REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Page 4, table I; delete temperature stability test. Add long term stability test. Electrical changes throughout table I. Editorial changes throughout. 88-11-09 M. A. FRYE B Add case outline 2. Add vendor CAGE 34333. Make corrections to load regulation and output voltage test conditions. Also correct short-circuit current, output source current, and RAMP bias current test limits. Change RAMP voltage-valley and RAMP voltage-valley to peak, delay to output, and charge current test limits. Editorial changes throughout. 90-05-29 M. A. FRYE C Add device types 02 and 03. Editorial changes throughout. 94-05-03 M. A. FRYE D Paragraph 1.2.2, case outline X, change descriptive designator from “CQCC2-N28B” to “CQCC1-N28B”. Table I: Input offset voltage test, VOS, change minimum limit from “-10 mV” to “-15 mV” and change maximum limit from “+10 mV” to “+15 mV”. Table I: start threshold, VSTART, fro device type 01, change maximum limit from “+9.6 V” to “+9.7 V”. Changes in accordance with N.O.R. 5962-R196-94. Terminal connections, add case outline 2 to device types 02 and 03. Changes in accordance with N.O.R. 5962-R202-95. 94-06-02 M. A. FRYE 95-10-05 M. A. FRYE F Table I, start up current test, ISTART; for the max value of “0.3” add “02, 03” in device type column. Changes in accordance with N.O.R. 5962-R160-97. 97-01-07 R. MONNIN G Add device class V devices. Redrawn. - ro 00-06-08 R. MONNIN H Add case outline “F”. Make correction to the VOH1 test condition under the Error amplifier section as specified in table I. - ro 02-07-19 R. MONNIN J Drawing updated to reflect current requirements. - ro 07-11-14 R. HEBER K Add device types 04 and 05. -rrp 08-12-03 R. HEBER E Under Table I; output source current test, move the -0.5 mA limit from the min L column to the max column, ILIM delay to output test, add footnote 2/. Update boilerplate paragraphs to current MIL-PRF-38535 requirements. - ro 10-11-30 C. SAFFLE M Add temperature stability test to Table I for device type 04. - ro 12-09-07 C. SAFFLE REV SHEET REV M M M SHEET 15 16 17 REV STATUS REV M M M M M M M M M M M M M M OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY MARCIA B. KELLEHER STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http://www.landandmaritime.dla.mil CHECKED BY ROBERT R. EVANS APPROVED BY THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A MICHAEL A. FRYE DRAWING APPROVAL DATE 88-02-09 REVISION LEVEL M MICROCIRCUIT, LINEAR, HIGH SPEED PULSE WIDTH MODULATOR CONTROLLER, MONOLITHIC SILICON SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 5962-87681 1 OF 17 5962-E449-12 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 5962 - Federal stock class designator \ RHA designator (see 1.2.1) 87681 01 E A Device type (see 1.2.2) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number For device class V: 5962 - Federal stock class designator \ RHA designator (see 1.2.1) 87681 01 V E A Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 01 02 03 04 05 Circuit function 1825 1825A 1825B 1825-SP 1825A-SP High speed PWM controller High speed PWM controller High speed PWM controller High speed PWM controller High speed PWM controller 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class M Q or V Device requirements documentation Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Certification and qualification to MIL-PRF-38535 STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87681 A REVISION LEVEL M SHEET 2 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals E F X GDIP1-T16 or CDIP2-T16 GDFP2-F16 or CDFP3-F16 CQCC1-N28B 16 16 28 2 CQCC1-N20 20 Package style Dual-in-line Flat pack Square leadless chip carrier with thermal