5962F9553602V

REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
A
Add a device class V device. Make changes to table II and add table IIB.
96-11-19
R. MONNIN
B
Add case outlines H and X. Make changes to 1.2.4, 1.3, and FIGURE 1.
97-06-13
R. MONNIN
C
Change case outline X dimensions L, R, and R1 for FIGURE 1. - lgt
97-11-25
R. MONNIN
D
Change values for thermal resistance under the absolute maximum ratings.
Change footnote 1 for table I. Change test conditions for Slew rate in
table I. – lgt
98-09-22
R. MONNIN
E
Add radiation hardened requirements. - ro
00-03-15
R. MONNIN
F
Change the maximum total dose available value in 1.5. Remove radiation test
circuit. – rrp
00-08-18
R. MONNIN
G
Delete figure 1 and update drawing to reflect current requirements. - ro
03-02-26
R. MONNIN
H
Add device type 02 tested at low dose rate. Make changes to footnotes 1/ and
2/ as specified under Table I. Make a change to paragraph 4.4.4.1.Delete the
Accelerated aging test. - ro
09-03-10
R. HEBER
J
Update drawing to current MIL-PRF-38535 requirements. Removed class M
references. -rrp
15-12-14
C. SAFFLE
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
REV
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J
J
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OF SHEETS
SHEET
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PMIC N/A
PREPARED BY
RICK OFFICER
STANDARD
MICROCIRCUIT
DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
CHECKED BY
RAJESH PITHADIA
APPROVED BY
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
MICHAEL FRYE
DRAWING APPROVAL DATE
96-04-29
REVISION LEVEL
J
MICROCIRCUIT, LINEAR, HIGH SPEED, HIGH
OUTPUT CURRENT, VOLTAGE FEEDBACK
AMPLIFIER, MONOLITHIC SILICON
SIZE
CAGE CODE
A
67268
SHEET
DSCC FORM 2233
APR 97
5962-95536
1 OF 11
5962-E111-16
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q) and
space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
F
95536
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
01
V
P
A
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
/
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
Generic number
01
LM7171
02
LM7171
Circuit function
High speed, high output current,
voltage feedback amplifier
High speed, high output current,
voltage feedback amplifier and not
sensitive at low dose rate
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
Device requirements documentation
Q or V
Certification and qualification to MIL-PRF-38535
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
H
P
X
Descriptive designator
GDFP1-F10 or CDFP2-F10
GDIP1-T8 or CDIP2-T8
GDFP1-G10
Terminals
10
8
10
Package style
Flat pack
Dual-in-line
Flat pack with gullwing leads
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-95536
A
REVISION LEVEL
J
SHEET
2
1.3 Absolute maximum ratings. 1/
Supply voltage (+VS to –VS) .................................................................
Differential input voltage .......................................................................
Output short circuit to ground ...............................................................
Storage temperature range ...................................................................
Power dissipation (PD) .........................................................................
Lead temperature (soldering, 10 seconds) ...........................................
Junction temperature (TJ) .....................................................................
36 V
±10 V 2/
Continuous 3/
-65°C to +150°C
730 mW
+260°C
+150°C
Thermal resistance, junction-to-case (θJC):
Cases H and X .................................................................................. 5°C/W
Case P .............................................................................................. 3°C/W
Thermal resistance, junction-to-ambient (θJA):
Cases H and X .................................................................................. 182°C/W still air
105°C/W at 500 linear feet per minute
Case P .............................................................................................. 106°C/W still air
53°C/W at 500 linear feet per minute
1.4 Recommended operating conditions.
Supply voltage ............................................................................................. 5.5 V to 36 V
Ambient operating temperature range (TA) ................................................. -55°C to +125°C
1.5 Radiation features. 4/ 5/
Device type 01:
Maximum total dose available (dose rate = 50 – 300 rads (Si)/s) ............. 300 Krads (Si)
Device type 02:
Maximum total dose available (dose rate = 10 mrads (Si)/s) ................... 300 Krads (Si)
The manufacturer supplying RHA device 02 parts on this drawing has completed Lot Acceptance testing at Low Dose Rate
(10 mrad/s) on these RHA marked parts. The Low Dose Rate (LDR) testing that was performed demonstrates that these
parts from the lot tested do not have an Enhanced Low Dose rate Sensitivity as defined by Method 1019.
Lot Acceptance Testing at LDR will continue to be performed on each wafer. Since the redesigned part did not
demonstrate ELDRS per Method 1019 and the previously tested device type 01 was not tested for ELDRS, device type 02
will be added to distinguish it from the 01 device.
