V V OUTPUT LOW VCC FIGURE 5A. TEST CIRCUIT OUTPUT HIGH OL FIGURE 5B. MEASUREMENT POINTS FIGURE 5. RECEIVER ENABLE AND DISABLE TIMES Application Information Receiver Features RS-485 and RS-422 are differential (balanced) data transmission standards for use in long haul or noisy environments. RS-422 is a subset of RS-485, so RS-485 transceivers are also RS-422 compliant. RS-422 is a pointto-multipoint (multidrop) standard, which allows only one driver and up to 10 (assuming one unit load devices) receivers on each bus. RS-485 is a true multipoint standard, which allows up to 32 one unit load devices (any combination of drivers and receivers) on each bus. To allow for multipoint operation, the RS-485 spec requires that drivers must handle bus contention without sustaining any damage. This device utilizes a differential input receiver for maximum noise immunity and common mode rejection. Input sensitivity is ±200mV, as required by the RS422 and RS-485 specifications. Another important advantage of RS-485 is the extended common mode range (CMR), which specifies that the driver outputs and receiver inputs withstand signals that range from +12V to -7V. RS-422 and RS-485 are intended for runs as long as 4000’, so the wide CMR is necessary to handle ground potential differences, as well as voltages induced in the cable by external fields. All the receivers include a “fail-safe if open” function that guarantees a high level receiver output if the receiver inputs are unconnected (floating). 7 Receiver input impedance surpasses the RS-422 spec of 4kΩ, and meets the RS-485 “Unit Load” requirement of 12kΩ minimum. Receiver inputs function with common mode voltages as great as +9V/-7V outside the power supplies (i.e., +12V and -7V), making them ideal for long networks where induced voltages are a realistic concern. The receiver easily meets the data rate supported by the driver, and the receiver output is tri-statable via the active low RE input. ISL43485 Driver Features Built-In Driver Overload Protection The RS-485, RS-422 driver is a differential output device that delivers at least 1.5V across a 54Ω load (RS-485), and at least 2V across a 100Ω load (RS-422) even with VCC = 3V. The driver features low propagation delay skew to maximize bit width, and to minimize EMI, and it is tri-statable via the active high DE input. As stated previously, the RS-485 spec requires that drivers survive worst case bus contentions undamaged. The ISL43485 meets this requirement via driver output short circuit current limits, and on-chip thermal shutdown circuitry. Outputs of the ISL43485 driver are not slew rate limited, so faster output transition times allow data rates of at least 30Mbps. Data Rate, Cables, and Terminations Twisted pair is the cable of choice for RS-485, RS-422 networks. Twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common mode signals, which are effectively rejected by the differential receivers in this IC. RS-485, RS-422 are intended for network lengths up to 4000’, but the maximum system data rate decreases as the transmission length increases. Devices operating at 30Mbps are often limited to lengths of less than one hundred feet. Figure 6 details the ISL43485’s 30Mbps performance driving 200’ of “CAT5” cable terminated in 120Ω at both ends. Note that the differential signal delivered to the receiver at the end of the cable (A-B) still exceeds 1.5V peak. Longer cable lengths are possible by reducing the data rate, as shown in Figure 7 for a data rate of 20Mbps. To minimize reflections, proper termination is imperative when using this 30Mbps device. In point-to-point, or point-tomultipoint (single driver on bus) networks, the main cable should be terminated in its characteristic impedance (typically 120Ω) at the end farthest from the driver. In multireceiver applications, stubs connecting receivers to the main cable should be kept as short as possible. Multipoint (multidriver) systems require that the main cable be terminated in its characteristic impedance at both ends. Stubs connecting a transceiver to the main cable should be kept as short as possible. 