NXP low VF (MEGA) Schottky rectifiers in CFP3 and CFP5 FlatPower packages

NXP low VF (MEGA)
Schottky rectifiers in
CFP3 and CFP5
FlatPower packages
FlatPower Schottky rectifiers Small on size - big on power
NXP’s FlatPower packages with clip-bond technology meet the demand for thinner
products with high power capabilities. Today a range of 37 medium-power Schottky
rectifiers are housed in CFP3 (SOD123W) and CFP5 (SOD128). They offer high power
ratings similar to standard SMA/SMB packages but occupy only half of the PCB area.
KEY FEATURES
} Very low forward voltage drop VF
} High forward current capability IF
} High power capability Ptot due to new clip-bonding
technology and optimized die design
} Junction temperature up to 175 °C
KEY BENEFITS
} Highest values for power capability
} Highly energy efficient
} Very small dimensions/low profile for economical use
of space
}Pad layout compatible with SMA/SMB for easy drop-in
replacement
}Capable of automatic optical inspection (AOI)
} AEC-Q101 qualified
BODY DIMENSIONS
} CFP3 (SOD123W): 2.6 x 1.7 x 1.0 mm
} CFP5 (SOD128): 3.8 x 2.5 x 1.0 mm
KEY APPLICATIONS
} Power management circuits, especially DC/DC converters
} Step-down and asynchronous converters
} Free-wheeling diodes for inductive loads in motors and relays
} High-temperature applications
Medium power low VF (MEGA) Schottky rectifiers single ≥ 1 A - FlatPower packages
CFP3 (SOD123W)
CFP5 (SOD128)
2.6 x 1.7 x 1.0
3.8 x 2.5 x 1.0
950
1050
20
30
1
40
60
100
30
40
2
60
100
30
40
3
60
4.5
IR max (mA) @ VR max
VF max (mV) @ IF max
VR max (V)
IF max (A)
Package
Size (mm)
P tot (mW) @
1 cm²
Optimization
340
1
Low VF
PMEG2010ER
450
0.05
Low IR
PMEG2010ER
360
1.5
Low VF
PMEG3010ER
PMEG3010EP
450
0.05
Low IR
PMEG3010BER
PMEG3010BEP
490
0.05
Low VF
PMEG4010ER
PMEG4010EP
490
0.05
Low VF
PMEG4010ETR
PMEG4010ETP
530
0.06
Low VF
PMEG6010ER
PMEG6010EP
530
0.06
Low VF
PMEG6010ETR
660
0.0003
Low IR
PMEG6010ELR
770
0.00015
Low IR
PMEG10010ELR
360
3
Low VF
PMEG3020EP
420
1.5
Low VF
450
0.1
Low IR
PMEG3020ER
PMEG3020CEP
520
0.05
Low IR
490
0.1
Low VF
PMEG4020ER
PMEG4020EP
490
0.1
Low VF
PMEG4020ETR
PMEG4020ETP
530
0.2
Low VF
PMEG6020ER
PMEG6020EP
530
0.2
Low VF
PMEG6020ETR
PMEG6020ETP
680
0.0007
Low IR
PMEG6020AELR
PMEG6020AELP
PMEG3020BEP
PMEG3020BER
PMEG3020DEP
760
0.0003
Low IR
PMEG6020ELR
770
0.0003
Low IR
PMEG10020AELR
830
0.00015
Low IR
PMEG10020ELR
360
5
Low VF
PMEG3030EP
450
0.15
Low IR
PMEG3030BEP
490
0.2
Low VF
PMEG4030EP
490
0.2
Low VF
PMEG4030ETP
540
0.1
Low IR
530
0.2
Low VF
PMEG6030EP
475
0.4
Low VF
PMEG6030EVP
530
0.2
Low VF
PMEG6030ETP
PMEG10020AELP
PMEG4030ER
690
0.001
Low IR
PMEG6030ELP
100
770
0.00045
Low VF
PMEG10030ELP
60
530
0.4
Low VF
PMEG6045ETP
360
8
Low VF
PMEG3050EP
450
0.25
Low IR
PMEG3050BEP
490
0.3
Low VF
PMEG4050EP
490
0.3
Low VF
PMEG4050ETP
30
5
40
FlatPower packages CFP3 and CFP5
Minimized outline and reflow soldering footprint
1.9
1.5
4.4
1.1
0.9
2.9
1
2.8
0.6
0.3
3.7
3.3
solder lands
2.8
2.4
solder resist
1.1 1.2
(2 ) (2 )
2.1 1.6
solder paste
occupied area
2
1.1
(2 )
1.2
(2 )
0.22
0.10
1.05
0.75
Dimensions in mm
08-11-06
Dimensions in mm
sod123w_fr
CFP3 (SOD123W)
CFP3 (SOD123W)
Dimensions in mm
CFP5 (SOD128)
CFP5 (SOD128)
Improved forward characteristics of low VF (MEGA) Schottky rectifiers
NXP low VF Maximum Efficiency General Applications (MEGA) Schotty rectifiers in new FlatPower CFP3 compared
to wire-bonded package.