_____
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Input differential voltage is measured at VS = ±15 V.
3/ Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient
temperature can result in exceeding the maximum allowed TJ of +150°C.
4/ For device type 01, these parts may be dose rate sensitive in a space environment and may demonstrate enhanced low
dose rate effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions as specified
in MIL-STD-883, method 1019, condition A.
5/ For device type 02, these parts have been tested and do not demonstrate low dose rate sensitivity. Radiation end point
limits for the noted parameters are guaranteed for the conditions specified in MIL-STD-883, test method 1019, condition D.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-95536
A
REVISION LEVEL
J
SHEET
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 as specified herein, or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-95536
A
REVISION LEVEL
J
SHEET
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/ 2/ 3/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits
Min
Unit
Max
±5 V section
Input offset voltage
1
VOS
01, 02
1.5
2,3
Input bias current
1
IIB
7
01, 02
10
2,3
Input offset current
1
IOS
CMRR
VCM = ±2.5 V
1
01, 02
AV
1
RL = 1 kΩ 4/
RL = 100 Ω 4/
Output voltage swing
VOUT
01, 02
RL = 100 Ω
Output current
IOUT
Sourcing, RL = 100 Ω 5/
01, 02
72
2,3
67
01, 02
dB
3.2
-3.2
2,3
3.0
-3.0
1
2.9
-2.9
2,3
2.8
-2.75
01, 02
29
V
mA
28
1
29
2,3
27.5
1
ICC
75
1
2,3
Supply current
dB
70
70
1
Sinking, RL = 100 Ω 5/
80
2,3
1
RL = 1 kΩ
µA
4
6
2,3
Large signal voltage gain
µA
12
2,3
Common mode rejection
ratio
mV
01, 02
2,3
8
mA
9
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-95536
A
REVISION LEVEL
J
SHEET
5
TABLE I. Electrical performance characteristics – Continued.
Test
Symbol
Conditions 1/ 2/ 3/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits
Min
Unit
Max
±15 V section
Input offset voltage
1
VOS
01, 02
1
2,3
Input bias current
1
IIB
7
01, 02
10
2,3
Input offset current
1
IOS
CMRR
VCM = ±10 V
1
01, 02
PSRR
VS = ±15 V to ±5 V
1
01, 02
AV
1
RL = 1 kΩ 4/
RL = 100 Ω 4/
Output voltage swing
VOUT
01, 02
RL = 100 Ω
Output current, open loop
IOUT
Sourcing, RL = 100 Ω 5/
dB
80
01, 02
80
75
1
75
2,3
70
01, 02
dB
13
-13
2,3
12.7
-12.7
1
10.5
-9.5
2,3
9.5
-9
1
01, 02
2,3
Sinking, RL = 100 Ω 5/
dB
85
2,3
1
RL = 1 kΩ
85
70
2,3
Large signal voltage gain
µA
4
6
2,3
Power supply rejection
ratio
µA
12
2,3
Common mode rejection
ratio
mV
105
V
mA
95
1
95
2,3
90
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-95536
A
REVISION LEVEL
J
SHEET
6
TABLE I. Electrical performance characteristics – Continued.
Test
Symbol
Conditions 1/ 2/ 3/
-55°C ≤ TA ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits
Min
Unit
Max
±15 V section - continued
Supply current
1
ICC
01, 02
8.5
2,3
SR
Slew rate
AV = 2, VIN = ±2.5 V, 6/
mA
9.5
4
01, 02
2000
V/µs
4
01, 02
170
MHz
rise and fall time = 3 ns,
TA = +25°C
Unity gain bandwidth
UGBW
1/ RHA devices supplied to this drawing have been characterized through all levels M, D, P, L, R, F of irradiation.
Pre and Post irradiation values are identical unless otherwise specified in table I. When performing post irradiation
electrical measurements for any RHA level, TA = +25°C.
2/ The 01 device may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883,
method 1019, condition A for device type 01. Device type 02, has been tested at low dose rate and does not demonstrate
low dose rate sensitivity (see 1.5 herein).
3/ Unless otherwise specified VCM = 0 V and RL > 1 MΩ for subgroups 1, 2, 3 only. VCM = 0 V for subgroup 4.
For the ±5 V section tests, +VS = +5 V and –VS = -5 V. For the ±15 V section tests, +VS = +15 V and –VS = -15 V.
4/ Large signal voltage gain is the total output swing divided by the input signal required to produce that swing.
