ISL3330, ISL3331 ® Data Sheet May 20, 2008 3.3V, ±15kV ESD Protected, Dual Protocol (RS-232/RS-485) Transceivers These devices are BiCMOS interface ICs that are user configured as either a single RS-422/RS-485 differential transceiver, or as a dual (2 Tx, 2 Rx) RS-232 transceiver. FN6361.0 Features • User Selectable RS-232 or RS-485/RS-422 Interface Port (Two RS-232 Transceivers or One RS-485/RS-422 Transceiver) • Operates From a Single 3.3V Supply In RS-232 mode, the on-board charge pump generates RS-232 compliant ±5V Tx output levels, from a supply as low as 3.15V. Four small 0.1µF capacitors are required for the charge pump. The transceivers are RS-232 compliant, with the Rx inputs handling up to ±25V. • ±15kV (HBM) ESD Protected Bus Pins (RS-232 or RS-485) In RS-485 mode, the transceivers support both the RS-485 and RS-422 differential communication standards. The RS-485 receiver features "full failsafe" operation, so the Rx output remains in a high state if the inputs are open or shorted together. The RS-485 transmitter supports up to three data rates, two of which are slew rate limited for problem free communications. The charge pump disables in RS-485 mode, thereby saving power, minimizing noise, and eliminating the charge pump capacitors. • Pb-Free (RoHS Compliant) Both RS-232/RS-485 modes feature loopback and shutdown functions. The loopback mode internally connects the Tx outputs to the corresponding Rx input, which facilitates the implementation of board level self test functions. The outputs remain connected to the loads during loopback, where connection problems (e.g., shorted connectors or cables) can be detected. The shutdown mode disables the Tx and Rx outputs, disables the charge pump if in RS-232 mode, and places the IC in a low current (30µA) mode. The ISL3331 is a QFN packaged device that offers additional functionality, including a lower speed and edge rate option (115kbps) for EMI sensitive designs, or to allow longer bus lengths. It also features a logic supply voltage pin (VL) that sets the VOH level of logic outputs, and the switching points of logic inputs, to be compatible with another supply voltage in mixed voltage systems. The QFN's choice of active high or low Rx enable pins increases design flexibility, allowing Tx/Rx direction control via a single signal by connecting DEN and RXEN together. For a dual port version of these devices, please see the ISL3332/ISL3333 data sheet. • 5V Tolerant Logic Inputs • True Flow-Through Pinouts Simplify Board Layouts • Full Failsafe (Open/Short) Rx in RS-485/RS-422 Mode • Loopback Mode Facilitates Board Self Test Functions • User Selectable RS-485 Data Rates . . . . . . . . . . 20Mbps - Slew Rate Limited. . . . . . . . . . . . . . . . . . . . . . . 460kbps - Slew Rate Limited (ISL3331 Only) . . . . . . . . . . 115kbps • Fast RS-232 Data Rate . . . . . . . . . . . . . . . Up to 400kbps • Low Current Shutdown Mode. . . . . . . . . . . . . . . . . . 30µA • QFN Package Saves Board Space (ISL3331 Only) • Logic Supply Pin (VL) Eases Operation in Mixed Supply Systems (ISL3331 Only) Applications • Gaming Applications (e.g., Slot machines) • Single Board Computers • Factory Automation • Security Networks • Industrial/Process Control Networks • Level Translators (e.g., RS-232 to RS-422) • Point of Sale Equipment Related Literature • Application Note AN1401 “Implementing a Three Pin, Half-Duplex, Dual Protocol Interface” TABLE 1. SUMMARY OF FEATURES PART NUMBER NO. OF PORTS PACKAGE OPTIONS ISL3330 1 20 Ld SSOP ISL3331 1 40 Ld QFN (6mmx6mm) 1 RS-485 DATA RATE (bps) RS-232 DATA RATE (kbps) VL PIN? ACTIVE H or L Rx ENABLE? LOW POWER SHUTDOWN? 20M, 460k 400 No H Yes 20M, 460k, 115k 400 Yes Both Yes CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2008. All Rights Reserved. All other trademarks mentioned are the property of their respective owners. ISL3330, ISL3331 Ordering Information PART NUMBER (NOTE) PART MARKING TEMP. RANGE (°C) PACKAGE (Pb-Free) PKG. DWG. # ISL3330IAZ 3330 IAZ -40 to +85 20 Ld SSOP M20.209 ISL3330IAZ-T* 3330 IAZ -40 to +85 20 Ld SSOP (Tape and Reel) M20.209 ISL3331IRZ ISL3331IRZ -40 to +85 40 Ld 6x6 QFN L40.6x6 ISL3331IRZ-T* ISL3331IRZ -40 to +85 40 Ld 6x6 QFN (Tape and Reel) L40.6x6 *Please refer to TB347 for details on reel specifications. NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. Pinouts ISL3330 (20 LD SSOP) TOP VIEW C1+ 1 20 C2+ C1- 2 19 C2- V+ 3 18 VCC A 4 17 RA B 5 16 RB Y 6 15 DY Z 7 14 DZ/SLEW 13 ON 485/232 8 DEN 9 12 RXEN GND 10 11 V- 2 NC NC C1- C1+ C2+ C2- VCC NC NC VL ISL3331 (40 LD QFN) TOP VIEW 40 39 38 37 36 35 34 33 32 31 4 27 DZ/SLEW Z 5 26 NC NC 6 25 NC NC 7 24 NC NC 8 23 NC NC 9 22 NC NC 10 21 ON 11 12 13 14 15 16 17 18 19 20 RXEN Y V- 28 DY NC 3 RXEN B GND 29 RB GND 2 SPB A NC 30 RA DEN 1 485/232 V+ FN6361.0 May 20, 2008 ISL3330, ISL3331 TABLE 2. ISL3330 FUNCTION TABLE RECEIVER OUTPUTS CHARGE PUMPS (Note 1) LOOPBACK (Note 2) MODE RA RB Y Z DRIVER SPEED (Mbps) N/A High-Z High-Z High-Z High-Z - ON OFF RS-232 1 N/A High-Z High-Z ON ON 0.46 ON OFF RS-232 1 0 N/A ON ON High-Z High-Z - ON OFF RS-232 1 1 1 N/A ON ON ON ON 0.46 ON OFF RS-232 0 0 0 1 N/A High-Z High-Z ON High-Z 0.46 ON OFF RS-232 0 0 1 0 N/A High-Z ON ON High-Z 0.46 ON OFF RS-232 0 0 1 1 N/A ON ON ON ON 0.46 ON ON RS-232 X 0 0 0 X High-Z High-Z High-Z High-Z - OFF OFF Shutdown 1 1 0 0 X High-Z High-Z High-Z High-Z - OFF OFF RS-485 1 X 0 1 1/0 High-Z High-Z ON ON 20/0.46 OFF OFF RS-485 1 X 1 0 X ON High-Z High-Z High-Z - OFF OFF RS-485 1 1 1 1 1/0 ON High-Z ON ON 20/0.46 OFF OFF RS-485 1 0 1 1 1/0 ON High-Z ON ON 20/0.46 OFF ON RS-485 INPUTS 485/232 ON RXEN 0 1 0 0 0 1 0 0 1 0 DEN SLEW DRIVER OUTPUTS NOTES: 1. Charge pumps are on if in RS-232 mode and ON or DEN or RXEN are high. 2. Loopback is enabled when ON = 0, and DEN = RXEN = 1. ISL3330 Truth Tables RS-485 TRANSMITTING MODE RS-232 TRANSMITTING MODE INPUTS (ON = 1) INPUTS (ON = 1) OUTPUTS OUTPUTS 485/232 DEN DY DZ Y Z 0 1 0 0 1 1 0 1 0 1 1 0 0 1 1 0 0 1 0 1 1 1 0 0 0 0 X X High-Z High-Z 485/232 DEN DY SLEW Y Z DATA RATE (Mbps) 1 1 0 1 1 0 20 1 1 1 1 0 1 20 1 1 0 0 1 0 0.46 1 1 1 0 0 1 0.46 1 0 X X - RS-485 RECEIVING MODE RS-232 RECEIVING MODE INPUTS (ON = 1) INPUTS (ON = 1) OUTPUT 485/232 RXEN A B RA RB 0 1 0 0 1 1 0 1 0 1 1 0 0 1 1 0 0 1 0 1 1 1 0 0 0 1 Open Open 1 1 0 0 X X High-Z High-Z 3 High-Z High-Z OUTPUT 485/232 RXEN B-A RA RB 1 1 ≥ -40mV 1 High-Z 1 1 ≤ -200mV 0 High-Z 1 1 Open or Shorted together 1 High-Z 1 0 X High-Z High-Z FN6361.0 May 20, 2008 ISL3330, ISL3331 TABLE 3. ISL3331 FUNCTION TABLE RECEIVER OUTPUTS INPUTS DRIVER OUTPUTS Z DRIVER DATA RATE (Mbps) CHARGE PUMPS (Note 3) MODE 485/232 ON RXEN AND/OR RXEN 0 1 1 and 0 0 N/A N/A High-Z High-Z High-Z High-Z - ON RS-232 0 1 1 and 0 1 N/A N/A High-Z High-Z ON ON 0.46 ON RS-232 0 1 0 or 1 0 N/A N/A ON ON High-Z High-Z - ON RS-232 0 1 0 or 1 1 N/A N/A ON ON ON ON 0.46 ON RS-232 0 0 1 and 0 1 N/A N/A High-Z High-Z ON High-Z 0.46 ON RS-232 0 0 0 or 1 0 N/A N/A High-Z ON ON High-Z 0.46 ON RS-232 0 0 0 or 1 1 N/A N/A ON ON ON ON 0.46 ON RS-232 (Note 4) X 0 1 and 0 0 X X High-Z High-Z High-Z High-Z - OFF Shutdown 1 1 1 and 0 0 X X High-Z High-Z High-Z High-Z - OFF RS-485 1 X 1 and 0 1 0 1/0 High-Z High-Z ON ON 0.46/0.115 OFF RS-485 1 X 1 and 0 1 1 X High-Z High-Z ON ON 20 OFF RS-485 1 X 0 or 1 0 X X ON High-Z High-Z High-Z - OFF RS-485 1 1 0 or 1 1 0 1/0 ON High-Z ON ON 0.46/0.115 OFF RS-485 1 1 0 or 1 1 1 X ON High-Z ON ON 20 OFF RS-485 1 0 0 or 1 1 0 1/0 ON High-Z ON ON 0.46/0.115 OFF RS-485 (Note 4) 1 0 0 or 1 1 1 X ON High-Z ON ON 20 OFF RS-485 (Note 4) DEN SLEW SPB RA