LITTELFUSE P0640Q22CLRP

Teccor® brand Protection Thyristors
Surface Mount
Q2L Series (C-Rated) SIDACtor® Device
Description
The Q2L SIDACtor series provides bidirectional transient
voltage protection in a low profile, chip scale package (CSP).
The small package QFN (Quad Flatpak No-Lead) is ideal for
dense board applications such as DSLAMs, T1/E1/J1 cards,
and other telecommunication equipment.
Features
•R
oHS compliant
•C
hip Scale Package (CSP) sizing
•W
ide range of IPP ratings including:
500A for 2x10μs GR 1089 waveform
200A for 5x310/10x700μs ITU/YDT waveform
100A for 10x1000μs GR 1089 waveform
150A for 10x560µs TIA-968-A
•B
idirectional transient voltage protection
•S
mall footprint (QFN)
•T
eccor brand SIDACtor technology
Agency Approvals
AGENCY
AGENCY FILE NUMBER
E133083
Protection solution to meet
•
•
•
•
Y
D/T 950
Y
D/T 993
Y
D/T 1082
G
R 1089
• IEC 61000-4-5
• ITU K.20/21
•T
IA-968-A
Electrical Characteristics
VDRM
@ldrm=5µA
VS
@100V/µs
Volts
Volts
IH
IS
IT
VT
@IT=1 amp
Capacitance
@1MHz, 2V bias
Amps
Volts
pF
Part Number
Marking
Min
Max
Min
Max
Min
Max
P0080Q22CLRP
P-8C
6
25
50
800
2.2
5
35
75
P0300Q22CLRP
P03C
25
40
50
800
2.2
5
25
45
P0640Q22CLRP
P06C
58
77
150
800
2.2
5
55
85
P0720Q22CLRP
P07C
65
88
150
800
2.2
5
50
75
P0900Q22CLRP
P09C
75
98
150
800
2.2
5
45
70
P1100Q22CLRP
P11C
90
130
150
800
2.2
5
45
70
P1300Q22CLRP
P13C
120
160
150
800
2.2
5
40
60
P1500Q22CLRP
P15C
140
180
150
800
2.2
5
35
55
P1800Q22CLRP
P18C
170
220
150
800
2.2
5
35
50
P2300Q22CLRP
P23C
190
260
150
800
2.2
5
30
50
P2600Q22CLRP
P26C
220
300
150
800
2.2
5
30
45
P3100Q22CLRP
P31C
275
350
150
800
2.2
5
30
45
P3500Q22CLRP
P35C
320
400
150
800
2.2
5
25
40
• All measurements are made at an ambient temperature of 25°C. IPP applies to -40°C
through +85°C temperature range.
• IPP is a repetitive surge rating and is guaranteed for the life of the product.
mAmps mAmps
•L
isted SIDACtor devices are bidirectional. All electrical parameters and surge ratings
apply to forward and reverse polarities.
• VS is measured at 100 V/µs.
• Off-state capacitance is measured at 1MHz with a 2 V bias.
Q2L (C-Rated) Series
Specifications are subject to change without notice.
Telecom Design Guide
www.littelfuse.com
©2006 Littelfuse
Teccor® brand Protection Thyristors
Surface Mount
Surge Ratings
Ipp
Series
di/dt
2x10µs
1.2x50µs/8x20µs
10x160µs
10x560µs
10x1000µs
Amps
Amps
Amps
Amps
Amps
Amps/µs
Min
Min
Min
Min
Min
Max
500
400
200
150
100
500
C
Thermal Considerations
Package
Symbol
Parameter
Value
Unit
QFN
TJ
Operating Junction Temperature Range
-40 to +150
°C
TS
Storage Temperature Range
-65 to +150
°C
RuJA
Thermal Resistance: Junction to Ambient
120
°C/W
PIN 1
PIN 2
tr x td Pulse Waveform
V-I Characteristics
IT
IS
IH
IDRM
-V
+V
VT
VDRM
VS
IPP – Peak Pulse Current – %IPP
+I
Waveform = tr x td
50
0
IH (TC = 25 ˚C)
IH
25 ˚C
4
2
Ratio of
Percent of VS Change – %
10
6
0
-4
-6
-8
-40 -20
0
20 40 60 80 100 120 140 160
Specifications are subject to change without notice.
td
t – Time (µs)
2.0
1.8
1.6
1.4
25 ˚C
1.2
1.0
0.8
0.6
0.4
-40 -20 0
20 40 60 80 100 120 140 160
Case Temperature (TC) – ˚C
Junction Temperature (TJ) – ˚C
Q2L (C-Rated) Series
tr
Normalized DC Holding Current Versus Case Temperature
14
12
8
Half Value
0
-I
Normalized VS Change Versus Junction Temperature
Peak
Value
100
tr = rise time to peak value
td = decay time to half value
Telecom Design Guide
www.littelfuse.com
©2006 Littelfuse
Teccor® brand Protection Thyristors
Surface Mount
Soldering Parameters
Liquidus
260
Temperature (°C)
220
Soak Stage
190
150
0
120
60 to 90
50 to 150
Time(s)
Physical Specifications
Environmental Specifications
Terminal Material
Matte Tin-plated Copper
Operating/Storage
Temperature
-40° C to ~ +150°C
Lead Solderability
ANSI/J-STD-002
Passive Aging
125° C, 1000 hours
Meet Spec
Humidity Aging
+85°C, 85% R.H. 1000 hours
Meet Spec
Thermal Shock
MIL-STD-202 Method 107G
+85°C/-40°C 100 times
Meet spec
Solvent Resistance
MIL-STD-202, Method 215
No Change
Vibration
MIL-STD-883C, Method 2007.1,
Condition A
No Change
Can be A or B
Can be A or B
BOTTOM VIEW
TOP VIEW
C
A
E
J
Dimensions
B
F
BOTTOM VIEW
TOP VIEW
C
A
END VIEW
B
H
Dimensions
E
J
1.50
(.059”)
SIDE VIEW
2.54
(.100”)
F
1.27
(.050”)
N2
N1
M1
K1
K2
M2
END VIEW
H
1.50
(.059”)
SIDE VIEW
1.27
(.050”)
N2
N1
K1
M1
M2
K2
2.54
Recommended
(.100”)
Soldering Pad Outline
(Reference Only)
*Reference Tech Brief
(EC642) for soldering
recommendations
Recommended
Soldering Pad Outline
(Reference Only)
Q2L (C-Rated) Series
Specifications are subject to change without notice.