pads Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ Supply voltage (VCC): Device types 01 and 04 ................................................................. Device types 02, 03, and 05 .......................................................... DC output current, source or sink ..................................................... Pulse output current, source or sink (0.5 µs): Device types 01, 02, 03, and 04 .................................................... Device type 05 ............................................................................... Analog input voltage: NONINVERTING, INVERTING, and RAMP pins ........................... SOFT START and CURRENT LIMIT / SD pins ............................. Power ground: Device type 05 ............................................................................... Clock output current .......................................................................... Error amplifier output current ............................................................ Soft start sink current ........................................................................ Oscillator charging current ................................................................ Power dissipation (PD) (all packages) ............................................... Storage temperature range ............................................................... Lead temperature (soldering, 10 seconds) ........................................ Junction temperature (TJ) ................................................................. 30 V dc 22 V dc 0.5 A 2.0 A 2.2 A -0.3 V dc to 7.0 V dc -0.3 V dc to 6.0 V dc ±0.2 V -5.0 mA 5.0 mA 20 mA -5.0 mA 1.0 W 2/ 3/ -65°C to +150°C +300°C +150°C Thermal resistance, junction-to-case (θJC) ....................................... See MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage range: Device types 01 and 04 ................................................................. Device types 02, 03, and 05 .......................................................... Sink/source output current (continuous or time average): Device types 04 and 05 ................................................................. Reference load current: Device types 04 and 05 ................................................................. Ambient operating temperature range (TA) ....................................... 10 V dc to 30 V dc 12 V dc to 22 V dc 0 mA to 100 mA 0 mA to 10 mA -55°C to +125°C ______ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ For case outline E, derate linearly above TA = +60°C at 11 mW/°C; for case outlines 2 and X, derate linearly above TA = 40°C at 9 mW/°C; for case outline F, derate linearly above TA = +60°C at 8 mW/°C. 3/ Must withstand the added PD due to short circuit test, e.g., ISC. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87681 A REVISION LEVEL M SHEET 3 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at https://assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Block diagrams. The block diagrams shall be as specified on figure 2. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87681 A REVISION LEVEL M SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Unit Min Max 5.05 5.15 V mV Reference section 1 All 1,2,3 01,04 ±20 02,03, 05 ±15 1,2,3 All ±20 mV TJ = +125°C, t = 1000 hrs. 2 01,02, 03 ±25 mV IO = -1.0 mA, VCC = 10 V 1,2,3 01,04 5.00 5.20 V 05 5.03 5.17 01, 04 5.00 5.20 05 5.03 5.17 01,04 5.00 5.20 05 5.03 5.17 01,04 5.00 5.20 05 5.03 5.17 01,04 -15 -100 02,03, 05 30 90 01,04 360 440 02,03, 05 375 425 05 0.9 1.1 MHz 01,04 ±2.0 % 02,03, 05 ±1.0 Output voltage VREF TJ = +25°C, IO = 1.0 mA Line regulation VRLINE 10 V < VCC < 30 V 12 V < VCC < 20 V Load regulation Long term