RB Y NOTES: 3. Charge pumps are on if in RS-232 mode and ON or DEN or RXEN is high, or RXEN is low. 4. Loopback is enabled when ON = 0, and DEN = 1, and (RXEN = 1 or RXEN = 0). ISL3331 Truth Tables RS-485 TRANSMITTING MODE RS-232 TRANSMITTING MODE INPUTS (ON = 1) INPUTS (ON = 1) OUTPUTS OUTPUTS DATA 485/232 DEN SLEW SPB DY Y Z Mbps 485/232 DEN DY DZ Y Z 1 1 0 0 0/1 1/0 0/1 0.115 0 1 0 0 1 1 1 1 0 1 0/1 1/0 0/1 0.460 0 1 0 1 1 0 1 1 1 X 0/1 1/0 0/1 20 0 1 1 0 0 1 1 0 X X X 0 1 1 1 0 0 0 0 X X High-Z High-Z High-Z High-Z RS-485 RECEIVING MODE INPUTS (ON = 1) RS-232 RECEIVING MODE INPUTS (ON = 1) 485/232 RXEN and/or RXEN OUTPUT 485/232 RXEN and/or RXEN A B RA RB 0 0 or 1 0 0 1 1 0 0 or 1 0 1 1 0 0 0 or 1 1 0 0 1 0 0 or 1 1 1 0 0 0 0 or 1 Open Open 1 1 0 1 and 0 X X 4 - OUTPUT B-A RA RB 1 0 or 1 ≥ -40mV 1 High-Z 1 0 or 1 ≤ -200mV 0 High-Z 1 0 or 1 Open or Shorted together 1 High-Z 1 1 and 0 X High-Z High-Z High-Z High-Z FN6361.0 May 20, 2008 ISL3330, ISL3331 Pin Descriptions PIN MODE FUNCTION 485/232 BOTH Interface Mode Select input. High for RS-485 Mode and low for RS-232 Mode. DEN BOTH Driver output enable. The driver outputs, Y and Z, are enabled by bringing DEN high. They are high impedance when DEN is low. GND BOTH Ground connection. NC BOTH No Connection. ON BOTH In RS-232 mode only, ON high enables the charge pumps. ON low, with DEN and RXEN low (and RXEN high if QFN), turns off the charge pumps (in RS-232 mode), and in either mode places the device in low power shutdown. In both modes, when ON is low, and DEN is high, and RXEN is high or RXEN is low, loopback is enabled. RXEN BOTH Receiver output enable. Rx is enabled when RXEN is high; Rx is high impedance when RXEN is low and, if using the QFN package, RXEN is high. When using the QFN and the active high Rx enable function, RXEN should be high or floating. RXEN BOTH Active low receiver output enable. Rx is enabled when RXEN is low; Rx is high impedance when RXEN is high and RXEN is low. (i.e., to use active low Rx enable function, tie RXEN to GND). For single signal Tx/Rx direction control, connect RXEN to DEN. Internally pulled high. (QFN only) VCC BOTH System power supply input (3.3V). VL BOTH Logic-Level Supply. All TTL/CMOS inputs and outputs are powered by this supply. QFN logic input pins that are externally tied high in an application, should use the VL supply for the high voltage level. (QFN only) A RS-232 Receiver input with ±15kV ESD protection. A low on A forces RA high; A high on A forces RA low. RS-485 Inverting receiver input with ±15kV ESD protection. B RS-232 Receiver input with ±15kV ESD protection. A low on B forces RB high; A high on B forces RB low. RS-485 Noninverting receiver input with ±15kV ESD protection. DY RS-232 Driver input. A low on DY forces output Y high. Similarly, a high on DY forces output Y low. RS-485 Driver input. A low on DY forces output Y high and output Z low. Similarly, a high on DY forces output Y low and output Z high. DZ/SLEW RS-232 Driver input. A low on DZ forces output Z high. Similarly, a high on DZ forces output Z low. RS-485 Slew rate control. With the SLEW pin high, the drivers run at the maximum slew rate (20Mbps). With the SLEW pin low, the drivers run at a reduced slew rate (460kbps). The QFN version works in conjunction with SPB to select one of three RS-485 data rates. Internally pulled high in RS-485 mode. SPB RA RS-485 Speed control. Works in conjunction with the SLEW pin to select the 20Mbps, 460kbps or 115kbps RS-485 data rate. Internally pulled high. (QFN only) RS-232 Receiver output. RS-485 Receiver output: If B > A by at least -40mV, RA is high; If B < A by -200mV or more, RA is low; RA = High if A and B are unconnected (floating) or shorted together (i.e., full fail-safe). RB RS-232 Receiver output. RS-485 Not used. Output is high impedance, and unaffected by RXEN and RXEN. Y RS-232 Driver output with ±15kV ESD protection. RS-485 Inverting driver output with ±15kV ESD protection. Z RS-232 Driver output with ±15kV ESD protection. RS-485 Noninverting driver output with ±15kV ESD protection. C1+ RS-232 External capacitor (voltage doubler) is connected to this lead. Not needed in RS-485 Mode. C1- RS-232 External capacitor (voltage doubler) is connected to this lead. Not needed in RS-485 Mode. C2+ RS-232 External capacitor (voltage inverter) is connected to this lead. Not needed in RS-485 Mode. C2- RS-232 External capacitor (voltage inverter) is connected to this lead. Not needed in RS-485 Mode. V+ RS-232 Internally generated positive RS-232 transmitter supply (+5.5V). C3 not needed in RS-485 Mode. V- RS-232 Internally generated negative RS-232 transmitter supply (-5.5V). C4 not needed in RS-485 Mode. 5 FN6361.0 May 20, 2008 ISL3330, ISL3331 / Typical Operating Circuits +3.3V + +3.3V 0.1µF 1 C1 0.1µF + C2 0.1µF + 2 20 19 C1+ VCC V+ C1C2+ C2- + C3 0.1µF C4 0.1µF + 17 R 5kΩ 5 B 3 V- 11 4 A 16 15 D 7 Z C2 0.1µF + 20 14 DZ D 7 VCC ON 485/232 13 485/232 GND C2 0.1µF A B 20 + 19 C1+ Z VCC V+ C1C2+ 3 + C3 0.1µF V- 11 C2- C4 0.1µF + 4 17 R 2 20 + 19 A 4 B 5 18 VCC V+ C1C2+ D DY 17 R LB Rx Y 14 3 V- 11 C2- RB Z C4 0.1µF + RA VCC 16 6 15 D 7 + C3 0.1µF 12 SLEW 14 9 VCC + C1+ RXEN 15 RB DY SLEW 9 VCC DEN 8 1 C2 0.1µF RA 0.1µF VCC 16 6 VCC + C1 0.1µF 12 7 13 RS-232 MODE WITH LOOPBACK 18 5 ON NOTE: PINOUT FOR SSOP RXEN Y DZ 10 +3.3V 0.1µF 2 14 D VCC DY DEN 8 VCC RS-232 MODE WITHOUT LOOPBACK + 15 9 NOTE: PINOUT FOR SSOP 1 RB 12 RXEN 10 C1 0.1µF 16 R 6 Z C4 0.1µF + RA LB Rx Y + C3 0.1µF 17 5kΩ DEN + 3 V- 11 R GND +3.3V V+ C2- 5 9 8 19 VCC C1C2+ 4 B1 DY D VCC 2 VCC RXEN 6 + 18 C1+ 5kΩ RB 12 0.1µF 1 C1 0.1µF A1 RA R 5kΩ Y + 18 ON 485/232 13 GND 10 NOTE: PINOUT FOR SSOP RS-485 MODE WITHOUT LOOPBACK 6 VCC VCC DEN 8 485/232 GND ON 13 10 NOTE: PINOUT FOR SSOP RS-485 MODE WITH LOOPBACK FN6361.0 May 20, 2008 ISL3330, ISL3331 Absolute Maximum Ratings (TA = +25°C) Thermal Information VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V VL (QFN Only) . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VCC + 0.5V Input Voltages All Except A,B. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V Input/Output Voltages A, B (Any Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . -25V to +25V Y, Z (Any Mode, Note 5) . . . . . . . . . . . . . . . . . . . -12.5V to +12.5V RA, RB (Non-QFN Package) . . . . . . . . . . . -0.5V to (VCC + 0.5V) RA, RB (QFN Package) . . . . . . . . . . . . . . . . -0.5V to (VL + 0.5V) Output Short Circuit Duration Y, Z, RA, RB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indefinite ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) 20 Ld SSOP Package (Note 6) . . . . . . 55 N/A 40 Ld QFN Package (Notes 7, 8). . . . . 31 2.5 Maximum Junction Temperature (Plastic Package) . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . -65°C to +150°C Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 5. One output at a time, IOUT ≤ 100mA for ≤ 10 minutes. 6. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 7. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 8. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. Electrical Specifications Test Conditions: VCC = 3.15V to 3.45V, C1 to C4 = 0.1µF, VL = VCC (for QFN only), Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C (Note 9) PARAMETER SYMBOL TEST CONDITIONS TEMP MIN (°C) (Note 15) TYP MAX (Note 15) UNITS DC CHARACTERISTICS - RS-485 DRIVER (485/232 = VCC) Driver Differential VOUT (no load) VOD1 Driver Differential VOUT (with load) VOD2 Change in Magnitude of Driver Differential VOUT for Complementary Output States Driver Common-Mode VOUT Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States Full - - VCC V R = 50Ω (RS-422) (Figure 1) Full 2 2.3 - V R = 27Ω (RS-485) (Figure 1) Full 1.5 2 5 V VOD3 RD = 60Ω, R = 375Ω, VCM = -7V to 12V (Figure 1) Full 1.5 - 5 V ΔVOD R = 27Ω or 50Ω (Figure 1) Full - 0.01 0.2 V VOC R = 27Ω or 50Ω (Figure 1) Full - - 3.0 V ΔVOC R = 27Ω or 50Ω (Figure 1) Full - 0.01 0.2 V Full 35 - 250 mA VOUT = 12V Full - - 150 µA VOUT = -7V Full -150 - - µA Driver Short-Circuit Current, VOUT = High or Low IOS -7V ≤ (VY or VZ) ≤ 12V (Note 11) Driver Three-State Output Leakage Current (Y, Z) IOZ Outputs Disabled, VCC = 0V or 3.45V DC CHARACTERISTICS - RS-232 DRIVER (485/232 = 0V) Driver Output Voltage Swing VO All TOUTS Loaded with 3kΩ to Ground Full ±5.0 - - V Driver Output Short-Circuit Current IOS VOUT = 0V Full -60 - 60 mA 2.2 - V DC CHARACTERISTICS - LOGIC PINS (i.e., DRIVER AND CONTROL INPUT PINS) Input High Voltage 7 VIH1 VL = VCC if QFN Full VIH2 2.7V ≤ VL < 3.0V (QFN Only) Full 2 - V VIH3 2.3V ≤ VL < 2.7V (QFN Only) Full 1.6 - V VIH4 1.6V ≤ VL < 2.3V (QFN Only) Full 0.7*VL - V VIH5 1.2V ≤ VL < 1.6V (QFN Only) 25 - - V 0.7*VL FN6361.0 May 20, 2008 ISL3330, ISL3331 Electrical Specifications Test Conditions: VCC = 3.15V to 3.45V, C1 to C4 = 0.1µF, VL = VCC (for QFN only), Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C (Note 9) (Continued) PARAMETER SYMBOL Input Low Voltage Input Current TEST CONDITIONS TEMP MIN (°C) (Note 15) TYP MAX (Note 15) UNITS VIL1 VL = VCC if QFN Full - - 0.8 V VIL2 VL ≥ 2.7V (QFN Only) Full - - 0.8 V VIL3 2.3V ≤ VL < 2.7V (QFN Only) Full - - 0.7 V - VIL4 1.6V ≤ VL < 2.3V (QFN Only) Full - 0.35*VL V VIL5 1.3V ≤ VL < 1.6V (QFN Only) 25 0.35*VL - V VIL6 1.2V ≤ VL < 1.3V (QFN Only) 25 0.25*VL - V IIN1 Except SLEW, RXEN (QFN), and SPB (QFN) Full -2 - 2 µA IIN2 SLEW (Note 13), RXEN (QFN), and SPB (QFN) Full -25 - 25 µA -7V ≤ VCM ≤ 12V, Full Failsafe Full -0.2 - -0.04 V VCM = 0V 25 - 35 - mV VIN = 12V Full - - 0.8 mA VIN = -7V Full -0.64 - - mA Full 15 - - kΩ DC CHARACTERISTICS - RS-485 RECEIVER INPUTS (485/232 = VCC) Receiver Differential Threshold Voltage VTH ΔVTH Receiver Input Hysteresis Receiver Input Current (A, B) IIN Receiver Input Resistance RIN VCC = 0V or 3.15V to 3.45V -7V ≤ VCM ≤ 12V, VCC = 0 (Note 12), or 3.15V ≤ VCC ≤ 3.45V DC CHARACTERISTICS - RS-232 RECEIVER INPUTS (485/232 = GND) Receiver Input Voltage Range VIN Full -25 - 25 V Receiver Input Threshold VIL Full - 1.1 0.8 V VIH Full 2.4 1.6 - V Receiver Input Hysteresis ΔVTH 25 - 0.5 - V Receiver Input Resistance RIN Full 3 5 7 kΩ VIN = ±15V, VCC Powered-Up (Note 12) DC CHARACTERISTICS - RECEIVER OUTPUTS (485 OR 232 MODE) Receiver Output High Voltage VOH1 IO = -1.5mA (VL = VCC if QFN) Full VCC - 0.4 - V VOH2 IO = -100µA, VL ≥ 1.2V (QFN Only) Full VL - 0.1 - V VOH3 IO = -500µA, VL = 1.5V (QFN Only) Full 1.2 - V VOH4 IO = -150µA, VL = 1.2V (QFN Only) Full 1.0 - V Receiver Output Low Voltage VOL IO = 5mA Full - 0.2 0.4 V Receiver Short-Circuit Current IOSR 0V ≤ VO ≤ VCC Full 7 - 85 mA Receiver Three-State Output Current IOZR Output Disabled, 0V ≤ VO ≤ VCC (or VL for QFN) Full - - ±10 µA ICC232 485/232 = 0V, ON = VCC Full - 3.7 7 mA ICC485 485/232 = VCC, ON = VCC Full - 1.3 5 mA ISHDN232 ON = DEN = RXEN = 0V (RXEN = SPB = VL if QFN) Full - 10 30 µA ISHDN485 ON = DEN = RXEN = SLEW = 0V (RXEN = VL, SPB = 0V if QFN) Full - 30 60 µA POWER SUPPLY CHARACTERISTICS No-Load Supply Current (Note 10) Shutdown Supply Current ESD CHARACTERISTICS Bus Pins (A, B, Y, Z) Any Mode Human Body Model 25 - ±15 - kV All Other Pins Human Body Model 25 - ±2.5 - kV Machine Model 25 - ±200 - V 8 FN6361.0 May 20, 2008 ISL3330, ISL3331 Electrical Specifications Test Conditions: VCC = 3.15V to 3.45V, C1 to C4 = 0.1µF, VL = VCC (for QFN only), Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C (Note 9) (Continued) PARAMETER SYMBOL TEST CONDITIONS TEMP MIN (°C) (Note 15) TYP MAX (Note 15) UNITS RS-232 DRIVER and RECEIVER SWITCHING CHARACTERISTICS (485/232 = 0V, ALL VERSIONS AND SPEEDS) Driver Output Transition Region Slew Rate SR Driver Output Transition Time tr, tf Driver Propagation Delay tDPHL CL ≥ 15pF Full - 20 30 V/µs CL ≤ 2500pF Full 4 12 - V/µs RL = 3kΩ, CL = 2500pF, 10% to 90% Full 0.22 1.2 3.1 µs RL = 3kΩ, CL = 1000pF (Figure 6) Full - 1 2 µs Full - 1.2 2 µs tDPHL - tDPLH (Figure 6) Full - 300 450 ns 25 - 1200 - ns RL = 5kΩ, Measured at VOUT = ±3V 25 - 500 - ns VOUT = ±3.0V (Note 14) 25 - 25 - µs RL = 3kΩ, Measured From 3V to -3V or -3V to 3V tDPLH Driver Propagation Delay Skew tDSKEW Driver Enable Time tDEN Driver Disable Time tDDIS Driver Enable Time from Shutdown tDENSD Driver Maximum Data Rate DRD RL = 3kΩ, CL = 1000pF, One Transmitter Switching Full 250 400 - kbps Receiver Propagation Delay tRPHL CL = 15pF (Figure 7) Full - 40 120 ns Full - 60 120 ns tRPLH tRPHL - tRPLH (Figure 7) Full - 20 40 ns CL = 15pF Full 0.46 2 - Mbps tZL CL = 15pF, SW = VCC (Figure 5) Full - 18 - ns tZH CL = 15pF, SW = GND (Figure 5) Full - 18 - ns Receiver Disable from Output Low tLZ CL = 15pF, SW = VCC (Figure 5) Full - 22 - ns Receiver Disable from Output High tHZ CL = 15pF, SW = GND (Figure 5) Full - 22 - ns Receiver Propagation Delay Skew tRSKEW Receiver Maximum Data Rate DRR Receiver Enable to Output Low Receiver Enable to Output High Receiver Enable from Shutdown to Output Low tZLSHDN CL = 15pF, SW = VCC (Figure 5, Note 14) 25 - 60 - ns Receiver Enable from Shutdown to Output High tZHSHDN CL = 15pF, SW = GND (Figure 5, Note 14) 25 - 20 - ns RS-485 DRIVER SWITCHING CHARACTERISTICS (FAST DATA RATE (20Mbps), 485/232 = VCC, SLEW = VCC, ALL VERSIONS) tDLH, tDHL RDIFF = 54Ω, CL = 100pF (Figure 2) Driver Differential Input to Output Delay Driver Output Skew Driver Differential Rise or Fall Time Full 10 20 35 ns tSKEW RDIFF = 54Ω, CL = 100pF (Figure 2) Full - 2 10 ns tR, tF RDIFF = 54Ω, CL = 100pF (Figure 2) Full 3 20 30 ns Driver Enable to Output Low tZL CL = 100pF, SW = VCC (Figure 3) Full - 28 60 ns Driver Enable to Output High tZH CL = 100pF, SW = GND (Figure 3) Full - 39 60 ns Driver Disable from Output Low tLZ CL = 15pF, SW = VCC (Figure 3) Full - 30 60 ns Driver Disable from Output High tHZ CL = 15pF, SW = GND (Figure 3) Full - 25 60 ns Driver Enable from Shutdown to Output Low tZL(SHDN) RL = 500Ω, CL = 100pF, SW = VCC (Figure 3, Note 14) Full - 100 250 ns Driver Enable from Shutdown to Output High tZH(SHDN) RL = 500Ω, CL = 100pF, SW = GND (Figure 3, Note 14) Full - 290 375 ns Full 20 35 - Mbps Driver Maximum Data Rate fMAX RDIFF = 54Ω, CL = 100pF (Figure 2) RS-485 DRIVER SWITCHING CHARACTERISTICS (MEDIUM DATA RATE (460kbps), 485/232 = VCC, SLEW = 0V, SPB (QFN Only) = VCC, ALL VERSIONS) Driver Differential Input to Output Delay tDLH, tDHL RDIFF = 54Ω, CL = 100pF (Figure 2) Driver Output Skew Driver Differential Rise or Fall Time 9 Full 200 500 1000 ns tSKEW RDIFF = 54Ω, CL = 100pF (Figure 2) Full - 10 150 ns tR, tF RDIFF = 54Ω, CL = 100pF (Figure 2) Full 300 660 1100 ns FN6361.0 May 20, 2008 ISL3330, ISL3331 Electrical Specifications Test Conditions: VCC = 3.15V to 3.45V, C1 to C4 = 0.1µF, VL = VCC (for QFN only), Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C (Note 9) (Continued) PARAMETER SYMBOL TEST CONDITIONS TEMP MIN (°C) (Note 15) TYP MAX (Note 15) UNITS Driver Enable to Output Low tZL CL = 100pF, SW = VCC (Figure 3) Full - 42 100 ns Driver Enable to Output High tZH CL = 100pF, SW = GND (Figure 3) Full - 350 450 ns Driver Disable from Output Low tLZ CL = 15pF, SW = VCC (Figure 3) Full - 30 60 ns tHZ CL = 15pF, SW = GND (Figure 3) Full - 25 60 ns Driver Enable from Shutdown to Output Low tZL(SHDN) RL = 500Ω, CL = 100pF, SW = VCC (Figure 3, Note 14) Full - - 500 ns Driver Enable from Shutdown to Output High tZH(SHDN) RL = 500Ω, CL = 100pF, SW = GND (Figure 3, Note 14) Full - - 750 ns Full 460 2000 - kbps Driver Disable from Output High Driver Maximum Data Rate fMAX RDIFF = 54Ω, CL = 100pF (Figure 2) RS-485 DRIVER SWITCHING CHARACTERISTICS (SLOW DATA RATE (115kbps, QFN ONLY), 485/232 = VCC, SLEW = SPB = GND) Driver Differential Input to Output Delay Driver Output Skew Driver Differential Rise or Fall Time tDLH, tDHL RDIFF = 54Ω, CL = 100pF (Figure 2) Full 800 1600 2500 ns tSKEW RDIFF = 54Ω, CL = 100pF (Figure 2) Full - 250 500 ns tR, tF RDIFF = 54Ω, CL = 100pF (Figure 2) Full 1000 1700 3100 ns Driver Enable to Output Low tZL CL = 100pF, SW = VCC (Figure 3) Full - 45 100 ns Driver Enable to Output High tZH CL = 100pF, SW = GND (Figure 3) Full - 910 1200 ns Driver Disable from Output Low tLZ CL = 15pF, SW = VCC (Figure 3) Full - 35 60 ns Driver Disable from Output High tHZ CL = 15pF, SW = GND (Figure 3) Full - 29 60 ns Driver Enable from Shutdown to Output Low tZL(SHDN) RL = 500Ω, CL = 100pF, SW = VCC (Figure 3, Note 14) Full - - 800 ns Driver Enable from Shutdown to Output High tZH(SHDN) RL = 500Ω, CL = 100pF, SW = GND (Figure 3, Note 14) Full - - 1500 ns Full 115 800 - kbps Full 20 45 70 ns Full - 3 10 ns Driver Maximum Data Rate fMAX RDIFF = 54Ω, CL = 100pF (Figure 2) RS-485 RECEIVER SWITCHING CHARACTERISTICS (485/232 = VCC, ALL VERSIONS AND SPEEDS) tPLH, tPHL (Figure 4) Receiver Input to Output Delay Receiver Skew | tPLH - tPHL | tSKEW (Figure 4) Receiver Maximum Data Rate fMAX Full 20 40 - Mbps Receiver Enable to Output Low tZL CL = 15pF, SW = VCC (Figure 5) Full - 15 60 ns Receiver Enable to Output High tZH CL = 15pF, SW = GND (Figure 5) Full - 15 60 ns Receiver Disable from Output Low tLZ CL = 15pF, SW = VCC (Figure 5) Full - 20 60 ns tHZ CL = 15pF, SW = GND (Figure 5) Full - 20 60 ns Receiver Enable from Shutdown to Output Low tZLSHDN CL = 15pF, SW = VCC (Figure 5, Note 14) Full - 500 900 ns Receiver Enable from Shutdown to Output High tZHSHDN CL = 15pF, SW = GND (Figure 5, Note 14) Full - 500 900 ns Receiver Disable from Output High NOTES: 9. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 10. Supply current specification is valid for loaded drivers when DEN = 0V. 11. Applies to peak current. See “Typical Performance Curves” beginning on page 19 for more information. 12. RIN defaults to RS-485 mode (>15kΩ) when the device is unpowered (VCC = 0V), or in SHDN, regardless of the state of the 485/232 pin. 13. The Slew pin has a pull-up resistor that enables only when in RS-485 mode (485/232 = VCC). 14. ON, RXEN, and DEN all simultaneously switched Low-to-High. 15. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. 10 FN6361.0 May 20, 2008 ISL3330, ISL3331 Test Circuits and Waveforms R DEN VCC Y DY RD D VOD Z + - VCM VOC R FIGURE 1. RS-485 DRIVER VOD AND VOC TEST CIRCUIT 3V DY 1.5V 1.5V 0V VCC CL = 100pF DEN tPHL VOH Y DY tPLH RDIFF D 50% OUT (Z) Z 50% VOL CL = 100pF tPLH tPHL SIGNAL GENERATOR VOH OUT (Y) 50% 50% VOL tDLH tDHL 90% DIFF OUT (Z - Y) 0V 10% 0V +VOD 90% tR 10% -VOD tF SKEW = |tPLH (Y OR Z) - tPHL (Z OR Y)| FIGURE 2B. MEASUREMENT POINTS FIGURE 2A. TEST CIRCUIT FIGURE 2. RS-485 DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES DEN DY SIGNAL GENERATOR Y 500Ω D Z VCC SW GND CL ENABLED DEN 1.5V 0V tZH tZH(SHDN) FOR SHDN TESTS, SWITCH ON AND DEN L- H SIMULTANEOUSLY PARAMETER OUTPUT RXEN DY SW CL (pF) tHZ Y/Z X 0/1 GND 15 tLZ Y/Z X 1/0 VCC 15 tZH Y/Z X 0/1 GND 100 tZL Y/Z X 1/0 VCC 100 tZH(SHDN) Y/Z 0 0/1 GND 100 tZL(SHDN) Y/Z 0 1/0 VCC 100 FIGURE 3A. TEST CIRCUIT 3V 1.5V OUT (Y, Z) OUTPUT HIGH tHZ VOH - 0.5V VOH 2.3V 0V tZL tZL(SHDN) OUT (Y, Z) tLZ VCC 2.3V OUTPUT LOW VOL + 0.5V V OL FIGURE 3B. MEASUREMENT POINTS FIGURE 3. RS-485 DRIVER ENABLE AND DISABLE TIMES 11 FN6361.0 May 20, 2008 ISL3330, ISL3331 Test Circuits and Waveforms (Continued) RXEN VCC 0V +1.5V 15pF A R B B RA 0V 0V -1.5V tPLH tPHL VCC SIGNAL GENERATOR RA 1.5V 1.5V 0V FIGURE 4B. MEASUREMENT POINTS FIGURE 4A. TEST CIRCUIT FIGURE 4. RS-485 RECEIVER PROPAGATION DELAY RXEN A SIGNAL GENERATOR 1kΩ RA R VCC SW B GND ENABLED RXEN 1.5V 3V 1.5V 0V 15pF tZH tZH(SHDN) FOR SHDN TESTS, SWITCH ON AND RXEN L- H SIMULTANEOUSLY OUTPUT HIGH RA tHZ VOH - 0.5V VOH 1.5V 0V PARAMETER DEN B (V) SW tHZ X +1.5 GND tLZ X -1.5 VCC tZL tZL(SHDN) tZH X +1.5 GND RA tZL X -1.5 VCC tZH(SHDN) 0 +1.5 GND tZL(SHDN) 0 -1.5 VCC tLZ VCC 1.5V OUTPUT LOW VOL + 0.5V V OL FIGURE 5B. MEASUREMENT POINTS FIGURE 5A. TEST CIRCUIT FIGURE 5. RS-485 RECEIVER ENABLE AND DISABLE TIMES VCC 3V DEN DY,Z DY,Z 1.5V CL Y, Z D 1.5V 0V tDPHL RL SIGNAL GENERATOR tDPLH VO+ OUT (Y,Z) 0V 0V VO- SKEW = |tDPHL - tDPLH| FIGURE 6B. MEASUREMENT POINTS FIGURE 6A. TEST CIRCUIT FIGURE 6. RS-232 DRIVER PROPAGATION DELAY VCC 3V RXEN A, B A, B R 50% 50% CL = 15pF RA, RB 0V tRPLH tRPHL SIGNAL GENERATOR VOH RA, RB 50% 50% SKEW = |tRPHL - tRPLH| FIGURE 7A. TEST CIRCUIT VOL FIGURE 7B. MEASUREMENT POINTS FIGURE 7. RS-232 RECEIVER PROPAGATION DELAY 12 FN6361.0 May 20, 2008 ISL3330, ISL3331 Detailed Description RS-422 networks use a two bus, full duplex structure for bidirectional communication, and the Rx inputs and Tx outputs (no tri-state required) connect to different busses, as shown in Figure 9. The Tx and Rx enables aren’t required, so connect RXEN and DEN to VCC through a 1kΩ resistor. The ISL333x port supports dual protocols: RS-485/RS-422, and RS-232. RS-485 and RS-422 are differential (balanced) data transmission standards for use in high speed (up to 20Mbps) networks, or long haul and noisy environments. The differential signalling, coupled with RS-485’s requirement for an extended common mode range (CMR) of +12V to -7V make these transceivers extremely tolerant of ground potential differences, as well as voltages induced in the cable by external fields. Both of these effects are real concerns when communicating over the RS-485/RS-422 maximum distance of 4000’ (1220m). It is important to note that the ISL333x don’t follow the RS-485 convention whereby the inverting I/O is labeled “B/Z”, and the non inverting I/O is “A/Y”. Thus, in the application diagrams, see Figures 8 and 9, the 333x A/Y (B/Z) pins connect to the B/Z (A/Y) pins of the generic RS-485/RS-422 ICs. Conversely, RS-485 is a true multipoint standard, which allows up to 32 devices (any combination of drivers that must be tri-statable and receivers) on each bus. Now bidirectional communication takes place on a single bus, so the Rx inputs and Tx outputs of a port connect to the same bus lines, as shown in Figure 8. A port set to RS-485/RS-422 mode includes one Rx and one Tx. See Application Note AN1401 for details about implementing a three pin, selectable RS-232/half-duplex RS-485 port. RS-232 is a point-to-point, singled ended (signal voltages referenced to GND) communication protocol targeting fairly short (< 150’, 46m) and low data rate (<1Mbps) applications. A port contains two transceivers (2 Tx and 2 Rx) in RS-232 mode. The RS-422 is typically a point-to-point (one driver talking to one receiver on a bus), or a point-to-multipoint (multidrop) standard that allows only one driver and up to 10 receivers on each bus. Because of the one driver per bus limitation, Protocol selection is handled via the 485/232 logic pin. + GENERIC 1/2 DUPLEX 485 XCVR +3.3V ISL333x R RE + DI +5V B 0.1µF + VCC GND VCC RO R B/Z RE Tx/Rx A/Y DEN DY GENERIC 1/2 DUPLEX 485 XCVR +5V D R 0.1µF A RXEN* DE 0.1µF VCC RA RO D DE B/Z Y RT RT DI D A/Y Z GND GND *QFN ONLY, CONNECT RXEN TO GND FIGURE 8. TYPICAL HALF DUPLEX