8 The driver output stages incorporate short circuit current limiting circuitry which ensures that the output current never exceeds the RS-485 spec, even at the common mode voltage range extremes. Additionally, it utilizes a foldback circuit which reduces the short circuit current, and thus the power dissipation, whenever the contending voltage exceeds either supply. In the event of a major short circuit condition, this device also includes a thermal shutdown feature that disables the drivers whenever the die temperature becomes excessive. This eliminates the power dissipation, allowing the die to cool. The drivers automatically reenable after the die temperature drops about 15 degrees. If the contention persists, the thermal shutdown/reenable cycle repeats until the fault is cleared. Receivers stay operational during thermal shutdown. Low Power Shutdown Mode This BiCMOS transceiver uses a fraction of the power required by its bipolar counterparts, nevertheless, the ISL43485 includes a shutdown feature that reduces the already low quiescent ICC to a 15nA trickle. They enter shutdown whenever the receiver and driver are simultaneously disabled (RE = VCC and DE = GND) for a period of at least 300ns. Disabling both the driver and the receiver for less than 80ns guarantees that shutdown is not entered. Note that receiver and driver enable times increase when these devices enable from shutdown. Refer to Notes 5-9, at the end of the Electrical Specification table, for more information. ISL43485 0 5 RO 0 DRIVER+CABLE DELAY 3 1.5 (~290ns) A-B 0 -1.5 -3 DI = 20Mbps 5 0 5 RO 0 DRIVER+CABLE DELAY 3 1.5 A-B -1.5 -3 TIME (20ns/DIV) FIGURE 6. DRIVER AND RECEIVER WAVEFORMS DRIVING 200 FEET OF CAT5 CABLE (DOUBLE TERMINATED WITH 120Ω) FIGURE 7. DRIVER AND RECEIVER WAVEFORMS DRIVING 300 FEET OF CAT5 CABLE (DOUBLE TERMINATED WITH 120Ω) 2.9 DIFFERENTIAL OUTPUT VOLTAGE (V) 110 DRIVER OUTPUT CURRENT (mA) (~425ns) 0 TIME (20ns/DIV) 100 90 80 70 60 50 40 30 20 10 0 DRIVER INPUT (V) 5 RECEIVER OUTPUT (V) DI = 30Mbps DRIVER INPUT (V) VCC = 3.3V, TA = 25°C; Unless Otherwise Specified RECEIVER INPUT (V) RECEIVER INPUT (V) RECEIVER OUTPUT (V) Typical Performance Curves 0 0.5 1 1.5 2 2.5 DIFFERENTIAL OUTPUT VOLTAGE (V) 3 2.8 RDIFF = 100Ω 2.7 2.6 2.5 2.4 2.3 RDIFF = 54Ω 2.2 2.1 2 -40 3.5 -25 0 25 50 75 85 TEMPERATURE (°C) FIGURE 8. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT VOLTAGE FIGURE 9. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs TEMPERATURE 160 800 140 120 750 80 60 40 ICC (µA) OUTPUT CURRENT (mA) ISL83483/85, DE = VCC, RE = X Y OR Z = LOW 100 20 0 -20 700 Y OR Z = HIGH -40 650 -60 ISL83483/85, DE = RE = GND; ISL83491, DE = X, RE = GND; ISL83488/90 -80 -100 -120 -7 -6 -4 -2 0 2 4 6 OUTPUT VOLTAGE (V) 8 10 12 FIGURE 10. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT VOLTAGE 9 600 -40 -25 0 25 50 75 TEMPERATURE (°C) FIGURE 11. SUPPLY CURRENT vs TEMPERATURE 85 ISL43485 Typical Performance Curves VCC = 3.3V, TA = 25°C; Unless Otherwise Specified (Continued) 16 4 RDIFF = 54Ω 3.5 RDIFF = 54Ω FIGURE 2A |tPHLY - tPLHZ| tPLHZ 14 3 13 2.5 tPLHY 11 tPHLY 10 2 1.5 |CROSSING PT. OF Y↑ & Z↓ CROSSING PT. OF Y↓ & Z↑| tPHLY 1 9 tPHLZ 8 -40 -25 0 25 50 0.5 -40 85 75 |tPLHY - tPHLZ| -25 TEMPERATURE (°C) 0 5 RO 0 3 2.5 B/Z 2 1.5 1 RECEIVER OUTPUT (V) DI 5 DRIVER INPUT (V) RDIFF = 54Ω, CL = 15pF A/Y 0.5 0 TIME (10ns/DIV) FIGURE 14. DRIVER AND RECEIVER WAVEFORMS, LOW TO HIGH Die Characteristics SUBSTRATE POTENTIAL (POWERED UP): GND TRANSISTOR COUNT: 528 PROCESS: Si Gate BiCMOS 10 50 85 75 FIGURE 13. DRIVER SKEW vs TEMPERATURE DRIVER OUTPUT (V) DRIVER OUTPUT (V) RECEIVER OUTPUT (V) FIGURE 12. DRIVER PROPAGATION DELAY vs TEMPERATURE 0 25 TEMPERATURE (°C) RDIFF = 54Ω, CL = 15pF DI 5 0 5 RO 0 3 2.5 2 A/Y 1.5 1 0.5 B/Z 0 TIME (10ns/DIV) FIGURE 15. DRIVER AND RECEIVER WAVEFORMS, HIGH TO LOW DRIVER INPUT (V) 12 SKEW (ns) PROPAGATION DELAY (ns) 15 ISL43485 Small Outline Plastic Packages (SOIC) M8.15 (JEDEC MS-012-AA ISSUE C) 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA 0.25(0.010) M H INCHES B M E SYMBOL -B- 1 2 3 L SEATING PLANE -A- h x 45o A D µα e A1 B 0.25(0.010) M C 0.10(0.004) C A M MIN MAX NOTES 0.0532 0.0688 1.35 1.75 - 0.0040 0.0098 0.10 0.25 - B 0.013 0.020 0.33 0.51 9 C 0.0075 0.0098 0.19 0.25 - D 0.1890 0.1968 4.80 5.00 3 E 0.1497 0.1574 3.80 4.00 4 0.050 BSC 1.27 BSC - H 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 L 0.016 0.050 0.40 1.27 6 8o 0o α NOTES: MILLIMETERS A N B S MAX A1 e -C- MIN 8 0o 8 7 8o 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. Rev. 0 12/93 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 11