stability 2/ Total output variation VRLOAD ∆VREF / ∆t VOM1 1.0 mA < IO < 10 mA 02,03 IO = -1.0 mA, VCC = 12 V VOM2 IO = -1.0 mA, VCC = 30 V 02,03 IO = -1.0 mA, VCC = 20 V VOM3 IO = -10 mA, VCC = 10 V 02,03 IO = -10 mA, VCC = 12 V VOM4 IO = -10 mA, VCC = 30 V 02,03 IO = -10 mA, VCC = 20 V Short-circuit current ISC 1,2,3 VREF = 0 V mA Oscillator section Initial accuracy fo 4 TJ = +25°C RT = 6.6 kΩ, CT = 220 pF, kHz TA = 25°C Voltage stability ∆fo / ∆V 10 V < VCC < 30 V 4,5,6 12 V < VCC < 20 V See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87681 A REVISION LEVEL M SHEET 5 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Min Unit Max Oscillator section – Continued. Temperature stability Total variation fOM1 VCC = 10 V 4,5,6 04 4,5,6 01,04 VCC = 30 V fOM4 Clock out high VCC = 12 V, 460 kHz 05 350 450 01,04 340 460 05 350 450 05 0.82 1.18 0.82 1.18 MHz RT = 6.6 kΩ, CT = 220 pF VCC = 20 V, RT = 6.6 kΩ, CT = 220 pF 1,2,3 VCLK(H) 1,2,3 VCLK(L) Clock out low 340 02,03 VCC = 20 V fOM3 % 02,03 VCC = 12 V fOM2 16 01,04 3.9 02,03, 05 3.7 V 01,04 2.9 02,03, 05 0.2 V Ramp voltage, peak 2/ Vim 1,2,3 All 2.6 3.0 V Ramp voltage, valley 2/ Viv 1,2,3 All 0.6 1.25 V Ramp voltage, valley 2/ to peak Vivp 1,2,3 01,02, 03,04 1.6 2.1 V 05 1.55 2.0 Oscillator discharge current IOSC RT = OPEN, VCT = 2 V 1,2,3 05 8.5 11 mA VOS VCM = 3.0 V, VO = 3.0 V 1,2,3 01,02, 03 -15 15 mV 04,05 -10 10 Error amplifier section Input offset voltage Input bias current IIB VCM = 3.0 V, VO = 3.0 V 1,2,3 All 3.0 µA Input offset current IOS VCM = 3.0 V, VO = 3.0 V 1,2,3 All ±1.0 µA Open loop gain AVOL 1.0 V < VO < 4.0 V 4,5,6 All 60 dB See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87681 A REVISION LEVEL M SHEET 6 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Min Unit Max Error amplifier section – Continued. Common-mode rejection ratio CMRR Power supply rejection ratio PSRR 1.5 V < VCM < 5.5 V, 4,5,6 All 75 dB 4,5,6 01,04 85 dB 02,03, 05 85 1.0 VOUT = 3.0 V 10 V < VCC < 30 V, VOUT = 3.0 V 12 V < VCC < 20 V, VOUT = 3.0 V Output sink current IO(SINK) E/A OUT voltage = 1.0 V 1,2,3 All Output source current IO(SOURCE) E/A OUT voltage = 4.0 V 1,2,3 All Output high voltage VOH1 E/A OUT current = -0.5 mA 1,2,3 All Output low voltage VOL1 E/A OUT current = 1.0 mA 1,2,3 Unity gain bandwidth BW 2/ Gain bandwidth 2/ product GBWP F = 200 kHz SR Slew rate 2/ mA -0.5 mA 4.0 5.0 V All 0 1.0 V 4,5,6 01 3.0 MHz 4,5,6 02,03, 05 6.0 MHz 04 5.0 01,02, 03 6.0 04 4.0 05 5.0 4,5,6 V/µs PWM comparator section. RAMP bias current Duty cycle range E/A OUT zero dc threshold voltage IBRAMP RAMP voltage = 0 V 1,2,3 DC(range) VTH 1,2,3 RAMP voltage = 0 V 1,2,3 01,04 -5.0 02,03, 05 -8.0 01,02, 03,04 0 80 05 0 85 01,02, 03,04 1.1 05 1.1 µA % V 1.4 See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87681 A REVISION LEVEL M SHEET 7 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Min Unit Max PWM comparator section – Continued. Delay to output 2/ 9,10,11 tD1 VEAOUT = 5 V to 0 V step 01,04 100 02,03 80 05 120 ns Soft-start/duty cycle clamp section SOFT START voltage = 0.5 V 1,2,3 µA 01,04 3.0 20 02,03, 05 8.0 20 01,04 1.0 02,03, 05 0.10 0.35 1,2,3 01,04 -15 15 µA VLIMIT 1,2,3 01,04 0.9 1.1 V Shutdown threshold VSHTDN 1,2,3 01,04 1.25 1.55 V Delay to output 2/ tD2 9,10,11 01,04 100 ns 1,2,3 02,03, 05 0.5 V 1,2,3 02,03 15 µA 05 15 ICHG Charge current SOFT START voltage = 2.5 V IDCHG Discharge current SOFT START voltage = 1.0 V 1,2,3 SOFT START voltage = 2.5 V mA Current limit / shutdown section CURRENT LIMIT / SD bias current Current limit threshold IB 0 V < CURRENT LIMIT / SD voltage < 4.0 V Current limit / start sequence / fault section Restart threshold VRS I LIM bias current IBLIM 0 V < V I LIM < 2 V 0 V < V I