RS-485 NETWORK + GENERIC 422 Rx (SLAVE) DY +5V R 0.1µF +5V VCC GND B D RXEN + VCC RT Z A Y B RO R Z RT A R 0.1µF A VCC DEN RA GENERIC FULL DUPLEX 422 XCVR (SLAVE) + ISL3330 (MASTER) RE 0.1µF +3.3V 1kΩ RO B D Y DI GND GND FIGURE 9. TYPICAL RS-422 NETWORK 13 FN6361.0 May 20, 2008 ISL3330, ISL3331 ISL333x Advantages These dual protocol ICs offer many parametric improvements vs those offered on competing dual protocol devices. Some of the major improvements are: • 3.3V Supply Voltage - Eliminates the 5V supply that powers just the interface IC • 15kV Bus Pin ESD - Eases board level requirements • Full Failsafe RS-485 Rx - Eliminates bus biasing • Selectable RS-485 Data Rate - Up to 20Mbps, or slew rate limited for low EMI and fewer termination issues • High RS-232 Data Rate - >250kbps • Lower Tx and Rx Skews - Wider, consistent bit widths • Lower ICC - Max ICC is 2x to -4x lower than competition • Flow-Thru Pinouts - Tx, Rx bus pins on one side/logic pins on the other, for easy routing to connector/UART • Packaging - Smaller (QFN) and Pb-free. RS-232 Mode RX FEATURES DEN pin, in SHDN (see Tables 2 and 3, and the “Low Power Shutdown (SHDN) Mode” on page 16), or when the 3.3V power supply is off. Because RS-232 is a point-to-point (only one Tx allowed on the bus) standard, the main use for this DEN disable function is to reduce power by eliminating the load current (approximately 1mA per Tx output) through the 5kΩ resistor in the Rx at the cable’s far end. CHARGE PUMPS The on-chip charge pumps create the RS-232 transmitter power supplies (typically +5.7/-5.3V) from a single supply as low as 3.15V, and are enabled only if the port is configured for RS-232 operation, and not in SHDN. The efficient design requires only four small 0.1µF capacitors for the voltage doubler and inverter functions. By operating discontinuously (i.e., turning off as soon as V+ and V- pump up to the nominal values), the charge pump contribution to RS-232 mode ICC is reduced significantly. Unlike competing devices that require the charge pump in RS-485 mode, disabling the charge pump saves power, and minimizes noise. If the application is a dedicated RS-485 port, then the charge pump capacitors aren’t even required. DATA RATES AND CABLING RS-232 receivers invert and convert RS-232 input levels (±3V to ±25V) to the standard TTL/CMOS levels required by a UART, ASIC, or µcontroller serial port. Receivers are designed to operate at faster data rates than the drivers, and they feature very low skews (20ns) so the receivers contribute negligibly to bit width distortion. Inputs include the standards required 3kΩ to 7kΩ pull-down resistor, so unused inputs may be left unconnected. Rx inputs also have built-in hysteresis to increase noise immunity and to decrease erroneous triggering due to slowly transitioning input signals. Rx outputs are short circuit protected, and are tri-statable via the active high RXEN pin, when the IC is shutdown (SHDN; see Tables 2 and 3, and the “Low Power Shutdown (SHDN) Mode” on page 16), or via the active low RXEN pin available on the QFN package option (see “ISL3331 (QFN Package) Special Features” on page 17). TX FEATURES RS-232 drivers invert and convert the standard TTL/CMOS levels from a UART, or µcontroller serial port to RS-232 compliant levels (±5V minimum). The Tx delivers these compliant output levels even at data rates of 400kbps, and with loads of 1000pF. The drivers are designed for low skew (typically 12% of the 400kbps bit width), and are compliant to the RS-232 slew rate specification (4V to 30V/µs) for a wide range of load capacitances. Tx inputs float if left unconnected and may cause ICC increases. For the best results, connect unused inputs to GND. Tx outputs are short circuit protected, and incorporate a thermal SHDN feature to protect the IC in situations of severe power dissipation. See the “RS-485 Mode” on page 14 for more details. Drivers disable via the active high 14 Drivers operate at data rates up to 400kbps, and are guaranteed for data rates up to 250kbps. The charge pumps and drivers are designed such that one driver can be operated at the rated load, and at 250kbps (see Figure 33). Figure 33 also shows that drivers can easily drive several thousands of picofarads at data rates up to 250kbps, while still delivering compliant ±5V output levels. Receivers operate at data rates up to 2Mbps. They are designed for a higher data rate to facilitate faster factory downloading of software into the final product, thereby improving the user’s manufacturing throughput. Figures 36 and 37 illustrate driver and receiver waveforms at 250kbps, and 400kbps, respectively. For these graphs, one driver drives the specified capacitive load, and a receiver. RS-232 doesn’t require anything special for cabling; just a single bus wire per transmitter and receiver, and another wire for GND. So an ISL333x RS-232 port uses a five conductor cable for interconnection. Bus terminations are not required, nor allowed, by the RS-232 standard. RS-485 Mode RX FEATURES RS-485 receivers convert differential input signals as small as 200mV, as required by the RS-485 and RS-422 standards, to TTL/CMOS output levels. The differential Rx provides maximum sensitivity, noise immunity, and common mode rejection. Per the RS-485 standard, receiver inputs function with common mode voltages as great as +12V and -7V, regardless of supply voltage, making them ideal for long networks where induced voltages are a realistic concern. FN6361.0 May 20, 2008 ISL3330, ISL3331 Each RS-485/422 port includes a single receiver (RA), and the unused Rx output (RB) is disabled. Drivers are also tri-stated when the IC is in SHDN, or when the 3.3V power supply is off. Worst case receiver input currents are 20% lower than the 1 “unit load” (1mA) RS-485 limit, which translates to a 15kΩ minimum input resistance. SPEED OPTIONS These receivers include a “full fail-safe” function that guarantees a high level receiver output if the receiver inputs are unconnected (floating), shorted together, or if the bus is terminated but undriven (i.e., differential voltage collapses to near zero due to termination). Failsafe with shorted or terminated and undriven inputs is accomplished by setting the Rx upper switching point at -40mV, thereby ensuring that the Rx recognizes a 0V differential as a high level. All the Rx outputs are short circuit protected, and are tri-statable via the active high RXEN pin, or when the IC is shutdown (see Tables 2 and 3, and the “Low Power Shutdown (SHDN) Mode” on page 16). ISL3331 (QFN) receiver outputs are also tri-statable via an active low RXEN input (see “ISL3331 (QFN Package) Special Features” on page 17). For the ISL3331 (QFN), when using the active high RXEN function, the RXEN pin may be left floating (internally pulled high), or should be connected to VCC through a 1kΩ resistor. If using the active low RXEN, then the RXEN pin must be connected to GND. TX FEATURES The RS-485/RS-422 driver is a differential output device that delivers at least 1.5V across a 54Ω load (RS-485), and at least 2V across a 100Ω load (RS-422). The drivers feature low propagation delay skew to maximize bit widths, and to minimize EMI. To allow multiple drivers on a bus, the RS-485 specification requires that drivers survive worst case bus contentions undamaged. The ISL333x drivers meet this requirement via driver output short circuit current limits, and on-chip thermal shutdown circuitry. The output stages incorporate current limiting circuitry that ensures that the output current never exceeds the RS-485 specification, even at the common mode voltage range extremes of 12V and -7V. In the event of a major short circuit condition, devices also include a thermal shutdown feature that disables the drivers whenever the die temperature becomes excessive. This eliminates the power dissipation, allowing the die to cool. The drivers automatically re-enable after the die temperature drops about +15°C. If the contention persists, the thermal shutdown/re-enable cycle repeats until the fault is cleared. Receivers stay operational during thermal shutdown. The RS-485 multi-driver operation also requires drivers to include tri-state functionality, where the port has a DEN pin to control this function. If the driver is used in an RS-422 network, such that driver tri-state isn’t required, then the DEN pin should connect to VCC through a 1kΩ resistor. 