Gas Discharge Tube (GDT) Products CG/CG2 Series CG/CG2 Series ® Description Littelfuse highly reliable CG/CG2 Series GDTs provide a high degree of surge protection in a small size ideal for board level circuit protection. GDTs function as switches which dissipate a minimum amount of energy and therefore handle currents that far surpass other types of transient voltage protection. Their gas-filled, rugged ceramic metal construction make them well suited to adverse environments. The CG/CG2 series comes in a variety of forms including surface mount, core, straight and shaped leads, to serve a variety of mounting methods. Agency Approvals AGENCY The CG Series (75-110V) is ideal for protection of test and communication equipment and other devices in which low voltage limits and extremely low arc voltages are required. AGENCY FILE NUMBER ® E128662 ® E320116 The CG2 Series (145V-1000V) is ideal for protecting equipment where higher voltage limits and holdover voltages are necessary. 2 Electrode GDT Graphical Symbol Features • Rugged Ceramic-Metal construction • Low Capacitance (<1.5pf) • Meets REA PE-80 • Available in surface mount, and a variety of lead options options Applications • Communication lines and equipment • CATV equipment • Test equipment • Data lines • Power supplies ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. Customer should verify actual device performance in their specific applications. 27 Revised: November 10, 2009 • • • • Instrumentation circuits Medical electronics ADSL equipment Telecom SLIC protection CG/CG2 Series Gas Discharge Tube (GDT) Products CG/CG2 Series Electrical Characteristics Device Specifications (at 25°C) DC Breakdown in Volts (@100V/s) Part Number MIN TYP MAX Impulse Breakdown in Volts Impulse Breakdown In Volts (@100V/μs) (@1 Kv/μsec) MAX Life Ratings Insulation CapaciArc Resistance tance Voltage (@1MHz) MIN MAX (on state Voltage) @1Amp Min Surge Life (@500A 10/1000μs) Nominal Nominal AC DC Max Impulse AC Dischage Holdover Impulse Discharge Discharge Current Voltage2 Discharge (9 cycle Current Current Current (8/20μs) (10x1sec @50-60Hz) @50Hz) TYP (1 Application @ 10/350μs) TYP NOTES: 1. Tested to UL1449 Third Edition 2. Reference REA PE-80, 0.2A. Tested to ITU-T Rec K.12 and REA PE 80 < 150 mSec. 3. Leaded devices = 5x[5(+) or 5 (-)] applications 20kA 8/20μSec. (75 to 600 volt devices.) MS and Core devices = 10x[5(+) and 5(-)] applications 10kA 8/20μS (800 to 1000 volt devices.) Product Characteristics Materials Product Marking CG/CG2 Series LS, Axial: Device: Nickel Plated 2–5 Microns Lead Wires: Tin Plated 17.5 ± 12.5 Microns Construction: Ceramic Insulator Core: Device: Tin Plated 17.5 ± 12.5 Microns. Construction: Ceramic Insulator MS: Device: Dull Tin Plated 7–9 Microns Construction: Ceramic Insulator Glow to arc transition current < 0.5Amps Glow Voltage 60-160 Volts Storage and Operational Temperature -40 to +90 Maximum Follow On Current1 230 Volts r.m.s, 200 Amps. (800V and 1000V devices tested to UL1449 3rd edition) LF Logo, Voltage and date code; Black in positive print 28 Revised: November 10, 2009 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. Customer should verify actual device performance in their specific applications. Gas Discharge Tube (GDT) Products CG/CG2 Series Device Dimensions Leaded 'L' Type Straight Axial Devices PROFILE VIEW Leaded 'LS' Type Shaped Lead Devices TOP VIEW PROFILE VIEW TOP VIEW 6.07 ± 0.3 [0.239 ± 0.012] 8.10 Max. [0.319 DIA Max.] 0.81DIA. TYP. [0.032] 8.10DIA. MAX. [0.319] 8.40 ± 0.3 [0.331 ± 0.012] 6.07 ± 0.15 [0.239 ± 0.006] 0.004 62 ± 2 8.4 ± 0.3 [0.331 ± 0.012] 0.40 ± 0.03 [0.0157 ± 0.0012] 2 Surfaces 9.85 ± 0.30 [0.388 ± 0.012] 0.80 [0.032] 11.15 ± 0.30 [0.439 ± 0.012] SOLDER PAD LAYOUT Core Devices 9.85 [0.388] TOP VIEW PROFILE VIEW 8.10 Max. [0.032 Max.] 8.60 [0.339] SEMI–PROFILE VIEW 6.07 ± 0.15 [0.239 ± 0.0059] 1.80 [0.071] 5.89 [0.232] 8.10 Max. 11.65 [0.459] 'MS' Type Devices 0.47 ± 0.1 [0.019 ± 0.0039] TOP VIEW PROFILE VIEW 8.30 ± 0.1 [0.327 ± 0.0039] 4 ± 0.2 [0.157 ± 0.0079] SEMI–PROFILE VIEW 5.58 [0.220] 6.05 ± 0.2 [0.238 ± 0.0079] ø8.30±0.1 R5.29 [R0.208] 2 9] 0. 7 ± .00 30 0 9. 6 ± 6 .3 [0 0.47 ± 0.1 [0.019 ± 0.0039] SOLDER PAD LAYOUT 2.29 [0.090] 8.71 [0.343] 5.89 [0.232] ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. Customer should verify actual device performance in their specific applications. 