NXP high-efficiency medium-power Schottky rectifiers in CFP15 package World´s thinnest medium-power Schottky rectifiers in CFP15 FlatPower package Delivering ultra-low forward voltages and high current density in the thinnest package available (0.78 mm), these rectifiers are ideal for use in smartphone and tablet chargers. NXP’s new medium-power Schottky barrier rectifiers with 5 – 15 A, housed in the new, low-profile CFP15 FlatPower package offer applied miniaturization of power. KEY FEATURES `` Average forward current: IFAV ≤ 5 - 15 A `` Reverse voltage: VR ≤ 45 - 60 V `` Extremely low forward voltage `` High-power capability due to clip-bond technology and heat sink `` Small, thin SMD power plastic package, with height of 0.78 mm (typ) `` Junction temperature up to 175 °C `` Automatic optical inspection of solder joint due to tin-plated lead ends `` AEC-Q101 qualified KEY APPLICATIONS `` Low-voltage rectification `` High-efficiency DC-to-DC conversion `` Switch-mode power supply (SMPS) `` Freewheeling applications `` Reverse-polarity protection `` Low-power applications Cutaway view of FlatPower package CFP15 (SOT1289) Solid clip Silicon die Tin-plated lead end Large heat sink CFP15 package details Tin plated lead ends m 4.3 m m 4.3 m 5.8 m 5.8 mm Application example flyback converter Schottky rectifier Rinrush m + VOUT 0.78 mm 0.78 mm - VCC DRAIN controller FB GND SOURCE aaa-012903 Medium-power low VF Schottky rectifiers single ≥ 5 A IF max (A) VR max (V) VF max (mV) @ IF max IR max (mA) @ VR max Optimization PMEG045V050EPD 5 45 490 0.3 Low VF PMEG060V050EPD 5 60 560 0.4 Low VF PMEG045V1000EPD 10 45 490 0.6 Low VF PMEG45U10EPD 10 45 490 0.6 Low VF PMEG45A10EPD 10 45 540 0.5 Low IR PMEG060V100EPD 10 60 560 0.7 Low VF PMEG045T150EPD 15 45 490 0.03 Low IR PMEG045V150EPD 15 45 490 1 Low VF PMEG050V150EPD 15 50 500 1 Low VF Product Type Ptot (mW) @ 1 cm² Package 1200 CFP15 (SOT1289) 5.8 x 4.3 x 0.78 Key package advantages of CFP15 (SOT1289) `` Benchmark flat design of only 0.78 mm height, compared to 1.1 mm of competitor products `` Footprint compatible to competitor types `` High power capability due to clip-bond technology and heat sink `` Automatic optical inspection of solder joint due to tin plated lead ends `` All package information, including outline and soldering footprint, visit: www.nxp.com/packages/SOT1289.html www.nxp.com © 2015 NXP Semiconductors N.V. All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The Date of release: February 2015 information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and Document order number: 9397 750 17638 may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof Printed in the Netherlands does not convey nor imply any license under patent- or other industrial or intellectual property rights.