15 The ISL3330 (SSOP) features two speed options that are user selectable via the SLEW pin: a high slew rate setting optimized for 20Mbps data rates (Fast), and a slew rate limited option for operation up to 460kbps (Med). The ISL3331 (QFN) offers an additional, more slew rate limited, option for data rates up to 115kbps (Slow). See the “Data Rate“ and “RS-485 Slew Rate Limited Data Rates” on page 17 for more information. Receiver performance is the same for all three speed options. DATA RATE, CABLES, AND TERMINATIONS RS-485/RS-422 are intended for network lengths up to 4000’ (1220m), but the maximum system data rate decreases as the transmission length increases. Devices operating at the maximum data rate of 20Mbps are limited to lengths of 20’ to 30’ (6m to 9m), while devices operating at or below 115kbps can operate at the maximum length of 4000’ (1220m). Higher data rates require faster edges, so both the ISL333x versions offer an edge rate capable of 20Mbps data rates. They both have a second option for 460kbps, but the ISL3331 also offers another, very slew rate limited, edge rate to minimize problems at slow data rates. Nevertheless, for the best jitter performance when driving long cables, the faster speed settings may be preferable, even at low data rates. See the “RS-485 Slew Rate Limited Data Rates” on page 17 for details. Twisted pair is the cable of choice for RS-485/RS-422 networks. Twisted pair cables tend to pick-up noise and other electromagnetically induced voltages as common mode signals, which are effectively rejected by the differential receivers in these ICs. The preferred cable connection technique is “daisy-chaining”, where the cable runs from the connector of one device directly to the connector of the next device, such that cable stub lengths are negligible. A “backbone” structure, where stubs run from the main backbone cable to each device’s connector, is the next best choice, but care must be taken to ensure that each stub is electrically “short”. See Table 4 for recommended maximum stub lengths for each speed option. TABLE 4. RECOMMENDED STUB LENGTHS SPEED OPTION MAXIMUM STUB LENGTH ft. (m) SLOW 350 to 500 (107 to 152) MED 100 to 150 (30.5 to 46) FAST 1 to 3 (0.3 to 0.9) FN6361.0 May 20, 2008 ISL3330, ISL3331 In point-to-point, or point-to-multipoint (RS-422) networks, the main cable should be terminated in its characteristic impedance (typically 120Ω) at the end farthest from the driver. In multi-receiver applications, stubs connecting receivers to the main cable should be kept as short as possible, but definitely shorter than the limits shown in Table 4. Multipoint (RS-485) systems require that the main cable be terminated in its characteristic impedance at both ends. Again, keep stubs connecting a transceiver to the main cable as short as possible (refer to Table 4). Avoid “star”, and other configurations, where there are many “ends” which would require more than the two allowed terminations to prevent reflections. disables the charge pumps if the port is in RS-232 mode, so V+ collapses to VCC, and V- collapses to GND. All but 10µA of SHDN ICC current is due to control input (SPB, SLEW) pull-up resistors (~10µA/resistor), so SHDN ICC varies depending on the ISL333x configuration. The specification tables indicate the worst case values, but careful selection of the configuration yields lower currents. For example, in RS-232 mode the SPB pin isn’t used, so floating it or tying it high minimizes SHDN ICC. ISL3330 CONNECTOR Proper termination is imperative to minimize reflections when using the 20Mbps speed option. Short networks using the medium and slow speed options need not be terminated, but terminations are recommended unless power dissipation is an overriding concern. Note that the RS-485 specification allows a maximum of two terminations on a network, otherwise the Tx output voltage may not meet the required VOD. A B Y Z R RA D DY UART OR ASIC OR µCONTROLLER FIGURE 10. ILLUSTRATION OF FLOW-THROUGH PINOUT High ESD All pins on the ISL333x include ESD protection structures rated at ±2.5kV (HBM), which is good enough to survive ESD events commonly seen during manufacturing. But the bus pins (Tx outputs and Rx inputs) are particularly vulnerable to ESD events because they connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can destroy an unprotected port. ISL333x bus pins are fitted with advanced structures that deliver ESD protection in excess of ±15kV (HBM), without interfering with any signal in the RS-485 or the RS-232 range. This high level of protection may eliminate the need for board level protection, or at the very least will increase the robustness of any board level scheme. Small Packages Competing 3.3V dual protocol ICs are available only in a 20 Ld or 24 Ld SSOP. The ISL3331’s tiny 6mmx6mm QFN footprint is 36% to 44% smaller than the competing SSOPs. Flow-Through Pinouts Even the ISL333x pinouts are features, in that the “flow-through” design simplifies board layout. Having the bus pins all on one side of the package for easy routing to a cable connector, and the Rx outputs and Tx inputs on the other side for easy connection to a UART, avoids costly and problematic crossovers. Figure 10 illustrates the flow-through nature of the pinout. Low Power Shutdown (SHDN) Mode The ISL333x enter the SHDN mode when ON = 0, and the Tx and Rx are disabled (DEN = 0, RXEN = 0, and RXEN = 1) and the already low supply current drops to as low as 10µA. SHDN disables the Tx and Rx outputs, and 16 When enabling from SHDN in RS-232 mode, allow at least 25µs for the charge pumps to stabilize before transmitting data. If fast enables are required, and ICC isn’t the greatest concern, disable the drivers with the DEN pin to keep the charge pumps active. The charge pumps aren’t used in RS-485 mode, thus the transceiver is ready to send or receive data in less than 2µs, which is much faster than competing devices that require the charge pump for all modes of operation. Internal Loopback Mode Setting ON = 0, DEN = 1, and RXEN = 1 or RXEN = 0 (QFN only), places the port in the loopback mode, a mode that facilitates implementing board level self test functions. In loopback, internal switches disconnect the Rx inputs from the Rx outputs, and feed back the Tx outputs to the appropriate Rx output. This way the data driven at the Tx input appears at the corresponding Rx output (refer to “Typical Operating Circuits” on page 6). The Tx outputs remain connected to their terminals, so the external loads are reflected in the loopback performance. This allows the loopback function to potentially detect some common bus faults such as one or both driver outputs shorted to GND, or outputs shorted together. Note