LIM < 1.5 V Current limit threshold VLIMIT 1,2,3 02,03, 05 0.95 1.05 V Over current threshold VOVER 1,2,3 02,03, 05 1.14 1.26 V tD3 1,2,3 02,03 80 ns 05 80 I LIM delay to 2/ VILIM = 0 V to 2 V step output See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87681 A REVISION LEVEL M SHEET 8 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Min Unit Max Output section. Output low level VOL2 1,2,3 IOUT = 20 mA IOUT = 200 mA Output high level VOH2 1,2,3 IOUT = -20 mA 01,02, 03,04 0.4 05 0.45 All 2.2 01,04 VHSAT V 12.0 IOUT = -200 mA Output high saturation voltage 13.0 V 1,2,3 IOUT = -20 mA 02,03, 05 2.9 V 3 IOUT = -200 mA Collector leakage ILC VC = 30 V 1,2,3 01,04 500 µA UVLO output low saturation VOLS IO = 20 mA 1,2,3 02,03 1.2 V Rise / fall time 2/ tr CL = 1.0 nF 9,10,11 01 60 ns 02,03, 05 45 04 75 Under-voltage lockout section. Start threshold 1,2,3 VSTART 01 8.8 9.7 02 8.4 9.6 03 V 17.0 04 8.8 9.6 05 8.3 9.6 Stop threshold VSTOP 1,2,3 03 9 V UVLO hysteresis VHYS 1,2,3 02,04 0.4 1.2 03 5.0 7.0 05 0.4 1.25 V See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87681 A REVISION LEVEL M SHEET 9 TABLE I. Electrical performance characteristics – Continued. Test Symbol Conditions 1/ -55°C ≤ TA ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Min Unit Max Supply current section. Start up current ISTART 1,2,3 VCC = 8.0 V VC = VCC = VTH (start) – 0.5 V Supply current ICC INVERTING INPUT, RAMP, and CURRENT LIMIT / SD 1,2,3 voltage = 0 V, NONINVERTING INPUT voltage = 1.0 V 1/ 01,04 2.5 02,03, 05 0.3 01,04 33 02,03, 05 36 mA mA Unless otherwise specified, characteristics apply at RT = 3.65 kΩ, CT = 1.0 nF. VCC = 15 V for device types 01 and 04 and VCC = 12 V for device types 02, 03, and 05. 2/ Guaranteed, if not tested, to the specified limits in table I herein. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime 's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 110 (see MIL-PRF-38535, appendix A). STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87681 A REVISION LEVEL M SHEET 10 Device types 01, 02, 03, 04, 05 01 02, 03 01, 02, 03, 04 Case outlines E F X 2 Terminal number Terminal symbol 1 INVERTING INPUT INVERTING INPUT NC NC 2 NONINVERTING INPUT NONINVERTING INPUT INVERTING INPUT INVERTING INPUT 3 E/A INPUT E/A INPUT NONINVERTING INPUT NONINVERTING INPUT 4 CLOCK CLOCK NC E / A OUT 5 RT RT NC CLOCK 6 CT CT E / A OUT NC 7 RAMP RAMP CLK / LEB RT 8 SOFT START SOFT START NC CT 9 CURRENT LIMIT / SD CURRENT LIMIT / SD RT RAMP 10 GROUND GROUND CT SOFT START 11 OUT A OUT A NC NC 12 POWER GROUND POWER GROUND NC CURRENT LIMIT / SD 13 VC VC RAMP GROUND 14 OUT B OUT B SOFT START OUT A 15 VCC VCC NC POWER GROUND 16 VREF VREF CURRENT LIMIT / SD NC 17 --- --- GROUND VC 18 --- --- NC OUT B 19 --- --- NC VCC 20 --- --- OUT A VREF 21 --- --- POWER GROUND --- 22 --- --- NC --- 23 --- --- VC --- 24 --- --- OUT B --- 25 --- --- NC --- 26 --- --- NC --- 27 --- --- VCC --- 28 --- --- VREF --- NC = No connection FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87681 A REVISION LEVEL M SHEET 11 Device types 01, 04 FIGURE 2. Block diagram. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87681 A REVISION LEVEL M SHEET 12 Device types 02, 03, and 05 FIGURE 2. Block diagram – Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87681 A REVISION LEVEL M SHEET 13 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015. (2) TA = +125°C, minimum. b. Interim and final electrical test parameters shall be as specified in table IIA herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table IIA herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. a. Tests shall be as specified in table IIA herein. b. Subgroups 7 and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87681 