NXP low VF (MEGA) Schottky rectifiers in CFP3 and CFP5 FlatPower packages FlatPower Schottky rectifiers Small on size - big on power NXP’s FlatPower packages with clip-bond technology meet the demand for thinner products with high power capabilities. Today a range of 37 medium-power Schottky rectifiers are housed in CFP3 (SOD123W) and CFP5 (SOD128). They offer high power ratings similar to standard SMA/SMB packages but occupy only half of the PCB area. KEY FEATURES } Very low forward voltage drop VF } High forward current capability IF } High power capability Ptot due to new clip-bonding technology and optimized die design } Junction temperature up to 175 °C KEY BENEFITS } Highest values for power capability } Highly energy efficient } Very small dimensions/low profile for economical use of space }Pad layout compatible with SMA/SMB for easy drop-in replacement }Capable of automatic optical inspection (AOI) } AEC-Q101 qualified BODY DIMENSIONS } CFP3 (SOD123W): 2.6 x 1.7 x 1.0 mm } CFP5 (SOD128): 3.8 x 2.5 x 1.0 mm KEY APPLICATIONS } Power management circuits, especially DC/DC converters } Step-down and asynchronous converters } Free-wheeling diodes for inductive loads in motors and relays } High-temperature applications Medium power low VF (MEGA) Schottky rectifiers single ≥ 1 A - FlatPower packages CFP3 (SOD123W) CFP5 (SOD128) 2.6 x 1.7 x 1.0 3.8 x 2.5 x 1.0 950 1050 20 30 1 40 60 100 30 40 2 60 100 30 40 3 60 4.5 IR max (mA) @ VR max VF max (mV) @ IF max VR max (V) IF max (A) Package Size (mm) P tot (mW) @ 1 cm² Optimization 340 1 Low VF PMEG2010ER 450 0.05 Low IR PMEG2010ER 360 1.5 Low VF PMEG3010ER PMEG3010EP 450 0.05 Low IR PMEG3010BER PMEG3010BEP 490 0.05 Low VF PMEG4010ER PMEG4010EP 490 0.05 Low VF PMEG4010ETR PMEG4010ETP 530 0.06 Low VF PMEG6010ER PMEG6010EP 530 0.06 Low VF PMEG6010ETR 660 0.0003 Low IR PMEG6010ELR 770 0.00015 Low IR PMEG10010ELR 360 3 Low VF PMEG3020EP 420 1.5 Low VF 450 0.1 Low IR PMEG3020ER PMEG3020CEP 520 0.05 Low IR 490 0.1 Low VF PMEG4020ER PMEG4020EP 490 0.1 Low VF PMEG4020ETR PMEG4020ETP 530 0.2 Low VF PMEG6020ER PMEG6020EP 530 0.2 Low VF PMEG6020ETR PMEG6020ETP 680 0.0007 Low IR PMEG6020AELR PMEG6020AELP PMEG3020BEP PMEG3020BER PMEG3020DEP 760 0.0003 Low IR PMEG6020ELR 770 0.0003 Low IR PMEG10020AELR 830 0.00015 Low IR PMEG10020ELR 360 5 Low VF PMEG3030EP 450 0.15 Low IR PMEG3030BEP 490 0.2 Low VF PMEG4030EP 490 0.2 Low VF PMEG4030ETP 540 0.1 Low IR 530 0.2 Low VF PMEG6030EP 475 0.4 Low VF PMEG6030EVP 530 0.2 Low VF PMEG6030ETP PMEG10020AELP PMEG4030ER 690 0.001 Low IR PMEG6030ELP 100 770 0.00045 Low VF PMEG10030ELP 60 530 0.4 Low VF PMEG6045ETP 360 8 Low VF PMEG3050EP 450 0.25 Low IR PMEG3050BEP 490 0.3 Low VF PMEG4050EP 490 0.3 Low VF PMEG4050ETP 30 5 40 FlatPower packages CFP3 and CFP5 Minimized outline and reflow soldering footprint 1.9 1.5 4.4 1.1 0.9 2.9 1 2.8 0.6 0.3 3.7 3.3 solder lands 2.8 2.4 solder resist 1.1 1.2 (2 ) (2 ) 2.1 1.6 solder paste occupied area 2 1.1 (2 ) 1.2 (2 ) 0.22 0.10 1.05 0.75 Dimensions in