that the loopback mode uses an additional set of receivers, as shown in the “Typical Operating Circuits” on page 6. These loopback receivers are not standards compliant, so the loopback mode can’t be used to implement a half-duplex RS-485 transceiver. See Application Note AN1401 for specific details on implementing a 3-pin, half duplex, dual protocol port. FN6361.0 May 20, 2008 ISL3330, ISL3331 ISL3331 (QFN Package) Special Features Logic Supply (VL Pin) The ISL3331 (QFN) includes a VL pin that powers the logic inputs (Tx inputs and control pins) and Rx outputs. These pins interface with “logic” devices such as UARTs, ASICs, and µcontrollers, and today many of these devices use power supplies significantly lower than 3.3V. Thus, a 3.3V output level from a 3.3V powered dual protocol IC might seriously overdrive and damage the logic device input. Similarly, the logic device’s low VOH might not exceed the VIH of a 3.3V powered dual protocol input. Connecting the VL pin to the power supply of the logic device (as shown in Figure 11) limits the ISL3331’s Rx output VOH to VL (see Figure 14) and reduces the Tx and control input switching points to values compatible with the logic device output levels. Tailoring the logic pin input switching points and output levels to the supply voltage of the UART, ASIC, or µcontroller eliminates the need for a level shifter/translator between the two ICs. VCC = +3.3V RA DY GND VCC = +2V VOH = 3.3V RXD VIH ≥ 2 VOH ≤ 2 ISL3330 TXD GND UART/PROCESSOR VCC = +3.3V VCC = +2V VL RA DY GND ESD DIODE VOH = 2V RXD VIH = 1.4V VOH ≤ 2 ESD DIODE TXD GND . TABLE 5. VIH AND VIL vs VL FOR VCC = 3.3V VL (V) VIH (V) VIL (V) 1.2 0.85 0.26 1.5 0.9 0.5 1.8 0.9 0.73 2.3 1.2 1.0 2.7 1.4 1.3 3.3 1.8 1.7 Note: With VL ≤ 1.6V, the ISL3331 may not operate at the full data rate unless the logic signal VIL is at least 0.2V below the typical value listed in Table 5. The VL supply current (IL) is typically less than 35µA, as shown in Figures 19 and 20. All of the DC VL current is due to inputs with internal pull-up resistors (SPB, SLEW, RXEN) being driven to the low input state. The worst case IL current occurs when all three of the inputs are low (see Figure 19), due to the IL through the pull-up resistors. IIL through an input pull-up resistor is ~10µA, so the IL in Figure 19 drops by about 18µA (at VL = 3.3V) when the SPB is high and 232 mode disables the SLEW pin pull-up (middle vs top curve). When all three inputs are driven high, IL drops to ~10nA. Thus, to minimize power dissipation, drive these inputs high when unneeded (e.g., SPB isn’t used in RS-232 mode, so drive it high). QFN logic input pins that are externally tied high in an application, should use the VL supply for the high voltage level. Active Low Rx Enable (RXEN) In many RS-485 applications, especially half duplex configurations, users like to accomplish “echo cancellation” by disabling the corresponding receiver while its driver is transmitting data. This function is available on the QFN package via an active low RXEN pin. The active low function also simplifies direction control by allowing a single Tx/Rx direction control line. If the active high RXEN were used, either two valuable I/O pins would be used for direction control, or an external inverter is required between DEN and RXEN. Figure 12 details the advantage of using the RXEN pin. When using RXEN, ensure that RXEN is tied to GND. RS-485 Slew Rate Limited Data Rates ISL3331 UART/PROCESSOR FIGURE 11. USING VL PIN TO ADJUST LOGIC LEVELS VL can be anywhere from VCC down to 1.2V, but the input switching points may not provide enough noise margin when VL < 1.5V. Table 5 indicates typical VIH and VIL values for various VL voltages so the user can ascertain whether or not a particular VL voltage meets his needs. 17 The ISL333x FAST speed option (SLEW = High) utilizes Tx output transitions optimized for a 20Mbps data rate. These fast edges may increase EMI and reflection issues, even though fast transitions aren’t required at the lower data rates used by many applications. With the SLEW pin low, both product types switch to a moderately slew rate limited output transition targeted for 460kbps (MED) data rates. The ISL3331 (QFN version), offers an additional slew rate limited data rate that is optimized for 115kbps (SLOW), and is selected when SLEW = 0 and SPB = 0 (see Table 3). The FN6361.0 May 20, 2008 ISL3330, ISL3331 slew limited edges permit longer unterminated networks, or longer stubs off terminated busses, and help minimize EMI and reflections. Nevertheless, for the best jitter performance when driving long cables, the faster speed options may be preferable, even at lower data rates. The faster output transitions deliver less variability (jitter) when loaded with the large capacitance associated with long cables. Of course, faster transitions require more attention to ensuring short stub lengths and quality terminations, so there are trade-offs to be made. Assuming a jitter budget of 10%, it is preferable to go with the slow speed option for data rates of 115kbps or less to minimize fast edge effects. Likewise, the medium speed option is a good choice for data rates between 115kbps and 460kbps. For higher data rates, or when the absolute best jitter is required, use the high speed option. 1kΩ OR NC Evaluation Board An evaluation board, part number ISL3331EVAL1Z, is available to assist in assessing the dual protocol IC’s performance. The evaluation board contains a QFN packaged device, but because the same die is used in all packages, the board is also useful for evaluating the functionality of the other versions. The board’s design allows for evaluation of all standard features, plus the QFN specific features. Refer to the evaluation board application note for details, and contact your sales representative for ordering information. ISL3331 +3.3V + RXEN * RA B R A RXEN Tx/Rx 0.1µF VCC DEN Y DY Z D GND ACTIVE HIGH RX ENABLE ISL3331 +3.3V + VCC RXEN RA R 0.1µF B RXEN * A DEN Y Tx/Rx DY D Z GND * QFN ONLY ACTIVE LOW RX ENABLE FIGURE 12. USING ACTIVE LOW vs ACTIVE HIGH RX ENABLE 18 FN6361.0 May 20, 2008 ISL3330, ISL3331 Typical Performance Curves VCC = VL = 3.3V, TA = +25°C; Unless Otherwise Specified 3.5 30 3.0 VOH, +25°C 25 HIGH OUTPUT VOLTAGE (V) RECEIVER OUTPUT CURRENT (mA) VOL, +25°C VOL, +85°C 20 VOH, +85°C 15 10 5 0 2.0 IOH = -0.5mA 1.5 IOH = -1mA IOH = -6mA 1.0 0.5 IOH = -2mA 0 0.0 1.0 2.0 RECEIVER OUTPUT VOLTAGE (V) 3.0 3.3 DIFFERENTIAL OUTPUT VOLTAGE (V) 80 70 60 50 40 30 20 10 0 0.5 1.0 1.5 2.0 1.5 2.5 3.3 3.0 2.5 3.0 2.30 2.25 RDIFF = 100Ω 2.20 2.15 2.10 2.05 RDIFF = 54Ω 2.00 1.95 1.90 -40 3.5 -25 DIFFERENTIAL OUTPUT VOLTAGE (V) 250 75 85 4.5 +25°C +85°C 0 50 25 TEMPERATURE (°C) FIGURE 16. RS-485, DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs TEMPERATURE FIGURE 15. RS-485, DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT VOLTAGE RS-232, RXEN, RXEN, ON = X, DEN = VCC 200 4.0 -40°C 150 3.5 100 ICC (mA) OUTPUT CURRENT (mA) 2.0 FIGURE 14. RECEIVER HIGH OUTPUT VOLTAGE vs LOGIC SUPPLY VOLTAGE (VL) (QFN ONLY) 90 0 1.0 VL (V) FIGURE 13. RECEIVER OUTPUT CURRENT vs RECEIVER OUTPUT VOLTAGE DRIVER OUTPUT CURRENT (mA) 2.5 50 Y OR Z = LOW 3.0 RS-232, RXEN, RXEN = X, ON = VCC, DEN = GND 2.5 0 Y OR Z = HIGH -50 +85°C 1.5 -100 -150 2.0 +25°C RS-485, HALF DUPLEX, DEN = VCC, RXEN, RXEN, ON = X RS-485, FULL DUPLEX, DEN = VCC, RXEN, RXEN, ON = X RS-485, DEN = GND, RXEN, RXEN = X, ON = VCC -40°C -7 -6 -4 -2 0 2 4 6 OUTPUT VOLTAGE (V) 8 10 12 FIGURE 17. RS-485, DRIVER OUTPUT CURRENT vs SHORT CIRCUIT VOLTAGE 19 1.0 -40 -25 