Telecom Design Guide
Inches
Millimeters
Min
Typ
Max
Min
Typ
Max
A
0.126
0.130
0.134
3.200
3.300
3.400
B
0.126
0.130
0.134
3.200
3.300
3.400
C
0.075
0.079
0.083
1.900
2.000
2.100
E
0.011
0.015
0.019
0.285
0.385
0.485
F
0.088
0.092
0.096
2.230
2.330
2.430
H
0.035
0.039
0.043
0.900
1.000
1.100
J
0.000
0.004
0.008
0.000
0.100
0.200
K1
0.004
0.008
0.012
0.100
0.200
0.300
K2
0.004
0.008
0.012
0.100
0.200
0.300
M1
0.063
0.067
0.071
1.610
1.710
1.810
M2
0.045
0.049
0.053
1.153
1.253
1.353
N1
0.095
0.099
0.103
2.420
2.520
2.620
N2
0.082
0.086
0.090
2.080
2.180
2.280
www.littelfuse.com
©2006 Littelfuse
Teccor® brand Protection Thyristors
Surface Mount
Part Marking System
Part Numbering System
Pxxx0Q22CLRP
First Line: Product Name (see marking in table)
PACKING STYLE
RP : Standard: Embossed carrier tape
and reel per EIA 481-1, 12mm tape in 13” reel,
5,000 pieces per reel
DEVICE TYPE
P : SIDACtor
Second Line: Lot number
MEDIAN VOLTAGE
xxx : xxx volts
CONSTRUCTION VARIATION
0 : Single SIDACtor chip used
as a single device
L : RoHS Compliant
SURGE Ipp Rating
C : 500AMP 2x10µs
100AMP 10x1000µs
PACKAGE TYPE
Q22 : QFN, 3.3mm x 3.3mm, two leaded package
Packaging
Package
Type
Description
Packing
Quantity
Added
Suffix
Industry
Standard
QFN
Embossed Carrier Reel Pack
5000
RP
EIA-481-1
Tape and Reel Specification
C
A
D
Symbols
Description
A
N
W1
B
Inches
Millimeters
Minimum
Maximum
Minimum
Maximum
Reel Diameter
N/A
12.992
N/A
330.0
B
Drive Spoke Width
0.059
N/A
1.50
N/A
C
Arbor Hole Diameter
0.504
0.531
12.80
13.50
D
Drive Spoke Diameter
0.795
N/A
20.20
N/A
N
Hub Diameter
1.969
N/A
50.00
N/A
Reel Inner Width at Hub
0.488
0.567
12.40
14.40
C
A
D
N
Reel DimensionB
W1
Reel Dimension
D0
P0
P2
T
D0
P0
P2
T
1
CARRIER TAPE EW1
D1
CARRIER TAPE E1
D1
W0
B0
F
W0
K0
P1
K0
A0
B0
E2 W
A0
COVER TAPE P1
A0
F
Pocket Width at bottom
0.138
0.146
3.50
3.70
Pocket Length at bottom
0.138
0.146
3.50
3.70
D0
Feed Hole Diameter
0.059
0.063
1.50
1.60
D1
Pocket Hole Diameter
0.059
N/A
1.50
N/A
E1
Feed hole position 1
0.065
0.073
1.65
1.85
E2
Feed hole position 2
0.400
0.408
10.15
10.35
F
Feed hole center-Pocket hole
0.215
0.219
5.45
5.55
K0
Pocket Depth
0.039
0.051
1.00
1.30
P0
Feed Hole Pitch
0.153
0.161
3.90
4.10
P1
Component Spacing
0.311
0.319
7.90
8.10
P2
Feed hole center-Pocket hole
0.077
0.081
1.95
2.05
T
Carrier Tape Thickness
0.010
0.014
0.25
0.35
W
Embossed Carrier Tape Width
0.453
0.484
11.50
12.30
W0
Cover Tape Width
0.358
0.366
9.10
9.30
2 W
EB0
COVER TAPE
Tape
Dimension
Items
Tape Dimension
Items
CARRIER TAPE
END
COVER TAPE
CARRIER TAPE
TRAILER
160mm MIN
COVER TAPE
START
END
START
LEADER
400mm MIN
TRAILER
MINTrailer Dimensions
Tape 160mm
Leader and
LEADER
400mm MIN
Tape Leader and Trailer Dimensions
Q2L (C-Rated) Series
Specifications are subject to change without notice.
Telecom Design Guide
www.littelfuse.com
©2006 Littelfuse