mm 08-11-06 Dimensions in mm sod123w_fr CFP3 (SOD123W) CFP3 (SOD123W) Dimensions in mm CFP5 (SOD128) CFP5 (SOD128) Improved forward characteristics of low VF (MEGA) Schottky rectifiers NXP low VF Maximum Efficiency General Applications (MEGA) Schotty rectifiers in new FlatPower CFP3 compared to wire-bonded package. Improved forward characteristic Improved forward characteristic (same reverse current: IR @30 V = 1 mA) (same reverse current: IR @20 V = 0.05 mA) 1.0 2.0 0.9 forward current 0.8 IF [A] 0.7 1.8 forward current 1.6 IF [A] 1.4 0.6 1.2 0.5 1.0 0.4 0.8 0.3 0.6 0.2 0.4 0.1 0.2 0 0 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 forward voltage VF [V] PMEG2010BER with clip-bond technology Equivalent type 20 V/1 A with wire-bond technology 0.50 brb344 0 0 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 forward voltage VF [V] PMEG3020ER with clip-bond technology Equivalent type 30 V/2 A with wire-bond technology 0.50 brb345 FlatPower versus SMA/SMB packages: easy drop-in replacements Typical deviation from SMA/SMB -50% -50% * CFP3* CFP5* inside view showing clip-bonding -48% structure -24% Footprint comparison: NXP CFP3/CFP5 on recommended solder pad Competitor SMA solder layout NXP CFP5 solder layout Competitor SMA solder layout NXP CFP3 NXP CFP5 NXP CFP5 Competitor SMB solder layout NXP CFP3 solder layout NXP CFP3 NXP CFP5 2 mm Scale Solder stencil opening and solder deposit volume must be considered. Market comparison NXP low VF (MEGA) Schottky rectifier in CFP3/CFP5 compared with rectifiers in SMA/SMB packages Supplier NXP NXP Diodes Inc. MCC ON Semi ROHM Vishay Diotec Fairchild KEC Supplier NXP Diodes Inc. ON Semi Vishay Fairchild Type range in CFP3/CFP5/SMA package IR max (A) VR max (V) Body dimensions (mm) PMEGxER/BER PMEGxEP/BEP B1x/B2x0A/B3xA SSx-LT/SK3xA-LT MBRA1x/SS16/BRAx RSXx/RBx Bx(L)A/SS(A)x SK1x/SK3xSMA SS1x/FMKAx SMAB3x 1, 2, 3 1, 2, 3, 5 20, 30, 40, 60 30, 40, 60 2.6 x 1.7 x 1.0 3.8 x 2.5 x 1.0 4.3 x 2.6 x 2.15 4.3 x 2.58 x 2.22 4.32 x 2.6 x 2.17 4.5 x 2.6 x 2.0 4.25 x 2.6 x 2.1 4.6 x 2.7 x 2.1 4.38 x 2.73 x 2.05 4.5 x 2.6 x 2.0 Type range in CFP5/SMB package IR max (A) VR max (V) PMEGxEP/BEP 1, 2, 3, 5 30, 40, 60 3.8 x 2.5 x 1.0 B340LB 3 40 4.32 x 3.62 x 2.31 1, 2, 3 20, 30, 40, 60 1, 3 1 3 30, 40, 60 Body dimensions (mm) MBRSx/SS26 1, 2 30, 40, 60 4.32 x 3.56 x 2.13 SL23/SS2x/B3x(L)B 2, 3 30, 40, 60 4.32 x 3.62 x 2.29 SSx/MBRS140 1, 2 30, 40, 60 4.4 x 3.63 x 2.18 ➜N XP advantage: Smallest package with competitive electrical characteristics. For CFP5 types, broadest forward-current range from 1 - 5 A. www.nxp.com © 2015 NXP Semiconductors N.V. All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The Date of release: February 2015 information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and Document order number: 9397 750 17640 may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof Printed in the Netherlands does not convey nor imply any license under patent- or other industrial or intellectual property rights.