Teccor® brand Protection Thyristors Surface Mount Q2L Series (C-Rated) SIDACtor® Device Description The Q2L SIDACtor series provides bidirectional transient voltage protection in a low profile, chip scale package (CSP). The small package QFN (Quad Flatpak No-Lead) is ideal for dense board applications such as DSLAMs, T1/E1/J1 cards, and other telecommunication equipment. Features •R oHS compliant •C hip Scale Package (CSP) sizing •W ide range of IPP ratings including: 500A for 2x10μs GR 1089 waveform 200A for 5x310/10x700μs ITU/YDT waveform 100A for 10x1000μs GR 1089 waveform 150A for 10x560µs TIA-968-A •B idirectional transient voltage protection •S mall footprint (QFN) •T eccor brand SIDACtor technology Agency Approvals AGENCY AGENCY FILE NUMBER E133083 Protection solution to meet • • • • Y D/T 950 Y D/T 993 Y D/T 1082 G R 1089 • IEC 61000-4-5 • ITU K.20/21 •T IA-968-A Electrical Characteristics VDRM @ldrm=5µA VS @100V/µs Volts Volts IH IS IT VT @IT=1 amp Capacitance @1MHz, 2V bias Amps Volts pF Part Number Marking Min Max Min Max Min Max P0080Q22CLRP P-8C 6 25 50 800 2.2 5 35 75 P0300Q22CLRP P03C 25 40 50 800 2.2 5 25 45 P0640Q22CLRP P06C 58 77 150 800 2.2 5 55 85 P0720Q22CLRP P07C 65 88 150 800 2.2 5 50 75 P0900Q22CLRP P09C 75 98 150 800 2.2 5 45 70 P1100Q22CLRP P11C 90 130 150 800 2.2 5 45 70 P1300Q22CLRP P13C 120 160 150 800 2.2 5 40 60 P1500Q22CLRP P15C 140 180 150 800 2.2 5 35 55 P1800Q22CLRP P18C 170 220 150 800 2.2 5 35 50 P2300Q22CLRP P23C 190 260 150 800 2.2 5 30 50 P2600Q22CLRP P26C 220 300 150 800 2.2 5 30 45 P3100Q22CLRP P31C 275 350 150 800 2.2 5 30 45 P3500Q22CLRP P35C 320 400 150 800 2.2 5 25 40 • All measurements are made at an ambient temperature of 25°C. IPP applies to -40°C through +85°C temperature range. • IPP is a repetitive surge rating and is guaranteed for the life of the product. mAmps mAmps •L isted SIDACtor devices are bidirectional. All electrical parameters and surge ratings apply to forward and reverse polarities. • VS is measured at 100 V/µs. • Off-state capacitance is measured at 1MHz with a 2 V bias. Q2L (C-Rated) Series Specifications are subject to change without notice. Telecom Design Guide www.littelfuse.com ©2006 Littelfuse Teccor® brand Protection Thyristors Surface Mount Surge Ratings Ipp Series di/dt 2x10µs 1.2x50µs/8x20µs 10x160µs 10x560µs 10x1000µs Amps Amps Amps Amps Amps Amps/µs Min Min Min Min Min Max 500 400 200 150 100 500 C Thermal Considerations Package Symbol Parameter Value Unit QFN TJ Operating Junction Temperature Range -40 to +150 °C TS Storage Temperature Range -65 to +150 °C RuJA Thermal Resistance: Junction to Ambient 120 °C/W PIN 1 PIN 2 tr x td Pulse Waveform V-I Characteristics IT IS IH IDRM -V +V VT VDRM VS IPP – Peak Pulse Current – %IPP +I Waveform = tr x td 50 0 IH (TC = 25 ˚C) IH 25 ˚C 4 2 Ratio of Percent of VS Change – % 10 6 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160 Specifications are subject to change without notice. td t – Time (µs) 2.0 1.8 1.6 1.4 25 ˚C 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160 Case Temperature (TC) – ˚C Junction Temperature (TJ) – ˚C Q2L (C-Rated) Series tr Normalized DC Holding Current Versus Case Temperature 14 12 8 Half Value 0 -I Normalized VS Change Versus Junction Temperature Peak Value 100 tr = rise time to peak value td = decay time to half value Telecom Design Guide www.littelfuse.com ©2006 Littelfuse Teccor® brand Protection Thyristors Surface Mount Soldering Parameters Liquidus 260 Temperature (°C) 220 Soak Stage 190 150 0 120 60 to 90 50 to 150 Time(s) Physical Specifications Environmental Specifications Terminal Material Matte Tin-plated Copper Operating/Storage Temperature -40° C