For the ±5 V section tests, VOUT = ±1 V. For the ±15 V section tests, VOUT = ±5 V.
5/ The open loop output current is guaranteed by the measurement of the open loop output voltage swing,
using 100 Ω output load.
6/ The slew rate is measured between ±4 V.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). The certificate of compliance
submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the
manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
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DSCC FORM 2234
APR 97
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A
REVISION LEVEL
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SHEET
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Device types
01 and 02
Case outlines
H and X
Terminal number
P
Terminal number
1
NC
NC
2
-INPUT
-INPUT
3
NC
+INPUT
4
+INPUT
-VS
5
-VS
NC
6
NC
OUTPUT
7
OUTPUT
+VS
8
NC
NC
9
+VS
---
10
NC
---
NC = No connection
FIGURE 1. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
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A
REVISION LEVEL
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SHEET
8
4. VERIFICATION
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection.
4.2.1 Additional criteria for device classes Q and V.
a.
The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
b.
Interim and final electrical test parameters shall be as specified in table IIA herein.
c.
Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups
A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections, and as specified herein.
4.4.1 Group A inspection.
a.
Tests shall be as specified in table IIA herein.
b.
Subgroups 5, 6, 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted.
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.2.1 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MILSTD-883.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-95536
A
REVISION LEVEL
J
SHEET
9
TABLE IIA. Electrical test requirements.
Test requirements
Interim electrical
parameters (see 4.2)
Final electrical
parameters (see 4.2)
Group A test
requirements (see 4.4)
Group C end-point electrical
parameters (see 4.4)
Group D end-point electrical
parameters (see 4.4)
Group E end-point electrical
parameters (see 4.4)
Subgroups
(in accordance with
MIL-PRF-38535, table III)
Device
Device
class Q
class V
----1,2,3,4 1/
1,2,3,4 1/ 2/
1,2,3,4
1,2,3,4
1,2,3
1,2,3 2/
1,2,3
1,2,3
1
1
1/ PDA applies to subgroup 1.
2/ Delta limits as specified in table IIB shall be required where specified and the delta limits
shall be computed with reference to the previous endpoint parameters.
TABLE IIB. Delta electrical characteristics (+25°C).
Parameters
Symbol 1/
Delta limits
Input offset voltage
VIO
±250 µV
Positive input bias current
+IIB
±500 nA
Negative input bias current
-IIB
±500 nA
1/ All delta parameters are tested at ±5 V and ±15 V.
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured
(see 3.5 herein).
a.
End-point electrical parameters shall be as specified in table IIA herein.
b.
For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as
specified in MIL-PRF-38535 for the RHA level being tested. All device classes must meet the postirradiation end-point
electrical parameter limits as defined in table I at TA = +25°C ±5°C, after exposure, to the subgroups specified in
table IIA herein.
4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883
method 1019, condition A for device type 01, condition D for device type 02 and as specified herein.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
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A
REVISION LEVEL
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SHEET
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5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes
Q and V.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor
prepared specification or drawing.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires
configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and
this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic
devices (FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-8108.
6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990,
or telephone (614) 692-0540.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in
MIL-HDBK-103 and QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein)
to DLA Land and Maritime-VA and have agreed to this drawing.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
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A
REVISION LEVEL
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STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 15-12-14
Approved sources of supply for SMD 5962-95536 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DLA Land and Maritime-VA. This information
bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime
maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-9553601QHA
3/
LM7171AMW-QML
5962-9553601QPA
27014
LM7171AMJ-QML
5962-9553601QXA
27014
LM7171AMWG-QML
5962-9553601VHA
3/
LM7171AMW-QMLV
5962-9553601VPA
3/
LM7171AMJ-QMLV
5962-9553601VXA
3/
LM7171AMWG-QMLV
5962F9553601QPA
3/
LM7171AMJFQML
5962F9553601QXA
3/
LM7171AMWGFQML
5962F9553601VHA
27014
LM7171AMWFQMLV
5962F9553601VPA
27014
LM7171AMJFQMLV
5962F9553601VXA
27014
LM7171AMWGFQMLV
5962F9553602VHA
27014
LM7171AMWFLQMLV
5962F9553602VXA
27014
LM7171AMWGFLQV
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
3/ Not available from an approved source of supply.
Vendor CAGE
number
27014
Vendor name
and address
National Semiconductor
2900 Semiconductor Drive
P.O. Box 58090
Santa Clara, CA 95052-8090
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.