29 Revised: November 10, 2009 CG/CG2 Series Gas Discharge Tube (GDT) Products CG/CG2 Series Soldering Parameters - Reflow Soldering (Surface Mount Devices) Pre Heat Pb – Free assembly Critical Zone TL to TP Ramp-up - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (Min to Max) (ts) 60 – 180 secs TL TS(max) Average ramp up rate (Liquidus Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 5°C/second max Reflow tP TP - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Temperature Reflow Condition tL Ramp-down Preheat TS(min) tS 25 Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 10 – 30 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C time to peak temperature (t 25ºC to peak) Time Soldering Parameters - Wave Soldering (Thru-Hole Devices) Recommended Process Parameters: 280 Wave Parameter 260 240 Lead-Free Recommendation Preheat: 220 (Depends on Flux Activation Temperature) 200 180 160 140 (Typical Industry Recommendation) Temperature Minimum: 100° C Temperature Maximum: Preheat Time: 150° C 60-180 seconds 120 100 Solder Pot Temperature: 280° C Maximum Solder Dwell Time: 2-5 seconds 80 60 40 240 230 220 210 200 190 180 170 160 150 140 130 120 110 90 100 80 70 60 50 40 20 0 0 30 20 10 Temperature (°C) - Measured on bottom side of board 300 Time (Seconds) Cooling Time Preheat Time Dwell Time Soldering Parameters - Hand Soldering Solder Iron Temperature: 350° C +/- 5°C Heating Time: 5 seconds max. CG/CG2 Series 30 Revised: November 10, 2009 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. Customer should verify actual device performance in their specific applications. Gas Discharge Tube (GDT) Products CG/CG2 Series Packaging Dimensions For 'L' Type Axial Lead Items <1.2 Max. Lead Bend 254.0 - 356.0 [10.0 - 14.0] <0.8 Max Direction of Feed 0.0 15] 52.4 [2.063] 22.8 [0.898] 6.4 [0.252] 5.0 Pitch [0.197] Core and 'MS' Type Items 275.0 [10.83] 10x4 ± 0.1 = 40 ± 0.2 [10 x 0.157 ± 0.004 = 1.575 ± 0.008] 1.75 ± 0.1 [0.069 ± 0.004] 0.4 ± 0.05 [0.016 ± 0.002] 100.0 [3.94] 4 ± 0.1 [0.157 ± 0.004] 1.5 DIA. MAX. [0.059] 76.0 [2.99] 25.0 [0.98] 7.5 ± 0.1 [0.295 ± 0.004] 8.5 ± 0.1 [0.335 ± 0.004] 17.7 [0.697] 16 +0.3 / -0.1 [0.630 +0.012 / -0.004] Direction of Feed 1.5 DIA. MAX. [0.059] 8.6 ± 0.1 [0.339 ± 0.004] 12 ± 0.1 [0.472 ± 0.004] For 'LS' Type Shaped Lead Items 275.0 [10.82] 10x4 ± 0.1 = 40 ± 0.2 [10x.157 ± 0.004 = 1.575 ± 0.008] 1.75 ± 0.1 [0.069 ± 0.004] 0.5 ± 0.05 [0.020 ± 0.002] 1.9 [0.075] 11.75 ± 0.1 [0.463 ± 0.004] 1.5 DIA. MAX. [0.059] 100.0 [3.93] 4 ± 0.1 [0.157 ± 0.004] 76.0 [2.99] 25.0 [0.98] 11.5 ± 0.1 [0.453 ± 0.004] 8 ± 0.1 [0.315 ± 0.004] 24 +0.3 / -0.1 [0.945 +0.019 / -0.004] 25.7 [1.01] Direction of Feed 0.5 ± 0.01 [0.020 ± 0.004] 9 ± 0.1 [0.354 ± 0.004] 1.5 DIA. MAX. [0.059] ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. Customer should verify actual device performance in their specific applications. 16 ± 0.1 [0.630 ± 0.004] 31 Revised: November 10, 2009 CG/CG2 Series Gas Discharge Tube (GDT) Products CG/CG2 Series Part Numbering System and Ordering Information CG2 XXX XX * XX Series CG -- for 75, 90, or 110V CG2 -- for 145V to 1000V Breakdown Voltage 75 90 110 145 230 250 300 350 470 600 800 1000 Lead Option Code Examples: CG75 -- A non-leaded 75V device CG2230L -- A leaded 230V device CG2800LTR -- A leaded 800V device, tape-and-reel (per EIA standard RS-296-D) Notes: CG/CG2 devices with other breakdown voltages in the 75-1000 V range are available upon request. (Blank) = No Leads / Core L = Straight Leads LS = Shaped Leads MS = Surface Mount Option Code* SN = denotes different DC Breakover Voltage Limit. Please refer to Electrical Characteristics table for additional information. Packaging Option Code (Blank) = No Leads / Core, Bulk Bag - 400 pcs L(Blank) = Straight Lead, Tray - 50 pcs LTR = Straight Lead, Tape & Reel per EIA RS-296-E - 500 per reel LTE = Straight Lead, Tape & Reel per IEC 60286-1 - 500 per reel LSTR = Shaped Lead (see LS dimensions), Tape & Reel - 500 per reel CG/CG2 Series 32 Revised: November 10, 2009 ©2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. Customer should verify actual device performance in their specific applications.