to ~ +150°C Lead Solderability ANSI/J-STD-002 Passive Aging 125° C, 1000 hours Meet Spec Humidity Aging +85°C, 85% R.H. 1000 hours Meet Spec Thermal Shock MIL-STD-202 Method 107G +85°C/-40°C 100 times Meet spec Solvent Resistance MIL-STD-202, Method 215 No Change Vibration MIL-STD-883C, Method 2007.1, Condition A No Change Can be A or B Can be A or B BOTTOM VIEW TOP VIEW C A E J Dimensions B F BOTTOM VIEW TOP VIEW C A END VIEW B H Dimensions E J 1.50 (.059”) SIDE VIEW 2.54 (.100”) F 1.27 (.050”) N2 N1 M1 K1 K2 M2 END VIEW H 1.50 (.059”) SIDE VIEW 1.27 (.050”) N2 N1 K1 M1 M2 K2 2.54 Recommended (.100”) Soldering Pad Outline (Reference Only) *Reference Tech Brief (EC642) for soldering recommendations Recommended Soldering Pad Outline (Reference Only) Q2L (C-Rated) Series Specifications are subject to change without notice. Telecom Design Guide Inches Millimeters Min Typ Max Min Typ Max A 0.126 0.130 0.134 3.200 3.300 3.400 B 0.126 0.130 0.134 3.200 3.300 3.400 C 0.075 0.079 0.083 1.900 2.000 2.100 E 0.011 0.015 0.019 0.285 0.385 0.485 F 0.088 0.092 0.096 2.230 2.330 2.430 H 0.035 0.039 0.043 0.900 1.000 1.100 J 0.000 0.004 0.008 0.000 0.100 0.200 K1 0.004 0.008 0.012 0.100 0.200 0.300 K2 0.004 0.008 0.012 0.100 0.200 0.300 M1 0.063 0.067 0.071 1.610 1.710 1.810 M2 0.045 0.049 0.053 1.153 1.253 1.353 N1 0.095 0.099 0.103 2.420 2.520 2.620 N2 0.082 0.086 0.090 2.080 2.180 2.280 www.littelfuse.com ©2006 Littelfuse Teccor® brand Protection Thyristors Surface Mount Part Marking System Part Numbering System Pxxx0Q22CLRP First Line: Product Name (see marking in table) PACKING STYLE RP : Standard: Embossed carrier tape and reel per EIA 481-1, 12mm tape in 13” reel, 5,000 pieces per reel DEVICE TYPE P : SIDACtor Second Line: Lot number MEDIAN VOLTAGE xxx : xxx volts CONSTRUCTION VARIATION 0 : Single SIDACtor chip used as a single device L : RoHS Compliant SURGE Ipp Rating C : 500AMP 2x10µs 100AMP 10x1000µs PACKAGE TYPE Q22 : QFN, 3.3mm x 3.3mm, two leaded package Packaging Package Type Description Packing Quantity Added Suffix Industry Standard QFN Embossed Carrier Reel Pack 5000 RP EIA-481-1 Tape and Reel Specification C A D Symbols Description A N W1 B Inches Millimeters Minimum Maximum Minimum Maximum Reel Diameter N/A 12.992 N/A 330.0 B Drive Spoke Width 0.059 N/A 1.50 N/A C Arbor Hole Diameter 0.504 0.531 12.80 13.50 D Drive Spoke Diameter 0.795 N/A 20.20 N/A N Hub Diameter 1.969 N/A 50.00 N/A Reel Inner Width at Hub 0.488 0.567 12.40 14.40 C A D N Reel DimensionB W1 Reel Dimension D0 P0 P2 T D0 P0 P2 T 1 CARRIER TAPE EW1 D1 CARRIER TAPE E1 D1 W0 B0 F W0 K0 P1 K0 A0 B0 E2 W A0 COVER TAPE P1 A0 F Pocket Width at bottom 0.138 0.146 3.50 3.70 Pocket Length at bottom 0.138 0.146 3.50 3.70 D0 Feed Hole Diameter 0.059 0.063 1.50 1.60 D1 Pocket Hole Diameter 0.059 N/A 1.50 N/A E1 Feed hole position 1 0.065 0.073 1.65 1.85 E2 Feed hole position 2 0.400 0.408 10.15 10.35 F Feed hole center-Pocket hole 0.215 0.219 5.45 5.55 K0 Pocket Depth 0.039 0.051 1.00 1.30 P0 Feed Hole Pitch 0.153 0.161 3.90 4.10 P1 Component Spacing 0.311 0.319 7.90 8.10 P2 Feed hole center-Pocket hole 0.077 0.081 1.95 2.05 T Carrier Tape Thickness 0.010 0.014 0.25 0.35 W Embossed Carrier Tape Width 0.453 0.484 11.50 12.30 W0 Cover Tape Width 0.358 0.366 9.10 9.30 2 W EB0 COVER TAPE Tape Dimension Items Tape Dimension Items CARRIER TAPE END COVER TAPE CARRIER TAPE TRAILER 160mm MIN COVER TAPE START END START LEADER 400mm MIN TRAILER MINTrailer Dimensions Tape 160mm Leader and LEADER 400mm MIN Tape Leader and Trailer Dimensions Q2L (C-Rated) Series Specifications are subject to change without notice. Telecom Design Guide www.littelfuse.com ©2006 Littelfuse