World's thinnest medium-power Schottky rectifiers in CFP15 FlatPower package

NXP high-efficiency
medium-power
Schottky rectifiers
in CFP15 package
World´s thinnest medium-power Schottky
rectifiers in CFP15 FlatPower package
Delivering ultra-low forward voltages and high current density in the thinnest package
available (0.78 mm), these rectifiers are ideal for use in smartphone and tablet chargers.
NXP’s new medium-power Schottky barrier rectifiers with
5 – 15 A, housed in the new, low-profile CFP15 FlatPower
package offer applied miniaturization of power.
KEY FEATURES
`` Average forward current: IFAV ≤ 5 - 15 A
`` Reverse voltage: VR ≤ 45 - 60 V
`` Extremely low forward voltage
`` High-power capability due to clip-bond technology and
heat sink
`` Small, thin SMD power plastic package, with height of
0.78 mm (typ)
`` Junction temperature up to 175 °C
`` Automatic optical inspection of solder joint due to tin-plated
lead ends
`` AEC-Q101 qualified
KEY APPLICATIONS
`` Low-voltage rectification
`` High-efficiency DC-to-DC conversion
`` Switch-mode power supply (SMPS)
`` Freewheeling applications
`` Reverse-polarity protection
`` Low-power applications
Cutaway view of FlatPower package CFP15 (SOT1289)
Solid clip
Silicon
die
Tin-plated
lead end
Large
heat sink
CFP15 package details
Tin plated lead ends
m
4.3 m
m
4.3 m
5.8
m
5.8
mm
Application example flyback converter
Schottky rectifier
Rinrush
m
+
VOUT
0.78 mm
0.78 mm
-
VCC
DRAIN
controller
FB
GND
SOURCE
aaa-012903
Medium-power low VF Schottky rectifiers single ≥ 5 A
IF max (A)
VR max (V)
VF max (mV)
@ IF max
IR max (mA)
@ VR max
Optimization
PMEG045V050EPD
5
45
490
0.3
Low VF
PMEG060V050EPD
5
60
560
0.4
Low VF
PMEG045V1000EPD
10
45
490
0.6
Low VF
PMEG45U10EPD
10
45
490
0.6
Low VF
PMEG45A10EPD
10
45
540
0.5
Low IR
PMEG060V100EPD
10
60
560
0.7
Low VF
PMEG045T150EPD
15
45
490
0.03
Low IR
PMEG045V150EPD
15
45
490
1
Low VF
PMEG050V150EPD
15
50
500
1
Low VF
Product Type
Ptot (mW)
@ 1 cm²
Package
1200
CFP15
(SOT1289)
5.8 x 4.3 x 0.78
Key package advantages of CFP15 (SOT1289)
`` Benchmark flat design of only 0.78 mm height, compared to 1.1 mm
of competitor products
`` Footprint compatible to competitor types
`` High power capability due to clip-bond technology and heat sink
`` Automatic optical inspection of solder joint due to tin plated lead ends
`` All package information, including outline and soldering footprint,
visit: www.nxp.com/packages/SOT1289.html
www.nxp.com
© 2015 NXP Semiconductors N.V.
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Date of release: February 2015
information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and
Document order number: 9397 750 17638
may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof
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