0 25 50 75 85 TEMPERATURE (°C) FIGURE 18. SUPPLY CURRENT vs TEMPERATURE FN6361.0 May 20, 2008 ISL3330, ISL3331 Typical Performance Curves 50 30 NO LOAD VIN = VL or GND DEN, RXEN, ON = GND 45 VCC = VL = 3.3V, TA = +25°C; Unless Otherwise Specified (Continued) VL ≤ VCC 25 40 RXEN = VL ICC AND IL (µA) 35 30 IL(µA) DEN, RXEN, DY, DZ/SLEW, ON = GND NO LOAD VIN = VL OR GND VL > VCC RS-485, SLEW, SPB, RXEN = GND 25 20 RS-232, RXEN = GND, SPB = VL 15 10 RS-485, SLEW, SPB, RXEN = VL 0 1.0 1.5 2.0 2.5 3.0 3.5 15 RS-232/RS-485 ICC 10 SPB = VL RS-485 IL 5 RS-232, SPB, RXEN = VL OR 5 SPB = GND RS-485 IL 20 0 4.0 1.0 1.5 2.0 2.5 VL (V) VL (V) FIGURE 19. RS-232, VL SUPPLY CURRENT vs VL VOLTAGE (QFN ONLY) 1640 SPB = VL RS-232 IL 3.0 3.5 4.0 FIGURE 20. VCC and VL SHDN SUPPLY CURRENTS vs VL VOLTAGE (QFN ONLY) 300 RDIFF = 54Ω, CL = 100pF RDIFF = 54Ω, CL = 100pF |tPLHZ - tPHLY| 1630 1620 |tPHLZ - tPLHY| 200 1610 tDHL SKEW (ns) PROPAGATION DELAY (ns) 250 1600 1590 tDLH 100 1580 1570 150 tDHL 50 1560 |tDLH - tDHL| 1550 -40 0 25 TEMPERATURE (°C) -25 50 75 85 FIGURE 21. RS-485, DRIVER PROPAGATION DELAY vs TEMPERATURE (SLOW DATA RATE, QFN ONLY) 550 0 -40 16 25 TEMPERATURE (°C) 50 75 85 RDIFF = 54Ω, CL = 100pF 14 545 |tPLHZ - tPHLY| 12 540 535 SKEW (ns) PROPAGATION DELAY (ns) 0 FIGURE 22. RS-485, DRIVER SKEW vs TEMPERATURE (SLOW DATA RATE, QFN ONLY) RDIFF = 54Ω, CL = 100pF tDHL 530 tDLH 525 tDHL 10 8 |tPHLZ - tPLHY| 6 4 |tDLH - tDHL| 520 515 -40 -25 2 -25 25 0 50 75 TEMPERATURE (°C) FIGURE 23. RS-485, DRIVER PROPAGATION DELAY vs TEMPERATURE (MEDIUM DATA RATE) 20 85 0 -40 -25 0 25 50 75 85 TEMPERATURE (°C) FIGURE 24. RS-485, DRIVER SKEW vs TEMPERATURE (MEDIUM DATA RATE) FN6361.0 May 20, 2008 ISL3330, ISL3331 Typical Performance Curves 24 VCC = VL = 3.3V, TA = +25°C; Unless Otherwise Specified (Continued) 3.0 RDIFF = 54Ω, CL = 100pF RDIFF = 54Ω, CL = 100pF |tDLH - tDHL| 2.5 22 21 2.0 tDLH SKEW (ns) PROPAGATION DELAY (ns) 23 20 19 tDHL 1.5 |tPHLZ - tPLHY| 1.0 18 17 0.5 |tPLHZ - tPHLY| 16 -25 25 0 50 75 0 -40 85 -25 TEMPERATURE (°C) 5 0 0 DRIVER OUTPUT (V) RA 4 Y 3 2 1 RECEIVER OUTPUT (V) 5 Z 0 DY DRIVER OUTPUT (V) 4 Y 3 2 1 Z 0 TIME (200ns/DIV) FIGURE 29. RS-485, DRIVER AND RECEIVER WAVEFORMS, LOW TO HIGH (MEDIUM DATA RATE) 21 0 5 RA 0 4 Z 3 2 Y 1 0 FIGURE 28. RS-485, DRIVER AND RECEIVER WAVEFORMS, HIGH TO LOW (SLOW DATA RATE, QFN ONLY) RECEIVER OUTPUT (V) 0 RA 0 5 DRIVER INPUT (V) RECEIVER OUTPUT (V) DRIVER OUTPUT (V) 5 5 TIME (400ns/DIV) FIGURE 27. RS-485, DRIVER AND RECEIVER WAVEFORMS, LOW TO HIGH (SLOW DATA RATE, QFN ONLY) RDIFF = 54Ω, CL = 100pF 85 75 RDIFF = 54Ω, CL = 100pF TIME (400ns/DIV) DY 50 FIGURE 26. RS-485, DRIVER SKEW vs TEMPERATURE (FAST DATA RATE) DRIVER INPUT (V) RECEIVER OUTPUT (V) DRIVER OUTPUT (V) DY 25 TEMPERATURE (°C) FIGURE 25. RS-485, DRIVER PROPAGATION DELAY vs TEMPERATURE (FAST DATA RATE) RDIFF = 54Ω, CL = 100pF 0 DRIVER INPUT (V) -40 RDIFF = 54Ω, CL = 100pF DY 5 0 RA 0 5 DRIVER INPUT (V) 15 4 Z 3 2 Y 1 0 TIME (200ns/DIV) FIGURE 30. RS-485, DRIVER AND RECEIVER WAVEFORMS, HIGH TO LOW (MEDIUM DATA RATE) FN6361.0 May 20, 2008 ISL3330, ISL3331 DY 0 5 RA 0 4 Y 3 2 Z 1 RDIFF = 54Ω, CL = 100pF DY 0 RA 0 4 Z 3 2 Y 1 0 TIME (10ns/DIV) FIGURE 31. RS-485, DRIVER AND RECEIVER WAVEFORMS, LOW TO HIGH (FAST DATA RATE) FIGURE 32. RS-485, DRIVER AND RECEIVER WAVEFORMS, HIGH TO LOW (FAST DATA RATE) RS-232 REGION OF NONCOMPLIANCE 250kbps VOUT+ 5.0 2.5 400kbps ALL TOUTS LOADED WITH 3kΩ TO GND 0 1 TRANSMITTER AT 250kbps or 400kbps, OTHER TRANSMITTER AT 30kbps -2.5 400kbps -5.0 250kbps VOUT 0 1000 2000 3000 4000 5000 TRANSMITTER OUTPUT VOLTAGE (V) 7.5 7.5 TRANSMITTER OUTPUT VOLTAGE (V) 0 5 TIME (10ns/DIV) -7.5 5 DRIVER INPUT (V) 5 RECEIVER OUTPUT (V) RDIFF = 54Ω, CL = 100pF DRIVER INPUT (V) VCC = VL = 3.3V, TA = +25°C; Unless Otherwise Specified (Continued) DRIVER OUTPUT (V) DRIVER OUTPUT (V) RECEIVER OUTPUT (V) Typical Performance Curves 5.0 VOUT+ 2.5 OUTPUTS STATIC ALL TOUTS LOADED WITH 3kΩ TO GND AND AT V+ OR V- 0 -2.5 -5.0 VOUT -7.5 -40 LOAD CAPACITANCE (pF) FIGURE 33. RS-232, TRANSMITTER OUTPUT VOLTAGE vs LOAD CAPACITANCE -25 0 50 25 TEMPERATURE (°C) 75 85 FIGURE 34. RS-232, TRANSMITTER OUTPUT VOLTAGE vs TEMPERATURE TRANSMITTER OUTPUT CURRENT (mA) 50 CL = 4000pF, 1 CHANNEL SWITCHING 40 5 Y OR Z = LOW DY 30 0 20 5 VOUT SHORTED TO GND 10 0 0 -5 Y/A 5 -10 RA Y OR Z = HIGH 0 -20 -30 -40 -25 0 25 50 75 85 2µs/DIV TEMPERATURE (°C) FIGURE 35. RS-232, TRANSMITTER SHORT CIRCUIT CURRENT vs TEMPERATURE 22 FIGURE 36. RS-232, TRANSMITTER AND RECEIVER WAVEFORMS AT 250kbps FN6361.0 May 20, 2008 ISL3330, ISL3331 Typical Performance Curves VCC = VL = 3.3V, TA = +25°C; Unless Otherwise Specified (Continued) 58 VIN = ±5 CL = 1000pF, 1 CHANNEL SWITCHING 57 RECEIVER + DUTY CYCLE (%) 5 DY 0 5 0 Y/A -5 5 RA FULL TEMP RANGE 56 55 SR IN = 15V/µs 54 53 52 51 SR IN = 100V/µs 50 0 49 0 500 2µs/DIV ALL TOUTS LOADED WITH 5kΩ TO GND DATA RATE (kbps) 450 2 TRANSMITTERS AT +25°C 400 1 TRANSMITTER AT +25°C 350 300 250 2000 1 TRANSMITTER AT +85°C 200 2 TRANSMITTERS AT +85°C 150 100 7.5 +25°C VOUT+ 5.0 +85°C 2.5 1 TRANSMITTER SWITCHING 0 ALL TOUTS LOADED WITH 5kΩ TO GND, CL = 1000pF -2.5 +85°C -5.0 +25°C VOUT - RS-232 REGION OF NONCOMPLIANCE VOUT ≥ ±4V AND DUTY CYCLE BETWEEN 40% AND 60% 500 1500 FIGURE 38. RS-232, RECEIVER OUTPUT + DUTY CYCLE vs DATA RATE TRANSMITTER OUTPUT VOLTAGE (V) FIGURE 37. RS-232, TRANSMITTER AND RECEIVER WAVEFORMS AT 400kbps 550 1000 DATA RATE (kbps) -7.5 0 1000 2000 3000 4000 LOAD CAPACITANCE (pF) 5000 FIGURE 39. RS-232, TRANSMITTER MAXIMUM DATA RATE vs LOAD CAPACITANCE 0 100 200 300 400 DATA RATE (kbps) 500 600 FIGURE 40. RS-232, TRANSMITTER OUTPUT VOLTAGE vs DATA RATE Die Characteristics 650 2 TRANSMITTERS SWITCHING 600 ALL TOUTS LOADED WITH 3kΩ TO GND, CL = 1000pF SKEW (ns) 550 +85°C GND TRANSISTOR COUNT: 500 2490 450 PROCESS: 400 +25°C 350 BiCMOS -40°C 300 250 SUBSTRATE AND QFN PAD POTENTIAL (POWERED UP): 0 50 200 400 600 650 DATA RATE (kbps) FIGURE 41. RS-232, TRANSMITTER SKEW vs DATA RATE 23 FN6361.0 May 20, 2008 ISL3330, ISL3331 Package Outline Drawing L40.6x6 40 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 3, 10/06 4X 4.5 6.00 36X 0.50 A B 6 PIN 1 INDEX AREA 6 PIN #1 INDEX AREA 40 31 30 1 6.00 4 . 10 ± 0 . 15 21 10 0.15 (4X) 11 20 0.10 M C A B TOP VIEW 40X 0 . 4 ± 0 . 1 4 0 . 23 +0 . 07 / -0 . 05 BOTTOM VIEW SEE DETAIL "X" 0.10 C 0 . 90 ± 0 . 1 ( C BASE PLANE ( 5 . 8 TYP ) SEATING PLANE 0.08 C SIDE VIEW 4 . 10 ) ( 36X 0 . 5 ) C 0 . 2 REF 5 ( 40X 0 . 23 ) 0 . 00 MIN. 0 . 05 MAX. ( 40X 0 . 6 ) DETAIL "X" TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 indentifier may be either a mold or mark feature. 24 FN6361.0 May 20, 2008 ISL3330, ISL3331 Shrink Small Outline Plastic Packages (SSOP) N M20.209 (JEDEC MO-150-AE ISSUE B) INDEX AREA H 0.25(0.010) M 20 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE B M E 1 2 3 0.25 0.010 SEATING PLANE -A- INCHES GAUGE PLANE -B- L A D -C- α e A2 A1 B C 0.10(0.004) 0.25(0.010) M C A M B S SYMBOL MIN MAX MIN MAX A 0.068 0.078 1.73 1.99 A1 0.002 0.008’ 0.05 0.21 A2 0.066 0.070’ 1.68 1.78 NOTES B 0.010’ 0.015 0.25 0.38 C 0.004 0.008 0.09 0.20’ D 0.278 0.289 7.07 7.33 3 E 0.205 0.212 5.20’ 5.38 4 e 0.026 BSC H 0.301 L 0.025 N α NOTES: MILLIMETERS 0.65 BSC 0.311 7.65 0.037 0.63 20 0 deg. 9 7.90’ 0.95 6 20 8 deg. 0 deg. 7 8 deg. 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. Rev. 3 11/02 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “B” does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimension at maximum material condition. 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 25 FN6361.0 May 20, 2008