Improved forward characteristic
Improved forward characteristic
(same reverse current: IR @30 V = 1 mA)
(same reverse current: IR @20 V = 0.05 mA)
1.0
2.0
0.9
forward
current 0.8
IF
[A]
0.7
1.8
forward
current 1.6
IF
[A]
1.4
0.6
1.2
0.5
1.0
0.4
0.8
0.3
0.6
0.2
0.4
0.1
0.2
0
0
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
forward voltage VF [V]
PMEG2010BER with clip-bond technology
Equivalent type 20 V/1 A with wire-bond technology
0.50
brb344
0
0
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
forward voltage VF [V]
PMEG3020ER with clip-bond technology
Equivalent type 30 V/2 A with wire-bond technology
0.50
brb345
FlatPower versus SMA/SMB packages: easy drop-in replacements
Typical deviation from SMA/SMB
-50%
-50%
* CFP3*
CFP5*
inside view
showing
clip-bonding
-48%
structure
-24%
Footprint comparison: NXP CFP3/CFP5 on recommended solder pad
Competitor SMA
solder layout
NXP CFP5
solder layout
Competitor SMA
solder layout
NXP
CFP3
NXP
CFP5
NXP
CFP5
Competitor SMB
solder layout
NXP CFP3
solder layout
NXP
CFP3
NXP
CFP5
2 mm
Scale
Solder stencil opening and solder deposit volume must be considered.
Market comparison
NXP low VF (MEGA) Schottky rectifier in CFP3/CFP5 compared with rectifiers in SMA/SMB packages
Supplier
NXP
NXP
Diodes Inc.
MCC
ON Semi
ROHM
Vishay
Diotec
Fairchild
KEC
Supplier
NXP
Diodes Inc.
ON Semi
Vishay
Fairchild
Type range in CFP3/CFP5/SMA package
IR max (A)
VR max (V)
Body dimensions (mm)
PMEGxER/BER
PMEGxEP/BEP
B1x/B2x0A/B3xA
SSx-LT/SK3xA-LT
MBRA1x/SS16/BRAx
RSXx/RBx
Bx(L)A/SS(A)x
SK1x/SK3xSMA
SS1x/FMKAx
SMAB3x
1, 2, 3
1, 2, 3, 5
20, 30, 40, 60
30, 40, 60
2.6 x 1.7 x 1.0
3.8 x 2.5 x 1.0
4.3 x 2.6 x 2.15
4.3 x 2.58 x 2.22
4.32 x 2.6 x 2.17
4.5 x 2.6 x 2.0
4.25 x 2.6 x 2.1
4.6 x 2.7 x 2.1
4.38 x 2.73 x 2.05
4.5 x 2.6 x 2.0
Type range in CFP5/SMB package
IR max (A)
VR max (V)
PMEGxEP/BEP
1, 2, 3, 5
30, 40, 60
3.8 x 2.5 x 1.0
B340LB
3
40
4.32 x 3.62 x 2.31
1, 2, 3
20, 30, 40, 60
1, 3
1
3
30, 40, 60
Body dimensions (mm)
MBRSx/SS26
1, 2
30, 40, 60
4.32 x 3.56 x 2.13
SL23/SS2x/B3x(L)B
2, 3
30, 40, 60
4.32 x 3.62 x 2.29
SSx/MBRS140
1, 2
30, 40, 60
4.4 x 3.63 x 2.18
➜N
XP advantage: Smallest package with competitive electrical characteristics. For CFP5 types, broadest forward-current range
from 1 - 5 A.
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© 2015 NXP Semiconductors N.V.
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Date of release: February 2015
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