A REVISION LEVEL M SHEET 14 TABLE IIA. Electrical test requirements. Test requirements Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Group A test requirements (see 4.4) Group C end-point electrical parameters (see 4.4) Group D end-point electrical parameters (see 4.4) Group E end-point electrical parameters (see 4.4) Subgroups (in accordance with MIL-STD-883, method 5005, table I) Device class M 1 Subgroups (in accordance with MIL-PRF-38535, table III) 1 1,4 1,2,3,4 1/ 1,2,3,4 1/ 1,2,3,4 1/ 2/ 1,2,3,4,5,6, 3/ 9,10,11 1,2,3 1,2,3,4,5,6, 3/ 9,10,11 1,2,3 1,2,3,4,5,6, 3/ 9,10,11 1,2,3,4 2/ 1,2,3 1,2,3 1,2,3 Device class Q --- Device class V --- --- 1/ PDA applies to subgroup 1. 2/ Delta limits as specified in table IIB shall be required where specified, and the delta limits shall be computed with reference to the previous interim electrical parameters. 3/ Subgroups 9, 10, and 11 are guaranteed if not tested. TABLE IIB. Burn-in and operating life test delta parameters. TA = +25°C 1/ Parameters 2/ Symbol Device types Delta limits VREF 04, 05 ±50 mV fO 04 ±40 kHz fO 05 ±50 kHz Oscillator discharge current IOSC 05 ±0.5 mA Error amp input bias current IIB 04, 05 ±0.5 µA Supply current ICC 04, 05 ±2 mA Reference output voltage Oscillator accuracy (RT = 3.65 kΩ, CT = 1 nF) Oscillator accuracy (RT = 6.6 kΩ, CT = 220 pF) 1/ 240 hour burn-in and 1,000 hour operating group C life test. 2/ These parameters shall be recorded before and after the required burn-in and life test to determine delta limits STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87681 A REVISION LEVEL M SHEET 15 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. b. TA = +125°C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table IIA herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C ±5°C, after exposure, to the subgroups specified in table IIA herein. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-0544. 6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0540. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87681 A REVISION LEVEL M SHEET 16 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DLA Land and Maritime-VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DLA Land and Maritime-VA. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-87681 A REVISION LEVEL M SHEET 17 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 12-09-07 Approved sources of supply for SMD 5962-87681 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime -VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-8768101EA 34333 SG1825CJ883B 01295 UC1825J883B 34333 SG1825CL883B 01295 UC1825L883B 5962-8768101QFA 01295 UC1825W883B 5962-8768101VEA 01295 UC1825JQMLV 5962-8768101V2A 01295 UC1825LQMLV 5962-8768101V2C 3/ UC1825L/QMLV 5962-8768102EA 01295 UC1825AJ883B 5962-8768102XA 3/ UC1825ALP883B 5962-87681022A 01295 UC1825AL883B 5962-8768102VEA 01295 UC1825AJQMLV 5962-8768102V2A 01295 UC1825ALQMLV 5962-8768103EA 3/ UC1825BJ/883B 5962-8768103XA 3/ UC1825BLP883B 5962-87681032A 3/ UC1825BL/883B 5962-87681012A 1 of 2 STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued DATE: 12-09-07 Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-8768104VEA 01295 UC1825J-SP 5962-8768104V2A 01295 UC1825FK-SP 5962-8768105VEA 01295 UC1825AJ-SP 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source of supply. Vendor CAGE number Vendor name and address 01295 Texas Instruments, Incorporated Semiconductor Group 8505 Forest Lane P.O. Box 660199 Dallas, TX 75243 Point of contact: U.S. Highway 75 South P.O. Box 84, M/S 853 Sherman, TX 75090-9493 34333 Microsemi Analog Mixed Signal Group 11861 Western Avenue Garden Grove, CA 92841-2119 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin. 2 of 2